# Power MOSFET, N Channel, 600 V, 12 A, 0.26 ohm, TO-220FP, Through Hole

![Product image](https://novapart.co/image/farnell:2986998/)

**URL**: https://novapart.co/products/STF16N60M6/power-mosfet-n-channel-600-v-12-a-026-ohm-to-220fp
**SKU**: STF16N60M6
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.9310
**Stock**: 100+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:12A; Drain Source Voltage Vds:600V; On Resistance Rds(on):0.26ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | MDmesh M6 |
| Qualification | - |
| Power Dissipation | 25W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220FP |
| Drain Source Voltage Vds | 600V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 12A |
| Drain Source On State Resistance | 0.26ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2986998/)

## **STF16N60M6** 

## N-channel 600 V, 0.26 Ω typ., 12 A MDmesh™ M6 Power MOSFET in a TO-220FP package 

Datasheet - production data 

## **Features** 

|**Order code**|**VDS**|**RDS(on) max.**|**ID**|
|---|---|---|---|
|STF16N60M6|600 V|0.32 Ω|12 A|



- Reduced switching losses 

- Lower RDS(on) x area vs previous generation 

- Low gate input resistance 

- 100% avalanche tested 

- Zener-protected 

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**----- Start of picture text -----**<br>
TO-220FP<br>**----- End of picture text -----**<br>


**Figure 1: Internal schematic diagram** 

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**----- Start of picture text -----**<br>
D(2)<br>G(1)<br>S(3) AM15572v1_no_tab<br>**----- End of picture text -----**<br>


## **Applications** 

- Switching applications 

- LLC converters 

- Boost PFC converters 

## **Description** 

The new MDmesh™ M6 technology incorporates the most recent advancements to the well-known and consolidated MDmesh family of SJ MOSFETs. STMicroelectronics builds on the previous generation of MDmesh devices through its new M6 technology, which combines excellent RDS(on) * area improvement with one of the most effective switching behaviors available, as well as a user-friendly experience for maximum endapplication efficiency. 

**Table 1: Device summary** 

|**Order code**|**Marking**|**Package**|**Packing**|
|---|---|---|---|
|STF16N60M6|16N60M6|TO-220FP|Tube|



_www.st.com_ 

March 2017 

DocID030461 Rev 1 

1/13 

This is information on a product in full production. 

|**Contents**<br>**STF16N60M6**|**Contents**<br>**STF16N60M6**|
|---|---|
|**Contents**||
|**1**|**Electrical ratings ............................................................................. 3**|
|**2**|**Electrical characteristics ................................................................ 4**|
||2.1<br>Electrical characteristics (curves) ...................................................... 6|
|**3**|**Test circuits ..................................................................................... 8**|
|**4**|**Package information ....................................................................... 9**|
||4.1<br>TO-220FP package information ...................................................... 10|
|**5**|**Revision history ............................................................................ 12**|



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**Electrical ratings** 

## **1 Electrical ratings** 

**Table 2: Absolute maximum ratings** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VGS|Gate-source voltage|±25|V|
|ID|Drain current (continuous) at Tc= 25 °C|12_(1)_|A|
|ID|Drain current (continuous) at Tc= 100 °C|7.6_(1)_|A|
|IDM|Drain current (pulsed)|32_(1)(2)_|A|
|PTOT|Total dissipation at Tc= 25 °C|25|W|
|dv/dt_(3)_|Peak diode recoveryvoltage slope|15|V/ns|
|dv/dt_(4)_|MOSFET dv/dt ruggedness|50||
|VISO|Insulation withstand voltage (RMS) from all three leads to external<br>heat sink (t = 1 s; TC= 25 °C)|2.5|kV|
|Tstg|Storage temperature range|-55 to 150|°C|
|Tj|Operating junction temperature range|||



## **Notes:** 

- (1) Limited by maximum junction temperature. 

- (2)Pulse width limited by safe operating area. 

(3)ISD ≤ 12 A, di/dt ≤ 400 A/μs; VDS(peak) < V(BR)DSS, VDD = 400 V 

- (4) VDS ≤ 480 V 

**Table 3: Thermal data** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|Rthj-case|Thermal resistancejunction-case|5|°C/W|
|Rthj-amb|Thermal resistancejunction-ambient|62.5||



## **Table 4: Avalanche characteristics** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|IAR|Avalanche current, repetitive or not repetitive (pulse width limited byTjmax)|2.5|A|
|EAS|Singlepulse avalanche energy(startingTj= 25 °C, ID= IAR; VDD= 50 V)|110|mJ|



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**Electrical characteristics** 

## **2 Electrical characteristics** 

(TC = 25 °C unless otherwise specified) 

**Table 5: On /off states** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|V(BR)DSS|Drain-source breakdown<br>voltage|VGS= 0 V, ID= 1 mA|600|||V|
|IDSS|Zero gate voltage drain<br>current|VGS= 0 V, VDS= 600 V|||1|µA|
|||VGS= 0 V, VDS= 600 V,<br>TC= 125 °C_(1)_|||100||
|IGSS|Gate-bodyleakage current|VDS= 0 V, VGS= ± 25 V|||±5|µA|
|VGS(th)|Gate threshold voltage|VDS= VGS, ID= 250µA|3.25|4|4.75|V|
|RDS(on)|Static drain-source on-<br>resistance|VGS= 10 V, ID= 6 A||0.26|0.32|Ω|



## **Notes:** 

(1)Defined by design, not subject to production test. 

**Table 6: Dynamic** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Ciss|Input capacitance|VGS= 100 V, f = 1 MHz,<br>VGS= 0 V|-|575|-|pF|
|Coss|Output capacitance||-|33|-||
|Crss|Reverse transfer<br>capacitance||-|3|-||
|Coss eq._(1)_|Equivalent output<br>capacitance|VDS= 0 to 480 V, VGS= 0 V|-|104|-|pF|
|RG|Intrinsicgate resistance|f = 1 MHz open drain|-|5.2|-|Ω|
|Qg|Totalgate charge|VDD= 480 V, ID= 12 A, VGS= 0<br>to 10 V (see_Figure 15: "Test_<br>_circuit for gate charge_<br>_behavior"_)|-|16.7|-|nC|
|Qgs|Gate-source charge||-|3.5|-||
|Qgd|Gate-drain charge||-|9.4|-||



## **Notes:** 

(1) Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS. 

**Table 7: Switching times** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|td(on)|Turn-on delaytime|VDD= 300 V, ID= 6 A<br>RG= 4.7 Ω, VGS= 10 V (see<br>_Figure 14: "Test circuit for_<br>_resistive load switching times"_<br>and_Figure 19: "Switching time_<br>_waveform"_)|-|13|-|ns|
|tr|Rise time||-|7.6|-||
|td(off)|Turn-off delaytime||-|19.8|-||
|tf|Fall time||-|6.8|-||



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**Electrical characteristics** 

**Table 8: Source drain diode** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|ISD|Source-drain current||-||12|A|
|ISDM_(1)_|Source-drain current<br>(pulsed)||-||32|A|
|VSD_(2)_|Forward on voltage|VGS= 0 V, ISD= 12 A|-||1.6|V|
|trr|Reverse recoverytime|ISD= 12 A, di/dt = 100 A/µs,<br>VDD= 60 V (see_Figure 16:_<br>_"Test circuit for inductive load_<br>_switching and diode recovery_<br>_times"_)|-|210||ns|
|Qrr|Reverse recoverycharge||-|1.7||µC|
|IRRM|Reverse recovery current||-|13.8||A|
|trr|Reverse recoverytime|ISD= 12 A, di/dt = 100 A/µs,<br>VDD= 60 V, Tj= 150 °C (see<br>_Figure 16: "Test circuit for_<br>_inductive load switching and_<br>_diode recovery times"_)|-|310||ns|
|Qrr|Reverse recoverycharge||-|3.2||µC|
|IRRM|Reverse recovery current||-|15.4||A|



## **Notes:** 

(1) Pulse width is limited by safe operating area. 

(2) Pulse test: pulse duration = 300 µs, duty cycle 1.5%. 

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**Electrical characteristics** 

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**----- Start of picture text -----**<br>
2.1  Electrical characteristics (curves)<br>**----- End of picture text -----**<br>


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Figure 2: Safe operating area  Figure 3: Thermal impedance<br>**----- End of picture text -----**<br>


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Figure 4: Output characteristics  Figure 5: Transfer characteristics<br>**----- End of picture text -----**<br>


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Figure 6: Gate charge vs gate-source voltage  Figure 7: Static drain-source on-resistance<br>**----- End of picture text -----**<br>


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**Electrical characteristics** 

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**----- Start of picture text -----**<br>
Figure 9: Normalized gate threshold voltage vs<br>Figure 8: Capacitance variations<br>temperature<br>**----- End of picture text -----**<br>


**Figure 10: Normalized on-resistance vs temperature Figure 11: Normalized V(BR)DSS vs temperature** 

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Figure 13: Source-drain diode forward<br>Figure 12: Output capacitance stored energy<br>characteristics<br>**----- End of picture text -----**<br>


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**Test circuits** 

## **3 Test circuits** 

**==> picture [416 x 586] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 15: Test circuit for gate charge<br>Figure 14: Test circuit for resistive load<br>behavior<br>switching times<br>Figure 16: Test circuit for inductive load<br>Figure 17: Unclamped inductive load test<br>switching and diode recovery times  circuit<br>Figure 19: Switching time waveform<br>Figure 18: Unclamped inductive waveform<br>**----- End of picture text -----**<br>


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**Package information** 

## **4 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _**www.st.com**_ . ECOPACK[®] is an ST trademark. 

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**Package information** 

## **4.1 TO-220FP package information** 

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**----- Start of picture text -----**<br>
Figure 20: TO-220FP package outline<br>**----- End of picture text -----**<br>


~~©~~ 10/13 DocID030461 Rev 1 

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**Package information** 

**Table 9: TO-220FP package mechanical data** 

|**Dim.**||**mm**||
|---|---|---|---|
||**Min.**|**Typ.**|**Max.**|
|A|4.4||4.6|
|B|2.5||2.7|
|D|2.5||2.75|
|E|0.45||0.7|
|F|0.75||1|
|F1|1.15||1.70|
|F2|1.15||1.70|
|G|4.95||5.2|
|G1|2.4||2.7|
|H|10||10.4|
|L2||16||
|L3|28.6||30.6|
|L4|9.8||10.6|
|L5|2.9||3.6|
|L6|15.9||16.4|
|L7|9||9.3|
|Dia|3||3.2|



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**Revision history** 

## **5 Revision history** 

**Table 10: Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|23-Mar-2017|1|First release.|



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## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

- © 2017 STMicroelectronics – All rights reserved 

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## Links

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- [Supplier page](https://es.farnell.com/stmicroelectronics/stf16n60m6/mosfet-n-ch-600v-12a-150deg-c/dp/2986998)
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