# Power MOSFET, N Channel, 30 V, 35 A, 0.0014 ohm, PowerFLAT, Surface Mount

![Product image](https://novapart.co/image/farnell:1752112/)

**URL**: https://novapart.co/products/STL150N3LLH5/power-mosfet-n-channel-30-v-35-a-00014-ohm
**SKU**: STL150N3LLH5
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.0200
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Power Dissipation | 80W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 80W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.0014ohm |
| Transistor Case Style | PowerFLAT |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 35A |
| Drain Source On State Resistance | 0.0014ohm |
| Gate Source Threshold Voltage Max | 1.55V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1752112/)

## **STL150N3LLH5** 

N-channel 30 V, 0.0014 Ω typ., 35 A STripFET™ V Power MOSFET in a PowerFLAT™ 5x6 package **Datasheet** - **production data Features Order code VDS RDS(on) max. ID** STL150N3LLH5 30 V 0.00175 Ω 35 A[(1)] 1. The value is rated according Rthj-pcb 1 2 3 • RDS(on) * Qg industry benchmark 4 • Extremely low on-resistance RDS(on) • High avalanche ruggedness **PowerFLAT™5x6** • Low gate drive power losses ~~o~~ **Applications Figure 1.  Internal schematic diagram** • Switching applications D(5, 6, 7, 8) 8 7 6 5 **Description** This device is an N-channel Power MOSFET developed using STMicroelectronics’ STripFET™V technology. The device has been G(4) optimized to achieve very low on-state resistance, contributing to a FOM that is among the best in its class. 1 2 3 4 ~~iu~~ Top View S(1, 2, 3) AM15540v2 **Table 1. Device summary Order code Marking Packages Packaging** STL150N3LLH5 150N3LH5 PowerFLAT™ 5X6 Tape and reel ~~_—[pp]~~ 

This device is an N-channel Power MOSFET developed using STMicroelectronics’ STripFET™V technology. The device has been optimized to achieve very low on-state resistance, contributing to a FOM that is among the best in its class. 

_www.st.com_ 

August 2013 

DocID14092 Rev 6 

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This is information on a product in full production. 

**Contents** 

**STL150N3LLH5** 

|**Contents**|**Contents**|
|---|---|
|**1**|**Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3**|
|**2**|**Electrical characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4**|
||2.1<br>Electrical characteristics (curves)       . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6|
|**3**|**Test circuits     . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8**|
|**4**|**Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9**|
|**5**|**Revision history  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13**|



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**Electrical ratings** 

## **1 Electrical ratings** 

**Table 2. Absolute maximum ratings** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VDS|Drain-source voltage|30|V|
|VGS|Gate-source voltage|± 22|V|
|ID<br>(1)|Drain current (continuous) at TC= 25 °C|195|A|
|ID<br>(1)|Drain current (continuous) at TC= 100 °C|122|A|
|ID<br>(2)|Drain current (continuous) at Tpcb= 25 °C|35|A|
|ID<br>(2)|Drain current (continuous) at Tpcb=100 °C|21.8|A|
|IDM<br>(3)|Drain current (pulsed)|140|A|
|PTOT<br>(1)|Total dissipation at TC= 25 °C|114|W|
|PTOT<br>(2)|Total dissipation at Tpcb= 25 °C|4|W|
|TJ<br>Tstg|Operating junction temperature<br>Storage temperature|-55 to 150|°C|



1. The value is rated according Rthj-c 

2. The value is rated according Rthj-pcb 

3. Pulse width limited by safe operating area 

**Table 3. Thermal resistance** 

||**Table 3. Thermal resistance**|||
|---|---|---|---|
|**Symbol**|**Parameter**|**Value**|**Unit**|
|Rthj-case|Thermal resistance junction-case|1.1|°C/W|
|Rthj-pcb<br>(1)|Thermal resistance junction-pcb|31.3|°C/W|



1. When mounted on FR-4 board of 1inch², 2oz Cu, t < 10 sec 

**Table 4. Avalanche data** 

||**Table 4. Avalanche data**|||
|---|---|---|---|
|**Symbol**|**Parameter**|**Value**|**Unit**|
|IAV|Not-repetitive avalanche current,<br>(pulse width limited by Tj max)|17|A|
|EAS|Single pulse avalanche energy<br>(starting TJ= 25 °C, ID= IAV, VDD= 24 V)|300|mJ|



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**Electrical characteristics** 

## **2 Electrical characteristics** 

(TCASE = 25 °C unless otherwise specified) 

**Table 5. On/off states** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|V(BR)DSS|Drain-source breakdown<br>voltage|ID= 250 µA, VGS= 0|30|||V|
|IDSS|Zero gate voltage drain<br>current|VDS= 30 V<br>VGS= 0|||1|µA|
|||VDS= 30 V, VGS= 0<br>TC=125 °C|||10|µA|
|IGSS|Gate body leakage current|VGS= ±22 V, VDS= 0|||±100|nA|
|VGS(th)|Gate threshold voltage|VDS= VGS, ID= 250 µA|1|1.55|2.2|V|
|RDS(on)|Static drain-source on-<br>resistance|VGS= 10 V, ID= 17.5 A||0.0014|0.00175|Ω|
|||VGS= 4.5 V, ID= 17.5 A||0.0019|0.0024|Ω|



**Table 6. Dynamic** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Ciss|Input capacitance|VDS= 25 V, f=1 MHz,<br>VGS=0|-|5800|-|pF|
|Coss|Output capacitance||-|1147|-|pF|
|Crss|Reverse transfer<br>capacitance||-|127|-|pF|
|Qg|Total gate charge|VDD=15 V, ID= 35 A<br>VGS=4.5 V<br>_(see Figure 14)_|-|40|-|nC|
|Qgs|Gate-source charge||-|13.4|-|nC|
|Qgd|Gate-drain charge||-|14.9|-|nC|
|RG|Gate input resistance|f = 1 MHz, gate DC<br>Bias = 0,<br>test signal level = 20 mV,<br>ID= 0|-|1.1|-|Ω|



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**Electrical characteristics** 

**Table 7. Switching times** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|td(on)|Turn-on delay time|VDD=15 V, ID= 17.5 A,<br>RG=4.7Ω,VGS=10 V<br>_(see Figure 13)_|-|17.2|-|ns|
|tr|Rise time||-|30.8|-|ns|
|td(off)|Turn-off delay time||-|65.8|-|ns|
|tf|Fall time||-|47.8|-|ns|



**Table 8. Source drain diode** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|ISD|Source-drain current||-||35|A|
|ISDM<br>(1)|Source-drain current (pulsed)||-||140|A|
|VSD<br>(2)|Forward on voltage|ISD= 35 A, VGS=0|-||1.1|V|
|trr|Reverse recovery time|ISD= 35 A,<br>di/dt = 100 A/µs,<br>VDD= 25 V|-<br>-<br>-|43.8||ns|
|Qrr|Reverse recovery charge|||46||nC|
|IRRM|Reverse recovery current|||2.1||A|



1. Pulse width limited by safe operating area 

2. Pulsed: pulse duration=300µs, duty cycle 1.5% 

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**STL150N3LLH5** 

**Electrical characteristics** 

## **2.1 Electrical characteristics (curves)** 

## **Figure 2. Safe operating area** 

**==> picture [163 x 139] intentionally omitted <==**

**----- Start of picture text -----**<br>
HV42710<br>ID(A)<br>TJ = 150 °C<br>TC = 25 °C<br>Single pulse<br>100<br>10 10 ms<br>100 ms<br>1<br>1 s<br>0.1<br>0.01<br>1.0 1 10 VDS(V)<br>Operation on this area is<br>DS(on)<br>limited by max R<br>**----- End of picture text -----**<br>


## **Figure 3. Thermal impedance** 

**==> picture [211 x 153] intentionally omitted <==**

**Figure 4. Output characteristics** 

**==> picture [167 x 155] intentionally omitted <==**

## **Figure 5. Transfer characteristics** 

**==> picture [167 x 155] intentionally omitted <==**

## **Figure 6. Normalized BVDSS vs temperature** 

**Figure 7. Static drain-source on-resistance** 

**==> picture [462 x 162] intentionally omitted <==**

**----- Start of picture text -----**<br>
BV(norm)DSS HV42790 RDS(on) HV42770<br>(mΩ)<br>1.1<br>2.5<br>1.05 VGS=10V<br>2.0<br>1<br>1.5<br>0.95<br>1.0<br>0.9<br>0.85 0.5<br>-55 -30 -5 20 45 70 95 120 145 TJ(°C) 0 10 20 30 ID(A)<br>**----- End of picture text -----**<br>


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**Electrical characteristics** 

## **Figure 8. Gate charge vs gate-source voltage** 

## **Figure 9. Capacitance variations** 

**==> picture [462 x 162] intentionally omitted <==**

**----- Start of picture text -----**<br>
HV42730 HV42760<br>VGS(V) C(pF )<br>f=1MHz<br>12 V DD =15 V 10000<br>ID=35 A<br>10<br>8000<br>8<br>Ciss<br>6000<br>6<br>4 4000<br>2 2000 Coss<br>0 Crss<br>0<br>0 20 40 60 Qg(nC) 0 10 20 VDS(V)<br>**----- End of picture text -----**<br>


**Figure 10. Normalized gate threshold voltage vs temperature** 

**Figure 11. Normalized on-resistance vs temperature** 

**==> picture [462 x 358] intentionally omitted <==**

**----- Start of picture text -----**<br>
HV42740 HV42750<br>VGS(th) RDS(on)<br>(norm) ID=250µA (norm)<br>ID=17.5 A<br>1.2 1.6<br>VGS=10 V<br>1 1.4<br>0.8 1.2<br>0.6 1<br>0.4 0.8<br>0.2 0.6<br>-55 -30 -5 20 45 70 95 120 145 TJ (°C) -55 -30 -5 20 45 70 95 120 145 TJ(°C)<br>Figure 12. Source-drain diode forward<br>characteristics<br>HV42780<br>VSD(V)<br>0.8 TJ=-55°C<br>0.7<br>TJ=25°C<br>0.6<br>0.5<br>TJ=175°C<br>0.4<br>0.3<br>0 10 20 30 ID(A)<br>**----- End of picture text -----**<br>


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**Test circuits** 

## **3 Test circuits** 

**Figure 13. Switching times test circuit for resistive load** 

**Figure 14. Gate charge test circuit** 

**==> picture [462 x 162] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDD<br>12V 47kΩ<br>1kΩ<br>100nF<br>RL 2200 3.3<br>μF μF<br>VDD IG=CONST<br>VD Vi=20V=VGMAX 100Ω D.U.T.<br>VGS<br>2200<br>RG D.U.T. μF 2.7kΩ VG<br>PW<br>47kΩ<br>1kΩ<br>PW<br>AM01468v1 AM01469v1<br>**----- End of picture text -----**<br>


**Figure 15. Test circuit for inductive load Figure 16. Unclamped inductive load test circuit switching and diode recovery times** 

**==> picture [462 x 346] intentionally omitted <==**

**----- Start of picture text -----**<br>
L<br>A A A<br>D<br>FAST L=100μH VD<br>G D.U.T. DIODE 2200 3.3<br>S B 3.3 1000 μF μF VDD<br>25 Ω B B D μF μF VDD ID<br>G<br>RG S<br>Vi D.U.T.<br>Pw<br>AM01470v1 AM01471v1<br>Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform<br>V(BR)DSS ton toff<br>VD tdon tr tdoff tf<br>90% 90%<br>IDM<br>10%<br>ID 0 10% VDS<br>VDD VDD 90%<br>VGS<br>AM01472v1 0 10% AM01473v1<br>**----- End of picture text -----**<br>


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**Package mechanical data** 

## **4 Package mechanical data** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _www.st.com_ . ECOPACK[®] is an ST trademark. 

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**Package mechanical data** 

## **Table 9. PowerFLAT™ 5x6 type S-C mechanical data** 

|**Dim.**|**mm**|**mm**|**mm**|
|---|---|---|---|
||**Min.**|**Typ.**|**Max.**|
|A|0.80||1.00|
|A1|0.02||0.05|
|A2||0.25||
|b|0.30||0.50|
|D||5.20||
|E||6.15||
|D2|4.11||4.31|
|E2|3.50||3.70|
|e||1.27||
|e1||0.65||
|L|0.715||1.015|
|K|1.05||1.35|



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**Package mechanical data** 

## **Figure 19. PowerFLAT™ 5x6 type S-C mechanical data** 

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**Package mechanical data** 

**==> picture [365 x 11] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 20. PowerFLAT™ 5x6 recommended footprint (dimensions are in mm)<br>**----- End of picture text -----**<br>


Footprint 

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**Revision history** 

## **5 Revision history** 

**Table 10. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|22-Oct-2007|1|First release|
|01-Apr-2008|2|Document status promoted from preliminary data to datasheet|
|23-Sep-2008|3|VGSvalue has been changed on_Table 2_and_Table 5_|
|12-Jun-2009|4|VGS(th)value has been changed on_Table 5_|
|05-Oct-2011|5|_Section 4: Package mechanical data_has been updated.<br>Minor text changes.|
|30-Aug-2013|6|– Modified:_Figure 1_and marking in_Table 1_<br>– Modified: IDvalue in_Figure 11_<br>– Updated:_Figure 13_,_14_,_15_and_16_<br>– Updated:_Section 4: Package mechanical data_|



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