# Schottky Rectifier, 30 V, 1 A, Single, DO-222AA, 2 Pins, 390 mV

![Product image](https://novapart.co/image/farnell:4035971/)

**URL**: https://novapart.co/products/STPS1L30MF/schottky-rectifier-30-v-1-a-single-do-222aa-2-pins
**SKU**: STPS1L30MF
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.0840
**Stock**: 1000+
**Lead Time**: 120 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | - |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | DO-222AA |
| Diode Configuration | Single |
| Forward Voltage Max | 390mV |
| Forward Surge Current | 50A |
| Average Forward Current | 1A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 30V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4035971/)

Low drop power Schottky rectifier in flat package 

**==> picture [61 x 39] intentionally omitted <==**

## **STPS1L30MF** 

## **Main product characteristics** 

|IF(AV)|1 A|
|---|---|
|VRRM|30 V|
|Tj(max)|150° C|
|VF(max)|0.39 V|



## **Features and benefits** 

- Very low profile package: 0.85 mm 

- Backward compatible with standard STmite footprint 

- Very small conduction losses 

- Negligible switching losses 

- Extremely fast switching 

- Low forward voltage drop for higher efficiency and extended battery life 

- Low thermal resistance 

- Avalanche capability specified 

**==> picture [88 x 99] intentionally omitted <==**

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A<br>K<br>STmite flat<br>(DO222-AA)<br>**----- End of picture text -----**<br>


## **Description** 

Single Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. 

Packaged in STmite flat, this device is intended for use in very low voltage, high frequency inverters, free wheeling and polarity protection applications. Due to the very small size of the package this device fits battery powered equipment (cellular, notebook, PDA’s, printers) as well as chargers and PCMCIA cards. 

## **Order Code** 

|**Order Code**||
|---|---|
|**Part number**|**Marking**|
|STPS1L30MF|F1L3|



## **Table 1. Absolute ratings (limiting values)** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage||30|V|
|IF(RMS)|RMS forward voltage||2|A|
|IF(AV)|Average forward current|Tc= 140° Cδ= 0.5|1|A|
|IFSM|Surge non repetitive forward current|tp= 10 ms sinusoidal|50|A|
|PARM|Repetitive peak avalanche power|tp= 1 µs   Tj= 25° C|1200|W|
|Tstg|Storage temperature range||-65 to + 150|°C|
|Tj|Maximum operating junction temperature(1)||150|°C|
|dV/dt|Critical rate of rise of reverse voltage  (rated VR, Tj= 25° C)||10000|V/µs|
|1.<br>condition to avoid thermal runaway for a diode on its own heatsink<br>dPtot<br>dTj<br>---------------<br>1<br>Rth j<br>a<br>–<br>(<br>)<br>------------------------**-**<br><|||||



1/7 

August 2006 

Rev 1 

_www.st.com_ 

**Characteristics** 

**STPS1L30MF** 

## **1 Characteristics** 

## **Table 2. Thermal resistance** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|Rth(j-c)|Junction to case|20|°C/W|
|Rth(j-a)<br>(1)|Junction to ambient|250|°C/W|



1. Mounted with minimum recommended pad size, PC board FR4 

## **Table 3. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Tests conditions**|**Tests conditions**|**Min.**|**Typ**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR (1)|Reverse leakage current|Tj= 25° C|VR= VRRM||0.13|0.39|mA|
|||Tj= 85° C|||5.25|16.5||
|||Tj= 25° C|VR= 20 V||0.05|0.24||
|||Tj= 85° C|||3.5|10.5||
|||Tj= 25° C|VR= 10 V||0.03|0.15||
|||Tj= 85° C|||2.4|7||
|VF (1)|Forward voltage drop|Tj= 25° C|IF= 1 A||0.33|0.39|V|
|||Tj= 85° C|||0.28|0.34||
|||Tj= 25° C|IF= 2 A||0.39|0.45||
|||Tj= 85° C|||0.36|0.42||
|||Tj= 25° C|IF= 3 A||0.45|0.53||
|||Tj= 85° C|||0.43|0.51||
|||Tj= 25° C|IF= 4 A||0.50|0.60||
|||Tj= 85° C|||0.50|0.60||



1. Pulse test: = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.26 x IF(AV) + 0.08 IF2(RMS) 

2/7 

**STPS1L30MF** 

**Characteristics** 

**Figure 1. Conduction losses versus average Figure 2. Average forward current versus current ambient temperature (** δ **= 0.5)** 

**==> picture [462 x 160] intentionally omitted <==**

**----- Start of picture text -----**<br>
PF(AV)(W) IF(AV)(A)<br>0.50 1.1<br>0.45 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 1.0 Rth(j-a)=Rth(j-c)<br>0.40 0.9<br>δ = 1 0.8<br>0.35<br>0.7<br>0.30<br>0.6 Rth(j-a)=270°C/W<br>0.25<br>0.5<br>0.20<br>0.4<br>0.15<br>0.3<br>T<br>0.10 0.2<br>0.05 IF(AV)(A) δ [=tp/T] tp 0.1 Tamb(°C)<br>0.00 0.0<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 0 25 50 75 100 125 150<br>**----- End of picture text -----**<br>


## **Figure 3. Normalized avalanche power derating versus pulse duration** 

**Figure 4. Normalized avalanche power derating versus junction temperature** 

**==> picture [462 x 160] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 PPARMARM(1µs)(tp) 1.2 PARMPARM(25°C)(tp)<br>1<br>0.1 0.8<br>0.6<br>0.01 0.4<br>0.2<br>0.001 tp(µs) 0 T (°C)j<br>0.01 0.1 1 10 100 1000 25 50 75 100 125 150<br>**----- End of picture text -----**<br>


**Figure 5. Non repetitive surge peak forward Figure 6. Relative variation of thermal current versus overload duration impedance junction to case versus (maximum values) pulse duration** 

**==> picture [462 x 160] intentionally omitted <==**

**----- Start of picture text -----**<br>
IM(A) Zth(j-c)/Rth(j-c)<br>22 1.0<br>20 0.9<br>18 0.8<br>16 0.7<br>14<br>12 TC=25°C 0.60.5 δ = 0.5<br>10<br>TC=75°C 0.4<br>8<br>6 0.3 δ = 0.2<br>TC=125°C T<br>4 IM 0.2 δ = 0.1<br>2 δ=0.5 t t(s) 0.1 Single pulse tp(s) δ [=tp/T] tp<br>0 0.0<br>1.E-03 1.E-02 1.E-01 1.E+00 1.E-04 1.E-03 1.E-02 1.E-01<br>**----- End of picture text -----**<br>


3/7 

**Characteristics** 

**STPS1L30MF** 

**Figure 7. Reverse leakage currrent versus reverse voltage applied (typical values)** 

**Figure 8. Reverse leakage currrent versus junction temperature (typical values)** 

**==> picture [462 x 160] intentionally omitted <==**

**----- Start of picture text -----**<br>
IR(mA) IR(mA)<br>1.E+03 1.E+03<br>T =150°Cj VR=30V<br>1.E+02 T =125°Cj 1.E+02<br>1.E+01 T =100°Cj 1.E+01<br>T =75°Cj<br>1.E+00 T =50°Cj 1.E+00<br>1.E-01 T =25°Cj 1.E-01<br>VR(V) T (°C)j<br>1.E-02 1.E-02<br>0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 0 25 50 75 100 125 150<br>**----- End of picture text -----**<br>


## **Figure 9. Junction capacitance versus reverse voltage applied (typical values)** 

## **Figure 10. Forward voltage drop versus forward current** 

**==> picture [462 x 160] intentionally omitted <==**

**----- Start of picture text -----**<br>
C(pF) IFM(A)<br>1000 2.0<br>F=1MHz<br>VOSC=30mVRMS 1.8<br>T =25°Cj 1.6 (maximum values)T =85°Cj<br>1.4<br>1.2 T =85°Cj<br>(typical values)<br>100 1.0<br>0.8<br>0.6 T =25°Cj<br>(maximum values)<br>0.4<br>VR(V) 0.2 VFM(V)<br>10 0.0<br>1 10 100 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50<br>**----- End of picture text -----**<br>


**Figure 11. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu=35 µm, typical values)** 

**==> picture [205 x 136] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a)(°C/W)<br>250<br>200<br>150<br>100<br>50<br>S(mm²)<br>0<br>0 20 40 60 80 100 120 140 160 180 200<br>**----- End of picture text -----**<br>


4/7 

**STPS1L30MF** 

**Package information** 

## **2 Package information** 

|**Table 4.**<br>**STmite flat**|**Table 4.**<br>**STmite flat**|**Table 4.**<br>**STmite flat**|**Table 4.**<br>**STmite flat**|**Table 4.**<br>**STmite flat**|**dimensions**|**dimensions**|**dimensions**|**dimensions**|**dimensions**||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||A<br>L1<br>L2<br>b2||**Ref.**|**Dimensions**||||||
||||||||||||**Millimeters**|||**Inches**|||
||||||||||||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|||||||||||A|0.80|0.85|0.95|0.031|0.033|0.037|
|||E1||c<br>D<br>b||L|||||||||||
||||||||||||||||||
|||||||||||b|0.40|0.55|0.65|0.016|0.022|0.026|
|||||||||||b2|0.70|0.85|1.00|0.027|0.033|0.039|
||||||L3|||||c|0.10|0.15|0.25|0.004|0.006|0.009|
|||||||||||D|1.75|1.90|2.05|0.069|0.075|0.081|
|||E|||||||||||||||
|||||||||||E|3.60|3.80|3.90|0.142|0.150|0.154|
|||||||||||E1|2.80|2.95|3.10|0.110|0.116|0.122|
|||||||||||L|0.50|0.55|0.80|0.020|0.022|0.031|
||||||||||||||||||
|||||||||||L1|2.10|2.40|2.60|0.083|0.094|0.102|
|||||||||||L2|0.45|0.60|0.75|0.018|0.024|0.030|
|||||||||||L3|0.20|0.35|0.50|0.008|0.014|0.020|



## **Figure 12. STmite flat recommended footprint (all dimensions in mm)** 

**==> picture [194 x 93] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.85 0.63 2.00 0.65<br>0.65 0.95 1.95<br>4.13<br>**----- End of picture text -----**<br>


In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 

5/7 

**Ordering information** 

**STPS1L30MF** 

## **3 Ordering information** 

|**Part number**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS1L30MF|F1L3|STmite flat|16 mg|12000|Tape and reel|



## **4 Revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|21-Aug-2006|1|First issue.|



6/7 

**STPS1L30MF** 

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7/7 



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- [Supplier page](https://es.farnell.com/stmicroelectronics/stps1l30mf/schottky-rectifier-40v-3a-do-222aa/dp/4035971)
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