# Schottky Rectifier, 60 V, 2 A, Single, DO-221AA, 2 Pins, 770 mV

![Product image](https://novapart.co/image/farnell:3214574RL/)

**URL**: https://novapart.co/products/STPS2L60UF/schottky-rectifier-60-v-2-a-single-do-221aa-pins
**SKU**: STPS2L60UF
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.1050
**Stock**: 1000+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:60V; Forward Current If(AV):2A; Diode Configuration:Single; Diode Case Style:DO-221AA; No. of Pins:2Pins; Forward Voltage VF Max:770mV; Forward

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | - |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | DO-221AA |
| Diode Configuration | Single |
| Forward Voltage Max | 770mV |
| Forward Surge Current | 75A |
| Average Forward Current | 2A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 60V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3214574RL/)

**STPS2L60** 

Datasheet 

60 V power Schottky rectifier 

**==> picture [110 x 156] intentionally omitted <==**

**----- Start of picture text -----**<br>
K —\+—. A<br>A<br>A<br>22 K K<br>SMA SMB Flat<br>A<br>K<br>DO-41<br>**----- End of picture text -----**<br>


## **Features** 

- Negligible switching losses 

- Low forward voltage drop for higher efficiency and extended battery life 

- Surface mount miniature package 

- Avalanche rated 

- ECOPACK[®] 2 compliant component 

## **Applications** 

- Lighting 

- Desktop power supply 

- Battery charger 

- Set top box 

- Auxiliary power 

## **Description** 

This 60 V power Schottky rectifier is ideal for switch mode power supplies and high frequency converters. 

Packaged in SMA, axial and SMB Flat, the STPS2L60 is optimized for use in low voltage, high frequency inverters and small battery chargers. 

|**Product summary**<br>~~+~~|**Product summary**<br>~~+~~|
|---|---|
|**Symbol**<br>~~+~~|**Values**<br>~~+~~|
|**IF(AV)**|2 A|
|**VRRM**|60 V|
|**Tj (max.)**|150 °C|
|**VF(typ.)**|0.51 V|



**DS2976** - **Rev 7** - **November 2018** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STPS2L60 Characteristics** 

**1** 

## **Characteristics** 

**Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||60|V|
|IF(RMS)|Forward rms current|||10|A|
|IF(AV)|Average forward current δ = 0.5,<br>square wave|SMB Flat|TL= 130 °C|2|A|
|||SMA|TL= 115 °C|||
|||DO-41|TL= 110 °C|||
|IFSM|Surge non repetitive forward current||tp= 10 ms sinusoidal|75|A|
|PARM|Repetitive peak avalanche power|tp= 10 µs, Tj= 125 °C||115|W|
|Tstg|Storage temperature range|||-65 to + 150|°C|
|Tj|Maximum operating junction temperature(1)|||+ 150|°C|



_1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink._ 

**Table 2. Thermal resistance parameter** 

|**Symbol**|**Parameter**|**Parameter**||**Max. value**|**Unit**|
|---|---|---|---|---|---|
|Rth(j-l)|Junction to lead||SMB Flat|15|°C/W|
||||SMA|25||
||Junction to lead|Lead length = 10 mm|DO-41|30||



For more information, please refer to the following application note : 

- AN5088 : Rectifiers thermal management, handling and mounting recommendations 

**Table 3. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR(1)|Reverse leakage<br>current|Tj= 25 °C|VR= VRRM|-||100|µA|
|||Tj= 100 °C||-|2|10|mA|
|VF(1)|Forward voltage<br>drop|Tj= 25 °C|IF= 2 A|-||0.60|V|
|||Tj= 125 °C||-|0.51|0.55||
|||Tj= 25 °C|IF= 4 A|-||0.77||
|||Tj= 125 °C||-|0.62|0.67||



_1. Pulse test: tp = 380 µs, δ < 2%_ 

To evaluate the conduction losses use the following equation: P = 0.43 x IF(AV) + 0.06 IF[2] (RMS) 

For more information, please refer to the following application notes related to the power losses : 

- AN604: Calculation of conduction losses in a power rectifier 

- AN4021: Calculation of reverse losses on a power diode 

**DS2976** - **Rev 7** 

**page 2/13** 

**STPS2L60 Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**==> picture [513 x 196] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient<br>average forward current temperature (δ = 0.5) DO-41, SMA<br>1.4 PF(AV)(W) 2.2 IF(AV)(A)<br>1.3 δ = 0.1 δ = 0.2 δ = 0.5 2.0 Rth(j-a)=Rth(j-l)<br>1.2 SMA<br>1.8<br>1.1 δ = 0.05 DO-41<br>1.0 δ = 1 1.6 Rth(j-a)=100°C/W<br>0.9 1.4<br>0.8 1.2<br>0.7<br>1.0<br>0.6<br>0.5 0.8<br>0.4 0.6<br>0.3 T T<br>0.4<br>0.2<br>0.10.0 IF(AV)(A) δ [=tp/T] tp 0.20.0 δ [=tp/T] tp Tamb (°C)<br>0.0     0.2     0.4      0.6     0.8    1.0      1.2     1.4     1.6     1.8     2.0     2.2     2.4 0 25 50 75 100 125 150<br>**----- End of picture text -----**<br>


**==> picture [513 x 412] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 3. Average forward current versus ambient Figure 4. Normalized avalanche power derating versus<br>temperature (δ = 0.5, SMB Flat) pulse duration (Tj = 125 °C)<br>2.2 IF(AV)(A) PARM(tp)<br>2.0 Rth(j-a)=Rth(j-l) 1 PARM(10 µs)<br>1.8<br>1.6 SMB  Flatflat<br>1.4 0.1<br>1.2<br>SMB flat Flat<br>1.0 RScuth(j-a)=2.5 cm²=40 °C/W<br>0.8<br>0.01<br>0.6 T<br>0.4<br>0.2 δ [=tp/T] tp Tamb(°C) t p(µs)<br>0.001<br>0.0<br>0 25 5 0 75 100 125 150 1 10 100 1000<br>Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of thermal impedance junction<br>to ambient versus pulse duration (SMA) to ambient versus pulse duration (DO-41)<br>Zth(j-a)/Rth(j-a) Zth(j-a)/Rth(j-a)<br>1.0 1.0<br>0.9 0.9<br>0.8 0.8<br>0.7 0.7<br>0.6 0.6<br>0.5 0.5<br>0.4 0.4<br>0.3 0.3<br>0.2 0.2<br>Single pulse<br>0.1 Single pulse tp(s) 0.1 tp(s)<br>0.0 0.0<br>1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>**----- End of picture text -----**<br>


**DS2976** - **Rev 7** 

**page 3/13** 

**STPS2L60 Characteristics (curves)** 

**==> picture [513 x 197] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Relative variation of thermal impedance junction Figure 8. Junction capacitance versus reverse voltage<br>to lead versus pulse duration (SMB Flat) applied (typical values)<br>Zth(j-l) /Rth(j-l) C(pF)<br>1.0 1000<br>epoxy printed circuit board FR4, copper thickness:35 µm<br>0.9 VOSCF=1MHz=30mVRMS<br>0.8 T =25°Cj<br>0.7<br>0.6<br>0.5 100<br>0.4<br>0.3<br>0.2<br>0.1 Single pulse<br>tp(s) VR(V)<br>0.0 10<br>1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1 10 100<br>**----- End of picture text -----**<br>


**==> picture [513 x 197] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 9. Reverse leakage current versus reverse voltage<br>Figure 10. Forward voltage drop versus forward current<br>applied (typical values)<br>IF(A)<br>IR(µA) 10<br>1.E+05<br>T =150°Cj 9 ( Mm aximum values)Tj=125°C<br>8<br>1.E+04 T =125°Cj 7 (maximum values)Tj=25°C<br>T =100°Cj 6 (typical values)   Tj=125°C<br>1.E+03<br>5<br>T =75°Cj<br>4<br>1.E+02 T =50°Cj 3<br>2<br>1.E+01 T =25°Cj<br>1 VF(V)<br>VR(V) 0<br>1.E+00 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6<br>0 10 20 30 40 50 60<br>**----- End of picture text -----**<br>


**==> picture [513 x 205] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 11. Thermal resistance junction to ambient versus<br>Figure 12. Thermal resistance versus lead length (DO-41)<br>copper surface under each lead (SMA)<br>Rth(°C/W)<br>Rth(j-a) (°C/W) 120<br>200<br>Epoxy printed circuit board FR4,copper thickness: 35 µm SMA Rth(j-a)<br>100<br>150<br>80<br>60<br>100<br>Rth(j-I)<br>40<br>50<br>20<br>S(Cu)(cm²) 0 Lleads(mm)<br>0 5 10 15 20 25<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**DS2976** - **Rev 7** 

**page 4/13** 

**STPS2L60 Characteristics (curves)** 

**Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMB Flat)** 

**==> picture [218 x 142] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a) (°C/W)<br>200<br>Epoxy printed circuit board FR4, eCu= 35 µm SMB-Flat<br>150<br>100<br>50<br>SCu(cm²)<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**DS2976** - **Rev 7** 

**page 5/13** 

**STPS2L60 Package information** 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

## **2.1 SMA package information** 

- Epoxy meets UL94, V0 

- Cooling method : by conduction (C) 

## **Figure 14. SMA package outline** 

**==> picture [303 x 223] intentionally omitted <==**

**----- Start of picture text -----**<br>
E1<br>D<br>E<br>A1<br>C A2<br>L b<br>**----- End of picture text -----**<br>


**Table 4. SMA package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches (for reference only)**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A1|1.90|2.45|0.074|0.097|
|A2|0.05|0.20|0.001|0.008|
|b|1.25|1.65|0.049|0.065|
|c|0.15|0.40|0.005|0.016|
|D|2.25|2.90|0.088|0.115|
|E|4.80|5.35|0.188|0.211|
|E1|3.95|4.60|0.155|0.182|
|L|0.75|1.50|0.029|0.060|



**DS2976** - **Rev 7** 

**page 6/13** 

**STPS2L60 SMA package information** 

## **Figure 15. SMA recommended footprint in mm (inches)** 

**==> picture [226 x 113] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.4 2.63 1.4<br>(0.055) (0.104) (0.055)<br>1.64<br>(0.065)<br>5.43<br>(0.214)<br>**----- End of picture text -----**<br>


**DS2976** - **Rev 7** 

**page 7/13** 

**STPS2L60 SMB Flat package information** 

## **2.2 SMB Flat package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

## **Figure 16. SMB Flat package outline** 

**==> picture [304 x 203] intentionally omitted <==**

**----- Start of picture text -----**<br>
A<br>c<br>D<br>L 2x<br>L1  2x<br>E E1<br>L2  2x<br>b<br>**----- End of picture text -----**<br>


**Table 5. SMB Flat mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches (for reference only)**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.90||1.10|0.035||0.043|
|b|1.95||2.20|0.077||0.087|
|c|0.15||0.40|0.006||0.016|
|D|3.30||3.95|0.130||0.156|
|E|5.10||5.60|0.201||0.220|
|E1|4.05||4.60|0.159||0.181|
|L|0.75||1.50|0.030||0.059|
|L1||0.40|||0.016||
|L2||0.60|||0.024||



**DS2976** - **Rev 7** 

**page 8/13** 

**STPS2L60 SMB Flat package information** 

## **Figure 17. Footprint recommendations, dimensions in mm (inches)** 

**==> picture [154 x 141] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.20 3.44 1.20<br>(0.047) (0.136) (0.047)<br>2.07<br>(0.082)<br>5.84<br>(0.230)<br>millimeters<br>(inches)<br>**----- End of picture text -----**<br>


**DS2976** - **Rev 7** 

**page 9/13** 

**STPS2L60 DO-41 package information** 

## **2.3 DO-41 Package information** 

- Epoxy meets UL 94, V0 

## **Figure 18. DO-41 package outline** 

**==> picture [309 x 131] intentionally omitted <==**

**----- Start of picture text -----**<br>
C A C<br>ØD<br>ØB<br>**----- End of picture text -----**<br>


**Table 6. DO-41 package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches (for reference only)**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|4.1|-|5.20|0.160|-|0.205|
|B|2.00|-|2.71|0.080|-|0.107|
|C|25.40|-||1.000|-||
|D|0.71|-|0.86|0.028|-|0.0034|



**DS2976** - **Rev 7** 

**page 10/13** 

**STPS2L60 Ordering Information** 

## **3 Ordering information** 

**Table 7. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS2L60A|S26|SMA|0.068 g|5000|Tape and reel|
|STPS2L60|STPS2L60|DO-41|0.34 g|2000|Ammopack|
|STPS2L60UF|FG26|SMB Flat|0.050 g|5000|Tape and reel|



**DS2976** - **Rev 7** 

**page 11/13** 

**STPS2L60** 

## **Revision history** 

**Table 8. Document revision history** 

|**Date**|**Version**|**Changes**|
|---|---|---|
|Jul-2003|2A|Last update.|
|Aug-2004|3|SMA package dimensions update. Reference A1 max changed from 2.70 mm<br>(0.106 inch) to 2.03 mm (0.080 inch).SMA package dimensions update.<br>Reference A1 max changed from 2.70 mm (0.106 inch) to 2.03 mm (0.080<br>inch).|
|18-Sep-2008|4|Reformatted to current standards. Added SMB flat package.|
|30-Sep-2009|5|Updated table 7 package dimensions.|
|23-Sep-2011|6|Updated SMA package information.|
|30-Nov-2018|7|UpdatedTable 1. Absolute ratings (limiting values, at 25 °C, unless otherwise<br>specified)andFigure 4. Normalized avalanche power derating versus pulse<br>duration (Tj= 125 °C).|



**DS2976** - **Rev 7** 

**page 12/13** 

**STPS2L60** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2018 STMicroelectronics – All rights reserved 

**DS2976** - **Rev 7** 

**page 13/13** 



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