# Schottky Rectifier, 60 V, 2 A, Single, DO-214AC (SMA), 2 Pins, 600 mV

![Product image](https://novapart.co/image/farnell:2354447/)

**URL**: https://novapart.co/products/STPS2L60A/schottky-rectifier-60-v-2-a-single-do-214ac-sma
**SKU**: STPS2L60A
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.0650
**Stock**: 10+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:60V; Forward Current If(AV):2A; Diode Configuration:Single; Diode Case Style:DO-214AC; No. of Pins:2Pins; Forward Voltage VF Max:600mV; Forward Su

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | STPS2 |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | DO-214AC (SMA) |
| Diode Configuration | Single |
| Forward Voltage Max | 600mV |
| Forward Surge Current | 75A |
| Average Forward Current | 2A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 60V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2354447/)

Power Schottk rectifier y 

**==> picture [61 x 39] intentionally omitted <==**

## **STPS2L60** 

## **Features** 

- Negligible switching losses 

- Low forward voltage drop 

- Surface mount miniature package 

- Avalanche capability specified 

- ECOPACK2[®] compliant component (SMB flat) 

## **Description** 

Axial and surface mount power Schottky rectifiers suited to switched mode power supplies and high frequency DC to DC converters. 

Packaged in SMA, DO-41 and SMB flat this device is especially intended for use in low voltage, high frequency inverters and small battery chargers. 

**==> picture [76 x 101] intentionally omitted <==**

**----- Start of picture text -----**<br>
A<br>K<br>DO-41<br>STPS2L60<br>**----- End of picture text -----**<br>


**==> picture [194 x 81] intentionally omitted <==**

**----- Start of picture text -----**<br>
A A<br>K<br>K<br>SMA SMB flat<br>(JEDEC DO-214AC) (JEDEC DO221-AA)<br>STPS2L60A STPS2L60UF<br>**----- End of picture text -----**<br>


## **Table 1. Device summary** 

|**Symbol**|**Value**|
|---|---|
|IF(AV)|2 A|
|VRRM|60 V|
|Tj(max)|150 °C|
|VF(max)|0.55 V|



September 2011 

1/9 

Doc ID 9173 Rev 6 

_www.st.com_ 

**Characteristics** 

**STPS2L60** 

## **1 Characteristics** 

## **Table 2. Absolute ratings (limiting values)** 

|**Table 2.**|**Table 2.**|**Absolute ratings (limiting values)**|**Absolute ratings (limiting values)**|**Absolute ratings (limiting values)**|||
|---|---|---|---|---|---|---|
|**Symbol**||**Parameter**|||**Value**|**Unit**|
|VRRM||Repetitive peak reverse voltage|||60|V|
|IF(RMS)||Forward rms voltage|||10|A|
|IF(AV)||Average forward current|SMB flat|TL= 130 °Cδ= 0.5|2|A|
||||SMA|TL= 115 °Cδ= 0.5|||
||||DO-41|TL= 110 °Cδ= 0.5|||
|IFSM||Surge non repetitive forward current||tp=10 ms sinusoidal|75|A|
|PARM||Repetitive peak avalanche power||tp= 1 µs   Tj= 25 °C|1600|W|
|Tstg||Storage temperature range|||-65 to + 150|°C|
|Tj||Maximum operating junction temperature(1)|||150|°C|
|dV/dt||Critical rate of rise of reverse voltage|||10000|V/µs|
|1.|condition to avoid thermal runaway for a diode on its own heatsink<br>dPtot<br>dTj<br><<br>1<br>Rth(j-a)||||||



## **Table 3. Thermal resistance** 

|**Symbol**|**Test conditions**|**Test conditions**||**Value**|**Unit**|
|---|---|---|---|---|---|
|Rth(j-l)|Junction-lead||SMB flat|15|°C/W|
||||SMA|25||
|||Lead length = 10 mm|DO-41|30||



## **Table 4. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR<br>(1)|Reverse leakage<br>current|Tj= 25 °C|VR= VRRM|||100|µA|
|||Tj= 100 °C|||2|10|mA|
|VF<br>(1)|Forward voltage drop|Tj= 25 °C|IF= 2 A|||0.60|V|
|||Tj= 125 °C|||0.51|0.55||
|||Tj= 25 °C|IF= 4 A|||0.77||
|||Tj= 125 °C|||0.62|0.67||



1. Pulse test: tp = 380 µs, δ < 2% 

To evaluate the conduction losses use the following equation: P = 0.43 x IF(AV) + 0.06 IF2(RMS) 

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Doc ID 9173 Rev 6 

**STPS2L60** 

**Characteristics** 

**Figure 1. Average forward power dissipation Figure 2. Average forward current versus versus average forward current ambient temperature (** δ **= 0.5) DO-41, SMA** 

**==> picture [462 x 340] intentionally omitted <==**

**----- Start of picture text -----**<br>
PF(AV)(W) IF(AV)(A)<br>1.4 2.2<br>1.3 δ = 0.1 δ = 0.2 δ = 0.5 2.0 Rth(j-a)=Rth(j-I)<br>1.2 δ = 0.05<br>1.8<br>1.1 DO-41<br>1.0 δ = 1 1.6 SMA<br>0.9 1.4<br>0.8 1.2<br>0.7 Rth(j-a)=100°C/W<br>0.6 1.0<br>0.5 0.8<br>0.4 T 0.6 T<br>0.3<br>0.4<br>0.2<br>0.1 IF(AV)(A) δ [=tp/T] tp 0.2 δ [=tp/T] tp Tamb(°C)<br>0.0 0.0<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 0 25 50 75 100 125 150<br>Figure 3. Average forward current versus  Figure 4. Normalized avalanche power<br>ambient temperature ( δ  = 0.5) derating versus pulse duration<br>SMB flat<br>2.22.0 IF(AV)(A) Rth(j-a)=Rth(j-l) 1 PPARMARM(1µs)(tp)<br>1.8<br>1.6 SMB  Flatflat<br>1.4 0.1<br>1.2 SMB  Flatflat<br>1.0 RScuth(j-a)=2.5 cm²=40 °C/W<br>0.8<br>0.01<br>0.6 T<br>0.4<br>0.2 δ [=tp/T] tp Tamb(°C) 0.001 tp(µs)<br>0.0<br>0 25 50 75 100 125 150 0.01 0.1 1 10 100 1000<br>**----- End of picture text -----**<br>


## **Figure 5. Normalized avalanche power derating versus junction temperature** 

**Figure 6. Non repetitive surge peak forward current versus overload duration (maximum values) (SMA)** 

**==> picture [462 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
IM(A)<br>PARM(Tj) 10<br>1.2 PARM(25°C) 9<br>8<br>1<br>7<br>0.8 6<br>Ta=25°C<br>0.6 5<br>4 Ta=75°C<br>0.4<br>3<br>0.2 2 IM Ta=125°C<br>0 T (°C)j 1 δ=0.5 t t(s)<br>25 50 75 100 125 150 0<br>1.E-03 1.E-02 1.E-01 1.E+00<br>**----- End of picture text -----**<br>


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Doc ID 9173 Rev 6 

**Characteristics** 

**STPS2L60** 

**Figure 7. Non repetitive surge peak forward Figure 8. Non repetitive surge peak forward current versus overload duration current versus overload duration (maximum values) (DO-41) (maximum values) (SMB flat)** 

**==> picture [462 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
IM(A) IM(A)<br>10 30<br>SMBflat<br>9<br>25<br>8<br>7<br>Ta=25°C 20<br>6<br>TL=25°C<br>5 15<br>Ta=75°C<br>4 TL=75°C<br>10<br>3<br>2 IM Ta=125°C 5 IM TL=125°C<br>1 δ=0.5 t t(s) δ=0.5 t t(s)<br>0 0<br>1.E-03 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00<br>**----- End of picture text -----**<br>


## **Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA)** 

**Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration (DO-41)** 

**==> picture [462 x 340] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-a)/Rth(j-a) Zth(j-a)/Rth(j-a)<br>1.0 1.0<br>epoxy printed circuit board FR4, copper thickness: 35 µm<br>0.9 0.9<br>0.8 0.8<br>0.7 0.7<br>0.6 0.6<br>0.5 0.5<br>0.4 0.4<br>0.3 0.3<br>0.2 0.2<br>0.1 Single pulse tp(s) 0.1 Single pulse tp(s)<br>0.0 0.0<br>1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>Figure 11. Relative variation of thermal  Figure 12. Reverse leakage current versus<br>impedance junction to lead versus  reverse voltage applied<br>pulse duration (SMB flat) (typical values)<br>Zth(j-l)/Rth(j-l) IR(µA)<br>1.0 1.E+05<br>epoxy printed circuit board FR4, copper thickness: 35 µm<br>0.9 T =150°Cj<br>0.8 1.E+04 T =125°Cj<br>0.7<br>T =100°Cj<br>0.6 1.E+03<br>0.5 T =75°Cj<br>0.4 1.E+02 T =50°Cj<br>0.3<br>0.2 1.E+01 T =25°Cj<br>0.1 Single pulse tp(s) VR(V)<br>0.0 1.E+00<br>1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 0 10 20 30 40 50 60<br>**----- End of picture text -----**<br>


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**STPS2L60** 

**Characteristics** 

**==> picture [462 x 376] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 13. Junction capacitance versus  Figure 14. Forward voltage drop versus<br>reverse voltage applied forward current<br>(typical values) (maximum values, low level)<br>C(pF) IFM(A)<br>1000 10<br>F=1MHz<br>VOSC=30mV 9 T =125°Cj<br>T =25°Cj (maximum values)<br>8<br>7<br>6 (typical values)T =125°Cj<br>100 5<br>T =25°Cj<br>4 (maximum values)<br>3<br>2<br>VR(V) 1 VFM(V)<br>10 0<br>1 10 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6<br>Figure 15. Thermal resistance junction to  Figure 16. Thermal resistance versus lead<br>ambient versus copper surface  length (DO-41)<br>under each lead (SMA and SMB flat)<br>Rth(j-a)(°C/W) Rth(°C/W)<br>130 120<br>120 epoxy printed circuit board FR4, copper thickness: 35 µm Rth(j-a)<br>110<br>100<br>100<br>90<br>80<br>80<br>SMA<br>70<br>60<br>60<br>50 Rth(j-I)<br>40 SMBflat 40<br>30<br>20 20<br>10 S(Cu)(cm²) Lleads(mm)<br>0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5 10 15 20 25<br>**----- End of picture text -----**<br>


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Doc ID 9173 Rev 6 

**STPS2L60** 

**Package information** 

## **2 Package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

|**Table 5.**|**Table 5.**|**Table 5.**|**Table 5.**|**SMB flat dimensions**|**SMB flat dimensions**||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|E<br>E1||||A||**Ref.**|**Dimensions**||||||
||||||||**Millimeters**|||**Inches**|||
||||||||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|||||||A|0.90||1.10|0.035||0.043|
|||||||b|1.95||2.20|0.077||0.087|
|||E1|||||||||||
|||||||c|0.15||0.40|0.006||0.016|
||||||||||||||
|||||||D|3.30||3.95|0.130||0.156|
|||||||E|5.10||5.60|0.200||0.220|
|||||||E1|4.05||4.60|0.189||0.181|
|||||||L|0.75||1.50|0.029||0.059|
||||||||||||||
|||||||L1||0.40|||0.016||
|||||||L2||0.60|||0.024||



## **Figure 17. SMB flat footprint dimensions** 

**==> picture [119 x 130] intentionally omitted <==**

**----- Start of picture text -----**<br>
5.84<br>(0.230)<br>2.07<br>(0.082)<br>1.20 3.44 1.20<br>(0.047) (0.136) (0.047)<br>millimeters<br>(inches)<br>**----- End of picture text -----**<br>


The footprint in _Figure 17_ has been optimized for the SMB flat package. The footprint of the SMB package can be used instead. 

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Doc ID 9173 Rev 6 

**STPS2L60** 

**Package information** 

|**Table 6.**|**Table 6.**|**SMA dimensions**|**SMA dimensions**|**SMA dimensions**|**SMA dimensions**|**SMA dimensions**||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**C**|||||||**b**||**Ref.**|**Dimensions**<br>**Millimeters**<br>**Inches**<br>**Min.**<br>**Max.**<br>**Min.**<br>**Max.**||||
|||||||||||||**Inches**||
|||**E1**|||**L**<br>**D**<br>**A1**<br>**A2**||||||**Max.**|**Min.**|**Max.**|
|||||||||||||||
||||||||||A1|1.90|2.45|0.075|0.094|
||||||||||A2|0.05|0.20|0.002|0.008|
|||**E**|||||||b|1.25|1.65|0.049|0.065|
||||||||||c|0.15|0.40|0.006|0.016|
|||||||||||||||
|||||||**1**|||D|2.25|2.90|0.089|0.114|
||||||**L**|||**b**|E|4.80|5.35|0.189|0.211|
||||||||||E1|3.95|4.60|0.156|0.181|
||||||||||L|0.75|1.50|0.030|0.059|



## **Figure 18. Footprint, dimensions in mm (inches)** 

**==> picture [231 x 115] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.4 2.63 1.4<br>(0.055) (0.103) (0.055)<br>1.64<br>(0.064)<br>5.43<br>(0.214)<br>**----- End of picture text -----**<br>


## **Table 7. DO-41 package dimensions** 

||C<br>A<br>B<br>O/<br>O/D<br>O/D<br>C|**Ref**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
||||**Millimeters**||**Inches**||
||||**Min.**|**Max.**|**Min.**|**Max.**|
|||A|4.07|5.20|0.160|0.205|
|||B|2.04|2.71|0.080|0.107|
|||C|25.4||1||
|||D|0.71|0.86|0.028|0.034|



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**Ordering information** 

**STPS2L60** 

## **3 Ordering information** 

## **Table 8. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS2L60A|S26|SMA|0.068 g|5000|Tape and reel|
|STPS2L60|STPS2L60|DO-41|0.34 g|2000|Ammopack|
|STPS2L60RL|STPS2L60|DO-41|0.34 g|5000|Tape and reel|
|STPS2L60UF|FG26|SMB flat|0.050 g|5000|Tape and reel|



## **4 Revision history** 

## **Table 9. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|Jul-2003|2A|Last update.|
|Aug-2004|3|SMA package dimensions update. Reference A1 max<br>changed from 2.70 mm (0.106 inch) to 2.03 mm (0.080 inch).|
|18-Sep-2008|4|Reformatted to current standards. Added SMB flat package.|
|30-Sep-2009|5|Updated table 7 package dimensions.|
|23-Sep-2011|6|Updated SMA package information.|



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