# IGBT, 8 A, 1.6 V, 75 W, 600 V, TO-252 (DPAK), 3 Pins

![Product image](https://novapart.co/image/farnell:4294107/)

**URL**: https://novapart.co/products/STGD4H60DF/igbt-8-a-16-v-75-w-600-to-252-dpak-3-pins
**SKU**: STGD4H60DF
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || IGBTs || Single IGBTs
**Price**: €0.3510
**Stock**: 10+
**Lead Time**: 107 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (21-Jan-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Power Dissipation | 75W |
| Transistor Mounting | Surface Mount |
| Transistor Case Style | TO-252 (DPAK) |
| Operating Temperature Max | 175°C |
| Continuous Collector Current | 8A |
| Collector Emitter Voltage Max | 600V |
| Collector Emitter Saturation Voltage | 1.6V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4294107/)

**STGD4H60DF** 

Datasheet 

**==> picture [135 x 36] intentionally omitted <==**

## Trench gate field-stop 600 V, 4 A high speed H series IGBT in a DPAK package 

## **Features** 

**==> picture [119 x 162] intentionally omitted <==**

**----- Start of picture text -----**<br>
TAB<br>2 3<br>1<br>DPAK<br>C(2, TAB)<br>G(1)<br>E(3) NG1E3C2T<br>**----- End of picture text -----**<br>


- Maximum junction temperature: TJ = 175 °C 

- Low VCE(sat) = 1.6 V (typ.) @ IC = 4 A 

- Tight parameter distribution 

- Low thermal resistance 

- Short-circuit rated 

- Soft and fast recovery antiparallel diode 

## **Applications** 

- Industrial motor control 

- Dishwashers 

- Refrigerators and freezers 

- Fans 

## **Description** 

This device is an IGBT developed using an advanced proprietary trench gate field-stop structure. This device is part of the H series of IGBTs, which represent an optimum compromise between conduction and switching losses to maximize the efficiency of high switching frequency converters. Moreover, a slightly positive VCE(sat) temperature coefficient and very tight parameter distribution result in safer paralleling operation. 

## **Product status link** 

STGD4H60DF 

|**Product summary**|**Product summary**|
|---|---|
|**Order code**|STGD4H60DF|
|**Marking**|G4H60DF|
|**Package**|DPAK|
|**Packing**|Tape and reel|



**DS13901** - **Rev 2** - **February 2023** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STGD4H60DF Electrical ratings** 

## **1 Electrical ratings** 

**Table 1. Absolute maximum ratings** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VCES|Collector-emitter voltage (VGE= 0)|600|V|
|IC|Continuous collector current at TC= 25 °C|8|A|
||Continuous collector current at TC= 100 °C|4||
|ICP(1)|Pulsed collector current|16|A|
|VGE|Gate-emitter voltage|±20|V|
|IF|Continuous forward current TC= 25 °C|8|A|
||Continuous forward current at TC= 100 °C|4||
|IFP(1)|Pulsed forward current|16|A|
|PTOT|Total power dissipation at TC= 25 °C|75|W|
|TSTG|Storage temperature range|-55 to 150|°C|
|TJ|Operating junction temperature range|-55 to 175||



_1. Pulse width limited by maximum junction temperature._ 

## **Table 2. Thermal data** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|RthJC|Thermal resistance, junction-to-case, IGBT|2|°C/W|
|RthJC|Thermal resistance, junction-to-case, diode|4.5|°C/W|
|RthJA|Thermal resistance, junction-to-ambient|100|°C/W|



**DS13901** - **Rev 2** 

**page 2/18** 

**STGD4H60DF Electrical characteristics** 

## **2 Electrical characteristics** 

TC = 25 °C unless otherwise specified. 

**Table 3. Static** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|V(BR)CES|Collector-emitter breakdown<br>voltage|VGE= 0 V, IC= 2 mA|600|||V|
|VCE(sat)|Collector-emitter saturation<br>voltage|VGE= 15 V, IC= 1 A||1.1||V|
|||VGE= 15 V, IC= 3 A||1.5|1.95||
|||VGE= 15 V, IC= 3 A, TJ= 125 °C||1.6|||
|||VGE= 15 V, IC= 3 A, TJ= 175 °C||1.7|||
|||VGE= 15 V, IC= 4 A||1.6|||
|VGE(th)|Gate threshold voltage|VCE= VGE, IC= 250 μA|5|6|7|V|
|ICES|Collector cut-off current|VCE= 600 V , VGE= 0 V|||25|μA|
|IGES|Gate-emitter leakage current|VGE= ±20 V , VCE= 0 V|||±250|nA|



**Table 4. Dynamic** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Cies|Input capacitance|VCE= 25 V, f = 1 MHz, VGE= 0 V|-|461|-|pF|
|Coes|Output capacitance|||20|||
|Cres|Reverse transfer capacitance|||9|||
|Qg|Total gate charge|VCC= 480 V, IC= 3 A, VGE= 0 to 15 V<br>(seeFigure 27. Gate charge test circuit)|-|35|-|nC|
|Qge|Gate-emitter charge|||6|||
|Qgc|Gate-collector charge|||17|||



**Table 5. Switching characteristics (inductive load)** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|td(on)|Turn-on delay time|VCE= 400 V, IC= 3 A,<br>RG= 47 Ω, VGE= 15 V<br>(seeFigure 26. Test circuit for inductive<br>load switchingandFigure 28. Switching<br>waveform)|-|35|-|ns|
|tr|Current rise time|||25|||
|td(off)|Turn-off delay time|||121|||
|tf|Current fall time|||111|||
|td(on)|Turn-on delay time|VCE= 400 V, IC= 3 A,<br>RG= 47 Ω, VGE= 15 V, TJ= 175 °C<br>(seeFigure 26. Test circuit for inductive<br>load switchingandFigure 28. Switching<br>waveform)|-|22|-|ns|
|tr|Current rise time|||30|||
|td(off)|Turn-off delay time|||170|||
|tf|Current fall time|||180|||
|tsc|Short-circuit withstand time|VCC≤ 360 V, VGE= 15 V, RG= 47 Ω|3|-|-|μs|



**DS13901** - **Rev 2** 

**page 3/18** 

**STGD4H60DF Electrical characteristics** 

**Table 6. Switching energy (inductive load)** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Eon(1)|Turn-on switching energy|VCE= 400 V, IC= 3 A,<br>RG= 47 Ω, VGE= 15 V|-|68|-|μJ|
|Eoff (2)|Turn-off switching energy|||45|||
|Ets|Total switching energy|||113|||
|Eon(1)|Turn-on switching energy|VCE= 400 V, IC= 3 A,<br>RG= 47 Ω, VGE= 15 V, TJ= 175 °C||105|||
|Eoff(2)|Turn-off switching energy|||92|||
|Ets|Total switching energy|||197|||



_1. Including the reverse recovery of the diode._ 

_2. Including the tail of the collector current._ 

**Table 7. Collector-emitter diode** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|VF|Forward on-voltage|IF= 1 A||1.3||V|
|||IF= 3 A|-|1.75|-||
|||IF= 3 A, TJ= 175 °C||1.3|||
|||IF= 4 A||1.85|||
|trr|Reverse recovery time|VCC= 400 V; IF= 3 A;<br>diF/dt = 160 A / μs|-|73|-|ns|
|Qrr|Reverse recovery charge|||66||nC|
|Irrm|Reverse recovery current|||2.3||A|
|Err|Reverse recovery energy|||9.9||μJ|
|trr|Reverse recovery time|VCC= 400 V; IF= 3 A;<br>diF/dt = 160 A / μs, TJ= 175 °C||118||ns|
|Qrr|Reverse recovery charge|||206||nC|
|Irrm|Reverse recovery current|||3.9||A|
|Err|Reverse recovery energy|||41||μJ|



**DS13901** - **Rev 2** 

**page 4/18** 

**STGD4H60DF Electrical characteristics (curves)** 

## **2.1 Electrical characteristics (curves)** 

**==> picture [513 x 198] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 1. Power dissipation vs case temperature Figure 2. Collector current vs case temperature<br>PTOT GADG170120220955PDT IC GADG170120220956CCT<br> (W) VGE ≥ 15 V, TJ ≤ 175 °C   (A) VGE ≥ 15 V, TJ ≤ 175 °C<br>8<br>75<br>6<br>50<br>4<br>25<br>2<br>0 0<br>25 75 125 175 TC (°C) 25 75 125 175 TC (°C)<br>**----- End of picture text -----**<br>


**==> picture [513 x 199] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 3. Output characteristics (TJ = 25°C) Figure 4. Output characteristics (TJ = 175°C)<br>IC GADG170120220957OC25 IC GADG170120220957OC175<br> (A)  (A)<br>VGE=15 V VGE=15 V<br>12 12<br>VGE=13 V VGE=11 V VGE=13 V VGE=11 V<br>8 8<br>VGE=9 V VGE=9 V<br>4 4<br>VGE=7 V VGE=7 V<br>0 0<br>0 1 2 3 VCE (V) 0 1 2 3 4 VCE (V)<br>**----- End of picture text -----**<br>


**==> picture [513 x 200] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 5. VCE(sat) vs junction temperature Figure 6. VCE(sat) vs collector current<br>VCE(sat) GADG170120220958VCET VCE(sat) GADG170120220958VCEC<br>(V) (V)<br>VGE=15 V IC=6 A<br>TJ= 175 °C<br>3.0<br>TJ= 25 °C<br>1.9 2.6<br>IC=3 A<br>2.2<br>TJ= -40 °C<br>1.5 1.8<br>IC=1.5 A<br>1.4<br>1.1 1.0<br>-50 0 50 100 150 TJ (°C) 0 4 8 12 IC (A)<br>**----- End of picture text -----**<br>


**DS13901** - **Rev 2** 

**page 5/18** 

**STGD4H60DF Electrical characteristics (curves)** 

**==> picture [513 x 198] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Forward bias safe operating area Figure 8. Transfer characteristics<br>IC GADG180120220859FSOA IC GADG170120221008TCH<br> (A) (A)<br>TJ= 175 °C<br>10  [1] tp= 1 µs 12<br>tp= 10 µs<br>VCE = 6 V<br>10  [0] tp= 100 µs 8<br>tp= 1 ms<br>TJ= 25 °C<br>10  [-1] 4<br>Single pulse, TC = 25 °C,<br>TJ ≤ 175 °C, VGE = 15 V<br>10  [-2] 0<br>10  [0] 10  [1] 10  [2] VCE (V) 4 6 8 10 VGE (V)<br>**----- End of picture text -----**<br>


**==> picture [513 x 417] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 9. Diode VF vs forward current<br>Figure 10. Normalized VGE(th) vs junction temperature<br>(V)VF GADG170120221008DVF V GE(th) IGBT180515EI62NVGE<br>(norm.)<br>IC = 250 μA, VCE = VGE<br>3.2 1.1<br>TJ= -40 °C<br>1.0<br>2.4<br>0.9<br>TJ= 25 °C<br>1.6<br>0.8<br>TJ= 175 °C<br>0.8<br>0.7<br>0.6<br>0.0<br>0 4 8 12 IF (A) -50 0 50 100 150 T J (°C)<br>Figure 12. Capacitance variation<br>Figure 11. Normalized V(BR)CES vs junction temperature<br>C  GADG170120221010CVR<br>V BR(CES) IGBT150515EI62NVBR (pF)<br>(norm.)<br>1.1<br>10  [3]<br>Cies<br>I C = 2 mA<br>10  [2]<br>1.0<br>10  [1]<br>f = 1 MHz Coes<br>0.9 10  [0] Cres<br>-50 0 50 100 150 T J (°C) 10  [-1] 10  [0] 10  [1] 10  [2] VCE (V)<br>**----- End of picture text -----**<br>


**DS13901** - **Rev 2** 

**page 6/18** 

**STGD4H60DF Electrical characteristics (curves)** 

**Figure 13. Gate charge vs. gate-emitter voltage** 

**==> picture [188 x 166] intentionally omitted <==**

**----- Start of picture text -----**<br>
VGE GADG170120221011GCGE<br> (V) VCC = 480 V, IC = 3 A, IG = 5 mA<br>15<br>12<br>9<br>6<br>3<br>0<br>0 10 20 30 Qg (nC)<br>**----- End of picture text -----**<br>


**Figure 14. Switching energy vs collector current** 

**==> picture [183 x 166] intentionally omitted <==**

**----- Start of picture text -----**<br>
E  GADG170120221011SLC<br>(mJ)<br>VGE = 15 V, TJ= 175  ℃<br>0.24<br>Eon<br>0.18<br>Eoff<br>0.12<br>0.06<br>0.00<br>0 3 6 IC (A)<br>**----- End of picture text -----**<br>


**==> picture [513 x 198] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 15. Switching energy vs gate resistance Figure 16. Switching energy vs temperature<br>E  GADG170120221013SLG E  GADG170120221012SLT<br>(mJ) IC = 3 A VCC = 400 V (mJ) IC = 3 A,<br>VGE = 15 V, TJ= 175  ℃ VGE = 15 V<br>0.10<br>0.17 Eon<br>Eon<br>0.08<br>Eoff<br>0.14<br>0.06<br>Eoff<br>0.11<br>0.04<br>0.08 0.02<br>0 100 200 300 RG (Ω) 0 50 100 150 TJ (°C)<br>**----- End of picture text -----**<br>


**Figure 17. Switching energy vs collector-emitter voltage** 

**==> picture [190 x 165] intentionally omitted <==**

**----- Start of picture text -----**<br>
E  GADG170120221012SLV<br>(mJ) IC = 3 A<br>VGE = 15 V, TJ= 175  ℃<br>Eon<br>0.12<br>0.10<br>Eoff<br>0.08<br>0.06<br>250 350 450 VCE (V)<br>**----- End of picture text -----**<br>


**Figure 18. Switching times vs collector current** 

**==> picture [181 x 165] intentionally omitted <==**

**----- Start of picture text -----**<br>
t  GADG170120221014STC<br>(ns)<br>VGE = 15 V, TJ= 175  ℃<br>tf<br>td(off)<br>10  [2]<br>tr<br>td(on)<br>10  [1]<br>0 3 6 IC (A)<br>**----- End of picture text -----**<br>


**DS13901** - **Rev 2** 

**page 7/18** 

**STGD4H60DF Electrical characteristics (curves)** 

**Figure 19. Switching times vs gate resistance** 

**==> picture [176 x 166] intentionally omitted <==**

**----- Start of picture text -----**<br>
t GADG180120220844STR<br>(ns)<br>td(off)<br>tf<br>10 [2]<br>td(on)<br>tr<br>IC = 3 A<br>10 [1] VGE = 15 V, TJ= 175  ℃<br>0 100 200 300 RG (Ω)<br>**----- End of picture text -----**<br>


**Figure 20. Reverse recovery current vs diode current slope** 

**==> picture [198 x 166] intentionally omitted <==**

**----- Start of picture text -----**<br>
Irrm GADG170120221018RRC<br>(A) IF = 3 A,<br>7<br>5<br>3<br>1<br>0 200 400 600 800 di/dt (A/µs)<br>**----- End of picture text -----**<br>


**Figure 22. Reverse recovery charge vs diode current Figure 21. Reverse recovery time vs diode current slope slope** 

**==> picture [450 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
(ns)trr GADG170120221017RRTIF = 3 A, (µC)Qrr GADG170120221019RRQIF = 3 A,<br>230<br>125<br>220<br>100<br>210<br>200<br>75<br>190<br>50<br>180<br>0 200 400 600 800 di/dt (A/µs) 0 200 400 600 800 di/dt (A/µs)<br>**----- End of picture text -----**<br>


## **Figure 23. Reverse recovery energy vs diode current slope** 

**==> picture [202 x 166] intentionally omitted <==**

**----- Start of picture text -----**<br>
Err GADG170120221020RRE<br>(μJ)<br>45<br>42<br>39<br>36<br>33<br>IF = 3 A,<br>30<br>0 200 400 600 800 di/dt (A/µs)<br>**----- End of picture text -----**<br>


**DS13901** - **Rev 2** 

**page 8/18** 

**STGD4H60DF Electrical characteristics (curves)** 

|**Figure 24.Thermal impedance for IGBT**<br>10<br>10<br>10<br>10<br>10<br>tp(s)<br>-5<br>-4<br>-3<br>-2<br>-1<br>10<br>-2<br>10<br>-1<br>K<br>0.2<br>0.05<br>0.02<br>0.01<br>0.1<br>Single pulse<br>δ=0.5<br>ZthTO2T_B<br>Zth= k*RthJC<br>δ = tp/t<br>t<br>tp|**Figure 24.Thermal impedance for IGBT**<br>10<br>10<br>10<br>10<br>10<br>tp(s)<br>-5<br>-4<br>-3<br>-2<br>-1<br>10<br>-2<br>10<br>-1<br>K<br>0.2<br>0.05<br>0.02<br>0.01<br>0.1<br>Single pulse<br>δ=0.5<br>ZthTO2T_B<br>Zth= k*RthJC<br>δ = tp/t<br>t<br>tp|
|---|---|
|||
|**Figure 25.Therm**|**al impedance for diode**<br>~~Zth = k  RthJC~~<br>~~*~~<br>~~δ= t~~p~~/~~~~_Ƭ_~~<br>_Ƭ_<br>~~t~~p|



**DS13901** - **Rev 2** 

**page 9/18** 

**STGD4H60DF Test circuits** 

## **3 Test circuits** 

**==> picture [513 x 176] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 26. Test circuit for inductive load switching Figure 27. Gate charge test circuit<br>A A<br>C<br>G L=100µH k k<br>E B<br>B<br>C 3.3µF 1000µF VCC<br>k<br>G D.U.T<br>k<br>+ RG E<br>k<br>-<br>k<br>AM01504v1 AM01505v1<br>**----- End of picture text -----**<br>


**==> picture [513 x 195] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 28. Switching waveform Figure 29. Diode reverse recovery waveform<br>90%<br>VG 10%<br>90%<br>VCE tcrosstr(Voff) 10% 25<br>90%<br>IC td(on)ton tr(Ion) td(off)toff tf 10%<br>AM01506v1<br>**----- End of picture text -----**<br>


**DS13901** - **Rev 2** 

**page 10/18** 

**STGD4H60DF Package information** 

## **4 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **4.1 DPAK (TO-252) type C2 package information** 

**Figure 30. DPAK (TO-252) type C2 package outline** 

**==> picture [33 x 34] intentionally omitted <==**

**==> picture [67 x 6] intentionally omitted <==**

**----- Start of picture text -----**<br>
0068772_type-C2_rev31<br>**----- End of picture text -----**<br>


**DS13901** - **Rev 2** 

**page 11/18** 

**STGD4H60DF DPAK (TO-252) type C2 package information** 

**Table 8. DPAK (TO-252) type C2 mechanical data** 

|**Di**|**mm**|**mm**|**mm**|
|---|---|---|---|
|**m.**|**Min.**|**Typ.**|**Max.**|
|A|2.20|2.30|2.38|
|A1|0.90|1.01|1.10|
|A2|0.00||0.10|
|b|0.72||0.85|
|b4|5.13|5.33|5.46|
|c|0.47||0.60|
|c2|0.47||0.60|
|D|6.00|6.10|6.20|
|D1|5.10|5.35|5.60|
|E|6.50|6.60|6.70|
|E1|5.00|5.20|5.40|
|e|2.186|2.286|2.386|
|H|9.80|10.10|10.40|
|L|1.40|1.50|1.70|
|L1|2.90 REF|||
|L2|0.90||1.25|
|L3|0.51 BSC|||
|L4|0.60|0.80|1.00|
|L6|1.80 BSC|||
|θ1|5°|7°|9°|
|θ2|5°|7°|9°|
|V2|0°||8°|



**DS13901** - **Rev 2** 

**page 12/18** 

**STGD4H60DF DPAK (TO-252) type C2 package information** 

**Figure 31. DPAK (TO-252) recommended footprint (dimensions are in mm)** 

**==> picture [156 x 276] intentionally omitted <==**

**==> picture [45 x 6] intentionally omitted <==**

**----- Start of picture text -----**<br>
FP_0068772_32<br>**----- End of picture text -----**<br>


**DS13901** - **Rev 2** 

**page 13/18** 

**STGD4H60DF DPAK (TO-252) packing information** 

## **4.2 DPAK (TO-252) packing information** 

## **Figure 32. DPAK (TO-252) tape outline** 

**==> picture [367 x 145] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 pitches cumulative<br>tolerance on tape +/- 0.2 mm<br>Top cover P0 D P2<br>T tape<br>E<br>F<br>|) pees cedoo s os<br>K0 W<br>B1 B0<br>f f PalataraI I t I et<br>For machine ref. only A0 P1 D1<br>including draft and<br>radii concentric around B0<br>User direction of feed<br>**----- End of picture text -----**<br>


**==> picture [5 x 5] intentionally omitted <==**

**----- Start of picture text -----**<br>
R<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Bending radius<br>**----- End of picture text -----**<br>


**==> picture [52 x 6] intentionally omitted <==**

**----- Start of picture text -----**<br>
User direction of feed<br>**----- End of picture text -----**<br>


AM08852v1 

**DS13901** - **Rev 2** 

**page 14/18** 

**STGD4H60DF DPAK (TO-252) packing information** 

**Figure 33. DPAK (TO-252) reel outline** 

**==> picture [426 x 273] intentionally omitted <==**

**----- Start of picture text -----**<br>
T<br>40mm min.<br>access hole<br>at slot location<br>B<br>D<br>C<br>N<br>A<br>Tape slot  G measured<br>in core for  at hub<br>Full radius  tape start<br>2.5mm min.width<br>AM06038v1<br>**----- End of picture text -----**<br>


**Table 9. DPAK (TO-252) tape and reel mechanical data** 

||**Tape**|**Tape**||**Reel**|**Reel**|
|---|---|---|---|---|---|
|**Di**|**mm**||**Di**|**mm**||
|**m.**|**Min.**|**Max.**|**m.**|**Min.**|**Max.**|
|A0|6.8|7|A||330|
|B0|10.4|10.6|B|1.5||
|B1||12.1|C|12.8|13.2|
|D|1.5|1.6|D|20.2||
|D1|1.5||G|16.4|18.4|
|E|1.65|1.85|N|50||
|F|7.4|7.6|T||22.4|
|K0|2.55|2.75||||
|P0|3.9|4.1|Base qty.||2500|
|P1|7.9|8.1|Bulk qty.||2500|
|P2|1.9|2.1||||
|R|40|||||
|T|0.25|0.35||||
|W|15.7|16.3||||



**DS13901** - **Rev 2** 

**page 15/18** 

**STGD4H60DF** 

## **Revision history** 

**Table 10. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|20-Jan-2022|1|First release.|
|23-Feb-2023|2|UpdatedTable 5. Switching characteristics (inductive load).|



**DS13901** - **Rev 2** 

**page 16/18** 

**STGD4H60DF Contents** 

## **Contents** 

|**1**|**Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2**|
|---|---|
|**2**|**Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3**|
||**2.1**<br>Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5|
|**3**|**Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10**|
|**4**|**Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11**|
||**4.1**<br>DPAK (TO-252) type C2 package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
||**4.2**<br>DPAK (TO-252) packing information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14|
|**Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16**||



**DS13901** - **Rev 2** 

**page 17/18** 

**STGD4H60DF** 

## **IMPORTANT NOTICE – READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2023 STMicroelectronics – All rights reserved 

**DS13901** - **Rev 2** 

**page 18/18** 



## Links

- [View this product on Novapart](https://novapart.co/products/STGD4H60DF/igbt-8-a-16-v-75-w-600-to-252-dpak-3-pins)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/stmicroelectronics/stgd4h60df/igbt-single-600v-8a-to-252/dp/4294107)
---

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