# Schottky Rectifier, 40 V, 1 A, Single, DO-214AA (SMB), 2 Pins, 500 mV

![Product image](https://novapart.co/image/farnell:1467548/)

**URL**: https://novapart.co/products/STPS140U/schottky-rectifier-40-v-1-a-single-do-214aa-smb-2
**SKU**: STPS140U
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.0710
**Stock**: 1000+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:40V; Forward Current If(AV):1A; Diode Configuration:Single; Diode Case Style:DO-214AA; No. of Pins:2Pins; Forward Voltage VF Max:500mV; Forward Surge Cur

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | STPS1 |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | DO-214AA (SMB) |
| Diode Configuration | Single |
| Forward Voltage Max | 500mV |
| Forward Surge Current | 60A |
| Average Forward Current | 1A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 40V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1467548/)

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## **STPS140** 

## POWER SCHOTTKY RECTIFIER 

**Table 1: Main Product Characteristics** 

|**IF(AV)**|**1 A**|
|---|---|
|**VRRM**|**40 V**|
|**Tj (max)**|**150°C**|
|**VF(max)**|**0.5 V**|



## **FEATURES AND BENEFITS** 

- Very small conduction losses 

- Negligible switching losses 

- Low forward voltage drop 

- Surface mount miniature packages 

- Avalanche capability specified 

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SMA SMB<br>(JEDEC DO-214AC) (JEDEC DO-214AA)<br>STPS140A STPS140U<br>**----- End of picture text -----**<br>


## **DESCRIPTION** 

Single chip Schottky rectifiers suited to Switched Mode Power Supplies and high frequency DC to DC converters. 

Packaged in SMA and SMB, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. 

**Table 2: Order Codes** 

|**Table 2: Order Codes**||
|---|---|
|**Part Number**|**Marking**|
|STPS140A|S140|
|STPS140U|G14|



**Table 3: Absolute Ratings** (limiting values) 

|**Symbol**|**Parameter**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||40|V|
|IF(RMS)|RMS forward voltage|||7|A|
|IF(AV)|Average forward current|SMA|TL= 130°Cδ= 0.5|1|A|
|||SMB|TL= 135°Cδ= 0.5|||
|IFSM|Surge non repetitive forward current||tp = 10ms sinusoidal|60|A|
|IRRM|Repetitive peak reverse current||tp = 2µs   F = 1kHz square|1|A|
|IRSM|Non repetitive peak reverse current||tp = 100µs square|1|A|
|PARM|Repetitive peak avalanche power||tp = 1µs   Tj = 25°C|900|W|
|Tstg|Storage temperature range|||-65 to + 150|°C|
|Tj|Maximum operating junction temperature *|||150|°C|
|dV/dt|Critical rate of rise of reverse voltage|||10000|V/µs|
|* :<br>thermal runaway condition for a diode on its own heatsink<br>dPtot<br>dTj<br>---------------<br>1<br>Rth j<br>a<br>–<br>(<br>)<br>------------------------**-**<br>>||||||



1/7 

August 2004 

REV. 8 

**STPS140** 

**Table 4: Thermal Resistance** 

|**Symbol**|**Parameter**||**Value**<br>|**Unit**|
|---|---|---|---|---|
|Rth(j-l)<br>Junction to le|ad|SMA|30<br>°<br>25|C/W|
|||SMB|||



**Table 5: Static Electrical Characteristics** 

|**Symbol**<br>**Param**|**eter**<br>**Tests conditions**|**eter**<br>**Tests conditions**|**Min.**|**Typ**|**Max.**<br>|**Unit**|
|---|---|---|---|---|---|---|
|IR*<br>Reverse leak|age current<br>Tj= 25°C<br>Tj= 100°C|VR= VRRM|||12|µA|
|||||0.25|2<br>|mA|
|VF**<br>Forward volta|ge drop<br>Tj= 25°C<br>Tj= 125°C<br>Tj= 25°C<br>Tj= 125°C|IF= 1A|||0.55<br>0.45<br>0.65<br>0.6|V|
|||||0.43|||
|||IF= 2A|||||
|||||0.53|||



Pulse test: *  tp = 5 ms, δ < 2% ** tp = 380 µs, δ < 2% 

2 To evaluate the conduction losses use the following equation: P = 0.4 x IF(AV) + 0.10 IF (RMS) 

**Figure 1: Average forward power dissipation versus average forward current** 

**Figure 2: Average forward current versus ambient temperature (** δ **= 0.5)** 

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PF(AV)(W)<br>0.7<br>δ = 0.1 δ = 0.2 δ = 0.5<br>0.6 δ = 0.05<br>0.5<br>δ = 1<br>0.4<br>0.3<br>0.2 T<br>0.1<br>IF(AV)(A) δ [=tp/T] tp<br>0.0<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>**----- End of picture text -----**<br>


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IF(AV)(A)<br>1.2<br>Rth(j-a)=Rth(j-I)<br>1.0<br>SMA<br>0.8 RS(CU)th(j-a)=1.5cm=100°C/W2<br>0.6 SMB<br>RS(CU)th(j-a)=1.5cm=80°C/W2<br>0.4<br>T<br>0.2<br>δ [=tp/T] tp Tamb(°C)<br>0.0<br>0 25 50 75 100 125 150<br>**----- End of picture text -----**<br>


**Figure 3: Normalized avalanche power derating versus pulse duration** 

**Figure 4: Normalized avalanche power derating versus junction temperature** 

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PARM(tp)<br>PARM(1µs)<br>1<br>0.1<br>0.01<br>0.001 tp(µs)<br>0.01 0.1 1 10 100 1000<br>**----- End of picture text -----**<br>


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PARM(tp)<br>PARM(25°C)<br>1.2<br>1<br>0.8<br>0.6<br>0.4<br>0.2<br>T (°C)j<br>0<br>25 50 75 100 125 150<br>**----- End of picture text -----**<br>


2/7 

**STPS140** 

**Figure 5: Non repetitive surge peak forward current versus overload duration (maximum values) (SMA)** 

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IM(A)<br>8<br>7<br>6<br>5 Ta=25°C<br>4<br>3 Ta=50°C<br>2 IM Ta=100°C<br>1 t<br>δ=0.5 t(s)<br>0<br>1E-3 1E-2 1E-1 1E+0<br>**----- End of picture text -----**<br>


**Figure 7: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy printed circuit board, e(Cu)=35µm, recommended pad layout) (SMA)** 

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Zth(j-c)/Rth(j-c)<br>1.0<br>0.9<br>0.8<br>0.7<br>0.6 δ = 0.5<br>0.5<br>0.4<br>0.3 δ = 0.2 T<br>0.2 δ = 0.1<br>0.1 Single pulse tp(s) δ [=tp/T] tp<br>0.0<br>1E-2 1E-1 1E+0 1E+1 1E+2<br>**----- End of picture text -----**<br>


**Figure 9: Reverse leakage current versus reverse voltage applied  (typical values)** 

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IR(µA)<br>1E+3<br>T =125°Cj<br>1E+2<br>T =75°Cj<br>1E+1<br>1E+0<br>T =25°Cj<br>1E-1<br>VR(V)<br>1E-2<br>0 5 10 15 20 25 30 35 40<br>**----- End of picture text -----**<br>


**Figure 6: Non repetitive surge peak forward current versus overload duration (maximum values) (SMB)** 

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**----- Start of picture text -----**<br>
IM(A)<br>8<br>7<br>6<br>5 Ta=25°C<br>4<br>Ta=50°C<br>3<br>2 IM Ta=100°C<br>1 t<br>δ=0.5 t(s)<br>0<br>1E-3 1E-2 1E-1 1E+0<br>**----- End of picture text -----**<br>


**Figure 8: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy printed circuit board, e(Cu)=35µm, recommended pad layout) (SMB)** 

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Zth(j-c)/Rth(j-c)<br>1.0<br>0.9<br>0.8<br>0.7<br>0.6 δ = 0.5<br>0.5<br>0.4<br>0.3 δ = 0.2 T<br>0.2 δ = 0.1<br>0.1 Single pulse tp(s) δ [=tp/T] tp<br>0.0<br>1E-2 1E-1 1E+0 1E+1 1E+2 1E+3<br>**----- End of picture text -----**<br>


**Figure 10: Junction capacitance versus reverse voltage applied (typical values)** 

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C(pF)<br>200<br>F=1MHz<br>T =25°Cj<br>100<br>50<br>20<br>VR(V)<br>10<br>1 2 5 10 20 50<br>**----- End of picture text -----**<br>


3/7 

**STPS140** 

**Figure 11: Forward voltage drop versus forward current (maximum values)** 

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IFM(A)<br>1E+1<br>T =125°Cj<br>1E+0<br>1E-1<br>VFM(V)<br>1E-2<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0<br>**----- End of picture text -----**<br>


**Figure 12: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) (SMA)** 

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Rth(j-a)(°C/W)<br>140<br>P=1.5W<br>120<br>100<br>80<br>60<br>40<br>20<br>S(Cu)(cm²)<br>0<br>0 1 2 3 4 5<br>**----- End of picture text -----**<br>


**Figure 13: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) (SMB)** 

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**----- Start of picture text -----**<br>
Rth(j-a)(°C/W)<br>120<br>P=1.5W<br>100<br>80<br>60<br>40<br>20<br>S(Cu)(cm²)<br>0<br>0 1 2 3 4 5<br>**----- End of picture text -----**<br>


4/7 

**STPS140** 

**Figure 14: SMA Package Mechanical Data** 

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E1<br>D<br>E<br>A1<br>C A2<br>L b<br>**----- End of picture text -----**<br>


|**REF.**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|
|---|---|---|---|---|
||**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A1|1.90|2.03|0.075|0.080|
|A2|0.05|0.20|0.002|0.008|
|b|1.25|1.65|0.049|0.065|
|c|0.15|0.41|0.006|0.016|
|E|4.80|5.60|0.189|0.220|
|E1|3.95|4.60|0.156|0.181|
|D|2.25|2.95|0.089|0.116|
|L|0.75|1.60|0.030|0.063|



**Figure 15: SMA Foot Print Dimensions** (in millimeters) 

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1.65<br>1.45 2.40 1.45<br>**----- End of picture text -----**<br>


5/7 

**STPS140** 

**Figure 16: SMB Package Mechanical Data** 

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E1<br>D<br>E<br>A1<br>C A2<br>L b<br>**----- End of picture text -----**<br>


|**REF.**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|
|---|---|---|---|---|
||**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A1|1.90|2.45|0.075|0.096|
|A2|0.05|0.20|0.002|0.008|
|b|1.95|2.20|0.077|0.087|
|c|0.15|0.41|0.006|0.016|
|E|5.10|5.60|0.201|0.220|
|E1|4.05|4.60|0.159|0.181|
|D|3.30|3.95|0.130|0.156|
|L|0.75|1.60|0.030|0.063|



**Figure 17: SMB Foot Print Dimensions** (in millimeters) 

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2.3<br>1.52 2.75 1.52<br>**----- End of picture text -----**<br>


6/7 

**STPS140** 

**Table 6: Ordering Information** 

|**Ordering type**|**Marking**|**Package**|**Weight**|**Baseqty**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS140A|S140|SMA|0.068g|5000|Tape & reel|
|STPS140U|G14|SMB|0.107g|2500|Tape & reel|



## ■ Band indicates cathode 

- Epoxy meets UL94, V0 

**Table 7: Revision History** 

|**Date**|**Revision**|**Description of Changes**|
|---|---|---|
|Jul-2003|7|Last update.|
|Aug-2004|8|SMA package dimensions update. Reference A1 max.<br>changed from 2.70mm (0.106inc.) to 2.03mm (0.080).|



Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners 

© 2004 STMicroelectronics - All rights reserved 

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7/7 



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