# Power MOSFET, N Channel, 1.2 kV, 12 A, 0.62 ohm, TO-220FP, Through Hole

![Product image](https://novapart.co/image/farnell:2807246/)

**URL**: https://novapart.co/products/STF12N120K5/power-mosfet-n-channel-12-kv-a-062-ohm-to-220fp
**SKU**: STF12N120K5
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €5.6500
**Stock**: 1000+
**Lead Time**: 113 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:12A; Drain Source Voltage Vds:1.2kV; On Resistance Rds(on):0.62ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V; P

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | MDmesh K5 |
| Qualification | - |
| Power Dissipation | 40W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220FP |
| Drain Source Voltage Vds | 1.2kV |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 12A |
| Drain Source On State Resistance | 0.62ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2807246/)

## **STF12N120K5, STFW12N120K5** 

N-channel 1200 V, 0.62 Ω typ., 12 A  MDmesh™ K5 Power MOSFETs in TO-220FP and TO-3PF packages 

**Datasheet** - **production data** 

## **Features** 

|**Features**|||||
|---|---|---|---|---|
|**Order code**|**VDS**|**RDS(on) max.**|**ID**|**PTOT**|
|STF12N120K5|1200 V|0.69Ω|12 A|40 W|
|STFW12N120K5||||63 W|



- Industry’s lowest RDS(on) x area 

- Industry’s best figure of merit (FoM) 

**==> picture [139 x 13] intentionally omitted <==**

**----- Start of picture text -----**<br>
TO-220FP<br>TO-3PF<br>**----- End of picture text -----**<br>


- Ultra low gate charge 

- 100% avalanche tested 

- Zener-protected 

## **Figure 1.  Internal schematic diagram** 

## **Applications** 

- Switching applications 

## **Description** 

These very high voltage N-channel Power MOSFETs are designed using MDmesh™ K5 technology based on an innovative proprietary vertical structure. The result is a dramatic reduction in on-resistance and ultra-low gate charge for applications requiring superior power density and high efficiency. 

**Table 1. Device summary** 

|**Order code**|**Marking**|**Packages**|**Packing**|
|---|---|---|---|
|STF12N120K5|12N120K5|TO-220FP|Tube|
|STFW12N120K5||TO-3PF||



_www.st.com_ 

May 2015 

DocID026396 Rev 2 

1/16 

This is information on a product in full production. 

**Contents** 

**STF12N120K5, STFW12N120K5** 

|**Contents**|**Contents**|
|---|---|
|**1**|**Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3**|
|**2**|**Electrical characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4**|
||2.1<br>Electrical characteristics (curves)   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6|
|**3**|**Test circuits     . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9**|
|**4**|**Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10**|
||4.1<br>TO-220FP, package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11|
||4.2<br>TO-3PF, package outline  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13|
|**5**|**Revision history  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15**|



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**Electrical ratings** 

## **1 Electrical ratings** 

**Table 2. Absolute maximum ratings** 

|**Symbol**|**Parameter**|**Value**|**Value**|**Unit**|
|---|---|---|---|---|
|||**TO-220FP**|**TO-3PF**||
|VGS|Gate-source voltage|±30||V|
|ID|Drain current at TC= 25 °C|12||A|
|ID|Drain current at TC= 100 °C|7.6||A|
|IDM<br>(1)|Drain current (pulsed)|48||A|
|PTOT|Total dissipation at TC= 25 °C|40|63|W|
|VISO|Insulation withstand voltage (RMS) from<br>all three leads to external heat sink<br>(t = 1 s, TC= 25 °C)|<br>2500|3500|V|
|IAR<br>(2)|Max current during repetitive or single<br>pulse avalanche|4||A|
|EAS<br>(3)|Single pulse avalanche energy|215||mJ|
|dv/dt(4)|Peak diode recovery voltage slope|4.5||V/ns|
|dv/dt(5)|MOSFET dv/dt ruggedness|50||V/ns|
|Tj<br>Tstg|Operating junction temperature<br>Storage temperature|- 55 to 150||°C|



1. Pulse width limited by safe operating area. 

2. Pulse width limited by TJmax. 

3. Starting TJ = 25 °C, ID=IAS, VDD= 50 V 

4. ISD ≤ 12 A, di/dt ≤ 100 A/µs, VPeak ≤ V(BR)DSS 

5. VDS ≤ 960 V 

**Table 3. Thermal data** 

|**Symbol**|**Parameter**|**Value**|**Value**|**Unit**|
|---|---|---|---|---|
|||**TO-220FP**|**TO-3PF**||
|Rthj-case|Thermal resistance junction-case max|3.1|1.98|°C/W|
|Rthj-amb|Thermal resistance junction-amb max|62.5|50|°C/W|



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**Electrical characteristics** 

## **2 Electrical characteristics** 

(TCASE = 25 °C unless otherwise specified) 

**Table 4. On/off states** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|V(BR)DSS|Drain-source breakdown<br>voltage, (VGS= 0)|ID= 1 mA|1200|||V|
|IDSS|Zero gate voltage drain<br>current (VGS= 0)|VDS= 1200 V|||1|µA|
|||VDS= 1200 V, Tc=125 °C|||50|µA|
|IGSS|Gate body leakage current<br>(VDS= 0)|VGS= ± 20 V|||±10|µA|
|VGS(th)|Gate threshold voltage|VDS= VGS, ID= 100 µA|3|4|5|V|
|RDS(on)|Static drain-source on<br>resistance|VGS= 10 V, ID= 6 A||0.62|0.69|Ω|



**Table 5. Dynamic** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Ciss|Input capacitance|VDS=100 V, f=1 MHz, VGS=0|-|1370|-|pF|
|Coss|Output capacitance||-|110|-|pF|
|Crss|Reverse transfer<br>capacitance||-|0.6|-|pF|
|Co(tr)<br>(1)|Equivalent capacitance,<br>time-related|VGS= 0, VDS= 0 to 960 V|-|128|-|pF|
|Co(er)<br>(2)|Equivalent capacitance,<br>energy-related||-|42|-|pF|
|RG|Intrinsic gate resistance|f = 1 MHz, ID= 0|-|3.5|-|Ω|
|Qg|Total gate charge|VDD= 960 V, ID= 6 A<br>VGS=10 V<br>_(seeFigure 18)_|-|44.2|-|nC|
|Qgs|Gate-source charge||-|7.3|-|nC|
|Qgd|Gate-drain charge||-|30|-|nC|



1. Time-related is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS 

2. Energy-related is defined as a constant equivalent capacitance giving the same stored energy as Coss when VDS increases from 0 to 80% VDSS 

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**Electrical characteristics** 

**Table 6. Switching times** 

||**Table 6.**|**Switching times**|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|td(on)|Turn-on delay time|VDD= 600 V, ID= 6 A,<br>RG=4.7Ω, VGS=10 V<br>_(seeFigure 20)_|-|23|-|ns|
|tr|Rise time||-|11|-|ns|
|td(off)|Turn-off delay time||-|68.5|-|ns|
|tf|Fall time||-|18.5|-|ns|



**Table 7. Source drain diode** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|ISD|Source-drain current||-||12|A|
|ISDM|Source-drain current (pulsed)||-||48|A|
|VSD<br>(1)|Forward on voltage|ISD= 12 A, VGS=0|-||1.5|V|
|trr|Reverse recovery time|ISD= 12 A, VDD= 60 V<br>di/dt = 100 A/µs,<br>_(seeFigure 19)_|-|630||ns|
|Qrr|Reverse recovery charge||-|12.6||µC|
|IRRM|Reverse recovery current||-|40||A|
|trr|Reverse recovery time|ISD= 12 A,VDD= 60 V<br>di/dt=100 A/µs,<br>Tj=150 °C<br>_(seeFigure 19)_|-|892||ns|
|Qrr|Reverse recovery charge||-|15.6||µC|
|IRRM|Reverse recovery current||-|35||A|



1. Pulsed: pulse duration = 300µs, duty cycle 1.5% 

**Table 8. Gate-source Zener diode** 

|**Symbol**|**Parameter**|**Test conditions**|**Min**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|V(BR)GSO|Gate-source breakdown voltage|IGS= ±1 mA, ID= 0|30|-||V|



The built-in back-to-back Zener diodes have been specifically designed to enhance the ESD capability of the device. The Zener voltage is appropriate for efficient and cost-effective intervention to protect the device integrity. These integrated Zener diodes thus eliminate the need for external components. 

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**STF12N120K5, STFW12N120K5** 

**Electrical characteristics** 

## **2.1 Electrical characteristics (curves)** 

**Figure 2. Safe operating area for TO-220FP** 

## **Figure 3. Thermal impedance for TO-220FP** 

## **Figure 4. Safe operating area for TO-3PF** 

## **Figure 5. Thermal impedance for TO-3PF** 

## **Figure 6. Output characteristics** 

## **Figure 7. Transfer characteristics** 

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**Electrical characteristics** 

**Figure 8. Gate charge vs gate-source voltage** 

**Figure 10. Capacitance variations** 

**Figure 12. Normalized gate threshold voltage vs temperature** 

**Figure 9. Static drain-source on-resistance** 

**Figure 11. Output capacitance stored energy** 

**Figure 13. Normalized on-resistance vs temperature** 

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**Electrical characteristics** 

**Figure 14. Normalized V(BR)DSS vs temperature** 

## **Figure 15. Source-drain diode forward characteristics** 

**Figure 16. Maximum avalanche energy vs starting TJ** 

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**Test circuits** 

## **3 Test circuits** 

**Figure 17. Switching time test circuit for resistive load** 

**Figure 18. Gate charge test circuit** 

**Figure 19. Test circuit for inductive load Figure 20. Unclamped inductive load test circuit switching and diode recovery times** 

## **Figure 21. Unclamped inductive waveform** 

**Figure 22. Switching time waveform** 

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**Package information** 

## **4 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

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**Package information** 

## **4.1 TO-220FP, package information** 

**==> picture [176 x 11] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 23. TO-220FP package outline<br>**----- End of picture text -----**<br>


**==> picture [405 x 577] intentionally omitted <==**

**----- Start of picture text -----**<br>
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**Package information** 

**Table 9. TO-220FP mechanical data** 

||**Table 9. TO-220FP mechanical data**|**Table 9. TO-220FP mechanical data**|**Table 9. TO-220FP mechanical data**|
|---|---|---|---|
|**Dim.**|**mm**|||
||**Min.**|**Typ.**|**Max.**|
|A|4.4||4.6|
|B|2.5||2.7|
|D|2.5||2.75|
|E|0.45||0.7|
|F|0.75||1|
|F1|1.15||1.70|
|F2|1.15||1.70|
|G|4.95||5.2|
|G1|2.4||2.7|
|H|10||10.4|
|L2||16||
|L3|28.6||30.6|
|L4|9.8||10.6|
|L5|2.9||3.6|
|L6|15.9||16.4|
|L7|9||9.3|
|Ø|3||3.2|



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**Package information** 

## **4.2 TO-3PF, package outline** 

**==> picture [167 x 11] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 24. TO-3PF package outline<br>**----- End of picture text -----**<br>


**==> picture [405 x 377] intentionally omitted <==**

**----- Start of picture text -----**<br>
���������<br>**----- End of picture text -----**<br>


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**Package information** 

**Table 10. TO-3PF mechanical data** 

||**Table 10. TO-3PF mechanical data**|**Table 10. TO-3PF mechanical data**|**Table 10. TO-3PF mechanical data**|
|---|---|---|---|
|**Dim.**|**mm**|||
||**Min.**|**Typ.**|**Max.**|
|A|5.30||5.70|
|C|2.80||3.20|
|D|3.10||3.50|
|D1|1.80||2.20|
|E|0.80||1.10|
|F|0.65||0.95|
|F2|1.80||2.20|
|G|10.30||11.50|
|G1||5.45||
|H|15.30||15.70|
|L|9.80|10|10.20|
|L2|22.80||23.20|
|L3|26.30||26.70|
|L4|43.20||44.40|
|L5|4.30||4.70|
|L6|24.30||24.70|
|L7|14.60||15|
|N|1.80||2.20|
|R|3.80||4.20|
|∅|3.40||3.80|



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**Revision history** 

## **5 Revision history** 

## **Table 11. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|22-May-2014|1|First release. Part number (STFW12N120K5) previously<br>included in datasheet DocID022133|
|11-May-2015|2|Updated title, features and description.<br>Updated_Table 4.: On/off states_and_Table 5.: Dynamic_.<br>Updated_Figure 9.: Static drain-source on-resistance_and_Figure_<br>_10.: Capacitance variations_<br>Minor text changes.|



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## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2015 STMicroelectronics – All rights reserved 

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