# IGBT, AEC-Q101, 84 A, 1.6 V, 441 W, 650 V, HU3PAK, 7 Pins

![Product image](https://novapart.co/image/farnell:4549906RL/)

**URL**: https://novapart.co/products/STGHU30M65DF2AG/igbt-aec-q101-84-a-16-v-441-w-650-hu3pak-7-pins
**SKU**: STGHU30M65DF2AG
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || IGBTs || Single IGBTs
**Price**: €1.7000
**Stock**: 50+
**Lead Time**: 23 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (21-Jan-2025) |
| No. Of Pins | 7Pins |
| Power Dissipation | 441W |
| Operating Temperature Max | 175°C |
| Continuous Collector Current | 84A |
| Collector Emitter Voltage Max | 650V |
| Collector Emitter Saturation Voltage | 1.6V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4549906RL/)

**STGHU30M65DF2AG** 

Datasheet 

Automotive-grade trench gate field-stop 650 V, 30 A low-loss M series IGBT in an HU3PAK package 

**Features** 

TAB 7 • AEC-Q101 qualified • Maximum junction temperature: TJ = 175 °C • e 1 6 μs of minimum short-circuit withstand time 

- VCE(sat) = 1.6 V (typ.) @ IC = 30 A 

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HU3PAK<br>**----- End of picture text -----**<br>


- Tight parameter distribution 

- Safer paralleling 

- Low thermal resistance 

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C(TAB)<br>G(1)<br>K(2)<br>E(3,4,5,6,7)<br>K2G1CTABE34567<br>**----- End of picture text -----**<br>


- Soft and very fast-recovery antiparallel diode 

- Excellent switching performance thanks to the extra driving kelvin pin 

## **Applications** 

- Automotive motor control 

- e-compressor 

- Industrial motor control 

- Power supplies and converters 

## **Description** 

This device is an IGBT developed using an advanced proprietary trench gate fieldstop structure. The device is part of the M series IGBTs, which represent an optimal balance between inverter system performance and efficiency where the low-loss and the short-circuit functionality is essential. Furthermore, the positive VCE(sat) temperature coefficient and the tight parameter distribution result in safer paralleling operation. & 

## **Product status link** ~~Saas~~ 

**Product status link** STGHU30M65DF2AG 

|**Product summary**<br>~~Saas~~|**Product summary**<br>~~Saas~~|
|---|---|
|**Order code**|STGHU30M65DF2AG|
|**Marking**|G30M65DF2AG|
|**Package**|HU3PAK|
|**Packing**|Tape and reel|



**DS14705** - **Rev 1** - **June 2024** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STGHU30M65DF2AG Electrical ratings** 

## **1 Electrical ratings** 

## **Table 1. Absolute maximum ratings** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VCES|Collector-emitter voltage (VGE= 0 V)|650|V|
|IC|Continuous collector current at TC= 25 °C|84|A|
||Continuous collector current at TC= 100 °C|57||
|ICP(1)|Pulsed collector current (tp≤ 1 μs)|120|A|
|VGE|Gate-emitter voltage|±20|V|
||Transient gate-emitter voltage (tp≤ 10 μs, D < 0.01)|±30||
|IF|Continuous forward current at TC= 25 °C|69|A|
||Continuous forward current at TC= 100 °C|43||
|IFP(1)|Pulsed collector current (tp≤ 1 μs)|120|A|
|PTOT|Total power dissipation at TC= 25 °C|441|W|
|TSTG|Storage temperature range|-55 to 150|°C|
|TJ|Operating junction temperature range|-55 to 175|°C|



_1. Defined by RthJC and limited by maximum junction temperature, not tested in production._ 

## **Table 2. Thermal data** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|RthJC|Thermal resistance, junction-to-case, IGBT|0.34|°C/W|
||Thermal resistance, junction-to-case, diode|0.82||
|RthJA|Thermal resistance, junction-to-ambient|30|°C/W|



**DS14705** - **Rev 1** 

**page 2/16** 

**STGHU30M65DF2AG Electrical characteristics** 

## **2 Electrical characteristics** 

TJ = 25 °C unless otherwise specified. 

**Table 3. Static characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|V(BR)CES|Collector-emitter breakdown<br>voltage|VGE= 0 V, IC= 250 μA|650|||V|
|VCE(sat)|Collector-emitter saturation<br>voltage|VGE= 15 V, IC= 30 A||1.60|2.0|V|
|||VGE= 15 V, IC= 30 A, TJ= 125 °C||1.84|||
|||VGE= 15 V, IC= 30 A, TJ= 175 °C||2.0|||
|VF|Forward on-voltage|IF= 30 A||1.86|2.65|V|
|||IF= 30 A, TJ= 125 °C||1.6|||
|||IF= 30 A, TJ= 175 °C||1.5|||
|VGE(th)|Gate threshold voltage|VCE= VGE, IC= 500 µA|5|6|7|V|
|ICES|Collector cut-off current|VGE= 0 V, VCE= 650 V|||25|µA|
|IGES|Gate-emitter leakage current|VCE= 0 V, VGE= ±20 V|||±250|nA|



**Table 4. Dynamic characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Cies|Input capacitance|VCE= 25 V, f = 1 MHz, VGE= 0 V|-|2393|-|pF|
|Coes|Output capacitance||-|146|-|pF|
|Cres|Reverse transfer capacitance||-|45.4|-|pF|
|Qg|Total gate charge|VCC= 520 V, IC= 30 A, VGE= 0 to 15 V<br>(seeFigure 26.  Gate charge test circuit)|-|90|-|nC|
|Qge|Gate-emitter charge||-|16.5|-|nC|
|Qgc|Gate-collector charge||-|39|-|nC|



**DS14705** - **Rev 1** 

**page 3/16** 

**STGHU30M65DF2AG Electrical characteristics** 

**Table 5. IGBT switching characteristics (inductive load)** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|td(on)|Turn-on delay time|VCE= 400 V, IC= 30 A, VGE= 15 V,<br>RG= 10 Ω (seeFigure 25.  Test circuit for<br>inductive load switching)||22|-|ns|
|tr|Current rise time|||10|-|ns|
|di/dt(on)|Turn-on current slope|||2350|-|A/µs|
|td(off)|Turn-off delay time|||151|-|ns|
|tf|Current fall time|||152|-|ns|
|Eon(1)|Turn-on switching energy|||210|-|µJ|
|Eoff(2)|Turn-off switching energy|||1147|-|µJ|
|td(on)|Turn-on delay time|VCE= 400 V, IC= 30 A, VGE= 15 V,<br>RG= 10 Ω, TJ= 175 °C (seeFigure 25.  Test<br>circuit for inductive load switching)||165|-|ns|
|tr|Current rise time|||11|-|ns|
|di/dt(on)|Turn-on current slope|||2120|-|A/µs|
|td(off)|Turn-off delay time|||165|-|ns|
|tf|Current fall time|||238|-|ns|
|Eon(1)|Turn-on switching energy|||382|-|µJ|
|Eoff(2)|Turn-off switching energy|||1530|-|µJ|
|tsc|Short-circuit withstand time|VCC= 400 V, VGE= 15 V, starting TJ≤ 150 °C|6||-|µs|



_1. Including the reverse recovery of the diode._ 

_2. Including the tail of the collector current._ 

**Table 6. Diode switching characteristics (inductive load)** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|trr|Reverse recovery time|IF= 30 A, VR= 400 V, VGE= 15 V,<br>di/dt = 1000 A/µs (seeFigure 25.  Test circuit<br>for inductive load switching)|-|223|-|ns|
|Qrr|Reverse recovery charge||-|1.207|-|μC|
|Irrm|Reverse recovery current||-|16|-|A|
|dIrr/dt|Peak rate of fall of reverse<br>recovery current during tb||-|90|-|A/µs|
|Err|Reverse recovery energy||-|0.265|-|mJ|
|trr|Reverse recovery time|IF= 30 A, VR= 400 V, VGE= 15 V,<br>di/dt = 1000 A/µs, TJ= 175 °C<br>(seeFigure 25.  Test circuit for inductive load<br>switching)|-|325|-|ns|
|Qrr|Reverse recovery charge||-|3.35|-|μC|
|Irrm|Reverse recovery current||-|25|-|A|
|dIrr/dt|Peak rate of fall of reverse<br>recovery current during tb||-|450|-|A/µs|
|Err|Reverse recovery energy||-|0.845|-|mJ|



**DS14705** - **Rev 1** 

**page 4/16** 

**STGHU30M65DF2AG Electrical characteristics** 

## **2.1 Electrical characteristics (curves)** 

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Figure 1. Total power dissipation vs temperature Figure 2. Collector current vs temperature<br>PTOT GPDP060620241543PDT IC GPDP060620241544CCT<br> (W) VGE ≥ 15 V, TJ ≤ 175 °C   (A) VGE ≥ 15 V, TJ ≤ 175 °C<br>400 80<br>300 60<br>200 40<br>100 20<br>0 0<br>-75 -25 25 75 125 175 TC (°C) -75 -25 25 75 125 175 TC (°C)<br>**----- End of picture text -----**<br>


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Figure 3. Typical output characteristics (TJ = 25 °C) Figure 4. Typical output characteristics (TJ = 175 °C)<br>IC GPDP060620241545OC25 IC GPDP060620241546OC175<br> (A) 13 V  (A)<br>VGE= 14,15 V 12 V VGE= 15 V<br>100 100<br>14 V<br>13 V<br>80 11 V 80<br>12 V<br>60 60<br>10 V 11 V<br>40 40 10 V<br>9 V<br>9 V<br>20 20<br>8 V 8 V<br>0 0 7 V<br>0 1 2 3 4 5 6 VCE (V) 0 1 2 3 4 5 6 VCE (V)<br>Figure 5. Typical transfer characteristics Figure 6. Typical VCE(sat) vs temperature<br>IC GPDP060620241549TCH VCE(sat) GPDP060620241547VCET<br> (A) (V)<br>VCE= 5 V<br>100 3.0<br>VGE= 15 V IC = 60 A<br>TJ= 25 °C<br>80 2.6<br>60 2.2<br>IC = 30 A<br>40 1.8<br>TJ= 175 °C<br>IC = 15 A<br>20 1.4<br>0 1.0<br>3 5 7 9 11 13 VGE (V) -75 -25 25 75 125 175 TJ (°C)<br>**----- End of picture text -----**<br>


**DS14705** - **Rev 1** 

**page 5/16** 

**STGHU30M65DF2AG Electrical characteristics** 

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Figure 7. Typical VCE(sat) vs collector current Figure 8. Forward bias safe operating area<br>VCE(sat) GPDP060620241548VCEC IC GPDP060620241549FSOA<br>(V)  (A)<br>VGE= 15 V<br>4<br>10  [2]<br>TJ= 25 °C<br>3<br>TJ= 175 °C<br>10  [1]<br>2<br>TJ= -55 °C<br>TC = 25 °C,<br>10  [0] TJ ≤ 175 °C, VGE = 15 V<br>1<br>tp = 1 μs<br>0 10  [-1]<br>0 20 40 60 80 IC (A) 10  [0] 10  [1] 10  [2] VCE (V)<br>**----- End of picture text -----**<br>


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Figure 9. Diode typical forward characteristics Figure 10.  Normalized gate treshold vs temperature<br>VF GPDP060620241550DVF VGE(th) GPDP060620241555VTH<br> (V) (norm.)<br>3.0 1.2 VGE = VCE<br>TJ= -55 °C IC = 0.5 mA<br>2.5<br>TJ= 175 °C 1.0<br>2.0<br>1.5<br>TJ= 25 °C 0.8<br>1.0<br>0.6<br>0.5<br>0.0 0.4<br>0 20 40 60 80 100 IF (A) -75 -25 25 75 125 175 TJ (°C)<br>**----- End of picture text -----**<br>


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Figure 11. Typical capacitance characteristics Figure 12. Typical gate charge characteristics<br>C  GPDP060620241557CVR VGE GPDP060620241557GCGE<br>(pF)  (V)<br>VCC = 520 V, IC = 30 A,<br>20<br>Cies IG = 1.41 mA<br>10  [3] 16<br>12<br>10  [2] 8<br>f = 1 MHz Coes 4<br>10  [1] Cres 0<br>10 [-1] 10 [0] 10 [1] 10 [2] VCE (V) 0 20 40 60 80 100 120 Qg (nC)<br>**----- End of picture text -----**<br>


**DS14705** - **Rev 1** 

**page 6/16** 

**STGHU30M65DF2AG Electrical characteristics** 

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Figure 13. Typical switching energy vs collector current Figure 14. Typical switching energy vs temperature<br>E GPDP060620241559SLC E GPDP060620241601SLT<br>(mJ) VCC = 400 V, RG = 10 Ω,  (mJ) VCC = 400 V, VGE = 15 V, IC = 30 A,<br>VGE = 15 V, TJ=175  ℃ RG = 10 Ω<br>2.5<br>Eoff 1.6<br>Eoff<br>2.0<br>1.2<br>1.5<br>0.8<br>1.0<br>Eon 0.4<br>0.5 Eon<br>0.0 0.0<br>0 10 20 30 40 50 60 IC (A) -25 25 75 125 175 TJ (°C)<br>**----- End of picture text -----**<br>


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Figure 15. Typical switching energy vs supply voltage Figure 16. Typical switching energy vs gate resistance<br>E GPDP060620241603SLV E GPDP060620241605SLG<br>(mJ) TICJ = 30 A = 175 , ℃  RG = 10 Ω, VGE = 15 V, (mJ) VTJCC = 175  = 400 V ℃ , VGE = 15 V, IC = 30 A,<br>2.4<br>2.0<br>Eoff<br>2.0<br>1.6<br>Eoff<br>1.6<br>1.2<br>1.2<br>0.8<br>Eon 0.8<br>Eon<br>0.4<br>0.4<br>0.0 0.0<br>100 200 300 400 500 VCC (V) 0 20 40 60 80 100 RG (Ω)<br>Figure 17. Typical switching times vs collector current Figure 18. Typical switching times vs gate resistance<br>t  GPDP100620241118STC t  GPDP100620241121STR<br>(ns) (ns) tf<br>tf td(off)<br>td(off) td(on)<br>10  [2] 10  [2]<br>tr<br>td(on)<br>10  [1] 10  [1]<br>tr<br>V CC  = 400 V, V GE  = 15 V, V CC  = 400 V, V GE  = 15 V,<br>RG = 10 Ω, TJ = 175  °C IC = 30 A, TJ = 175  °C<br>10  [0] 10  [0]<br>0 10 20 30 40 50 60 IC (A) 0 20 40 60 80 100 RG (Ω)<br>**----- End of picture text -----**<br>


**DS14705** - **Rev 1** 

**page 7/16** 

**STGHU30M65DF2AG Electrical characteristics** 

**Figure 19. Typical reverse recovery current vs diode** 

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current slope<br>Irrm GPDP100620241123RRC<br> (A) VCC = 400 V,   VGE = 15 V, i i ft<br>24 IF = 30 A, TJ = 175 °C oy |<br>20 eePt tT tT EE EY<br>16 PtBRR| | EE ee<br>12 Pt Pt A<br>8<br>4 PA Tt i tt Pt |<br>Ea<br>0 Pt ye ee ey tt Ey<br>0 200 400 600 800 1000 di/dt(A/µs)<br>**----- End of picture text -----**<br>


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Figure 20. Typical reverse recovery time vs diode current<br>slope<br>**----- End of picture text -----**<br>


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trr GPDP100620241125RRT<br> (ns) VCC = 400 V,   VGE = 15 V, Li<br>700 I F  = 30 A, T J  = 175 °C Lf} [tty] | ft<br>600 RSEERNE<br>500 PtPt} || PINPN |EEEtee ee<br>400 Pt | tp [PN]<br>300<br>200 Pt | | te ee<br>Pt tT | te te<br>100 Pt ye ee eT Tt Ey<br>0 200 400 600 800 1000 di/dt (A/µs)<br>**----- End of picture text -----**<br>


**Figure 21. Typical reverse recovery charge vs diode current slope** 

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Qrr GADG100620241321RRQ<br> (µC) ,<br>3.5 | F = 3 0A,Ts= 175°C |<br>Fee EE<br>Peat<br>3.0<br>2.5 Pee<br>px |<br>2.0 i<br>PPYEEeeee<br>1.5 EEE  eel<br>TYEE EEEEEE<br>1.0 Pf ELL LLL<br>|<br>0.5<br>BEER<br>0.0<br>0 PEEP 200 400  EEE 600  eee 800 1000 di/dt (A/µs)<br>**----- End of picture text -----**<br>


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Figure 22. Typical reverse recovery energy vs diode<br>current slope<br>Err GPDP100620241145RRE<br> (mJ) VCC = 400 V, VGE = 15 V,<br>IF = 30 A, TJ = 175 °C<br>0.8 | tee<br>PF] ETE LL PRL<br>0.6<br>Fi tit} Yt tt tT<br>PLL LE IATLEEL<br>0.4 /<br>PEACE<br>/<br>0.2 PL LYELL EEE<br>COA<br>0.0<br>0 PVE 200 TET 400 600 TTT 800 Ty 1000 tl di/dt (A/µs)<br>**----- End of picture text -----**<br>


**Figure 23. IGBT maximum transient thermal impedance** 

**Figure 24. Diode maximum transient thermal impedance** 

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ZthJC GADG060620241622_IGBT ZthJC GPDP060620241625_Diode<br>(°C/W) (°C/W) 4 3<br>aFRE duty Hee =0.5 HHH PHPES duty=0.5 ull)io,Beeogee<br>10  [-1] cl Ill 4 carr iimmns! 7NUM<br>3<br>res 0.05 ann Meat 10  [-1] ae<br>2 2<br>[att aN<br>0.05<br>10  [-2] eanWie HEL R 0. thJC = 0.34  ELHHAN °C/W SSH.en ANTSo R thJC  = 0.82 °C/W<br>VAIN duty = t on  / T sii ci SHace duty = t on  / T<br>Single pulse<br>ee te ile ton | LTTA Single pulse NIEUT LTTll ton<br>T T<br>10  [-3] ania 10  [-2] Alo<br>um {hl =<br>10  [-6] 10  [-5] 10  [-4] 10  [-3] 10  [-2] tp (s) 10  [-6] 10  [-5] 10  [-4] 10  [-3] 10  [-2] tp (s)<br>**----- End of picture text -----**<br>


**DS14705** - **Rev 1** 

**page 8/16** 

**STGHU30M65DF2AG Test circuits** 

## **3 Test circuits** 

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Figure 25.  Test circuit for inductive load switching Figure 26.  Gate charge test circuit<br>A A<br>C<br>G L=100µH k k<br>E B<br>B<br>C 3.3µF 1000µF VCC<br>k<br>G D.U.T<br>k<br>+ RG E<br>k<br>-<br>k<br>AM01504v1 AM01505v1<br>**----- End of picture text -----**<br>


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Figure 28.  Diode reverse recovery waveform<br>Figure 27.  Switching waveform<br>di/dt Qrr<br>VG 10%90% IF ts trr tf<br>90%<br>VCE tr(Voff) 10% 10%IRRM t<br>tcross IRRM<br>90%<br>VRRM<br>IC td(on)ton tr(Ion) td(off)toff tf 10%<br>AM01506v1 dv/dt<br>GADG180720171418SA<br>**----- End of picture text -----**<br>


**DS14705** - **Rev 1** 

**page 9/16** 

**STGHU30M65DF2AG Package information** 

**4 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **4.1 HU3PAK package information** 

**Figure 29. HU3PAK package outline** 

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×<br>DM00674007_2<br>**----- End of picture text -----**<br>


**DS14705** - **Rev 1** 

**page 10/16** 

**STGHU30M65DF2AG Package information** 

**Table 7. HU3PAK package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|
|**Ref.**|**mm**|||
||**Min.**|**Typ.**|**Max.**|
|A|3.40|3.50|3.60|
|A1||0.05||
|b|0.50|0.60|0.70|
|b2|0.50|0.70|1.00|
|b3|0.80|0.90|1.00|
|c|0.40|0.50|0.60|
|c2|0.40|0.50|0.60|
|D|11.70|11.80|11.90|
|D1|8.80|8.955|9.10|
|E|13.90|14.00|14.10|
|E1|12.30|12.40|12.50|
|E2|7.75|7.80|7.85|
|e||1.27||
|H|18.00|18.58|19.00|
|aaa||0.10||
|L|2.40|2.52|2.60|
|L1||3.05||
|L2|0.90|1.00|1.10|
|L3||0.26||
|L4|0.075|0.125|0.175|
|L5|1.83|1.93|2.03|
|L6|2.14|2.24|2.34|
|L7|4.44|4.54|4.64|
|F1|2.90|3.00|3.10|
|F2|2.40|2.50|2.60|
|F3|0.25|0.35|0.45|
|N1|3.80|3.90|4.00|
|N2|0.25|0.30|0.45|
|N3|0.80|0.90|1.00|
|T|0.50|0.67|0.70|
|T2|9.18|9.38|9.43|
|V1||0 °|8 °|
|V2||0 °|8 °|



**DS14705** - **Rev 1** 

**page 11/16** 

**STGHU30M65DF2AG Package information** 

**Figure 30. HU3PAK recommended footprint (dimensions in mm)** 

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×<br>6 ×  1 27 7_0,90<br>**----- End of picture text -----**<br>


## **4.2 HU3PAK packing information** 

**Figure 31. HU3PAK carrier tape outline** 

**DS14705** - **Rev 1** 

**page 12/16** 

**STGHU30M65DF2AG Package information** 

**Table 8. HU3PAK tape mechanical data** 

|**Dimension**<br>~~ee~~|**Value**<br>~~ee~~<br>~~e~~|
|---|---|
||**mm**<br>~~e~~|
|A0<br>~~ee~~|14.40 ±0.10<br>~~e~~|
|B0|19.70|
|D|1.50 ±0.10|
|E|1.75 ±0.10|
|F|15.65 ±0.10|
|I0|11.00|
|I1|11.60 ±0.10|
|I2|8.00|
|I3|7.00|
|K0|4.20|
|P0|4.00 ±0.10|
|P1|20.00 ±0.10|
|P2|2.00 ±0.10|
|T|0.40 ±0.50|
|W|32.00 ±0.30|



**Figure 32. HU3PAK reel outline (dimensions are in mm)** 

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Reel width Reel inner width Reel outer width<br>32.0 33.4 ±1.0 37.4 ±1.0<br>——<br>**----- End of picture text -----**<br>


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DM00345054_3_reel<br>**----- End of picture text -----**<br>


**DS14705** - **Rev 1** 

**page 13/16** 

**STGHU30M65DF2AG** 

## **Revision history** 

## **Table 9. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|11-Jun-2024|1|First release.|



**DS14705** - **Rev 1** 

**page 14/16** 

**STGHU30M65DF2AG Contents** 

|**Contents**|**Contents**|
|---|---|
|**1**|**Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2**|
|**2**|**Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3**|
||**2.1**<br>Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5|
|**3**|**Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9**|
|**4**|**Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10**|
||**4.1**<br>HU3PAK package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10|
||**4.2**<br>HU3PAK packing information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12|
|**Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14**||



**DS14705** - **Rev 1** 

**page 15/16** 

**STGHU30M65DF2AG** 

## **IMPORTANT NOTICE – READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

- © 2024 STMicroelectronics – All rights reserved 

**DS14705** - **Rev 1** 

**page 16/16** 



## Links

- [View this product on Novapart](https://novapart.co/products/STGHU30M65DF2AG/igbt-aec-q101-84-a-16-v-441-w-650-hu3pak-7-pins)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/stmicroelectronics/stghu30m65df2ag/igbt-single-650v-84a-hu3pak/dp/4549906RL)
---

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