# Schottky Rectifier, 150 V, 1 A, Single, DO-214AC (SMA), 2 Pins, 820 mV

![Product image](https://novapart.co/image/farnell:3129776/)

**URL**: https://novapart.co/products/STPS1150AY/schottky-rectifier-150-v-1-a-single-do-214ac-sma-2
**SKU**: STPS1150AY
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.0960
**Stock**: 200+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:150V; Forward Current If(AV):1A; Diode Configuration:Single; Diode Case Style:DO-214AC; No. of Pins:2Pins; Forward Voltage VF Max:820mV; Forward S

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | - |
| Qualification | AEC-Q101 |
| Diode Mounting | Surface Mount |
| Diode Case Style | DO-214AC (SMA) |
| Diode Configuration | Single |
| Forward Voltage Max | 820mV |
| Forward Surge Current | 50A |
| Average Forward Current | 1A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 150V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3129776/)

**STPS1150-Y** 

Datasheet 

## Automotive power Schottky rectifier 

## **Features** 

**==> picture [58 x 66] intentionally omitted <==**

**----- Start of picture text -----**<br>
K A<br>A<br>K \<br>SMA<br>**----- End of picture text -----**<br>


- AEC-Q101 qualified 

- Negligible switching losses 

- Low forward voltage drop for higher efficiency and extended battery life 

- Low thermal resistance 

- Surface mount miniature package 

- Avalanche capability specified 

- ECOPACK[®] 2 compliant component 

- PPAP capable 

## **Description** 

This 150 V power Schottky rectifier is ideal for switch mode power supplies on up to 24 V rails and high frequency converters. 

Packaged in SMA, the STPS1150-Y is intended for use in ECU (Engine Control Unit) and fly-back converters in automotive applications where low drop forward voltage is required to reduce power dissipation. 

## **Product status** ~~ro~~ 

|**Product status**<br>~~ro~~|**Product status**<br>~~ro~~|
|---|---|
|STPS1150-Y||
|**Product summary**<br>~~Loo~~||
|**Symbol**<br>~~Ld~~|**Values**<br>~~d~~|
|**IF(AV)**|1 A|
|**VRRM**|150 V|
|**Tj (max)**|175 °C|
|**VF(max)**|0.67 V|



**DS7258** - **Rev 3** - **April 2018** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STPS1150-Y Characteristics** 

**1** 

## **Characteristics** 

**Table 1. Absolute ratings (limiting values, at 25 °C unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage, Tj= -40 °C to +175 °C||150|V|
|IF(RMS)|Forward rms current||15|A|
|IF(AV)|Average forward current|TL= 150 °C, δ = 0.5 square wave|1|A|
|IFSM|Surge non repetitive forward current|tp= 10 ms sinusoidal|50|A|
|PARM|Repetitive peak avalanche power|tp= 10 µs, Tj= 125 °C|108|W|
|Tstg|Storage temperature range||-65 to +175|°C|
|Tj|Operating junction temperature range(1)||-40 to +175|°C|



_1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink._ 

**Table 2. Thermal resistance parameters** 

|**Symbol**|**Parameter**|**Max. value**|**Unit**|
|---|---|---|---|
|Rth(j-l)|Junction to lead|30|°C/W|



**Table 3. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR(1)|Reverse leakage current|Tj= 25 °C|VR= VRRM|-|0.2|1.0|µA|
|||Tj= 125 °C||-|0.2|1.0|mA|
|VF(2)|Forward voltage drop|Tj= 25 °C|IF= 1 A|-|0.78|0.82|V|
|||Tj= 125 °C||-|0.62|0.67||
|||Tj= 25 °C|IF= 2 A|-|0.85|0.89||
|||Tj= 125 °C||-|0.69|0.75||



_1. tp = 5 ms, δ < 2%_ 

_2. tp = 380 μs, δ < 2%_ 

To evaluate the conduction losses, use the following equation: P = 0.59 x IF(AV) + 0.08 x IF[2] (RMS) 

**DS7258** - **Rev 3** 

**page 2/9** 

**STPS1150-Y Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**==> picture [513 x 205] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient<br>average forward current temperature (δ = 0.5)<br>0.9 PF(AV)(W) 1.2 IF(AV() A)<br>δ = 0.1 δ = 0.2 δ = 0.5<br>0.8 Rth(j-a) = Rth(j-l)<br>δ = 0.05 1.0<br>0.7<br>0.6 δ = 1 0.8<br>0.5<br>0.6<br>0.4<br>0.3 0.4<br>T<br>0.2 T<br>0.2<br>0.1 IF(AV)(A) δ =tp/T tp δ = tp/ T tp Tamb (°C)<br>0.0 0.0<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 2 5 5 0 7 5 100 125 150 175<br>**----- End of picture text -----**<br>


**Figure 3. Normalized avalanche power derating versus pulse duration (Tj = 125 °C)** 

**==> picture [193 x 142] intentionally omitted <==**

**----- Start of picture text -----**<br>
PARM(tp)<br>1 PARM(10 µs)<br>0.1<br>0.01<br>t p(µs)<br>0.001<br>1 10 100 1000<br>**----- End of picture text -----**<br>


**Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration** 

**==> picture [221 x 141] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.0 Zth(j-a)/Rth(j-a)<br>SMA<br>0.9<br>0.8<br>0.7<br>0.6<br>0.5<br>0.4<br>0.3<br>Single pulse<br>0.2<br>0.1<br>0.0 tp(s)<br>1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>**----- End of picture text -----**<br>


**==> picture [513 x 206] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 5. Reverse leakage current versus reverse voltage Figure 6. Junction capacitance versus reverse voltage<br>applied (typical values) applied (typical values)<br>IR(µA) C(pF)<br>1.E+ 04 100<br>F = 1 MHz<br>1.E+ 03 T =150°Cj VOSCT  = 25 °C= 30mVj  RMS<br>1.E+ 02 T =125°Cj<br>T =100°Cj<br>1.E+ 01<br>T =75°Cj 10<br>1.E+ 00<br>T =50°Cj<br>1.E- 01<br>T =25°Cj<br>1.E- 02<br>VR(V) VR(V)<br>1.E- 03 1<br>0 25 50 75 100 125 150 1 10 100 1000<br>**----- End of picture text -----**<br>


**DS7258** - **Rev 3** 

**page 3/9** 

**STPS1150-Y Characteristics (curves)** 

**==> picture [513 x 206] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Forward voltage drop versus forward current Figure 8. Thermal resistance junction to ambient versus<br>copper surface under each lead (SMA)<br>IFM(A)<br>3.0 Rth(j-a) (°C/W)<br>200<br>2.5 (maximum values)T =125°Cj Epoxy printed circuit copper thickness = 35 µm<br>2.0 150<br>1.5 T =125°Cj<br>(typical values)<br>100<br>1.0<br>T =25°Cj<br>(maximum values)<br>0.5 50<br>VFM( V)<br>0.0<br>SCu(cm²)<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**DS7258** - **Rev 3** 

**page 4/9** 

**STPS1150-Y Package information** 

**2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

## **2.1 SMA package information** 

- Band shows cathode 

- Epoxy meets UL94, V0 

**Figure 9. SMA package outline** 

**==> picture [236 x 164] intentionally omitted <==**

**----- Start of picture text -----**<br>
E1<br>D<br>E<br>A1<br>C A2<br>L b<br>**----- End of picture text -----**<br>


**Table 4. SMA package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A1|1.90|2.45|0.075|0.097|
|A2|0.05|0.20|0.002|0.008|
|b|1.25|1.65|0.049|0.065|
|c|0.15|0.40|0.006|0.016|
|D|2.25|2.90|0.089|0.114|
|E|4.80|5.35|0.189|0.211|
|E1|3.95|4.60|0.156|0.181|
|L|0.75|1.50|0.030|0.059|



**DS7258** - **Rev 3** 

**page 5/9** 

**STPS1150-Y SMA package information** 

## **Figure 10. SMA recommended footprint in mm (inches)** 

**==> picture [256 x 127] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.4 2.63 1.4<br>(0.055) (0.104) (0.055)<br>1.64<br>(0.065)<br>5.43<br>(0.214)<br>**----- End of picture text -----**<br>


**DS7258** - **Rev 3** 

**page 6/9** 

**STPS1150-Y Ordering Information** 

**3 Ordering Information** 

**Table 5. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS1150AY|1150Y|SMA|0.068 g|5000|Tape and reel|



**DS7258** - **Rev 3** 

**page 7/9** 

**STPS1150-Y** 

## **Revision history** 

## **Table 6. Document revision history** 

|**Date**|**Version**|**Changes**|
|---|---|---|
|02-Nov-2011|1|Initial release.|
|02-May-2012|2|Updated Table 3.|
|16-Apr-2018|3|UpdatedFigure 3. Normalized avalanche power derating versus pulse<br>duration (Tj= 125 °C),Table 2. Thermal resistance parametersandTable<br>1. Absolute ratings (limiting values, at 25 °C unless otherwise specified).<br>Removed figure 4 and figure 5.|



**DS7258** - **Rev 3** 

**page 8/9** 

**STPS1150-Y** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

- © 2018 STMicroelectronics – All rights reserved 

**DS7258** - **Rev 3** 

**page 9/9** 



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