# IGBT, 80 A, 1.6 V, 283 W, 650 V, TO-3P, 3 Pins

![Product image](https://novapart.co/image/farnell:3132711/)

**URL**: https://novapart.co/products/STGWT40HP65FB/igbt-80-a-16-v-283-w-650-to-3p-3-pins
**SKU**: STGWT40HP65FB
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || IGBTs || Single IGBTs
**Price**: €1.3200
**Stock**: 500+
**Lead Time**: 120 days (indicative)

## Description

DC Collector Current:80A; Collector Emitter Saturation Voltage Vce(on):1.6V; Power Dissipation Pd:283W; Collector Emitter Voltage V(br)ceo:650V; Transistor Case Style:TO-3P; No. of Pins:3

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | HB |
| Power Dissipation | 283W |
| Transistor Mounting | Through Hole |
| Transistor Case Style | TO-3P |
| Operating Temperature Max | 175°C |
| Continuous Collector Current | 80A |
| Collector Emitter Voltage Max | 650V |
| Collector Emitter Saturation Voltage | 1.6V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3132711/)

## **STGWT40HP65FB** 

## Trench gate field-stop IGBT, HB series 650 V, 40 A high speed 

Datasheet - production data 

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TAB<br>**----- End of picture text -----**<br>


## **Features** 

- Maximum junction temperature: TJ = 175 °C 

- Minimized tail current 

- VCE(sat) = 1.6 V (typ.) @ IC = 40 A 

- Tight parameter distribution 

**==> picture [86 x 33] intentionally omitted <==**

**----- Start of picture text -----**<br>
3<br>2<br>1<br>TO-3P<br>**----- End of picture text -----**<br>


**Figure 1: Internal schematic diagram** 

- Co-packed diode for protection 

- Safe paralleling 

- Low thermal resistance 

## **Applications** 

- Power factor corrector (PFC) 

## **Description** 

This device is an IGBT developed using an advanced proprietary trench gate field-stop structure. The device is part of the new HB series of IGBTs, which represents an optimum compromise between conduction and switching loss to maximize the efficiency of any frequency converter. Furthermore, the slightly positive VCE(sat) temperature coefficient and very tight parameter distribution result in safer paralleling operation. 

**Table 1: Device summary** 

|**Order code**|**Marking**|**Package**|**Packing**|
|---|---|---|---|
|STGWT40HP65FB|GWT40HP65FB|TO-3P|Tube|



_www.st.com_ 

July 2016 DocID028465 Rev 3 

1/17 

This is information on a product in full production. 

|**Contents**<br>**STGWT40HP65FB**|**Contents**<br>**STGWT40HP65FB**|
|---|---|
|**Contents**||
|**1**|**Electrical ratings ............................................................................. 3**|
|**2**|**Electrical characteristics ................................................................ 4**|
||2.1<br>Electrical characteristics (curves) ...................................................... 6|
|**3**|**Test circuits ................................................................................... 12**|
|**4**|**Package information ..................................................................... 13**|
||4.1<br>TO-3P package information ............................................................ 14|
|**5**|**Revision history ............................................................................ 16**|



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**Electrical ratings** 

## **1 Electrical ratings** 

**Table 2: Absolute maximum ratings** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VCES|Collector-emitter voltage (VGE= 0 V)|650|V|
|IC|Continuous collector current at TC= 25 °C|80|A|
||Continuous collector current at TC= 100 °C|40||
|ICP_(1)_|Pulsed collector current|160|A|
|VGE|Gate-emitter voltage|± 30|V|
|IF_(2)_|Continuous forward current at TC= 25 °C|5|A|
||Continuous forward current at TC= 100 °C|5||
|IFP_(3)_|Pulsed forward current|10|A|
|PTOT|Total dissipation at TC= 25 °C|283|W|
|TSTG|Storage temperature range|- 55 to 150|°C|
|TJ|Operating junction temperature range|- 55 to 175||



## **Notes:** 

- (1)Pulse width limited by maximum junction temperature. 

- (2)Limited by wires. 

- (3)Pulsed forward current. 

**Table 3: Thermal data** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|RthJC|Thermal resistancejunction-case IGBT|0.53|°C/W|
|RthJC|Thermal resistancejunction-case diode|5||
|RthJA|Thermal resistancejunction-ambient|50||



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**Electrical characteristics** 

## **2 Electrical characteristics** 

TJ = 25 °C unless otherwise specified 

## **Table 4: Static characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|V(BR)CES|Collector-emitter breakdown<br>voltage|VGE= 0 V, IC= 2 mA|650|||V|
|VCE(sat)|Collector-emitter saturation<br>voltage|VGE= 15 V, IC= 40 A||1.6|2.0|V|
|||VGE= 15 V, IC= 40 A,<br>TJ= 125 °C||1.7|||
|||VGE= 15 V, IC= 40 A,<br>TJ= 175 °C||1.8|||
|VF|Forward on-voltage|IF= 5 A||2||V|
|||IF= 5 A, TJ= 125 °C||1.85|||
|||IF= 5 A, TJ= 175 °C||1.75|||
|VGE(th)|Gate threshold voltage|VCE= VGE, IC= 1 mA|5|6|7|V|
|ICES|Collector cut-off current|VGE= 0 V, VCE= 650 V|||25|µA|
|IGES|Gate-emitter leakage current|VCE= 0 V, VGE= ±20 V|||±250|nA|



**Table 5: Dynamic characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Cies|Input capacitance|VCE= 25 V, f = 1 MHz,<br>VGE= 0 V|-|5412|-|pF|
|Coes|Output capacitance||-|198|-||
|Cres|Reverse transfer capacitance||-|107|-||
|Qg|Totalgate charge|VCC= 520 V, IC= 40 A,<br>VGE= 15 V (see_Figure 29:_<br>_"Gate charge test circuit"_)|-|210|-|nC|
|Qge|Gate-emitter charge||-|39|-||
|Qgc|Gate-collector charge||-|82|-||



**Table 6: IGBT switching characteristics (inductive load)** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|td(off)|Turn-off-delaytime|VCE= 400 V, IC= 40 A,<br>VGE= 15 V, RG= 5 Ω (see<br>_Figure 28: "Test circuit for_<br>_inductive load switching"_)|-|142|-|ns|
|tf|Current fall time||-|27|-|ns|
|Eoff_(1)_|Turn-off switching energy||-|363|-|µJ|
|td(off)|Turn-off-delaytime|VCE= 400 V, IC= 40 A,<br>VGE= 15 V, RG= 5 Ω<br>TJ= 175 °C (see_Figure 28:_<br>_"Test circuit for inductive_<br>_load switching"_)|-|141|-|ns|
|tf|Current fall time||-|61|-|ns|
|Eoff|Turn-off switching energy||-|764|-|µJ|



**Notes:** 

(1)Including the tail of the collector current. 

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**Electrical characteristics** 

**Table 7: Diode switching characteristics (inductive load)** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|trr|Reverse recoverytime|IF= 5 A, VR= 400 V,<br>VGE= 15 V (see_Figure_<br>_28: "Test circuit for_<br>_inductive load switching"_)<br>di/dt = 1000 A/µs|-|140||ns|
|Qrr|Reverse recoverycharge||-|21||nC|
|Irrm|Reverse recoverycurrent||-|6.6||A|
|dIrr/dt|Peak rate of fall of reverse<br>recoverycurrent duringtb||-|430||A/µs|
|Err|Reverse recoveryenergy||-|1.6||µJ|
|trr|Reverse recoverytime|IF= 5 A, VR= 400 V,<br>VGE= 15 V TJ= 175 °C<br>(see_Figure 28: "Test_<br>_circuit for inductive load_<br>_switching"_)<br>di/dt = 1000 A/µs|-|200||ns|
|Qrr|Reverse recoverycharge||-|47.3||nC|
|Irrm|Reverse recoverycurrent||-|9.6||A|
|dIrr/dt|Peak rate of fall of reverse<br>recovery current during tb||-|428||A/µs|
|Err|Reverse recoveryenergy||-|3.2||µJ|



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**Electrical characteristics** 

## **2.1 Electrical characteristics (curves)** 

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**----- Start of picture text -----**<br>
Figure 2: Power dissipation vs. case  Figure 3: Collector current vs. case<br>temperature   temperature<br>**----- End of picture text -----**<br>


**Figure 4: Output characteristics (TJ = 25°C)** 

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**Figure 5: Output characteristics (TJ = 175°C)** 

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**Figure 6: VCE(sat) vs. junction temperature** 

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**Figure 7: VCE(sat) vs. collector current** 

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**Electrical characteristics** 

**Figure 8: Collector current vs. switching Figure 9: Forward bias safe operating area frequency** 

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**==> picture [161 x 143] intentionally omitted <==**

**Figure 10: Transfer characteristics** 

**==> picture [156 x 142] intentionally omitted <==**

**Figure 11: Diode VF vs. forward current** 

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**----- Start of picture text -----**<br>
Figure 12: Normalized VGE(th) vs junction  Figure 13: Normalized V(BR)CES vs. junction<br>temperature  temperature<br>**----- End of picture text -----**<br>


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**Electrical characteristics** 

**==> picture [416 x 571] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 15: Gate charge vs. gate-emitter<br>Figure 14: Capacitance variations<br>voltage<br>Figure 16: Switching energy vs collector  Figure 17: Switching energy vs gate<br>current  resistance<br>Figure 19: Switching energy vs. collector<br>Figure 18: Switching energy vs temperature<br>emitter voltage<br>**----- End of picture text -----**<br>


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**Electrical characteristics** 

**==> picture [397 x 179] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 20: Switching times vs. collector  Figure 21: Switching times vs. gate<br>current  resistance<br>**----- End of picture text -----**<br>


**==> picture [410 x 179] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 22: Reverse recovery current vs. diode  Figure 23: Reverse recovery time vs. diode<br>current slope  current slope<br>**----- End of picture text -----**<br>


**==> picture [409 x 179] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 24: Reverse recovery charge vs. diode  Figure 25: Reverse recovery energy vs. diode<br>current slope  current slope<br>**----- End of picture text -----**<br>


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**Electrical characteristics** 

**Figure 26: Thermal impedance** 

**==> picture [308 x 295] intentionally omitted <==**

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**Electrical characteristics** 

**Figure 27: Thermal impedance for diode** 

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**Test circuits** 

## **3 Test circuits** 

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**----- Start of picture text -----**<br>
Figure 28: Test circuit for inductive load<br>switching<br>Figure 29: Gate charge test circuit<br>VCC<br>A A<br>C<br>12 V 47 kΩ<br>G L=100 µH 1 kΩ<br>100 nF<br>E B<br>B<br>C 3.3µF 1000µF VCC<br>G D.U.T Vi ≤ VGMAX IG=CONST 100 Ω D.U.T.<br>+ RG E 2200<br>µF 2.7 kΩ VG<br>-<br>47 kΩ<br>PW 1 kΩ<br>AM01504v1<br>AM01505v1<br>**----- End of picture text -----**<br>


**Figure 30: Switching waveform** 

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**Package information** 

## **4 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _**www.st.com**_ . ECOPACK[®] is an ST trademark. 

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**Package information** 

## **4.1 TO-3P package information** 

**Figure 31: TO-3P package outline** 

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**----- Start of picture text -----**<br>
8045950_B<br>**----- End of picture text -----**<br>


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**Package information** 

**Table 8: TO-3P package mechanical data** 

|**Dim.**||**mm**||
|---|---|---|---|
||**Min.**|**Typ.**|**Max.**|
|A|4.60|4.80|5.00|
|A1|1.45|1.50|1.65|
|A2|1.20|1.40|1.60|
|b|0.80|1.00|1.20|
|b1|1.80|2.00|2.20|
|b2|2.80|3.00|3.20|
|c|0.55|0.60|0.75|
|D|19.70|19.90|20.10|
|D1|13.70|13.90|14.10|
|E|15.40|15.60|15.80|
|E1|13.40|13.60|13.80|
|E2|9.40|9.60|9.90|
|e|5.15|5.45|5.75|
|L|19.80|20.00|20.20|
|L1|3.30|3.50|3.70|
|L2|18.20|18.40|18.60|
|ØP|3.30|3.40|3.50|
|ØP1|3.10|3.20|3.30|
|Q|4.80|5.00|5.20|
|Q1|3.60|3.80|4|



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**Revision history** 

## **5 Revision history** 

**Table 9: Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|20-Oct-2015|1|First release.|
|01-Mar-2016|2|Updated features in cover page.<br>Inserted_Section 2.1: "Electrical characteristics (curves)"_.<br>Minor text changes|
|13-Jul-2016|3|Document statuspromoted frompreliminarytoproduction data.|



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## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

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ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

- © 2016 STMicroelectronics – All rights reserved 

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