# Intelligent Power Module (IPM), IPM, IGBT, 600 V, 3 A, 1 kV, NDIP, SLLIMM-nano

![Product image](https://novapart.co/image/farnell:2341744/)

**URL**: https://novapart.co/products/STGIPN3H60/intelligent-power-module-ipm-igbt-600-v-3-a-1-kv
**SKU**: STGIPN3H60
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Intelligent Power Modules
**Price**: €4.4500
**Stock**: 200+
**Lead Time**: 127 days (indicative)

## Description

IPM Power Device:IGBT; Voltage Rating (Vces / Vdss):600V; Current Rating (Ic / Id):3A; Isolation Voltage:1kV; IPM Case Style:NDIP; IPM Series:SLLIMM-nano; Product Range:-; SVHC:No SVHC (17-Dec-2

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| Ipm Series | SLLIMM-nano |
| Product Range | - |
| Ipm Case Style | NDIP |
| Ipm Power Device | IGBT |
| Isolation Voltage | 1kV |
| Current Rating (Ic / Id) | 3A |
| Voltage Rating (Vces / Vdss) | 600V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2341744/)

**STGIPN3H60** 

Datasheet 

## SLLIMM-nano IPM, 3 A, 600 V, 3-phase inverter bridge IGBT 

## **Features** 

- IPM 3 A, 600 V, 3-phase IGBT inverter bridge including control ICs for gate driving and freewheeling diodes 

- Optimized for low electromagnetic interferences 

- VCE(sat) negative temperature coefficient 

- 3.3 V, 5 V, 15 V CMOS/TTL input comparators with hysteresis and pull-down/ pull-up resistors 

- Undervoltage lockout 

- Internal bootstrap diode 

- Interlocking function 

- Shutdown function 

- Comparator for fault protection against overtemperature and overcurrent 

- Op-amp for advanced current sensing 

- Optimized pinout for easy board layout 

**NDIP-26L** 

## **Applications** 

- 3-phase inverters for motor drives 

- Dish washers 

- Refrigerator compressors 

- Air-conditioning fans 

- Draining and recirculation pumps 

## **Description** 

|**Device summary**<br>~~a~~|**Device summary**<br>~~a~~|
|---|---|
|**Order code**<br>STGIPN3H60|STGIPN3H60|
|**Marking**|GIPN3H60|
|**Package**|NDIP-26L|
|**Packing**|Tube|



This intelligent power module implements a compact, high performance AC motor drive in a simple, rugged design. It is composed of six IGBTs with freewheeling diodes and three half-bridge HVICs for gate driving, providing low electromagnetic interference (EMI) characteristics with optimized switching speed. The package is optimized for thermal performance and compactness in built-in motor applications, or other low power applications where assembly space is limited. This IPM includes an operational amplifier, completely uncommitted, and a comparator that can be used to design a fast and efficient protection circuit. SLLIMM™ is a trademark of STMicroelectronics. 

**DS7272** - **Rev 8** - **March 2020** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STGIPN3H60 Internal schematic diagram and pin configuration** 

**1 Internal schematic diagram and pin configuration** 

**Figure 1. Internal schematic diagram** 

**==> picture [481 x 556] intentionally omitted <==**

**----- Start of picture text -----**<br>
PIN 1 PIN 26<br>GND N W<br>GND<br>SD-OD<br>HVG<br>Vcc W VCC OUT W, OUT W<br>LVG<br>HIN W HIN<br>SD-OD VBOOT<br>LIN W LIN Vboot W<br>OP+<br>GND OP+<br>OPOUT OPOUT<br>N V<br>OP- OP- HVG<br>Vcc V VCC OUT V, OUT V<br>LVG<br>HIN V HIN<br>SD-OD VBOOT<br>LIN V LIN Vboot V<br>CIN<br>GND<br>CIN N U<br>HVG<br>Vcc U VCC OUT U,OUT U<br>LVG<br>HIN U HIN P<br>SD-OD SD-OD VBOOT<br>LIN U LIN Vboot U<br>PIN 16 PIN 17<br>AM09916v1<br>**----- End of picture text -----**<br>


**DS7272** - **Rev 8** 

**page 2/20** 

**STGIPN3H60 Internal schematic diagram and pin configuration** 

**Table 1. Pin description** 

|**Pin**|**Symbol**|**Description**|
|---|---|---|
|1|GND|Ground|
|2|SD<br>/ OD|Shutdown logic input (active low) / open-drain (comparator output)|
|3|VCCW|Low voltage power supply W phase|
|4|HIN W|High-side logic input for W phase|
|5|LIN<br>W|Low-side logic input for W phase|
|6|OP+|Op-amp non inverting input|
|7|OPOUT|Op-amp output|
|8|OP-|Op-amp inverting input|
|9|VCCV|Low voltage power supply V phase|
|10|HIN V|High-side logic input for V phase|
|11|LIN<br>V|Low-side logic input for V phase|
|12|CIN|Comparator input|
|13|VCCU|Low voltage power supply for U phase|
|14|HIN U|High-side logic input for U phase|
|15|SD<br>/ OD|Shutdown logic input (active low) / open-drain (comparator output)|
|16|LIN<br>U|Low-side logic input for U phase|
|17|VBOOTU|Bootstrap voltage for U phase|
|18|P|Positive DC input|
|19|U, OUTU|U phase output|
|20|NU|Negative DC input for U phase|
|21|VBOOTV|Bootstrap voltage for V phase|
|22|V, OUTV|V phase output|
|23|NV|Negative DC input for V phase|
|24|VBOOTW|Bootstrap voltage for W phase|
|25|W, OUTW|W phase output|
|26|NW|Negative DC input for W phase|



**DS7272** - **Rev 8** 

**page 3/20** 

**STGIPN3H60 Internal schematic diagram and pin configuration** 

**Figure 2. Pin layout (top view)** 

**==> picture [424 x 215] intentionally omitted <==**

**----- Start of picture text -----**<br>
PIN26 (*) (*) PIN17<br>PIN #1 ID<br>PIN1 PIN16<br>(*) Dummy pin internally connected to P (positive DC input). AM09368V1<br>**----- End of picture text -----**<br>


**DS7272** - **Rev 8** 

**page 4/20** 

**STGIPN3H60 Electrical ratings** 

**2 Electrical ratings** 

## **2.1 Absolute maximum ratings** 

## **Table 2. Inverter part** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VCES|Each IGBT collector emitter voltage (VIN(1)= 0)|600|V|
|± IC|Continuous collector current each IGBT(TC= 25 °C)|3|A|
|± ICP (2)|Pulsed collector current each IGBT (less than 1 ms)|18|A|
|PTOT|Total power dissipation each IGBT(TC= 25 °C)|9.7|W|



_1. Applied between HINi, LIN i and GND for i = U, V, W._ 

_2. Pulse width limited by max. junction temperature._ 

**Table 3. Control part** 

|**Symbol**|**Parameter**|**Min.**|**Max.**|**Unit**|
|---|---|---|---|---|
|VOUT|Output voltage applied between OUTU, OUTV,<br>OUTW- GND|Vboot- 21|Vboot+ 0.3|V|
|VCC|Low voltage power supply|- 0.3|21|V|
|VCIN|Comparator input voltage|- 0.3|VCC+ 0.3|V|
|Vop+|Op-amp non-inverting input|- 0.3|VCC+ 0.3|V|
|Vop-|Op-amp inverting input|- 0.3|VCC+ 0.3|V|
|Vboot|Bootstrap voltage|- 0.3|620|V|
|VIN|Logic input voltage applied among HIN,<br>LIN<br>and GND|- 0.3|15|V|
|V<br>SD/OD|Open-drain voltage|- 0.3|15|V|
|dVout/dt|Allowed output slew rate||50|V/ns|



**Table 4. Total system** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VISO|Isolation withstand voltage applied between each pin and heat sink plate<br>(AC voltage, t = 60 s)|1000|Vrms|
|TJ|Power chip operating junction temperature range|-40 to 150|°C|
|TC|Module operation case temperature range|-40 to 125|°C|



**DS7272** - **Rev 8** 

**page 5/20** 

**STGIPN3H60 Thermal data** 

## **2.2 Thermal data** 

## **Table 5. Thermal data** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|Rth(j-c)|Thermal resistance junction-case single IGBT|12.8|°C/W|
||Thermal resistance junction-case single diode|15.5||
|Rth(j-a)|Thermal resistance junction-ambient (per module)|22||



**DS7272** - **Rev 8** 

**page 6/20** 

**STGIPN3H60 Electrical characteristics** 

**3 Electrical characteristics** 

## **3.1 Inverter part** 

TJ = 25 °C unless otherwise specified. 

**Table 6. Static** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|VCE(sat)|Collector-emitter saturation<br>voltage|VCC= Vboot= 15 V,<br>VIN (1)= 0 to 5 V, IC= 1 A|-|2.15|2.6|V|
|||VCC= Vboot= 15 V,<br>VIN (1)= 0 to 5 V, IC= 1 A,<br>TJ= 125 °C|-|1.65|||
|ICES|Collector cut-off current<br>(VIN (1)= 0 “logic state”)|VCE= 550 V, VCC= 15 V ,<br>VBS= 15 V|-||250|µA|
|VF|Diode forward voltage|VIN (1)= 0 “logic state”, IC= 1 A|-||1.7|V|



_1. Applied between HINi, LIN i and GND for i = U, V, W (LIN inputs are active low)._ 

**Table 7. Inductive load switching time and energy** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|ton (1)|Turn-on time|VDD= 300 V,<br>VCC= Vboot= 15 V,<br>VIN (2)= 0 to 5 V,<br>IC= 1 A<br>(seeFigure 4. Switching time<br>definition)|-|275|-|ns|
|tc(on) (1)|Crossover time (on)||-|90|-||
|toff (1)|Turn-off time||-|890|-||
|tc(off) (1)|Crossover time (off)||-|125|-||
|trr|Reverse recovery time||-|50|-||
|Eon|Turn-on switching energy||-|18|-|µJ|
|Eoff|Turn-off switching energy||-|13|-||



_1. tON and tOFF include the propagation delay time of the internal drive. tC(ON) and tC(OFF) are the switching time of IGBT itself under the internally given gate driving conditions._ 

_2. Applied between HINi, LIN i and GND for i = U, V, W ( LIN inputs are active low)._ 

**DS7272** - **Rev 8** 

**page 7/20** 

**STGIPN3H60 Inverter part** 

**Figure 3. Switching time test circuit** 

**==> picture [416 x 527] intentionally omitted <==**

**----- Start of picture text -----**<br>
INPUT<br>BOOT<br>/Lin VBOOT>VCC BUS<br>+5V<br>/SD HVG<br>RSD<br>Hin L<br>OUT<br>VCC<br>Vcc<br>IC<br>DT LVG<br>VCE<br>GND CP+<br>0<br>1<br>AM09366v1<br>Figure 4. Switching time definition<br>100% IC 100% IC<br>t rr<br>VCE IC IC VCE<br>VIN VIN<br>t ON t OFF<br>t C(ON) t C(OFF)<br>VIN(ON) 10% IC 90% IC 10% VCE VIN(OFF) 10% VCE 10% IC<br>(a) turn-on (b) turn-off<br>AM09223V1<br>**----- End of picture text -----**<br>


Figure 4. Switching time definition refers to HIN inputs (active high). For LIN inputs (active low), VIN polarity must be inverted for turn-on and turn-off. 

**DS7272** - **Rev 8** 

**page 8/20** 

**STGIPN3H60 Control part** 

## **3.2 Control part** 

(VCC = 15 V unless otherwise specified). 

**Table 8. Low voltage power supply** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|VCC_hys|VCCUV hysteresis||1.2|1.5|1.8|V|
|VCC_thON|VCCUV turn-ON threshold||11.5|12|12.5|V|
|VCC_thOFF|VCCUV turn-OFF threshold||10|10.5|11|V|
|Iqccu|Undervoltage quiescent supply<br>current|VCC= 15 V,<br>SD<br>/OD = 5 V,<br>LIN<br>= 5 V, HIN = 0 V, CIN = 0 V|||150|µA|
|Iqcc|Quiescent current|Vcc= 15 V,<br>SD<br>/OD = 5 V,<br>LIN<br>= 5 V, HIN = 0 V, CIN = 0 V|||1|mA|
|Vref|Internal comparator (CIN)<br>reference voltage||0.5|0.54|0.58|V|



**Table 9. Bootstrapped voltage** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|VBS_hys|VBSUV hysteresis||1.2|1.5|1.8|V|
|VBS_thON|VBSUV turn-ON threshold||11.1|11.5|12.1|V|
|VBS_thOFF|VBSUV turn-OFF threshold||9.8|10|10.6|V|
|IQBSU|Undervoltage VBSquiescent<br>current|VBS< 9 V<br>SD<br>/OD = 5 V,<br>LIN<br>and HIN = 5 V, CIN = 0 V||70|110|µA|
|IQBS|VBSquiescent current|VBS= 15 V<br>SD<br>/OD = 5 V,<br>LIN<br>and HIN = 5 V, CIN = 0 V||200|300|µA|
|RDS(on)|Bootstrap driver on-resistance|LVG ON||120||Ω|



**Table 10. Logic inputs** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Vil|Low logic level voltage||0.8||1.1|V|
|Vih|High logic level voltage||1.9||2.25|V|
|IHINh|HIN logic “1” input bias current|HIN = 15 V|110|175|260|µA|
|IHINI|HIN logic “0” input bias current|HIN = 0 V|||1|µA|
|ILINI|LIN<br>logic “1” input bias current|LIN<br>= 0 V|3|6|20|µA|
|ILINh|LIN<br>logic “0” input bias current|LIN<br>= 15 V|||1|µA|
|ISDh|SD<br>logic “0” input bias current|SD<br>= 15 V|30|120|300|µA|
|ISDI|SD<br>logic “1” input bias current|SD<br>= 0 V|||3|µA|
|Dt|Dead time|seeFigure 5. Dead time and<br>interlocking waveform definitions||180||ns|



**DS7272** - **Rev 8** 

**page 9/20** 

**STGIPN3H60 Control part** 

## **Table 11. Op-amp characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Vio|Input offset voltage|Vic= 0 V, Vo= 7.5 V|||6|mV|
|Iio|Input offset current|Vic= 0 V, Vo= 7.5 V||4|40|nA|
|Iib|Input bias current(1)|||100|200|nA|
|Vicm|Input common mode voltage<br>range||0|||V|
|VOL|Low level output voltage|RL= 10 kΩ to VCC||75|150|mV|
|VOH|High level output voltage|RL= 10 kΩ to GND|14|14.7||V|
|Io|Output short-circuit current|Source, Vid= + 1 V; Vo= 0 V|16|30||mA|
|||Sink, Vid= -1 V; Vo= VCC|50|80||mA|
|SR|Slew rate|Vi= 1 - 4 V; CL= 100 pF; unity<br>gain|2.5|3.8||V/µs|
|GBWP|Gain bandwidth product|Vo= 7.5 V|8|12||MHz|
|Avd|Large signal voltage gain|RL= 2 kΩ|70|85||dB|
|SVR|Supply voltage rejection ratio|vs. VCC|60|75||dB|
|CMRR|Common mode rejection ratio||55|70||dB|



_1. The direction of the input current is out of the IC._ 

**Table 12. Sense comparator characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Iib|Input bias current|VCIN= 1 V|||1|µA|
|Vol|Open-drain low level output<br>voltage|Iod= 3 mA|||0.5|V|
|td_comp|Comparator delay|SD<br>/OD pulled to 5 V<br>through 100 kΩ resistor||90|130|ns|
|SR|Slew rate|CL= 180 pF; Rpu= 5 kΩ||60||V/µs|
|tsd|Shutdown to high / low-side driver<br>propagation delay|VOUT= 0, Vboot= VCC,<br>VIN= 0 to 3.3 V|50|125|200|ns|
|tisd|Comparator triggering to high /<br>low-side driver turn-off<br>propagation delay|Measured applying a voltage step<br>from 0 V to 3.3 V to pin CIN|50|200|250||



**DS7272** - **Rev 8** 

**page 10/20** 

**STGIPN3H60 Waveform definitions** 

## **Table 13. Truth table** 

|**Condition**|**Logic input (VI)**|**Logic input (VI)**|**Logic input (VI)**|**Output**|**Output**|
|---|---|---|---|---|---|
||**SD**<br>**/OD**|**LIN**|**HIN**|**LVG**|**HVG**|
|Shutdown enable half-bridge tri-state|L|X(1)|X(1)|L|L|
|Interlocking half-bridge tri-state|H|L|H|L|L|
|0 “logic state” half-bridge tri-state|H|H|L|L|L|
|1 “logic state” low-side direct driving|H|L|L|H|L|
|1 “logic state” high-side direct driving|H|H|H|L|H|



_1. X: don’t care._ 

## **3.3** 

## **Waveform definitions** 

## **Figure 5. Dead time and interlocking waveform definitions** 

**==> picture [453 x 389] intentionally omitted <==**

**----- Start of picture text -----**<br>
LIN<br>CONTROL SIGNAL EDGES HIN<br>OVERLAPPED:<br>INTERLOCKING + DEAD TIME LVG<br>DTLH DTHL<br>HVG<br>gate driver outputs OFF gate driver outputs OFF<br>(HALF-BRIDGE TRI-STATE) (HALF-BRIDGE TRI-STATE)<br>LIN<br>CONTROL SIGNALS EDGES HIN<br>SYNCHRONOUS (*):<br>DEAD TIME<br>LVG<br>DTLH DTHL<br>HVG<br>gate driver outputs OFF gate driver outputs OFF<br>(HALF-BRIDGE TRI-STATE) (HALF-BRIDGE TRI-STATE)<br>LIN<br>CONTROL SIGNALS EDGES HIN<br>NOT OVERLAPPED,<br>BUT INSIDETHE DEADTIME:<br>LVG<br>DEAD TIME<br>DTLH DTHL<br>HVG<br>gate driver outputs OFF gate driver outputs OFF<br>(HALF-BRIDGE TRI-STATE) (HALF-BRIDGE TRI-STATE)<br>LIN<br>CONTROL SIGNALS EDGES<br>NOT OVERLAPPED, HIN<br>OUTSIDETHE DEADTIME:<br>DIRECT DRIVING<br>LVG<br>DTLH DTHL<br>HVG<br>gate driver outputs OFF gate driver outputs OFF<br>(HALF-BRIDGE TRI-STATE) (HALF-BRIDGE TRI-STATE)<br>INTERLOCKING INTERLOCKING<br>**----- End of picture text -----**<br>


- (*)  HIN and LIN can be connected together and driven by just one control signal 

**DS7272** - **Rev 8** 

**page 11/20** 

**STGIPN3H60 Shutdown function** 

**4** 

## **Shutdown function** 

The device is equipped with three half-bridge IC gate drivers and integrates a comparator for fault detection. The comparator has an internal voltage reference VREF connected to the inverting input, while the non-inverting input pin (CIN) can be connected to an external shunt resistor for current monitoring. 

Since the comparator is embedded in the U IC gate driver, in case of fault it disables directly the U outputs, whereas the shutdown of V and W IC gate drivers depends on the RC value of the external SD circuitry, which fixes the disabling time. 

For an effective design of the shutdown circuit, please refer to Application note AN4966. 

## **Figure 6. Shutdown timing waveforms** 

**==> picture [373 x 445] intentionally omitted <==**

**----- Start of picture text -----**<br>
GADG250120171515FSR<br>. i)<br>V REF a, Seeeri reer<br>f<br>i<br>CI N 1 J<br>'<br>i<br>f\<br>'<br>HIN or LIN<br>'i]<br>i<br>U ' V, W 1<br>PROTECT ION<br>HVG or  LVG<br>i ee<br>— H '<br>SD/ODor Vogt { I<br>T/SD/OD — q!li)<br>iee eee cine<br>Vin-------4-5 ‘<br>1 1<br>A<br>ro tT B<br>open -drain gate<br>(internal)<br>' t A ' t B '<br>L >t i)<br>ta = tq In (ot ton) te 2 ti ne)<br>SHUTDOWN CIRCUIT ~ Vitwien—Von 7’ ~ Vi n e— V e<br>Vi<br>oe Ta = (Ron_op//Rsp//Rpp_sp// [∗] Rwrc)* €sv = Ron_ov * sp<br>Rso Te = (Rsp//Rpp_spo// [∗] Ryrc)*sp<br>V.—— a:x Vo= aonRon_ov//Rpp_sp// [∗] [∗] Rute LV<br>I een § § ae on (Row_ov//Rpp_ ≅ sp// Rwre) +  Rsp “<br>= =>RPD_sD+ i “Rute i = Ron.ov Ron_op + Rsp V,<br>Vi= Rpp_so// ∗ [∗] Rte LV,<br>off Spi (Rep _ sp// Rwrc) + Rsp ms<br>RSD and CSD external circuitry must be designed to ensure  Von<Vii & Voge> Vin<br>Please refer to AN4966 for further details.<br>**----- End of picture text -----**<br>


* RNTC to be considered only when the NTC is internally connected to the T/SD/OD pin. 

**DS7272** - **Rev 8** 

**page 12/20** 

**STGIPN3H60 Application circuit example** 

**5** 

## **Application circuit example** 

**Figure 7. Application circuit example** 

**==> picture [170 x 46] intentionally omitted <==**

**==> picture [291 x 358] intentionally omitted <==**

**==> picture [38 x 6] intentionally omitted <==**

**----- Start of picture text -----**<br>
AM09367v1<br>**----- End of picture text -----**<br>


Application designers are free to use a different scheme according to the specifications of the device. 

**DS7272** - **Rev 8** 

**page 13/20** 

**STGIPN3H60 Guidelines** 

## **5.1 Guidelines** 

- Input signal HIN is active high logic. A pull-down resistor of 85 kΩ (typ.) is built-in for each high-side input. If an external RC filter is used for noise immunity, attention should be given to the variation of the input signal level. 

- Input signal LIN is active low logic. A 720 kΩ (typ.) pull-up resistor, connected to an internal 5 V regulator through a diode, is built-in for each low-side input. 

- To avoid input signal oscillation, the wiring of each input should be as short as possible. 

- By integrating an application specific type HVIC inside the module, direct coupling to the MCU terminals without an optocoupler is possible. 

- Each capacitor should be located as close as possible to pins of IPM. 

- Low inductance shunt resistors should be used for phase leg current sensing. 

- Electrolytic bus capacitors should be mounted as close to the module bus terminals as possible. Additional high frequency ceramic capacitors mounted close to the module pins improve the performance. 

- The SD /OD signal should be pulled up to 5 V / 3.3 V with an external resistor (see Smart shutdown function for detailed info). 

   - These guidelines ensure the specifications of the device for application designs. For further details, please refer to the relevant application note AN4043. 

**Table 14. Recommended operating conditions** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|VPN|Supply voltage|Applied between P-Nu, Nv, Nw||300|500|V|
|VCC|Control supply voltage|Applied between VCC-GND|13.5|15|18|V|
|VBS|High-side bias voltage|Applied between VBOOTi-OUTifor i<br>= U, V, W|13||18|V|
|tdead|Blanking time to avoid arm-short|For each input signal|1.5|||µs|
|fPWM|PWM input signal|-40 °C < TC< 100 °C<br>-40 °C < TJ< 125 °C|||25|kHz|
|TC|Case operation temperature||||100|°C|



**DS7272** - **Rev 8** 

**page 14/20** 

**STGIPN3H60 Package information** 

**6 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **6.1 NDIP-26L type C package information** 

**Figure 8. NDIP-26L type C package outline** 

**==> picture [330 x 400] intentionally omitted <==**

**==> picture [31 x 6] intentionally omitted <==**

**----- Start of picture text -----**<br>
8278949_7<br>**----- End of picture text -----**<br>


**DS7272** - **Rev 8** 

**page 15/20** 

**STGIPN3H60 NDIP-26L type C package information** 

**Table 15. NDIP-26L type C mechanical data** 

|**Di**|**mm**|**mm**|**mm**|
|---|---|---|---|
|**m.**|**Min.**|**Typ.**|**Max.**|
|A|||4.40|
|A1|0.80|1.00|1.20|
|A2|3.00|3.10|3.20|
|A3|1.70|1.80|1.90|
|A4|5.70|5.90|6.10|
|b|0.53||0.72|
|b1|0.52|0.60|0.68|
|b2|0.83||1.02|
|b3|0.82|0.90|0.98|
|c|0.46||0.59|
|c1|0.45|0.50|0.55|
|D|29.05|29.15|29.25|
|D1|0.50|0.77|1.00|
|D2|0.35|0.53|0.70|
|D3|||29.55|
|E|12.35|12.45|12.55|
|e|1.70|1.80|1.90|
|e1|2.40|2.50|2.60|
|eB1|16.10|16.40|16.70|
|eB2|21.18|21.48|21.78|
|L|1.24|1.39|1.54|



**DS7272** - **Rev 8** 

**page 16/20** 

**STGIPN3H60 NDIP-26L packing information** 

## **6.2 NDIP-26L packing information** 

**Figure 9. NDIP-26L tube (dimensions are in mm)** 

**==> picture [38 x 39] intentionally omitted <==**

**==> picture [123 x 53] intentionally omitted <==**

**==> picture [16 x 5] intentionally omitted <==**

**----- Start of picture text -----**<br>
Notes:<br>**----- End of picture text -----**<br>


1- Material: extrused/transparent PVC 0.80[±0.1] mm thickness 10E6~10E11/SQ PVC 

- 2- General tolerance unless otherwise specified: ±0.25 mm 

**==> picture [26 x 6] intentionally omitted <==**

**----- Start of picture text -----**<br>
8313150_3<br>**----- End of picture text -----**<br>


**Table 16. Shipping details** 

|**Parameter**|**Value**|
|---|---|
|Base quantity|17 pieces|
|Bulk quantity|476 pieces|



**DS7272** - **Rev 8** 

**page 17/20** 

**STGIPN3H60** 

## **Revision history** 

## **Table 17. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|23-Jun-2011|1|Initial release.|
|23-Dec-2011|2|Document status promoted from preliminary data to datasheet. Added_Figure 9 on_<br>_page 20._|
|03-Jul-2012|3|Modified: Min. and Max. value_Table 4 on page 6_.<br>Added:_Table 14 on page 17_.|
|14-Mar-2014|4|Updated_Figure 3: Switching time test circuit, Figure 6: Smart shutdown timing_<br>_waveforms._<br>Updated_Table 9: Bootstrapped voltage (VCC = 15 V unless otherwise specified),_<br>_Table 10: Logic inputs (VCC = 15 V unless otherwise specified)_.<br>Updated_Section 6: Package mechanical data._|
|28-Aug-2014|5|Updated unit in_Table 9: Bootstrapped voltage (VCC = 15 V unless otherwise_<br>_specified)_|
|12-Nov-2014|6|Updated unit for Slew rate parameter in_Table 11.: OPAMP characteristics (VCC = 15_<br>_V unless otherwise specified)_<br>Updated_6: Package mechanical data_.|
|16-Mar-2017|7|Updated_Section 6.1: "NDIP-26L type C package information" and Section 6.2:_<br>_"NDIP-26L packing information"_.<br>Minor text changes.|
|02-Mar-2020|8|Modified title, applications and description on cover page.<br>ModifiedTable 2. Inverter part,Table 5. Thermal data,Table 6. , Table 8. Low voltage<br>power supply,Table 12. Sense comparator characteristics,Section  4  Shutdown<br>function.<br>Minor text changes.|



**DS7272** - **Rev 8** 

**page 18/20** 

**STGIPN3H60 Contents** 

## **Contents** 

|**1**|**Internal schematic diagram and pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2**|
|---|---|
|**2**|**Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5**|
||**2.1**<br>Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5|
||**2.2**<br>Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6|
|**3**|**Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7**|
||**3.1**<br>Inverter part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7|
||**3.2**<br>Control part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9|
||**3.3**<br>Waveform definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
|**4**|**Smart shutdown function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12**|
|**5**|**Application circuit example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13**|
||**5.1**<br>Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14|
|**6**|**Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15**|
||**6.1**<br>NDIP-26L type C package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15|
||**6.2**<br>NDIP-26L packing information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17|
|**Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18**||



**DS7272** - **Rev 8** 

**page 19/20** 

**STGIPN3H60** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2020 STMicroelectronics – All rights reserved 

**DS7272** - **Rev 8** 

**page 20/20** 



## Links

- [View this product on Novapart](https://novapart.co/products/STGIPN3H60/intelligent-power-module-ipm-igbt-600-v-3-a-1-kv)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/stmicroelectronics/stgipn3h60/ipm-igbt-3a-1kv-ndip/dp/2341744)
---

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