# Power MOSFET, N Channel, 525 V, 2.5 A, 2.1 ohm, TO-220FP, Through Hole

![Product image](https://novapart.co/image/farnell:2098324/)

**URL**: https://novapart.co/products/STP4N52K3/power-mosfet-n-channel-525-v-25-a-21-ohm-to-220fp
**SKU**: STP4N52K3
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.4480
**Stock**: 10+

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:2.5A; Drain Source Voltage Vds:525V; On Resistance Rds(on):2.1ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3.75V; P

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 20W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220FP |
| Drain Source Voltage Vds | 525V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 2.5A |
| Drain Source On State Resistance | 2.1ohm |
| Gate Source Threshold Voltage Max | 3.75V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2098324/)

## **STD4N52K3, STF4N52K3, STP4N52K3, STU4N52K3** N-channel 525 V, 2.5 A, 2.1 Ω typ., SuperMESH3™ Power MOSFET in DPAK, TO-220FP, TO-220 and IPAK packages 

## **Datasheet — production data** 

## **Features** 

|**Order codes**|**VDSS**|**RDS(on)**<br>**max**|**ID**|**Pw**|
|---|---|---|---|---|
|STD4N52K3<br>STF4N52K3<br>STP4N52K3<br>STU4N52K3|525 V|< 2.6Ω|2.5 A<br>2.5 A<br>2.5 A(1)<br>2.5 A|45 W<br>20 W<br>45 W<br>45 W|



1. Limited by package 

- 100% avalanche tested 

- Extremely high dv/dt capability 

**==> picture [172 x 155] intentionally omitted <==**

**----- Start of picture text -----**<br>
3<br>1<br>DPAK 3<br>2<br>1<br>TO-220FP<br>3<br>3 2<br>2 1<br>1<br>TO-220 IPAK<br>**----- End of picture text -----**<br>


- Gate charge minimized 

- Very low intrinsic capacitance 

- Improved diode reverse recovery characteristics 

- Zener-protected 

## **Application** 

- Switching applications 

## **Description** 

These SuperMESH3™ Power MOSFETs are the result of improvements applied to STMicroelectronics’ SuperMESH™ technology, combined with a new optimized vertical structure. These devices boast an extremely low onresistance, superior dynamic performance and high avalanche capability, rendering them suitable for the most demanding applications. 

## **Figure 1. Internal schematic diagram** 

**==> picture [220 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
D(2)<br>G(1)<br>S(3)<br>AM01476v1<br>**----- End of picture text -----**<br>


**Table 1. Device summary** 

|**Order codes**|**Marking**|**Package**|**Packaging**|
|---|---|---|---|
|STD4N52K3|4N52K3|DPAK|Tape and reel|
|STF4N52K3|4N52K3|TO-220FP|Tube|
|STP4N52K3|4N52K3|TO-220|Tube|
|STU4N52K3|4N52K3|IPAK|Tube|



February 2013 Doc ID 18206 Rev 2 1/21 

This is information on a product in full production. 

_www.st.com_ 

|**Contents**|**STD4N52K3, STF4N52K3, STP4N52K3, STU4N52K3**|
|---|---|
|**Contents**||
|**1**|**Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3**|
|**2**|**Electrical characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4**|
||2.1<br>Electrical characteristics (curves)         . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6|
|**3**|**Test circuits     . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9**|
|**4**|**Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10**|
|**5**|**Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18**|
|**6**|**Revision history  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20**|



2/21 

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**STD4N52K3, STF4N52K3, STP4N52K3, STU4N52K3** 

**Electrical ratings** 

## **1 Electrical ratings** 

## **Table 2. Absolute maximum ratings** 

|**Table 2.**|**Absolute maximum ratings**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Value**||||**Unit**|
|||**TO-220 **|**DPAK**|**IPAK**|**TO-220FP**||
|VDS|Drain-source voltage (VGS= 0)|525||||V|
|VGS|Gate- source voltage|± 30||||V|
|ID|Drain current (continuous) at TC= 25 °C|2.5|||2.5(1)|A|
|ID|Drain current (continuous) at TC= 100 °C|2|||2(1)|A|
|IDM<br>(2)|Drain current (pulsed)|10|||10(1)|A|
|PTOT|Total dissipation at TC= 25 °C|45|||20|W|
|IAR|Avalanche current, repetitive or not-<br>repetitive (pulse width limited by Tjmax)|1.3||||A|
|EAS|Single pulse avalanche energy<br>(starting Tj= 25°C, ID= IAR, VDD= 50V)|110||||mJ|
|dv/dt(3)|Peak diode recovery voltage slope|12||||V/ns|
|VISO|Insulation withstand voltage (RMS) from<br>all three leads to external heat sink<br>(t = 1 s; TC= 25 °C)||||2500|V|
|Tstg|Storage temperature|-55 to 150||||°C|
|Tj|Max. operating junction temperature|150||||°C|



1. Limited by package 

2. Pulse width limited by safe operating area 

3. ISD ≤   2.5 A, di/dt = 400 A/μs, peak VDD  ≤  V(BR)DSS, VDD = 80% V(BR)DSS. 

## **Table 3. Thermal data** 

|**Table 3.**|**Thermal data**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Value**||||**Unit**|
|||**TO-220 **|**DPAK**|**IPAK**|**TO-220FP**||
|Rthj-case|Thermal resistance junction-case max|2.78|||6.25|°C/W|
|Rthj-pcb<br>(1)|Thermal resistance junction-pcb max||50|||°C/W|
|Rthj-amb|Thermal resistance junction-ambient max|62.5||100|62.5|°C/W|
|Tl|Maximum lead temperature for soldering<br>purpose|300||300||°C|



1. When mounted on 1inch sq FR-4 board, 2 oz Cu 

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**STD4N52K3, STF4N52K3, STP4N52K3, STU4N52K3** 

**Electrical characteristics** 

## **2 Electrical characteristics** 

(TC = 25 °C unless otherwise specified) 

## **Table 4. On /off states** 

|**Table 4.**|**On /off states**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|V(BR)DSS|Drain-source<br>breakdown voltage|ID= 1 mA, VGS= 0|525|||V|
|IDSS|Zero gate voltage<br>drain current (VGS= 0)|VDS= 525 V<br>VDS= 525 V, TC=125 °C|||1<br>50|μA<br>μA|
|IGSS|Gate-body leakage<br>current (VDS= 0)|VGS= ± 20 V|||± 10|μA|
|VGS(th)|Gate threshold voltage|VDS= VGS, ID= 50 μA|3|3.75|4.5|V|
|RDS(on|Static drain-source on-<br>resistance|VGS= 10 V, ID= 1.25 A||2.1|2.6|Ω|



## **Table 5. Dynamic** 

|**Table 5.**|**Dynamic**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|Ciss<br>Coss<br>Crss|Input capacitance<br>Output capacitance<br>Reverse transfer<br>capacitance|VDS= 100 V, f = 1 MHz,<br>VGS= 0|-|334<br>28<br>5|-|pF<br>pF<br>pF|
|Coss(eq)<br>(1)|Equivalent output<br>capacitance time<br>related|VDS= 0 to 420 V, VGS= 0|-|20|-|pF|
|RG|Intrinsic gate<br>resistance|f = 1 MHz open drain|-|4|-|Ω|
|Qg<br>Qgs<br>Qgd|Total gate charge<br>Gate-source charge<br>Gate-drain charge|VDD= 400 V, ID= 2.5 A,<br>VGS= 10 V<br>(see_Figure 19_)|-|11<br>2<br>7|-|nC<br>nC<br>nC|



1. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS. 

## **Table 6. Switching times** 

|**Table 6.**|**Switching times**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max**|**Unit**|
|td(on)<br>tr<br>td(off)<br>tf|Turn-on delay time<br>Rise time<br>Turn-off-delay time<br>Fall time|VDD= 260 V, ID= 1.25 A,<br>RG= 4.7Ω,VGS= 10 V<br>(see_Figure 18_)|-|8<br>7<br>21<br>14|-|ns<br>ns<br>ns<br>ns|



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**Electrical characteristics** 

## **Table 7. Source drain diode** 

|**Table 7.**|**Source drain diode**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|ISD<br>ISDM (1)|Source-drain current<br>Source-drain current (pulsed)||-||2.5<br>10|A<br>A|
|VSD (2)|Forward on voltage|ISD= 2.5 A, VGS= 0|-||1.6|V|
|trr<br>Qrr<br>IRRM|Reverse recovery time<br>Reverse recovery charge<br>Reverse recovery current|ISD= 2.5 A, di/dt = 100 A/μs<br>VDD= 60 V (see_Figure 23_)|-|173<br>778<br>9||ns<br>nC<br>A|
|trr<br>Qrr<br>IRRM|Reverse recovery time<br>Reverse recovery charge<br>Reverse recovery current|ISD= 2.5 A, di/dt = 100 A/μs<br>VDD= 60 V, Tj= 150 °C<br>(see_Figure 23_)|-|196<br>941<br>10||ns<br>nC<br>A|



1. Pulse width limited by safe operating area 

2. Pulsed: Pulse duration = 300 μs, duty cycle 1.5% 

## **Table 8. Gate-source Zener diode** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|BVGSO<br>(1)|Gate-source breakdown<br>voltage|Igs=± 1 mA (open drain)|30|-||V|



1. The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components 

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**Electrical characteristics** 

## **2.1 Electrical characteristics (curves)** 

**Figure 2. Safe operating area for TO-220 Figure 3. Thermal impedance for TO-220** 

**==> picture [228 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
ID AM08637v1<br>(A) Tj=150°C<br>Tc=25°C<br>Single pulse<br>10<br>10µs<br>100µs<br>1<br>1ms<br>10ms<br>0.1<br>0.01<br>0.1 1 10 100 VDS(V)<br>DS(on)<br>Operation in this area is<br>Limited by max R<br>**----- End of picture text -----**<br>


**==> picture [175 x 169] intentionally omitted <==**

**Figure 4. Safe operating area for TO-220FP Figure 5. Thermal impedance for TO-220FP** 

**==> picture [462 x 371] intentionally omitted <==**

**----- Start of picture text -----**<br>
ID AM08638v1<br>(A) Tj=150°C<br>Tc=25°C<br>Single pulse<br>10<br>10µs<br>1 100µs<br>1ms<br>10ms<br>0.1<br>0.01<br>0.1 1 10 100 VDS(V)<br>Figure 6. Safe operating area for DPAK, IPAK Figure 7. Thermal impedance for DPAK, IPAK<br>ID AM08639v1<br>(A) Tj=150°C<br>Tc=25°C<br>Single pulse<br>10<br>10µs<br>100µs<br>1<br>1ms<br>10ms<br>0.1<br>0.01<br>0.1 1 10 100 VDS(V)<br>DS(on)<br>Operation in this area is<br>Limited by max R<br>DS(on)<br>Operation in this area is<br>Limited by max R<br>**----- End of picture text -----**<br>


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**Electrical characteristics** 

## **Figure 8. Output characteristics** 

**==> picture [228 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
AM08640v1<br>ID<br>(A)<br>6 VGS=10V<br>7V<br>5<br>4<br>6V<br>3<br>2<br>1<br>5V<br>0<br>0 5 10 15 20 25 VDS(V)<br>**----- End of picture text -----**<br>


## **Figure 10. Normalized BVDSS vs temperature** 

## **Figure 9. Transfer characteristics** 

**==> picture [228 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
AM08641v1<br>ID(A)<br>4.5 VGS=15V<br>4.0<br>3.5<br>3.0<br>2.5<br>2.0<br>1.5<br>1.0<br>0.5<br>0<br>0 1 2 3 4 5 6 7 8 9 VGS(V)<br>**----- End of picture text -----**<br>


## **Figure 11. Static drain-source on-resistance** 

**==> picture [462 x 176] intentionally omitted <==**

**----- Start of picture text -----**<br>
BVDSS AM08648v1 RDS(on) AM08643v1<br>(norm) (Ω)<br>1.10 2.35 VGS=10V<br>1.05 2.25<br>1.00 2.15<br>0.95 2.05<br>0.90 1.95<br>0.85 1.85<br>0.80 1.75<br>-75 -25 25 75 125 TJ(°C) 0 0.5 1.0 1.5 2.0 2.5 ID(A)<br>**----- End of picture text -----**<br>


## **Figure 12. Capacitance variations** 

## **Figure 13. Gate charge vs gate-source voltage** 

**==> picture [462 x 177] intentionally omitted <==**

**----- Start of picture text -----**<br>
C AM00893v1 VGS AM08642v1<br>(pF) (V) VGS<br>12 VDS VDD=420V 400<br>Ciss ID=2.5A<br>350<br>10<br>100 300<br>8<br>250<br>6 200<br>Coss<br>10 150<br>4<br>Crss 100<br>2<br>50<br>1 0 0<br>0.1 1 10 100 VDS(V) 0 2 4 6 8 10 12 Qg(nC)<br>**----- End of picture text -----**<br>


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**Electrical characteristics** 

**Figure 14. Normalized gate threshold voltage Figure 15. Normalized on-resistance vs vs temperature temperature** 

**==> picture [462 x 176] intentionally omitted <==**

**----- Start of picture text -----**<br>
VGS(th) AM08646v1 RDS(on) AM08647v1<br>(norm) (norm)<br>1.1<br>2.5<br>1.0<br>2.0<br>0.9<br>1.5<br>0.8<br>1.0<br>0.7<br>0.6 0.5<br>0.5 0<br>-75 -25 25 75 125 TJ(°C) -75 -25 25 75 125 TJ(°C)<br>**----- End of picture text -----**<br>


## **Figure 16. Source-drain diode forward characteristics** 

**==> picture [228 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
VSD AM08649v1<br>(V)<br>1.0 TJ=-50°C<br>0.9<br>0.8<br>TJ=25°C<br>0.7<br>0.6<br>TJ=150°C<br>0.5<br>0.4<br>0 0.5 1 1.5 2 2.5 ISD(A)<br>**----- End of picture text -----**<br>


**Figure 17. Maximum avalanche energy vs starting Tj** 

**==> picture [228 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
AM08650v1<br>EAS (mJ)<br>120<br>ID=2.5 A<br>VDD=50 V<br>100<br>80<br>60<br>40<br>20<br>0<br>0 20 40 60 80 100 120 140 TJ(°C)<br>**----- End of picture text -----**<br>


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**Test circuits** 

## **3 Test circuits** 

**Figure 18. Switching times test circuit for Figure 19. Gate charge test circuit resistive load** 

**==> picture [462 x 195] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDD<br>12V 47kΩ<br>1kΩ<br>100nF<br>RL 2200 3.3<br>μF μF<br>VDD IG=CONST<br>VD Vi=20V=VGMAX 100Ω D.U.T.<br>VGS<br>2200<br>RG D.U.T. μF 2.7kΩ VG<br>PW<br>47kΩ<br>1kΩ<br>PW<br>AM01468v1 AM01469v1<br>Figure 20. Test circuit for inductive load  Figure 21. Unclamped Inductive load test<br>switching and diode recovery times circuit<br>**----- End of picture text -----**<br>


**==> picture [462 x 346] intentionally omitted <==**

**----- Start of picture text -----**<br>
L<br>A A A<br>D<br>G D.U.T. FASTDIODE L=100μH VD 2200 3.3<br>S B 3.3 1000 μF μF VDD<br>25 Ω B B D μF μF VDD ID<br>G<br>RG S<br>Vi D.U.T.<br>Pw<br>AM01470v1 AM01471v1<br>Figure 22. Unclamped inductive waveform Figure 23. Switching time waveform<br>V(BR)DSS ton toff<br>VD tdon tr tdoff tf<br>90% 90%<br>IDM<br>10%<br>ID 0 10% VDS<br>VDD VDD 90%<br>VGS<br>AM01472v1 0 10% AM01473v1<br>**----- End of picture text -----**<br>


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**Package mechanical data** 

## **4 Package mechanical data** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

**Table 9. DPAK (TO-252) mechanical data** 

|**Dim.**|**mm**|**mm**|**mm**|
|---|---|---|---|
||**Min.**|**Typ.**|**Max.**|
|A|2.20||2.40|
|A1|0.90||1.10|
|A2|0.03||0.23|
|b|0.64||0.90|
|b4|5.20||5.40|
|c|0.45||0.60|
|c2|0.48||0.60|
|D|6.00||6.20|
|D1||5.10||
|E|6.40||6.60|
|E1||4.70||
|e||2.28||
|e1|4.40||4.60|
|H|9.35||10.10|
|L|1|||
|L1||2.80||
|L2||0.80||
|L4|0.60||1|
|R||0.20||
|V2|0°||8°|



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**Package mechanical data** 

## **Figure 24. DPAK (TO-252) drawing** 

**==> picture [405 x 284] intentionally omitted <==**

**----- Start of picture text -----**<br>
0068772_I<br>**----- End of picture text -----**<br>


## **Figure 25. DPAK footprint[(a)]** 

**==> picture [405 x 151] intentionally omitted <==**

**----- Start of picture text -----**<br>
6.7 1.8 3<br>1.6<br>2.3<br>6.7<br>2.3<br>1.6<br>AM08850v1<br>**----- End of picture text -----**<br>


a. All dimensions are in millimeters 

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**Package mechanical data** 

**Table 10. TO-220FP mechanical data** 

|**Dim.**|**mm**|**mm**|**mm**|
|---|---|---|---|
||**Min.**|**Typ.**|**Max.**|
|A|4.4||4.6|
|B|2.5||2.7|
|D|2.5||2.75|
|E|0.45||0.7|
|F|0.75||1|
|F1|1.15||1.70|
|F2|1.15||1.70|
|G|4.95||5.2|
|G1|2.4||2.7|
|H|10||10.4|
|L2||16||
|L3|28.6||30.6|
|L4|9.8||10.6|
|L5|2.9||3.6|
|L6|15.9||16.4|
|L7|9||9.3|
|Dia|3||3.2|



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**Package mechanical data** 

## **Figure 26. TO-220FP drawing** 

**==> picture [405 x 577] intentionally omitted <==**

**----- Start of picture text -----**<br>
7012510_Rev_K_B<br>**----- End of picture text -----**<br>


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**Package mechanical data** 

## **Table 11. TO-220 type A mechanical data** 

|**Dim.**|**mm**|**mm**|**mm**|
|---|---|---|---|
||**Min.**|**Typ.**|**Max.**|
|A|4.40||4.60|
|b|0.61||0.88|
|b1|1.14||1.70|
|c|0.48||0.70|
|D|15.25||15.75|
|D1||1.27||
|E|10||10.40|
|e|2.40||2.70|
|e1|4.95||5.15|
|F|1.23||1.32|
|H1|6.20||6.60|
|J1|2.40||2.72|
|L|13||14|
|L1|3.50||3.93|
|L20||16.40||
|L30||28.90||
|∅P|3.75||3.85|
|Q|2.65||2.95|



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**Package mechanical data** 

**Figure 27. TO-220 type A drawing** 

**==> picture [405 x 383] intentionally omitted <==**

**----- Start of picture text -----**<br>
0015988_typeA_Rev_S<br>**----- End of picture text -----**<br>


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**Package mechanical data** 

**Table 12. IPAK (TO-251) mechanical data** 

|**DIM**|**mm.**|**mm.**|**mm.**|
|---|---|---|---|
||**min.**|**typ.**|**max.**|
|A|2.20||2.40|
|A1|0.90||1.10|
|b|0.64||0.90|
|b2|||0.95|
|b4|5.20||5.40|
|B5||0.30||
|c|0.45||0.60|
|c2|0.48||0.60|
|D|6.00||6.20|
|E|6.40||6.60|
|e||2.28||
|e1|4.40||4.60|
|H||16.10||
|L|9.00||9.40|
|L1|0.80||1.20|
|L2||0.80|1.00|
|V1||10°||



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**Package mechanical data** 

## **Figure 28. IPAK (TO-251) drawing** 

**==> picture [405 x 456] intentionally omitted <==**

**----- Start of picture text -----**<br>
0068771_J<br>**----- End of picture text -----**<br>


Doc ID 18206 Rev 2 

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**STD4N52K3, STF4N52K3, STP4N52K3, STU4N52K3** 

**Packaging mechanical data** 

## **5 Packaging mechanical data** 

**Table 13. DPAK (TO-252) tape and reel mechanical data** 

||**Tape**|**Tape**||**Reel**|**Reel**|
|---|---|---|---|---|---|
|**Dim.**|**mm**||**Dim.**|**mm**||
||**Min.**|**Max.**||**Min.**|**Max.**|
|A0|6.8|7|A||330|
|B0|10.4|10.6|B|1.5||
|B1||12.1|C|12.8|13.2|
|D|1.5|1.6|D|20.2||
|D1|1.5||G|16.4|18.4|
|E|1.65|1.85|N|50||
|F|7.4|7.6|T||22.4|
|K0|2.55|2.75||||
|P0|3.9|4.1||Base qty.|2500|
|P1|7.9|8.1||Bulk qty.|2500|
|P2|1.9|2.1||||
|R|40|||||
|T|0.25|0.35||||
|W|15.7|16.3||||



18/21 

Doc ID 18206 Rev 2 

**STD4N52K3, STF4N52K3, STP4N52K3, STU4N52K3** 

**Packaging mechanical data** 

**==> picture [395 x 327] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 29. Tape for DPAK (TO-252)<br>10 pitches cumulative<br>tolerance on tape +/- 0.2 mm<br>Top cover P0 D P2<br>T tape<br>o i e ; —4 |<br>| / O0O0 G8G 0CO0 8 G00 E<br>F<br>K0 W<br>B1 B0<br>on e |||| e |] ®]]<br>ena olo l o i a i c te<br>| Tl LT<br>For machine ref. only A0 P1 D1<br>including draft and<br>radii concentric around B0 —_—><br>User direction of feed<br>R<br>S e ca l e alice<br>a Bending radius<br>ad<br>User direction of feed<br>**----- End of picture text -----**<br>


**==> picture [39 x 6] intentionally omitted <==**

**----- Start of picture text -----**<br>
AM08852v1<br>**----- End of picture text -----**<br>


## **Figure 30. Reel for DPAK (TO-252)** 

**==> picture [377 x 249] intentionally omitted <==**

**----- Start of picture text -----**<br>
T<br>REEL DIMENSIONS<br>40mm min.<br>Access hole<br>At slot location<br>B<br>D<br>C<br>N<br>A<br>Full radius Tape slot  G measured at hub<br>in core for<br>tape start 25 mm min.<br>width<br>AM08851v2<br>**----- End of picture text -----**<br>


19/21 

Doc ID 18206 Rev 2 

**STD4N52K3, STF4N52K3, STP4N52K3, STU4N52K3** 

**Revision history** 

## **6 Revision history** 

**Table 14. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|09-Nov-2010|1|First release.|
|19-Feb-2013|2|Updated packages order in_Table 1: Device summary_.<br>Updated_Table 4: Package mechanical data_and_Table 5: Packaging_<br>_mechanical data_.<br>Minor text changes on the cover page.|



20/21 

Doc ID 18206 Rev 2 

**STD4N52K3, STF4N52K3, STP4N52K3, STU4N52K3** 

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Doc ID 18206 Rev 2 

21/21 



## Links

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- [Supplier page](https://es.farnell.com/stmicroelectronics/stp4n52k3/mosfet-n-ch-525v-2-5a-to-220/dp/2098324)
---

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