# IGBT, 60 A, 1.7 V, 260 W, 600 V, TO-263 (D2PAK), 3 Pins

![Product image](https://novapart.co/image/farnell:4872918/)

**URL**: https://novapart.co/products/STGB30H60DLLFBAG/igbt-60-a-17-v-260-w-600-to-263-d2pak-3-pins
**SKU**: STGB30H60DLLFBAG
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || IGBTs || Single IGBTs
**Price**: €1.1000
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (05-Nov-2025) |
| No. Of Pins | 3Pins |
| Product Range | HB Series |
| Power Dissipation | 260W |
| Transistor Mounting | Surface Mount |
| Transistor Case Style | TO-263 (D2PAK) |
| Operating Temperature Max | 175°C |
| Continuous Collector Current | 60A |
| Collector Emitter Voltage Max | 600V |
| Collector Emitter Saturation Voltage | 1.7V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4872918/)

**STGB30H60DLLFBAG** 

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Datasheet 

Automotive-grade trench gate field-stop, 600 V, 30 A, high-speed HB series IGBT in a D²PAK package 

## **Features** 

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TAB<br>2<br>3<br>1<br>D PAK²<br>**----- End of picture text -----**<br>


- AEC-Q101 qualified 

- High-speed switching series 

- Logic level gate drive 

- Low VF soft recovery co-packaged diode 

- Maximum junction temperature: TJ = 175 °C 

- Minimized tail current 

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C(2, TAB)<br>G(1)<br>E(3)<br>G1C2TE3_diode<br>**----- End of picture text -----**<br>


- VCE(sat) = 1.7 V (typ.) at IC = 30 A 

- Safer paralleling 

- Tight parameter distribution 

- Low thermal resistance 

## **Applications** 

- Automotive injection 

## **Description** 

This device is an IGBT developed using an advanced proprietary trench gate field ‑ stop structure. The device is part of the new HB series of IGBTs, which represents an optimum compromise between conduction and switching loss to maximize the efficiency of any frequency converter. Furthermore, the slightly positive VCE(sat) temperature coefficient and very tight parameter distribution result in safer paralleling operation. 

**Product status link** STGB30H60DLLFBAG 

## **Product summary** 

|**Product summary**|**Product summary**|
|---|---|
|**Order code**|STGB30H60DLLFBAG|
|**Marking**|GB30H60DLLFB|
|**Package**|D²PAK|
|**Packing**|Tape and reel|



**DS11876** - **Rev 2** - **May 2025** For further information, contact your local STMicroelectronics sales office. 

www.st.com 

**STGB30H60DLLFBAG Electrical ratings** 

## **1 Electrical ratings** 

## **Table 1. Absolute maximum ratings** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VCES|Collector-emitter voltage|600|V|
|IC|Continuous collector current at TC= 25 °C|60|A|
||Continuous collector current at TC= 100 °C|30||
|ICP(1)|Pulsed collector current|120|A|
|VGE|Gate-emitter voltage|±20|V|
|IF|Continuous forward current at TC= 25 °C|60|A|
||Continuous forward current at TC= 100 °C|30||
|IFP(1)|Pulsed collector current|120|A|
|PTOT|Total power dissipation at TC= 25 °C|260|W|
|TSTG|Storage temperature range|-55 to 150|°C|
|TJ|Operating junction temperature range|-55 to 175|°C|



_1. Pulse width limited by maximum junction temperature._ 

**Table 2. Thermal data** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|RthJC|Thermal resistance, junction-to-case, IGBT|0.58|°C/W|
||Thermal resistance, junction-to-case, diode|2.08||
|RthJA|Thermal resistance, junction-to-ambient|62.5|°C/W|



**DS11876** - **Rev 2** 

**page 2/14** 

**STGB30H60DLLFBAG Electrical characteristics** 

## **2 Electrical characteristics** 

TJ = 25 °C unless otherwise specified. 

**Table 3. Static characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|V(BR)CES|Collector-emitter breakdown<br>voltage|VGE= 0 V, IC= 1 mA|600|-|-|V|
|VCE(sat)|Collector-emitter saturation<br>voltage|VGE= 5 V, IC= 30 A|-|1.7|2.35|V|
|||VGE= 5 V, IC= 30 A, TJ= 125 °C|-|1.9|-||
|||VGE= 5 V, IC= 30 A, TJ= 175 °C|-|2|-||
|VF|Forward on-voltage|IF= 30 A|-|1.4|1.7|V|
|||IF= 30 A, TJ= 125 °C|-|1.35|-||
|||IF= 30 A, TJ= 175 °C|-|1.25|-||
|VGE(th)|Gate threshold voltage|VCE= VGE, IC= 1 mA|0.7|1.8|2.5|V|
|ICES|Collector cut-off current|VGE= 0 V, VCE= 600 V|-|-|25|µA|
|IGES|Gate-emitter leakage current|VCE= 0 V, VGE= ±10 V|-|-|±250|nA|



**Table 4. Dynamic characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Cies|Input capacitance|VCE= 25 V, f = 1 MHz, VGE= 0 V|-|5000|-|pF|
|Coes|Output capacitance||-|120|-|pF|
|Cres|Reverse transfer capacitance||-|75|-|pF|
|Qg|Total gate charge|VCC= 520 V, IC= 30 A, VGE= 0 to 5 V<br>(see theFigure 25. Gate charge test circuit)|-|110|-|nC|
|Qge|Gate-emitter charge||-|16|-|nC|
|Qgc|Gate-collector charge||-|42|-|nC|



**Table 5. IGBT switching characteristics (inductive load)** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|td(off)|Turn-off delay time|VCE= 400 V, IC= 30 A, VGE= 5 V,<br>RG= 10 Ω<br>(see theFigure 24. Test circuit for inductive<br>load switching)|-|320|-|ns|
|tf|Current fall time||-|20|-|ns|
|Eoff(1)|Turn-off switching energy||-|0.6|-|μJ|
|td(off)|Turn-off delay time|VCE= 400 V, IC= 30 A, VGE= 15 V,<br>RG= 10 Ω, TJ= 175 °C<br>(see theFigure 24. Test circuit for inductive<br>load switching)|-|330|-|ns|
|tf|Current fall time||-|40|-|ns|
|Eoff(1)|Turn-off switching energy||-|0.88|-|μJ|



_1. Including the tail of the collector current._ 

**DS11876** - **Rev 2** 

**page 3/14** 

**STGB30H60DLLFBAG Electrical characteristics** 

## **2.1 Electrical characteristics (curves)** 

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**----- Start of picture text -----**<br>
Figure 1. Total power dissipation vs temperature Figure 2. Maximum collector current vs temperature<br>PTOT IGBT181020161430PDT IC IGBT181020161433CCT<br>(W)  (A)<br>VGE = 15 V 60 VGE = 15 V<br>250 TJ = 175 °C TJ = 175 °C<br>50<br>200<br>40<br>150<br>30<br>100<br>20<br>50<br>10<br>0 0<br>-75 -25 25 75 125 175 TC (°C) -75 -25 25 75 125 175 TC (°C)<br>**----- End of picture text -----**<br>


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Figure 3. Typical output characteristics (TJ = 25 °C) Figure 4. Typical output characteristics (TJ = 175 °C)<br>IC IGBT201020161152OC25 IC IGBT201020161155OC175<br>(A)  VGE = 10 V (A)  VGE = 10 V<br>4 V<br>80 80<br>4 V<br>3 V<br>60 60<br>3 V<br>40 40<br>20 20<br>2 V<br>0 0<br>0 1 2 3 4 VCE (V) 0 1 2 3 4 VCE (V)<br>Figure 5. Typical transfer characteristics Figure 6. Typical VCE(sat) vs temperature<br>IC IGBT181020161517TCH VCE(SAT) IGBT181020161446VCET<br> (A) (V)<br>VCE = 5 V VGE = 5 V<br>80 2.2<br>TJ = 25 °C IC = 40 A<br>60 2.0<br>TJ = 175 °C<br>40 1.8<br>IC = 30 A<br>20 1.6<br>0 1.4<br>1.0 1.5 2.0 2.5 3.0 3.5 VGE (V) -75 -25 25 75 125 175 TJ (°C)<br>**----- End of picture text -----**<br>


**DS11876** - **Rev 2** 

**page 4/14** 

**STGB30H60DLLFBAG Electrical characteristics** 

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**----- Start of picture text -----**<br>
Figure 7. Typical VCE(sat) vs collector current Figure 8. Collector current vs switching frequency<br>VCE(SAT) IGBT181020161452VCEC IC IGBT181020161501CCS<br>(V) (A)<br>3.5 VGE = 5 V 50<br>TJ = 175 °C<br>TC = 80 °C<br>3.0 40<br>TC = 100 °C<br>TJ = 25 °C<br>2.5 30<br>2.0 20<br>1.5 TJ = -50 °C 10 duty cycle = 0.5, V Rectangular current shapeCC  400 V,<br>RG = 10 Ω, VGE= 0 to 5 V,<br>1.0 0 TJ = 175 °C<br>0 20 40 60 80 100 120 IC (A) 10 [0] 10 [1] 10 [2] f (kHz)<br>**----- End of picture text -----**<br>


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Figure 9. Forward bias safe operating area Figure 10. Diode typical forward characteristics<br>IC GIPG280120141450FSR VF IGBT181020161526DVF<br>(A) (V)<br>2.4<br>100<br>2.0<br>10 10 μs 1.6 TJ = -50 °C<br>100 μs<br>1 ms<br>1.2<br>1 TJ = 25 °C<br>(single pulse Tc = 25 °C,  0.8<br>TJ ≤ 175 °C, VGE = 15 V)   TJ = 175 °C<br>0.1 0.4<br>1 10 100 VCE (V) 0 20 40 60 80 100 IF (A)<br>Vce(sat) limit<br>**----- End of picture text -----**<br>


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Figure 11. Normalized gate treshold vs temperature Figure 12. Normalized V(BR)CES vs junction temperature<br>VGE(th) IGBT181020161531NVGE V(BR)CES IGBT181020161534NVBR<br>(Norm.) (Norm.)<br>VCE = VGE IC = 1 mA<br>1.6 1.2<br>IC = 1 mA<br>1.2 1.1<br>0.8 1.0<br>0.4 0.9<br>0.0 0.8<br>-75 -25 25 75 125 175 TJ (°C) -75 -25 25 75 125 175 TJ (°C)<br>**----- End of picture text -----**<br>


**DS11876** - **Rev 2** 

**page 5/14** 

**STGB30H60DLLFBAG Electrical characteristics** 

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Figure 13. Typical capacitance characteristics Figure 14. Typical gate charge characteristics<br>C  IGBT181020161540CVR VGE IGBT181020161543GCGE<br>(pF)  (V)<br>CIES VCC = 520 V<br>10<br>IC = 30 A<br>10  [3 ] 8<br>f = 1MHz<br>6<br>10  [2 ] 4<br>COES 2<br>CRES<br>10  [1 ] 0<br>10  [-1 ] 10  [0 ] 10  [1 ] 10  [2 ] VCE (V) 0 40 80 120 160 200 Qg (nC)<br>Figure 15. Typical switching energy vs collector current Figure 16. Typical switching energy vs temperature<br>E IGBT181020161546SLC E IGBT181020161600SLT<br>(µJ) Ets (µJ) VCC = 400 V, IC = 30 A<br>6000 VCC = 400 V, RG = 10 Ω 3000 RG = 10 Ω, VGE = 5 V<br>VGE = 5 V, TJ = 175 °C Ets<br>5000 2500<br>4000 Eon 2000<br>3000 1500 Eon<br>Eoff<br>2000 1000<br>Eoff<br>1000 500<br>0 0<br>0 10 20 30 40 50 60 IC (A) 25 50 75 100 125 150 TJ (°C)<br>**----- End of picture text -----**<br>


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Figure 17. Typical switching energy vs collector emitter<br>Figure 18. Typical switching energy vs gate resistance<br>voltage<br>E IGBT181020161553SLG<br>E IGBT181020161606SLV<br>(µJ) IC = 30 A, RG = 10 Ω Ets (µJ) VCC = 400 V, IC = 30 A<br>3500 VGE = 5 V, TJ = 175 °C 5000 VGE = 5 V, TJ = 175 °C Ets<br>3000<br>4000<br>2500<br>2000 Eoff 3000 Eon<br>1500 2000<br>Eoff<br>1000<br>Eoff 1000<br>500<br>0<br>0 0 10 20 30 40 RG (Ω)<br>200 250 300 350 400 450 500 VCE (V)<br>**----- End of picture text -----**<br>


**DS11876** - **Rev 2** 

**page 6/14** 

**STGB30H60DLLFBAG Electrical characteristics** 

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Figure 19. Typical switching times vs collector current Figure 20. Typical switching times vs gate resistance<br>t IGBT181020161622STC t IGBT201020161257STR<br>(ns) RG = 10 Ω, TJ = 175 °C (ns) IC = 30 A, TJ = 175 °C<br>V CC  = 400 V, V GE  = 5 V VCC = 400 V, VGE = 5 V<br>td(off)<br>10 [3]<br>td(off)<br>10 [2]<br>td(on) td(on)<br>10 [2]<br>tf<br>tf<br>tr<br>tr<br>10 [1] 10 [1]<br>0 10 20 30 40 50 60 IC (A) 0 10 20 30 40 RG (Ω)<br>**----- End of picture text -----**<br>


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Figure 21. Diode typical forward on voltage vs<br>Figure 22. IGBT normalized transient thermal impedance<br>temperature<br>VF IGBT181020161538DVF K ZthTO2T_B<br>(V)  δ=0.5<br>IF = 30 A<br>1.6<br>0.2<br>1.5 0.1<br>0.05<br>10-1<br>1.4 0.02<br>1.3 0.01 Zth = k*RthJC<br>δ = tp/t<br>Single pulse<br>1.2 tp<br>10-2 t<br>1.1 10-5 10-4 10-3 10-2 10-1 tp [(s)]<br>-75 -25 25 75 125 175 TJ (°C)<br>**----- End of picture text -----**<br>


**Figure 23. Diode normalized transient thermal impedance** 

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**DS11876** - **Rev 2** 

**page 7/14** 

**STGB30H60DLLFBAG Test circuits** 

## **3 Test circuits** 

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Figure 24. Test circuit for inductive load switching Figure 25. Gate charge test circuit<br>A A<br>C<br>G L=100µH k k<br>E B<br>B<br>C 3.3µF 1000µF VCC<br>k<br>G D.U.T<br>k<br>+ RG E<br>k<br>-<br>k<br>AM01504v1 AM01505v1<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Figure 27. Diode reverse recovery waveform<br>Figure 26. Switching waveform<br>90%<br>VG 10%<br>90%<br>VCE tr(Voff) 10%<br>tcross 25<br>90%<br>IC td(on)ton tr(Ion) td(off)toff tf 10%<br>AM01506v1<br>**----- End of picture text -----**<br>


**DS11876** - **Rev 2** 

**page 8/14** 

**STGB30H60DLLFBAG Package information** 

**4 Package information** 

To meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions, and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **4.1 D²PAK (TO-263) type A2 package information** 

**Figure 28. D²PAK (TO-263) type A2 package outline** 

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**==> picture [122 x 220] intentionally omitted <==**

0079457_A2_27 

**DS11876** - **Rev 2** 

**page 9/14** 

**STGB30H60DLLFBAG Package information** 

**Table 6. D²PAK (TO-263) type A2 package mechanical data** 

|**Dim**|**mm**|**mm**|**mm**|
|---|---|---|---|
|**.**|**Min.**|**Typ.**|**Max.**|
|A|4.40||4.60|
|A1|0.03||0.23|
|b|0.70||0.93|
|b2|1.14||1.70|
|c|0.45||0.60|
|c2|1.23||1.36|
|D|8.95||9.35|
|D1|7.50|7.75|8.00|
|D2|1.10|1.30|1.50|
|E|10.00||10.40|
|E1|8.70|8.90|9.10|
|E2|7.30|7.50|7.70|
|e||2.54||
|e1|4.88||5.28|
|H|15.00||15.85|
|J1|2.49||2.69|
|L|2.29||2.79|
|L1|1.27||1.40|
|L2|1.30||1.75|
|R||0.40||
|V2|0°||8°|



**DS11876** - **Rev 2** 

**page 10/14** 

**STGB30H60DLLFBAG Package information** 

**Figure 29. D²PAK (TO-263) recommended footprint (dimensions are in mm)** 

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0079457_Rev27_footprint<br>**----- End of picture text -----**<br>


## **4.2 D²PAK packing information** 

**Figure 30. D²PAK tape drawing (dimensions are in mm)** 

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**----- Start of picture text -----**<br>
DM01095771_1<br>**----- End of picture text -----**<br>


**DS11876** - **Rev 2** 

**page 11/14** 

**STGB30H60DLLFBAG** 

## **Revision history** 

## **Table 7. Document revision history** 

|**Date**|**Version**|**Changes**|
|---|---|---|
|18-Oct-2016|1|First release.|
|12-May-2025|2|UpdatedTable 3. Static characteristicsandSection 4: Package information.|



**DS11876** - **Rev 2** 

**page 12/14** 

**STGB30H60DLLFBAG Contents** 

|**Contents**|**Contents**|
|---|---|
|**1**|**Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2**|
|**2**|**Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3**|
||**2.1**<br>Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4|
|**3**|**Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8**|
|**4**|**Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9**|
||**4.1**<br>D²PAK (TO-263) type A2 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9|
||**4.2**<br>D²PAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
|**Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12**||



**DS11876** - **Rev 2** 

**page 13/14** 

**STGB30H60DLLFBAG** 

## **IMPORTANT NOTICE – READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

- © 2025 STMicroelectronics – All rights reserved 

**DS11876** - **Rev 2** 

**page 14/14** 



## Links

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- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/stmicroelectronics/stgb30h60dllfbag/transistor-igbt-600v-60a-to-263/dp/4872918)
---

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