# IGBT, 8 A, 1.6 V, 68 W, 650 V, TO-252 (DPAK), 3 Pins

![Product image](https://novapart.co/image/farnell:3366980/)

**URL**: https://novapart.co/products/STGD4M65DF2/igbt-8-a-16-v-68-w-650-to-252-dpak-3-pins
**SKU**: STGD4M65DF2
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || IGBTs || Single IGBTs
**Price**: €0.3570
**Stock**: 10+
**Lead Time**: 120 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | 650V M |
| Power Dissipation | 68W |
| Transistor Mounting | Surface Mount |
| Transistor Case Style | TO-252 (DPAK) |
| Operating Temperature Max | 175°C |
| Continuous Collector Current | 8A |
| Collector Emitter Voltage Max | 650V |
| Collector Emitter Saturation Voltage | 1.6V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3366980/)

**STGD4M65DF2** 

Datasheet 

## Trench gate field-stop, 650 V, 4 A, M series  low-loss IGBT 

## **Features** 

**==> picture [55 x 48] intentionally omitted <==**

**----- Start of picture text -----**<br>
TAB<br>2 3<br>1<br>DPAK<br>**----- End of picture text -----**<br>


- 6 µs of short-circuit withstand time 

- VCE(sat) = 1.6 V (typ.) @ IC = 4 A 

- Tight parameter distribution 

- Safer paralleling 

- Low thermal resistance 

- Soft and very fast recovery antiparallel diode 

## **Applications** 

- Motor control 

- UPS 

- PFC 

## **Description** 

This device is an IGBT developed using an advanced proprietary trench gate fieldstop structure. The device is part of the M series IGBTs, which represent an optimal balance between inverter system performance and efficiency where the low-loss and the short-circuit functionality is essential. Furthermore, the positive VCE(sat) temperature coefficient and the tight parameter distribution result in safer paralleling operation. 

|**Product status**|
|---|
|STGD4M65DF2|
||
|**Product summary**|
|**Order code**<br>STGD4M65DF2|
|**Marking**<br>G4M65DF2|
|**Package**<br>DPAK|
|**Packing**<br>Tape and reel|



**DS11397** - **Rev 5** - **December 2018** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STGD4M65DF2 Electrical ratings** 

**1 Electrical ratings** 

**Table 1. Absolute maximum ratings** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VCES|Collector-emitter voltage (VGE= 0 V)|650|V|
|IC|Continuous collector current at TC= 25 °C|8|A|
||Continuous collector current at TC= 100 °C|4|A|
|ICP (1)|Pulsed collector current|16|A|
|VGE|Gate-emitter voltage|±20|V|
|IF|Continuous forward current at TC= 25 °C|8|A|
||Continuous forward current at TC= 100 °C|4|A|
|IFP (1)|Pulsed forward current|16|A|
|PTOT|Total power dissipation at TC= 25 °C|68|W|
|TSTG|Storage temperature range|- 55 to 150|°C|
|TJ|Operating junction temperature range|- 55 to 175|°C|



_1. Pulse width limited by maximum junction temperature._ 

**Table 2. Thermal data** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|RthJC|Thermal resistance junction-case IGBT|2.2|°C/W|
|RthJC|Thermal resistance junction-case diode|5|°C/W|
|RthJA|Thermal resistance junction-ambient|100|°C/W|



**DS11397** - **Rev 5** 

**page 2/20** 

**STGD4M65DF2 Electrical characteristics** 

## **2 Electrical characteristics** 

TC = 25 °C unless otherwise specified 

## **Table 3. Static characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|V(BR)CES|Collector-emitter breakdown voltage|VGE= 0 V, IC= 250 µA|650|||V|
|VCE(sat)|Collector-emitter saturation voltage|VGE= 15 V, IC= 4 A||1.6|2.1|V|
|||VGE= 15 V, IC= 4 A, TJ= 125 °C||1.9|||
|||VGE= 15 V, IC= 4 A, TJ= 175 °C||2.1|||
|VF|Forward on-voltage|IF= 4 A||1.9||V|
|||IF= 4 A, TJ= 125 °C||1.7|||
|||IF= 4 A, TJ= 175 °C||1.6|||
|VGE(th)|Gate threshold voltage|VCE= VGE, IC= 250 µA|5|6|7|V|
|ICES|Collector cut-off current|VGE= 0 V, VCE= 650 V|||25|µA|
|IGES|Gate-emitter leakage current|VCE= 0 V, VGE= ± 20 V|||±250|µA|



**Table 4. Dynamic characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Min. **|**Typ. **|**Max. **|**Unit**|
|---|---|---|---|---|---|---|
|Cies|Input capacitance|VCE= 25 V, f = 1 MHz, VGE= 0 V|-|369|-|pF|
|Coes|Output capacitance||-|24.8|-||
|Cres|Reverse transfer<br>capacitance||-|8|-||
|Qg|Total gate charge|VCC= 520 V, IC= 4 A, VGE= 0 to 15 V (seeFigure 29. Gate<br>charge test circuit)|-|15.2|-|nC|
|Qge|Gate-emitter charge||-|3|-||
|Qgc|Gate-collector charge||-|7|-||



**DS11397** - **Rev 5** 

**page 3/20** 

**STGD4M65DF2 Electrical characteristics** 

## **Table 5. IGBT switching characteristics (inductive load)** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|td(on)|Turn-on delay time|VCE= 400 V, IC= 4 A, VGE= 15 V, RG= 47 Ω<br>(seeFigure 28. Test circuit for inductive load switching)||12|-|ns|
|tr|Current rise time|||6.9|-|ns|
|(di/dt)on|Turn-on current slope|||480|-|A/µs|
|td(off)|Turn-off delay time|||86|-|ns|
|tf|Current fall time|||120|-|ns|
|Eon (1)|Turn-on switching<br>energy|||0.040|-|mJ|
|Eoff (2)|Turn-off switching<br>energy|||0.136|-|mJ|
|Ets|Total switching energy|||0.176|-|mJ|
|td(on)|Turn-on delay time|VCE= 400 V, IC= 4 A, VGE= 15 V, RG= 47 Ω, TJ= 175 °C<br>(seeFigure 28. Test circuit for inductive load switching)||11.6|-|ns|
|tr|Current rise time|||8|-|ns|
|(di/dt)on|Turn-on current slope|||410|-|A/µs|
|td(off)|Turn-off delay time|||85|-|ns|
|tf|Current fall time|||211|-|ns|
|Eon (1)|Turn-on switching<br>energy|||0.067|-|mJ|
|Eoff (2)|Turn-off switching<br>energy|||0.210|-|mJ|
|Ets|Total switching energy|||0.277|-|mJ|
|tsc|Short-circuit withstand<br>time|VCC≤ 400 V, VGE= 15 V, TJstart= 150 °C|6||-|µs|
|||VCC≤ 400 V, VGE= 13 V, TJstart= 150 °C|10||-||



_1. Including the reverse recovery of the diode._ 

_2. Including the tail of the collector current._ 

**Table 6. Diode switching characteristics (inductive load)** 

|**Symbol**|**Parameter**|**Test conditions**|**Min. **|**Typ. **|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|trr|Reverse recovery time|IF= 4 A, VR= 400 V, VGE= 15 V, di/dt = 800 A/µs (see<br>Figure 28. Test circuit for inductive load switching)|-<br>-<br>-<br>-<br>-|133|-|ns|
|Qrr|Reverse recovery charge|||140|-|nC|
|Irrm|Reverse recovery current|||5|-|A|
|dIrr/dt|Peak rate of fall of<br>reverse recovery current<br>during tb|||520|-|A/µs|
|Err|Reverse recovery energy|||15|-|µJ|
|trr|Reverse recovery time|IF= 4 A, VR= 400 V, VGE= 15 V, TJ= 175 °C, di/dt = 800 A/µs<br>(seeFigure 28. Test circuit for inductive load switching)|<br>-<br>-<br>-<br>-<br>-|236|-|ns|
|Qrr|Reverse recovery charge|||370|-|nC|
|Irrm|Reverse recovery current|||6.6|-|A|
|dIrr/dt|Peak rate of fall of<br>reverse recovery current<br>during tb|||378|-|A/µs|
|Err|Reverse recovery energy|||32|-|µJ|



**DS11397** - **Rev 5** 

**page 4/20** 

**STGD4M65DF2 STGD4M65DF2 electrical characteristics (curves)** 

## **2.1 STGD4M65DF2 electrical characteristics (curves)** 

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**----- Start of picture text -----**<br>
Figure 1. Power dissipation vs. case temperature Figure 2. Collector current vs. case temperature<br>P TOT IGBT160320161051PDT I C IGBT170320161114CCT<br>(W) V GE ≥15 V, T J ≤ 175 °C (A) V GE ≥15 V, T J ≤ 175 °C<br>8<br>60<br>6<br>40<br>4<br>20<br>2<br>0 0<br>-50 0 50 100 150 T C(°C) -50 0 50 100 150 T C(°C)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Figure 3. Output characteristics (TJ = 25 °C) Figure 4. Output characteristics (TJ = 175 °C)<br>I C IGBT160320161105OC25 I C IGBT160320161107OC175<br>(A) (A)<br>V GE = 15 V 13 V V GE = 15 V<br>12 12<br>13 V<br>11 V<br>8 8<br>11 V<br>9 V<br>4 4<br>9 V<br>7 V<br>0 7 V 0<br>0 1 2 3 4 5 V CE (V) 0 1 2 3 4 5 V CE (V)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Figure 5. VCE(sat) vs. junction temperature Figure 6. VCE(sat) vs. collector current<br>V CE(SAT) IGBT160320161120VCET V CE(SAT) IGBT160320161125VCEC<br>(V) (V)<br>V GE = 15 V 3.0 V GE = 15 V<br>3.0<br>2.5<br>2.5 T j = 175 °C<br>I C = 8 A T j = 25 °C<br>2.0<br>I C = 4 A<br>2.0<br>1.5<br>1.5 T j = -40 °C<br>1.0<br>1.0 I C = 2 A 0.5<br>-50 0 50 100 150 T J (°C) 0 2 4 6 I C (A)<br>**----- End of picture text -----**<br>


**DS11397** - **Rev 5** 

**page 5/20** 

**STGD4M65DF2 STGD4M65DF2 electrical characteristics (curves)** 

**==> picture [513 x 366] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Collector current vs. switching frequency Figure 8. Forward bias safe operating area<br>IC IGBT160320161125CCS IC IGBT160320161133FSOA<br>(A)  (A)  single pulse, TC = 25°C,<br>12 TJ ≤175 °C, VGE = 15 V<br>10 10  [1 ] tp = 1 µs<br>8 tp = 10 µs<br>6 TC = 80 °C<br>tp = 100 µs<br>4 TC = 100 °C 10  [0 ]<br>tp = 1 ms<br>2 Rectangular current shape<br>(duty cycle = 0.5, VCC = 400 V,<br>0 RG = 47 Ω,VGE = 0/15 V, Tj = 175 °C 10  [-1 ]<br>10  [0 ] 10  [1 ] 10  [2 ] f (kHz) 10  [0 ] 10  [1 ] 10  [2 ] VCE (V)<br>Figure 9. Transfer characteristics Figure 10. Diode VF vs. forward current<br>I C IGBT170320161116TCH V F IGBT160320161134DVF<br>(A) (V)<br>2.6<br>V CE = 6 V T j = -40 °C<br>12<br>2.2<br>T j = 25 °C 1.8<br>8<br>1.4 T j = 175 °C<br>1.0<br>4 T j = 25 °C<br>T j = 175 °C<br>0.6<br>0 0.2<br>6 7 8 9 10 11 12 V GE (V) 0 2 4 6 I F (A)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Figure 11. Normalized VGE(th) vs. junction temperature Figure 12. Normalized V(BR)CES vs. junction temperature<br>V GE(th) IGBT160320161135NVGE V (BR)CES IGBT160320161135NVBR<br>(Norm.) (Norm.)<br>I C = 250 μA<br>V CE = V GE , I C = 250 µA 1.06<br>1.05<br>1.02<br>0.95<br>0.98<br>0.85<br>0.94<br>0.75 0.9<br>-50 0 50 100 150 T J (°C) -50 0 50 100 150 T J (°C)<br>**----- End of picture text -----**<br>


**DS11397** - **Rev 5** 

**page 6/20** 

**STGD4M65DF2 STGD4M65DF2 electrical characteristics (curves)** 

**==> picture [513 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 13. Capacitance variations Figure 14. Gate charge vs. gate-emitter voltage<br>C  IGBT160320161139CVR V GE IGBT160320161140GCGE<br>(pF) (V) V CC = 520 V, I C = 4 A, I G = 1 mA<br>C ies 15<br>10  [2] 12<br>9<br>10  [1] 6<br>C oes<br>f = 1 MHz 3<br>C res<br>10  [0] 0<br>10  [-1] 10  [0] 10  [1] 10  [2] V CE (V) 0 3 6 9 12 15 Q g (nC)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Figure 15. Switching energy vs. collector current Figure 16. Switching energy vs. gate resistance<br>E  IGBT160320161145SLC E  IGBT170320161117SLG<br>(mJ) V CC = 400 V, R G = 47 Ω,V GE = 15 V, (mJ) V CC =400 V, I C = 4 A, V GE = 15 V,<br>T  j  = 175 °C T j = 175 °C<br>0.5<br>0.4<br>0.3 E tot 0.4 E tot<br>0.3<br>0.2 E off<br>E off 0.2<br>0.1<br>E on 0.1 E on<br>0 0<br>0 2 4 6 I C (A) 0 100 200 300 400 R G (Ω)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Figure 17. Switching energy vs. temperature Figure 18. Switching energy vs. collector emitter voltage<br>E  IGBT170320161118SLT E  IGBT160320161148SLV<br>(mJ) V CC = 400 V, I C = 4 A, R G = 47 Ω, (mJ) I C = 4 A, R G = 47 Ω, V GE = 15 V,<br>0.24 V GE = 15 V T j = 175 °C E tot<br>0.3<br>E tot<br>0.18 E off<br>0.2<br>E off<br>0.12<br>0.1<br>0.06 E on E on<br>0 0<br>0 50 100 150 T J (°C) 150 250 350 450 V CE (V)<br>**----- End of picture text -----**<br>


**DS11397** - **Rev 5** 

**page 7/20** 

**STGD4M65DF2 STGD4M65DF2 electrical characteristics (curves)** 

**==> picture [513 x 377] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 19. Short-circuit time and current vs. VGE Figure 20. Switching times vs. collector current<br>(µs)t sc V GE ≥15 V, T J ≤ 175 °C IGBT170320161118SCV I [A]sc (ns)t  T V jCC = 175 °C = 400 V, V GE = 15 V, R  IGBT160320161149STC G = 47 Ω,<br>21 25 t f<br>10  [2] t d(off)<br>17 20<br>t SC I SC<br>13 15 t d(on)<br>10  [1]<br>9 10<br>t r<br>5 5 10  [0]<br>9 10 11 12 13 14 15 V GE(V) 0 2 4 6 I C (A)<br>Figure 22. Reverse recovery current vs. diode current<br>Figure 21. Switching times vs. gate resistance<br>slope<br>t  IGBT160320161153STR<br>(ns) V CC = 400 V, V GE = 15 V, I C = 4 A, Irrm IGBT170320161121RRC<br>T j = 175 °C (A) VCC = 400 V, VGE = 15 V, IF = 4 A,<br>t f 6 Tj = 175 °C<br>10  [2] t d(off)<br>5<br>4<br>10  [1] t d(on) t r<br>3<br>2<br>10  [0]<br>0 100 200 300 400 R G (Ω) 1<br>0 150 300 450 600 750 di/dt (A/µs)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Figure 24. Reverse recovery charge vs. diode current<br>Figure 23. Reverse recovery time vs. diode current slope<br>slope<br>(ns)t rr V CC =400 V, V IGBT170320161122RRTGE = 15 V, I F = 4 A, (nC)Qrr IGBT170320161123RRQ<br>440 T j = 175 °C VTCCj = 175 °C = 400 V, VGE = 15 V, IF = 4 A,<br>370<br>380<br>365<br>320<br>360<br>260<br>355<br>200<br>0 150 300 450 600 750 di/dt (A/µs) 350<br>0 150 300 450 600 750 di/dt (A/µs)<br>**----- End of picture text -----**<br>


**DS11397** - **Rev 5** 

**page 8/20** 

**STGD4M65DF2 STGD4M65DF2 electrical characteristics (curves)** 

**Figure 25. Reverse recovery energy vs. diode current slope** 

**==> picture [175 x 144] intentionally omitted <==**

**----- Start of picture text -----**<br>
E rr IGBT170320161124RRE<br>(μJ) V CC = 400 V, V GE = 15 V,<br>I F = 4 A, T j = 175 °C<br>62<br>54<br>46<br>38<br>30<br>0 150 300 450 600 750 di/dt (A/µs)<br>**----- End of picture text -----**<br>


**Figure 26. Thermal impedance for IGBT** 

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**----- Start of picture text -----**<br>
ZthTO2T_B<br>K<br>δ=0.5<br>0.2<br>0.1<br>0.05<br>10-1<br>0.02<br>Zth=k Rthj-c<br>0.01 δ=tp/t<br>Single pulse tp<br>t<br>1010-2 -5 10-4 10-3 10-2 10-1 tp [(s)]<br>**----- End of picture text -----**<br>


**Figure 27. Thermal impedance for diode** 

**==> picture [156 x 150] intentionally omitted <==**

**DS11397** - **Rev 5** 

**page 9/20** 

**STGD4M65DF2 Test circuits** 

## **3 Test circuits** 

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**----- Start of picture text -----**<br>
Figure 28. Test circuit for inductive load switching Figure 29. Gate charge test circuit<br>A A<br>C<br>G L=100µH k k<br>E B<br>B<br>C 3.3µF 1000µF VCC<br>k<br>G D.U.T<br>k<br>+ RG E<br>k<br>-<br>k<br>AM01504v1 AM01505v1<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Figure 31. Diode reverse recovery waveform<br>Figure 30. Switching waveform<br>90%<br>VG 10%<br>90%<br>VCE Tr(Voff) 10%<br>Tcross<br>90% 25<br>IC Td(on)Ton Tr(Ion) Td(off)Toff Tf 10%<br>AM01506v1<br>**----- End of picture text -----**<br>


**DS11397** - **Rev 5** 

**page 10/20** 

**STGD4M65DF2 Package information** 

**4 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

**DS11397** - **Rev 5** 

**page 11/20** 

**STGD4M65DF2 DPAK (TO-252) type A2 package information** 

## **4.1 DPAK (TO-252) type A2 package information** 

**Figure 32. DPAK (TO-252) type A2 package outline** 

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**----- Start of picture text -----**<br>
0068772_type-A2_rev26<br>**----- End of picture text -----**<br>


**DS11397** - **Rev 5** 

**page 12/20** 

**STGD4M65DF2 DPAK (TO-252) type A2 package information** 

**Table 7. DPAK (TO-252) type A2 mechanical data** 

|**Di**|**mm**|**mm**|**mm**|
|---|---|---|---|
|**m.**|**Min.**|**Typ.**|**Max.**|
|A|2.20||2.40|
|A1|0.90||1.10|
|A2|0.03||0.23|
|b|0.64||0.90|
|b4|5.20||5.40|
|c|0.45||0.60|
|c2|0.48||0.60|
|D|6.00||6.20|
|D1|4.95|5.10|5.25|
|E|6.40||6.60|
|E1|5.10|5.20|5.30|
|e|2.159|2.286|2.413|
|e1|4.445|4.572|4.699|
|H|9.35||10.10|
|L|1.00||1.50|
|L1|2.60|2.80|3.00|
|L2|0.65|0.80|0.95|
|L4|0.60||1.00|
|R||0.20||
|V2|0°||8°|



**DS11397** - **Rev 5** 

**page 13/20** 

**STGD4M65DF2 DPAK (TO-252) type C2 package information** 

## **4.2 DPAK (TO-252) type C2 package information** 

**Figure 33. DPAK (TO-252) type C2 package outline** 

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0068772_type-C2_rev26 

**DS11397** - **Rev 5** 

**page 14/20** 

**STGD4M65DF2 DPAK (TO-252) type C2 package information** 

**Table 8. DPAK (TO-252) type C2 mechanical data** 

|**Di**|**mm**|**mm**|**mm**|
|---|---|---|---|
|**m.**|**Min.**|**Typ.**|**Max.**|
|A|2.20|2.30|2.38|
|A1|0.90|1.01|1.10|
|A2|0.00||0.10|
|b|0.72||0.85|
|b4|5.13|5.33|5.46|
|c|0.47||0.60|
|c2|0.47||0.60|
|D|6.00|6.10|6.20|
|D1|5.10||5.60|
|E|6.50|6.60|6.70|
|E1|5.20||5.50|
|e|2.186|2.286|2.386|
|H|9.80|10.10|10.40|
|L|1.40|1.50|1.70|
|L1|2.90 REF|||
|L2|0.90||1.25|
|L3|0.51 BSC|||
|L4|0.60|0.80|1.00|
|L6|1.80 BSC|||
|θ1|5°|7°|9°|
|θ2|5°|7°|9°|
|V2|0°||8°|



**DS11397** - **Rev 5** 

**page 15/20** 

**STGD4M65DF2 DPAK (TO-252) type C2 package information** 

**Figure 34. DPAK (TO-252) recommended footprint (dimensions are in mm)** 

**DS11397** - **Rev 5** 

**page 16/20** 

**STGD4M65DF2 DPAK (TO-252) packing information** ~~To~~ 

## **4.3** 

## **DPAK (TO-252) packing information** 

## **Figure 35. DPAK (TO-252) tape outline** 

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**----- Start of picture text -----**<br>
10 pitches cumulative<br>tolerance on tape +/- 0.2 mm<br>Top cover P0 D P2<br>T tape<br>E<br>F<br>B1 J) K0 B0 paeg e s W<br>I<br>f f  PEREllos oe oes:<br>For machine ref. only A0 P1 D1<br>including draft and<br>radii concentric around B0<br>User direction of feed<br>R<br>—— Bending radius<br>User direction of feed<br>AM08852v1<br>**----- End of picture text -----**<br>


**DS11397** - **Rev 5** 

**page 17/20** 

**STGD4M65DF2 DPAK (TO-252) packing information** 

**Figure 36. DPAK (TO-252) reel outline** 

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**----- Start of picture text -----**<br>
T<br>40mm min.<br>access hole<br>at slot location<br>B<br>D<br>C<br>N<br>A<br>Tape slot  G measured<br>in core for  at hub<br>Full radius  tape start<br>2.5mm min.width<br>**----- End of picture text -----**<br>


AM06038v1 

**Table 9. DPAK (TO-252) tape and reel mechanical data** 

||**Tape**|**Tape**||**Reel**|**Reel**|
|---|---|---|---|---|---|
|**Di**|**mm**||**Di**|**mm**||
|**m.**|**Min.**|**Max.**|**m.**|**Min.**|**Max.**|
|A0|6.8|7|A||330|
|B0|10.4|10.6|B|1.5||
|B1||12.1|C|12.8|13.2|
|D|1.5|1.6|D|20.2||
|D1|1.5||G|16.4|18.4|
|E|1.65|1.85|N|50||
|F|7.4|7.6|T||22.4|
|K0|2.55|2.75||||
|P0|3.9|4.1|Base qty.||2500|
|P1|7.9|8.1|Bulk qty.||2500|
|P2|1.9|2.1||||
|R|40|||||
|T|0.25|0.35||||
|W|15.7|16.3||||



**DS11397** - **Rev 5** 

**page 18/20** 

**STGD4M65DF2** 

## **Revision history** 

## **Table 10. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|25-Nov-2015|1|First release.|
|18-Apr-2016|2|Modified: features in cover page<br>Modified: Table 2:_"Absolute maximum ratings"_, Table 4:_"Static characteristics"_, Table 5:_"Dynamic_<br>_characteristics"_, Table 6:_"IGBT switching characteristics (inductive load)"_and Table 7:_"Diode_<br>_switching characteristics (inductive load)"_Added: Section 2.1:_"Electrical characteristics (curves)"_<br>Minor text changes|
|28-Apr-2016|3|Modified: Table 1:_"Device summary"_in cover page<br>Minor text changes|
|21-Nov-2016|4|UpdatedTable 1. Absolute maximum ratings<br>UpdatedFigure 24. Reverse recovery charge vs. diode current slope<br>UpdatedFigure 31. Diode reverse recovery waveform|
|05-Dec-2018|5|AddedSection 4.2 DPAK (TO-252) type C2 package information.|



**DS11397** - **Rev 5** 

**page 19/20** 

**STGD4M65DF2** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2018 STMicroelectronics – All rights reserved 

**DS11397** - **Rev 5** 

**page 20/20** 



## Links

- [View this product on Novapart](https://novapart.co/products/STGD4M65DF2/igbt-8-a-16-v-68-w-650-to-252-dpak-3-pins)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/stmicroelectronics/stgd4m65df2/igbt-650v-8a-175deg-c-68w/dp/3366980)
---

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