# Schottky Rectifier, 30 V, 15 A, Dual Common Cathode, PowerFLAT, 8 Pins, 570 mV

![Product image](https://novapart.co/image/farnell:4860877RL/)

**URL**: https://novapart.co/products/STPS15L30CDJFTR/schottky-rectifier-30-v-15-a-dual-common-cathode
**SKU**: STPS15L30CDJFTR
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.4040
**Stock**: 200+
**Lead Time**: 124 days (indicative)

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4860877RL/)

**STPS15L30CDJF** 

Datasheet 

## 30 V, 15 A high efficiency PowerFLAT power Schottky diode 

## **Features** 

- Low forward voltage drop 

- Very low conduction losses 

- Negligible switching losses 

- Extremely fast switching 

- Low thermal resistance 

- Avalanche rated 

- High integration 

- Thin package: 1 mm 

- ECOPACK2 compliant 

## **Applications** 

- Switching diode 

- SMPS 

- DC/DC converter 

- Telecom power 

## **Description** 

**Product status link** STPS15L30CDJF 

This dual center tap Schottky rectifier is ideally suited for switch mode power supply and high frequency DC to DC converters. 

Packaged in PowerFLAT 5x6, the STPS15L30CDJF is optimized for use in low voltage high frequency inverters, free-wheeling and polarity protection applications. Its low profile was especially designed to be used in applications with space-saving constraints. 

|**Product summary**|**Product summary**|
|---|---|
|**Symbol**|**Value**|
|**IF(AV)**|2 X 7.5 A|
|**VRRM**|30 V|
|**Tj (max.)**|150 °C|
|**VF (typ.)**|0.34 V|



**DS6250** - **Rev 5** - **March 2023** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STPS15L30CDJF Characteristics** 

**1 Characteristics** 

**Table 1. Absolute ratings (limiting values, per diode)** 

|**Symbol**|**Parameter**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||30|V|
|IF(RMS)|Forward rms current|||10|A|
|IF(AV)|Average forward current, δ = 0.5<br>square wave|Tc= 140 °C|Per diode|7.5|A|
|||Tc= 135 °C|Per device|15||
|IFSM|Surge non repetitive forward current|tp= 10 ms sinusoidal||75|A|
|PARM|Repetitive peak avalanche power|tp= 10 µs, Tj= 125 °C||200|W|
|Tstg|Storage temperature range|||-65 to +175|°C|
|Tj|Maximum operating junction temperature(1)|||+150|°C|



_1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink._ 

**Table 2. Thermal resistance parameters** 

|**Symbol**|**Parameter**||**Max.**|**Unit**|
|---|---|---|---|---|
|Rth(j-c)|Junction to case|Per diode|2.5|°C/W|
|||Per device|1.6||
|Rth(c)|Coupling||0.7||



When the diodes 1 and 2 are used simultaneously : Δ Tj(diode 1) = P(diode1) x Rth(j-c)(per diode) + P(diode 2) x Rth(c) 

For more information, please refer to the following application note : 

- AN5046: Printed circuit board assembly recommendations for STMicroelectronics PowerFLAT packages 

**Table 3. Static electrical characteristics (per diode)** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR(1)|Reverse leakage current|Tj= 25 °C|VR= 30 V|-||1|mA|
|||Tj= 125 °C||-|70|140|mA|
|VF(1)|Forward voltage drop|Tj= 25 °C|IF= 7.5 A|-||0.48|V|
|||Tj= 125 °C||-|0.34|0.39||
|||Tj= 25 °C|IF= 15 A|-||0.57||
|||Tj= 125 °C||-|0.44|0.51||



_1. Pulse test: tp = 380 µs, δ < 2%_ 

To evaluate the conduction losses, use the following equation: P = 0.27 x IF(AV) + 0.016 x IF[2] (RMS) 

For more information, please refer to the following application notes related to the power losses: 

- AN604: Calculation of conduction losses in a power rectifier 

- AN4021: Calculation of reverse losses in a power diode 

**DS6250** - **Rev 5** 

**page 2/9** 

**STPS15L30CDJF Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**==> picture [513 x 191] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient<br>average forward current (per diode) temperature (δ = 0.5, per diode)<br>PF(AV)(W) IF(AV)(A)<br>4.5 9<br>δ = 1<br>4.0 δ = 0.5 8 Rth(j-a) = Rth(j-c)<br>3.5 7<br>δ = 0.2<br>3.0 δ = 0.1 6<br>δ = 0.05<br>2.5 5<br>2.0 4<br>1.5 3<br>1.0 T 2 T<br>0.5 IF(AV)(A ) δ [=tp/T] tp 1 δ [=tp/T] tp Tamb(°C)<br>0.0 0<br>0 1 2 3 4 5 6 7 8 9 10 0 25 50 75 100 125 150<br>**----- End of picture text -----**<br>


**Figure 3. Normalized avalanche power derating versus pulse duration** 

**==> picture [224 x 152] intentionally omitted <==**

**----- Start of picture text -----**<br>
PARM(tp)<br>1 PARM(10 µs)<br>0.1<br>0.01<br>t p(µs)<br>0.001<br>1 10 100 1000<br>**----- End of picture text -----**<br>


**Figure 4. Relative variation of thermal impedance junction to case versus pulse duration** 

**==> picture [221 x 153] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-c)/Rth(j-c)<br>1.0<br>0.9<br>0.8<br>0.7<br>0.6<br>0.5<br>0.4<br>0.3<br>0.2<br>0.1 Single pulse tp(s)<br>0.0<br>1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00<br>**----- End of picture text -----**<br>


**==> picture [513 x 192] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 5. Reverse leakage current versus reverse voltage Figure 6. Junction capacitance versus reverse voltage<br>applied (typical values, per diode) applied (typical values, per diode)<br>IR(mA) C(pF)<br>1.E+03 1000<br>F = 1 MHz<br>TC = 150 °C VOSC = 30 mVRMS<br>Tj = 25 °C<br>1.E+02 TC = 125 °C<br>1.E+01 TC = 100 °C<br>TC = 75 °C<br>1.E+00<br>TC = 50 °C<br>1.E-01 TC = 25 °C<br>VR(V) VR(V)<br>1.E-02 100<br>0 5 10 15 20 25 30 1 10 100<br>**----- End of picture text -----**<br>


**DS6250** - **Rev 5** 

**page 3/9** 

**STPS15L30CDJF Characteristics (curves)** 

**Figure 7. Forward voltage drop versus forward current Figure 8. Thermal resistance junction to ambient versus (per diode) copper surface under tab (typical values)** 

**==> picture [476 x 152] intentionally omitted <==**

**----- Start of picture text -----**<br>
IFM(A )<br>20 Rth(j-a)(°C/W)<br>18 120<br>Tj = 25 °C PowerFlat_5X6<br>16 (Maximum values) 100 epoxy printed board FR4, ecu = 70 µm<br>14<br>80<br>12<br>Tj = 125 °C<br>10 (Maximum values) 60<br>8<br>Tj = 125 °C 40<br>6 (Typical values)<br>4 20<br>2 SCu(cm²)<br>VFM (V ) 0<br>0 0 1 2 3 4 5 6 7 8 9 10<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6<br>**----- End of picture text -----**<br>


**DS6250** - **Rev 5** 

**page 4/9** 

**STPS15L30CDJF Package information** 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **2.1 PowerFLAT 5x6 package information** 

- Epoxy meets UL 94,V0 

- Cooling method: by conduction (C) 

**Figure 9. PowerFLAT 5x6 package outline (non-contractual)** 

**==> picture [118 x 140] intentionally omitted <==**

**==> picture [66 x 293] intentionally omitted <==**

**----- Start of picture text -----**<br>
Bottom view<br>Side view<br>Top view<br>**----- End of picture text -----**<br>


_Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed._ 

**DS6250** - **Rev 5** 

**page 5/9** 

**STPS15L30CDJF PowerFLAT 5x6 package information** 

**Table 4. PowerFLAT 5x6 mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Rf**|**Millimeters**|||**Inches (for reference only)**|||
|**e**|**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.80||1.00|0.031||0.039|
|A1|0.00||0.05|0.000||0.002|
|b|0.30||0.50|0.01||0.02|
|c||0.25|||0.010||
|D|4.80||5.40|0.189||0.212|
|D2|3.91||4.45|0.154||0.175|
|e||1.27|||0.050||
|E|5.90||6.35|0.232||0.250|
|E2|3.34||3.70|0.138||0.146|
|L|0.50||0.80|0.020||0.031|
|K|1.10||1.575|0.015||0.023|
|L1|0.05|0.15|0.25|0.002|0.006|0.009|



**Figure 10. PowerFLAT 5x6 recommended footprint (dimensions are in mm)** 

_Note: For packing information, please refer to TN1173._ 

**DS6250** - **Rev 5** 

**page 6/9** 

**STPS15L30CDJF Ordering information** 

**3 Ordering information** 

## **Table 5. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS15L30CDJFTR|PS15 L30C|PowerFLAT 5x6|0.095 g|3000|Tape and reel|



**DS6250** - **Rev 5** 

**page 7/9** 

**STPS15L30CDJF** 

## **Revision history** 

**Table 6. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|13-May-2009|1|First issue.|
|09-Nov-2009|2|Updated Table 1.|
|30-Jul-2010|3|Replace Power QFN with PowerFLAT. Updated Figure 9.|
|18-May-2011|4|Added reference E in Table 5. Updated package graphics.<br>Removed dash from order code and updated marking in Table 6.<br>Added Figure 12.|
|15-Mar-2023|5|Updated cover image andSection 2.1  PowerFLAT 5x6 package information.|



**DS6250** - **Rev 5** 

**page 8/9** 

**STPS15L30CDJF** 

## **IMPORTANT NOTICE – READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

- © 2023 STMicroelectronics – All rights reserved 

**DS6250** - **Rev 5** 

**page 9/9** 



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