# Schottky Rectifier, 45 V, 7.5 A, Dual Common Cathode, TO-252 (DPAK), 3 Pins, 520 mV

![Product image](https://novapart.co/image/farnell:9907408/)

**URL**: https://novapart.co/products/STPS15L45CB/schottky-rectifier-45-v-75-a-dual-common-cathode
**SKU**: STPS15L45CB
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.3010
**Stock**: 1000+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:45V; Forward Current If(AV):7.5A; Diode Configuration:Dual Common Cathode; Diode Case Style:TO-252; No. of Pins:3Pins; Forward Voltage VF Max:520mV; Forward

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | TO-252 (DPAK) |
| Diode Configuration | Dual Common Cathode |
| Forward Voltage Max | 520mV |
| Forward Surge Current | 75A |
| Average Forward Current | 7.5A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 45V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:9907408/)

**STPS15L45C** 

Datasheet 

2 x 7.5 A - 45 V low drop power Schottky rectifier 

## **Features** 

**==> picture [139 x 119] intentionally omitted <==**

**----- Start of picture text -----**<br>
A1<br>K<br>A2<br>K<br>K<br>A2<br>A2<br>A1<br>A1<br>DPAK<br>**----- End of picture text -----**<br>


- Very small conduction losses 

- Negligible switching losses 

- Extremely fast switching 

- Low forward voltage drop 

- Low capacitance 

- Avalanche capability specified 

- ECOPACK2 compliant component 

## **Applications** 

- SMPS 

- Freewheeling diodes 

- Switching diodes 

## **Description** 

Dual center tab Schottky rectifier suited for SMPS and high frequency DC to DC converters. 

Packaged in DPAK, the STPS15L45C is intended for use in low voltage, high frequency inverters, freewheeling and polarity protection applications. 

## **Product status link** 

STPS15L45C 

|**Product summary**|**Product summary**|
|---|---|
|**Symbol**|**Value**|
|**IF(AV)**|2 x 7.5 A|
|**VRRM**|45 V|
|**T j(max.)**|150 °C|
|**VF(typ.)**|0.40 V|



**DS2653** - **Rev 6** - **April 2020** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STPS15L45C Characteristics** 

**1** 

## **Characteristics** 

**Table 1. Absolute ratings (limiting values, per diode, at 25 °C unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**||**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||45|V|
|IF(RMS)|Forward rms current|||10|A|
|IF(AV)|Average forward current|Tc= 140 °C, δ = 0.5 square wave|Per diode|7.5|A|
||||Per device|15||
|IFSM|Surge non repetitive forward current||tp= 10 ms sinusoidal|75|A|
|PARM|Repetitive peak avalanche power||tp= 10 µs, Tj= 125 °C|265|W|
|Tstg|Storage temperature range|||-65 to +175|°C|
|Tj|Maximum operating junction temperature(1)|||150|°C|



_1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink._ 

**Table 2. Thermal resistance parameters** 

|**Symbol**|**Parameter**||**Max. value**|**Unit**|
|---|---|---|---|---|
|Rth(j-c)|Junction to case|Per diode|4|°C/W|
|||Total|2.4||
|Rth(c)|Coupling||0.7||



When the diodes 1 and 2 are used simultaneously : 

Δ Tj(diode 1) = P(diode1) x Rth(j-c)(per diode) + P(diode 2) x Rth(c) 

For more information, please refer to the following application note : 

- AN5088 : Rectifiers thermal management, handling and mounting recommendations 

**Table 3. Static electrical characteristics (per diode)** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR(1)|Reverse leakage current|Tj= 25 °C|VR= VRRM|-||500|µA|
|||Tj= 125 °C||-|60|120|mA|
|VF(2)|Forward voltage drop|Tj= 25 °C|IF= 7.5 A|-||0.52|V|
|||Tj= 125 °C||-|0.40|0.46||
|||Tj= 25 °C|IF= 12 A|-||0.60||
|||Tj= 125 °C||-|0.49|0.57||
|||Tj= 25 °C|IF= 15 A|-||0.64||
|||Tj= 125 °C||-|0.53|0.63||



_1. Pulse test: tp = 5 ms, δ < 2%_ 

_2. Pulse test: tp = 380 μs, δ < 2%_ 

To evaluate the conduction losses, use the following equation: 

**DS2653** - **Rev 6** 

**page 2/10** 

**STPS15L45C Characteristics** 

P = 0.29 x IF(AV) + 0.023 x IF[2] (RMS) 

For more information, please refer to the following application notes related to the power losses : 

- AN604: Calculation of conduction losses in a power rectifier 

- AN4021: Calculation of reverse losses on a power diode 

**DS2653** - **Rev 6** 

**page 3/10** 

**STPS15L45C Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**Figure 1. Average forward power dissipation versus average forward current (per diode)** 

**==> picture [222 x 142] intentionally omitted <==**

**----- Start of picture text -----**<br>
PF(AV)(W)<br>5.5<br>δ = 0.5<br>5.0 δ = 0.2<br>4.5 δ = 0.1<br>4.0 δ = 0.05<br>3.5 δ = 1<br>3.0<br>2.5<br>2.0<br>1.5<br>1.0<br>0.5 IF(AV)(A)<br>δ = tp/T tp<br>0.0<br>0         1         2         3         4         5        6         7         8         9        10<br>**----- End of picture text -----**<br>


**Figure 3. Normalized avalanche power derating versus pulse duration (Tj = 125 °C)** 

**==> picture [220 x 161] intentionally omitted <==**

**----- Start of picture text -----**<br>
PARM(tp)<br>PARM(10 µs)<br>1<br>0.1<br>0.01<br>t p(µs)<br>0.001<br>1 10 100 1000<br>**----- End of picture text -----**<br>


**Figure 2. Average forward current versus ambient temperature (δ = 0.5, per diode)** 

**==> picture [209 x 141] intentionally omitted <==**

**----- Start of picture text -----**<br>
IF(AV)(A)<br>Rth(j-a) = Rth(j-c)<br>Rth(j-a) = 70 °C/W<br>T<br>Tamb(°C)<br>δ = tp/T tp<br>0              25             50            75            100           125           150<br>**----- End of picture text -----**<br>


**Figure 4. Relative variation of thermal impedance junction to case versus pulse duration** 

**==> picture [225 x 151] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-c)/Rth(j-c)<br>1.0<br>0.9<br>0.8<br>0.7<br>0.6<br>0.5<br>0.4<br>0.3<br>0.2<br>0.1 Single pulse tp(s)<br>0.0<br>  1.E-03 1.E-02 1.E-01  1.E+00<br>**----- End of picture text -----**<br>


**DS2653** - **Rev 6** 

**page 4/10** 

**STPS15L45C Characteristics (curves)** 

**==> picture [513 x 206] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 5. Reverse leakage current versus reverse voltage Figure 6. Junction capacitance versus reverse voltage<br>applied (typical values, per diode) applied (typical values, per diode)<br>IR(mA) C(nF)<br>1.E+03 10.0<br>F = 1 MHz<br>Tj = 150  ° C VOSC = 30 mV<br>1.E+02 Tj = 25 °C<br>Tj = 125 °C<br>1.E+01 T j  = 100 °C<br>Tj = 75  ° C 1.0<br>1.E+00 Tj = 50 °C<br>1.E-01 Tj = 25 °C<br>V R (V) VR(V)<br>1.E-02 0.1<br>0 5 10 15 20 25 30 35 40 45 1 10 100<br>**----- End of picture text -----**<br>


**==> picture [513 x 205] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Forward voltage drop versus forward current Figure 8. Thermal resistance junction to ambient versus<br>(per diode) copper surface under tab<br>IFM(A) Rth(j-a) (°C/W)<br>100<br>100 DPAK<br>Tj = 125 °C 90 Epoxy printed circuit board, copper thickness: 35 µm<br>(Maximum values)<br>80<br>70<br>60<br>Tj = 125 °C<br>(Typical values) 50<br>10<br>40<br>Tj = 25 °C 30<br>(Maximum values) 20<br>10<br>VFM(V) S Cu (cm²)<br>0<br>1<br>0 5 10 15 20 25 30 35 40<br>0.0           0.2           0.4           0.6           0.8           1.0           1.2           1.4           1.6           1.8<br>**----- End of picture text -----**<br>


**DS2653** - **Rev 6** 

**page 5/10** 

**STPS15L45C Package information** 

**2** 

## **Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **2.1** 

## **DPAK package information** 

- Epoxy meets UL 94,V0 

- Cooling method: by conduction (C) 

**Figure 9. DPAK package outline** 

**==> picture [353 x 315] intentionally omitted <==**

**----- Start of picture text -----**<br>
E<br>A<br>b4<br>c2<br>Thermal pad<br>E1<br>L2<br>D1<br>D<br>H R<br>L4<br>A1<br>b R<br>e<br>e1 c<br>A2<br>L1<br>L<br>V2<br>G auge<br>0.25 plane<br>**----- End of picture text -----**<br>


_Note:_ 

_This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed._ 

**DS2653** - **Rev 6** 

**page 6/10** 

**STPS15L45C DPAK package information** 

**Table 4. DPAK package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches (for reference only)**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A|2.18|2.40|0.085|0.094|
|A1|0.90|1.10|0.035|0.043|
|A2|0.03|0.23|0.001|0.009|
|b|0.64|0.90|0.025|0.035|
|b4|4.95|5.46|0.194|0.215|
|c|0.46|0.61|0.018|0.024|
|c2|0.46|0.60|0.018|0.023|
|D|5.97|6.22|0.235|0.244|
|D1|4.95|5.60|0.194|0.220|
|E|6.35|6.73|0.250|0.265|
|E1|4.32|5.50|0.170|0.216|
|e|2.286 typ.||0.090 typ.||
|e1|4.40|4.70|0.173|0.185|
|H|9.35|10.40|0.368|0.409|
|L|1.0|1.78|0.039|0.070|
|L2||1.27||0.050|
|L4|0.60|1.02|0.023|0.040|
|V2|-8°|+8°|-8°|+8°|



**Figure 10. DPAK recommended footprint (dimensions in mm)** 

**==> picture [296 x 177] intentionally omitted <==**

**----- Start of picture text -----**<br>
12.7<br>6.7 3.0 3.0<br>A<br>4.572<br>6.7<br>B<br>1.6<br>The device must be positioned within 0.05 AB<br>**----- End of picture text -----**<br>


**DS2653** - **Rev 6** 

**page 7/10** 

**STPS15L45C Ordering Information** 

## **3 Ordering Information** 

**Table 5. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS15L45CB|S15L45C|DPAK|0.35 g|75|Tube|
|STPS15L45CB-TR||||2500|Tape and reel|



**DS2653** - **Rev 6** 

**page 8/10** 

**STPS15L45C** 

## **Revision history** 

**Table 6. Document revision history** 

|**Date**|**Version**|**Changes**|
|---|---|---|
|10-Mar-2011|2|Automatic revalidation date workflow started.|
|07-Jul-2015|3|Updated DPAK package information and reformatted to current standard.<br>Removed IPAK.|
|29-Nov-2018|4|Updated DPAK package information and reformatted to current standard.|
|09-Aug-2019|5|AddedSection  Applications. UpdatedTable 3,Figure 4andTable 5.|
|02-Apr-2020|6|UpdatedFigure 5.|



**DS2653** - **Rev 6** 

**page 9/10** 

**STPS15L45C** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2020 STMicroelectronics – All rights reserved 

**DS2653** - **Rev 6** 

**page 10/10** 



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