# Schottky Rectifier, 150 V, 1 A, Single, DO-41 (DO-204AL), 2 Pins, 670 mV

![Product image](https://novapart.co/image/farnell:1467546/)

**URL**: https://novapart.co/products/STPS1150/schottky-rectifier-150-v-1-a-single-do-41-204al-2
**SKU**: STPS1150
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.0750
**Stock**: 50+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:150V; Forward Current If(AV):1A; Diode Configuration:Single; Diode Case Style:DO-41 (DO-204AL); No. of Pins:2Pins; Forward Voltage VF Max:670mV; Forward S

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | STPS1 |
| Qualification | - |
| Diode Mounting | Through Hole |
| Diode Case Style | DO-41 (DO-204AL) |
| Diode Configuration | Single |
| Forward Voltage Max | 670mV |
| Forward Surge Current | 50A |
| Average Forward Current | 1A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 150V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1467546/)

**STPS1150** 

Datasheet 

150 V, 1 A power Schottky rectifier 

## **Features** 

- Negligible switching losses 

- Low forward voltage drop for higher efficiency and extended battery life 

- Low thermal resistance 

- Surface mount miniature package 

- Avalanche capability 

- ECOPACK2 compliant component 

## **Applications** 

- Switching diode 

- SMPS 

- DC/DC converter 

- Telecom power 

## **Description** 

This 150 V power Schottky rectifier is ideal for switch mode power supplies on up to 24 V rails and high frequency converters. 

Packaged in SMA, SMA Flat Notch and axial, the STPS1150 is optimized for use in consumer and computer applications where low drop forward voltage is required to reduce power dissipation. 

**Product status** STPS1150 

|**Product summary**|**Product summary**|
|---|---|
|**Symbol**|**Values**|
|**IF(AV)**|1 A|
|**VRRM**|150 V|
|**Tj (max.)**|175 °C|
|**VF(typ.)**|0.62 V|



**DS3281** - **Rev 8** - **September 2019** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STPS1150 Characteristics** 

**1** 

## **Characteristics** 

**Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||150|V|
|IF(RMS)|Forward rms current|||15|A|
|IF(AV)|Average forward current δ =<br>0.5, square wave|SMA|TL= 150 °C|1|A|
|||SMA Flat Notch|TL= 160 °C|||
|||DO-41|TL= 150 °C|||
|IFSM|Surge non repetitive forward<br>current|SMA|tp= 10 ms sinusoidal|50|A|
|||SMA Flat Notch||50||
|||DO-41||75||
|PARM|Repetitive peak avalanche<br>power|tp= 10 µs, Tj= 125 °C||108|W|
|Tstg|Storage temperature range|||-65 to + 175|°C|
|Tj|Maximum operating junction temperature(1)|||+ 175|°C|



_1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink._ 

**Table 2. Thermal resistance parameter** 

|**Symbol**|**Parameter**|**Parameter**||**Max. value**|**Unit**|
|---|---|---|---|---|---|
|Rth(j-l)|Junction to lead||SMA|30|°C/W|
||||SMA Flat Notch|20||
||Junction to lead|Lead length = 10 mm|DO-41|30||



For more information, please refer to the following application note : 

- AN5088 : Rectifiers thermal management, handling and mounting recommendations 

**Table 3. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR(1)|Reverse leakage<br>current|Tj= 25 °C|VR= VRRM|-|0.2|1.0|µA|
|||Tj= 125 °C||-|0.2|1.0|mA|
|VF(2)|Forward voltage<br>drop|Tj= 25 °C|IF= 1 A|-|0.78|0.82|V|
|||Tj= 125 °C||-|0.62|0.67||
|||Tj= 25 °C|IF= 2 A|-|0.85|0.89||
|||Tj= 125 °C||-|0.69|0.75||



_1. Pulse test: tp = 5 ms, δ < 2%_ 

_2. Pulse test: tp = 380 µs, δ < 2%_ 

To evaluate the conduction losses use the following equation: P = 0.59 x IF(AV) + 0.08 IF[2] (RMS) 

**DS3281** - **Rev 8** 

**page 2/13** 

**STPS1150 Characteristics (curves)** 

For more information, please refer to the following application notes related to the power losses : 

- AN604: Calculation of conduction losses in a power rectifier 

- AN4021: Calculation of reverse losses on a power diode 

## **1.1 Characteristics (curves)** 

**Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient average forward current temperature (δ = 0.5)** 

**==> picture [479 x 151] intentionally omitted <==**

**----- Start of picture text -----**<br>
PF(AV)(W) IF(AV)(A)<br>0.9 1.2<br>δ = 0.1 δ = 0.2 δ = 0.5 Rth(j-a) = Rth(j-l)<br>0.8 SMA / DO-41<br>δ = 0.05 1.0<br>0.7<br>0.6 δ = 1 0.8<br>Rth(j-a) = 120 °C/W<br>0.5<br>0.6<br>0.4<br>0.3 0.4<br>0.2 T T<br>0.2<br>0.1 IF(AV)(A) δ =tp/T tp δ=tp/T tp Tamb(°C)<br>0.0 0.0<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 25 50 75 100 125 150 175<br>**----- End of picture text -----**<br>


**==> picture [513 x 205] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 4. Relative variation of thermal impedance junction<br>Figure 3. Normalized avalanche power derating versus<br>to ambient versus pulse duration (SMA)<br>pulse duration (Tj = 125 °C)<br>1 PARMPARM(10 µs)(tp) 1.0 Zth(j-a)/Rth(j-a) SMA<br>0.9<br>0.8<br>0.7<br>0.1<br>0.6<br>0.5<br>0.4<br>0.01 0.3<br>Single pulse<br>0.2<br>0.001 t p(µs) 0.10.0 tp(s)<br>1 10 100 1000 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>**----- End of picture text -----**<br>


**DS3281** - **Rev 8** 

**page 3/13** 

**STPS1150 Characteristics (curves)** 

**Figure 5. Relative variation of thermal impedance junction Figure 6. Reverse leakage current versus reverse voltage to ambient versus pulse duration (DO-41) applied (typical values)** 

**==> picture [478 x 149] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-a)/Rth(j-a) IR(µA)<br>1.0 1.E+ 04<br>DO-41<br>0.9<br>1.E+ 03<br>0.8 T =150°Cj<br>0.7 1.E+ 02 T =125°Cj<br>0.6 T =100°Cj<br>1.E+ 01<br>0.5 T =75°Cj<br>1.E+ 00<br>0.4 T =50°Cj<br>0.3 1.E- 01<br>T =25°Cj<br>0.2<br>0.1 Single pulse 1.E- 02<br>tp(s) VR(V)<br>0.0 1.E- 03<br>1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 0 25 50 75 100 125 150<br>**----- End of picture text -----**<br>


**==> picture [513 x 205] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Junction capacitance versus reverse voltage<br>Figure 8. Forward voltage drop versus forward current<br>applied (typical values)<br>IF(A)<br>C(pF) 3.0<br>100<br>F = 1 MHz<br>VOSCT  = 25 °C= 30mVj  RMS 2.5 (maximum values)T= 125°Cj<br>2.0<br>1.5 T= 125°Cj<br>10 (typical values)<br>1.0<br>T= 25°Cj<br>(maximum values)<br>0.5<br>VR(V) 0.0 VF(V)<br>1<br>0.0 0 .1 0.2 0 .3 0.4 0 .5 0.6 0 .7 0.8 0 .9 1.0<br>1 10 100 1000<br>**----- End of picture text -----**<br>


**Figure 9. Thermal resistance junction to ambient versus copper surface under each lead (SMA)** 

**==> picture [226 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a) (°C/W)<br>200<br>Epoxy printed circuit copper thickness = 35 µm<br>150<br>100<br>50<br>SCu(cm²)<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**Figure 10. Thermal resistance versus lead length (DO-41)** 

**==> picture [223 x 148] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(°C/W)<br>120<br>Rth(j-a)<br>100<br>80<br>60<br>Rth(j-I)<br>40<br>20<br>Lleads(mm)<br>0<br>5 10 15 20 25<br>**----- End of picture text -----**<br>


**DS3281** - **Rev 8** 

**page 4/13** 

**STPS1150 Characteristics (curves)** 

## **Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat Notch)** 

**==> picture [225 x 151] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a) (°C/W)<br>200<br>Epoxy printed circuit board FR4,copper thickness: 35 µm<br>SMA Flat Notch<br>150<br>100<br>50<br>S(Cu)(cm²)<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**DS3281** - **Rev 8** 

**page 5/13** 

**STPS1150 Package information** 

**2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **2.1** 

## **SMA package information** 

- Epoxy meets UL 94, V0 

- Cooling method : by conduction (C) 

**Figure 12. SMA package outline** 

**==> picture [280 x 195] intentionally omitted <==**

**----- Start of picture text -----**<br>
E1<br>D<br>E<br>A1<br>C A2<br>L b<br>**----- End of picture text -----**<br>


**Table 4. SMA package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches (for reference only)**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A1|1.90|-|2.45|0.075|-|0.097|
|A2|0.05|-|0.20|0.002|-|0.008|
|b|1.25|-|1.65|0.049|-|0.065|
|C|0.15|-|0.40|0.006|-|0.016|
|D|2.25|-|2.90|0.089|-|0.114|
|E|4.80|-|5.35|0.189|-|0.211|
|E1|3.95|-|4.60|0.156|-|0.181|
|L|0.75|-|1.50|0.030|-|0.059|



**DS3281** - **Rev 8** 

**page 6/13** 

**STPS1150 SMA package information** 

## **Figure 13. SMA recommended footprint in mm (inches)** 

**==> picture [231 x 115] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.4 2.63 1.4<br>(0.055) (0.103) (0.055)<br>1.64<br>(0.064)<br>5.43<br>(0.214)<br>**----- End of picture text -----**<br>


**DS3281** - **Rev 8** 

**page 7/13** 

**STPS1150 SMA Flat Notch package information** 

## **2.2 SMA Flat Notch package information** 

- Epoxy meets UL94, V0 

- Cooling method: by conduction (C) 

- Band indicates cathode 

**Figure 14. SMA Flat Notch package outline** 

**Table 5. SMA Flat Notch package mechanical data** 

|**Ref.**<br>~~=~~|**Dimensions**<br>~~ee~~<br>~~=~~|**Dimensions**<br>~~ee~~<br>~~=~~|**Dimensions**<br>~~ee~~<br>~~=~~|**Dimensions**<br>~~ee~~<br>~~=~~|**Dimensions**<br>~~ee~~<br>~~=~~|**Dimensions**<br>~~ee~~<br>~~=~~|
|---|---|---|---|---|---|---|
||**Millimeters**<br>~~es~~<br>~~=~~|||**Inches (for reference only)**<br>~~es~~<br>~~=~~|||
||**Min.**<br>~~=~~|**Typ.**<br>~~=~~|**Max.**<br>~~=~~|**Min.**<br>~~=~~|**Typ.**<br>~~=~~|**Max.**<br>~~=~~|
|A1|0.90||1.10|0.035||0.044|
|A1||0.05|||0.002||
|b|1.25||1.65|0.049||0.065|
|C|0.15||0.40|0.005||0.016|
|D|2.25||2.90|0.088||0.115|
|E|5.00||5.35|0.196||0.211|
|E1|3.95||4.60|0.155||0.182|
|G||2.00|||0.079||
|G1||0.85|||0.033||
|L|0.75||1.20|0.029|||
|L1||0.45|||0.018||
|L2||0.45|||0.018||
|L3||0.05|||0.002||
|V|||8°|||8°|
|V1|||8°|||8°|



**DS3281** - **Rev 8** 

**page 8/13** 

**STPS1150 SMA Flat Notch package information** 

**Figure 15. SMA Flat Notch recommended footprint in mm (inches)** 

**==> picture [287 x 140] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.20 3.12 1.20<br>(0.047) (0.123) (0.047)<br>1.52<br>(0.060)<br>5.52<br>(0.217)<br>**----- End of picture text -----**<br>


**DS3281** - **Rev 8** 

**page 9/13** 

**STPS1150 DO-41 package information** 

## **2.3 DO-41 package information** 

- Epoxy meets UL 94, V0 

## **Figure 16. DO-41 package outline** 

**==> picture [309 x 132] intentionally omitted <==**

**----- Start of picture text -----**<br>
C A C<br>ØD<br>ØB<br>**----- End of picture text -----**<br>


**Table 6. DO-41 package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches (for reference only)**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|4.1|-|5.20|0.160|-|0.205|
|B|2.00|-|2.71|0.080|-|0.107|
|C|25.40|-||1.000|-||
|D|0.71|-|0.86|0.028|-|0.0034|



**DS3281** - **Rev 8** 

**page 10/13** 

**STPS1150 Ordering Information** 

## **3 Ordering Information** 

## **Table 7. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS1150AFN|A1150|SMA Flat Notch|0.039 g|10 000|Tape and reel|
|STPS1150A|1150|SMA|0.068 g|5000|Tape and reel|
|STPS1150|STPS1150|DO-41|0.34 g|2000|Ammopack|
|STPS1150RL|STPS1150|DO-41|0.34 g|5000|Tape and reel|



**DS3281** - **Rev 8** 

**page 11/13** 

**STPS1150** 

## **Revision history** 

**Table 8. Document revision history** 

|**Date**|**Version**|**Changes**|
|---|---|---|
|Jul-2003|2A|Last update.|
|Aug-2004|3|SMA package dimensions update. Reference A1 max. changed from 2.70 mm<br>(0.106) to 2.03 mm (0.080).|
|31-May-2006|4|Reformatted to current standard. Added ECOPACK statement. Updated SMA<br>footprint in Figure 15. Changed nF to pF in Figure 10.|
|09-Feb-2011|5|Added STmite and STmite flat package.|
|15-Apr-2014|6|Updated : Features, Table 2, 3 and Figure 2. Updated Section 2: Package<br>information.|
|28-Sep-2018|7|Removed STmite and STmite flat package information. Updated<br>Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified)<br>andFigure 3. Normalized avalanche power derating versus pulse duration (Tj<br>= 125 °C).|
|25-Sep-2019|8|AddedSection  2.2  SMA Flat Notch package information.|



**DS3281** - **Rev 8** 

**page 12/13** 

**STPS1150** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2019 STMicroelectronics – All rights reserved 

**DS3281** - **Rev 8** 

**page 13/13** 



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