# Power MOSFET, N Channel, 800 V, 8 A, 0.55 ohm, TO-220FP, Through Hole

![Product image](https://novapart.co/image/farnell:2668695/)

**URL**: https://novapart.co/products/STF10LN80K5/power-mosfet-n-channel-800-v-8-a-055-ohm-to-220fp
**SKU**: STF10LN80K5
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.0400
**Stock**: 10+

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:8A; Drain Source Voltage Vds:800V; On Resistance Rds(on):0.55ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V; Pow

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | MDmesh K5 |
| Qualification | - |
| Power Dissipation | 25W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220FP |
| Drain Source Voltage Vds | 800V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 8A |
| Drain Source On State Resistance | 0.55ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2668695/)

## **STF10LN80K5** 

## N-channel 800 V, 0.55 Ω typ., 8 A MDmesh™ K5 Power MOSFET in a TO-220FP package 

Datasheet - production data 

## **Features** 

|**Order code**|**VDS**|**RDS(on) max.**|**ID**|
|---|---|---|---|
|STF10LN80K5|800 V|0.63 Ω|8 A|



- Industry’s lowest RDS(on) x area 

- Industry’s best figure of merit (FoM) 

- Ultra-low gate charge 

- 100% avalanche tested 

- Zener-protected 

**==> picture [42 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
TO-220FP<br>**----- End of picture text -----**<br>


**Figure 1: Internal schematic diagram** 

## **Applications** 

- Switching applications 

D(2) **Description** This very high voltage N-channel Power MOSFET is designed using MDmesh™ K5 technology based on an innovative proprietary vertical structure. The result is a dramatic G(1) reduction in on-resistance and ultra-low gate charge for applications requiring superior power density and high efficiency. S(3) AM15572v1_no_tab 

**Table 1: Device summary** 

|**Order code**|**Marking**|**Package**|**Packing**|
|---|---|---|---|
|STF10LN80K5|10LN80K5|TO-220FP|Tube|



This is information on a product in full production. 

_www.st.com_ 

December 2015 

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|**Contents**<br>**STF10LN80K5**|**Contents**<br>**STF10LN80K5**|
|---|---|
|**Contents**||
|**1**|**Electrical ratings ............................................................................. 3**|
|**2**|**Electrical characteristics ................................................................ 4**|
||2.1<br>Electrical characteristics (curves) ...................................................... 6|
|**3**|**Test circuits ..................................................................................... 9**|
|**4**|**Package information ..................................................................... 10**|
||4.1<br>TO-220FP package information ...................................................... 11|
|**5**|**Revision history ............................................................................ 13**|



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**Electrical ratings** 

## **1 Electrical ratings** 

**Table 2: Absolute maximum ratings** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VGS|Gate-source voltage|± 30|V|
|ID<br>_(1)_|Drain current (continuous) at TC= 25 °C|8|A|
|ID<br>_(1)_|Drain current (continuous) at TC= 100 °C|5|A|
|ID<br>_(2)_|Drain currentpulsed|32|A|
|PTOT|Total dissipation at TC= 25 °C|25|W|
|VISO|Insulation withstand voltage (RMS) from all three leads to<br>external heat sink (t=1s; TC=25°C)|2500|V|
|dv/dt_(3)_|Peak diode recovery voltage slope|4.5|V/ns|
|dv/dt_(4)_|MOSFET dv/dt ruggedness|50||
|Tj|Operating junction temperature|- 55 to 150|°C|
|Tstg|Storage temperature|||



## **Notes:** 

(1) Limited by maximum junction temperature. 

(2) Pulse width limited by safe operating area 

(3) ISD≤ 8 A, di/dt≤100 A/μs; VDS peak ≤ V(BR)DSS 

(4) VDS ≤ 640 V 

**Table 3: Thermal data** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|Rthj-case|Thermal resistancejunction-case|5|°C/W|
|Rthj-amb|Thermal resistance junction-ambient|62.5|°C/W|



## **Table 4: Avalanche characteristics** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|IAR|Avalanche current, repetitive or not repetitive (pulse width<br>limited by Tjmax)|2.7|A|
|EAS|Single pulse avalanche energy (starting Tj= 25 °C, ID= IAR,<br>VDD= 50 V)|240|mJ|



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**Electrical characteristics** 

## **2 Electrical characteristics** 

TC = 25 °C unless otherwise specified 

**Table 5: On/off-state** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|V(BR)DSS|Drain-source breakdown voltage|VGS= 0 V, ID= 1 mA|800|||V|
|IDSS|Zero gate voltage drain current|VGS= 0 V, VDS= 800 V|||1|µA|
|||VGS= 0 V, VDS= 800 V<br>TC= 125 °C|||50|µA|
|IGSS|Gate bodyleakage current|VDS= 0 V, VGS= ±20 V|||±10|µA|
|VGS(th)|Gate threshold voltage|VDS= VGS, ID= 100µA|3|4|5|V|
|RDS(on)|Static drain-source on-resistance|VGS= 10 V, ID= 4 A||0.55|0.63|Ω|



**Table 6: Dynamic** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Ciss|Input capacitance|VDS= 100 V, f = 1 MHz,<br>VGS= 0 V|-|427|-|pF|
|Coss|Output capacitance||-|43|-|pF|
|Crss|Reverse transfer capacitance||-|0.25|-|pF|
|Co(tr)<br>_(1)_|Equivalent capacitance time<br>related|VDS= 0 to 640 V,<br>VGS= 0 V|-|72|-|pF|
|Co(er)<br>_(2)_|Equivalent capacitance energy<br>related|||27|-|pF|
|Rg|Intrinsicgate resistance|f = 1 MHz , ID= 0 A|-|7|-|Ω|
|Qg|Total gate charge|VDD= 640 V, ID= 8 A<br>VGS= 10 V<br>See_Figure 16: "Test_<br>_circuit for gate charge_<br>_behavior"_|-|15|-|nC|
|Qgs|Gate-source charge||-|4.2|-|nC|
|Qgd|Gate-drain charge||-|9|-|nC|



## **Notes:** 

(1) Time related is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS 

(2)Energy related is defined as a constant equivalent capacitance giving the same stored energy as Coss when VDS increases from 0 to 80% VDSS 

**Table 7: Switching times** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|td(on)|Turn-on delaytime|VDD= 400 V, ID= 4 A, RG= 4.7 Ω<br>VGS= 10 V See_Figure 15: "Test_<br>_circuit for resistive load switching_<br>_times"_and_Figure 20: "Switching_<br>_time waveform"_|-|11.8|-|ns|
|tr|Rise time||-|10|-|ns|
|td(off)|Turn-off delaytime||-|28|-|ns|
|tf|Fall time||-|13|-|ns|



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**Electrical characteristics** 

||**Table 8: Source-drain diode**|**Table 8: Source-drain diode**|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|ISD|Source-drain current||-||8|A|
|ISDM<br>_(1)_|Source-drain current<br>(pulsed)||-||32|A|
|VSD<br>_(2)_|Forward on voltage|ISD= 8 A, VGS= 0 V|-||1.5|V|
|trr|Reverse recoverytime|ISD= 8 A, di/dt = 100 A/µs,<br>VDD= 60 V, see_Figure 17:_<br>_"Test circuit for inductive load_<br>_switching and diode recovery_<br>_times"_)|-|350||ns|
|Qrr|Reverse recoverycharge||-|3.9||µC|
|IRRM|Reverse recovery current||-|22.5||A|
|trr|Reverse recoverytime|ISD= 8 A, di/dt = 100 A/µs,<br>VDD= 60 V, Tj= 150 °C<br>see_Figure 17: "Test circuit_<br>_for inductive load switching_<br>_and diode recovery times"_|-|505||ns|
|Qrr|Reverse recoverycharge||-|5||µC|
|IRRM|Reverse recovery current||-|20||A|



## **Notes:** 

- (1) Pulse width limited by safe operating area 

- (2) Pulsed: pulse duration = 300 µs, duty cycle 1.5% 

**Table 9: Gate-source Zener diode** 

|**Symbol**|**Parameter**|**Test conditions**|**Min**|**Typ.**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|V(BR)GSO|Gate-source breakdown voltage|IGS= ± 1mA, ID= 0A|30|-|-|V|



The built-in back-to-back Zener diodes are specifically designed to enhance the ESD performance of the device. The Zener voltage facilitates efficient and cost-effective device integrity protection,thus eliminating the need for additional external componentry. 

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**Electrical characteristics** 

## **2.2 Electrical characteristics (curves)** 

**==> picture [386 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 2: Safe operating area  Figure 3: Thermal impedance<br>GC20940_ZTH<br>K<br>δ=0.5<br>δ=0.2 0.1<br>0.05<br>10 [-1] 0.02<br>0.01<br>Single pulse<br>10 [-2]<br>10-3<br>10 [-4] 10 [-3] 10 -2 10 -1 10 0 tp(s)<br>**----- End of picture text -----**<br>


**==> picture [386 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 4: Output characteristics  Figure 5: Transfer characteristics<br>**----- End of picture text -----**<br>


**==> picture [409 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 6: Gate charge vs gate-source voltage  Figure 7: Static drain-source on-resistance<br>**----- End of picture text -----**<br>


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**Electrical characteristics** 

**Figure 8: Capacitance variations** 

**==> picture [159 x 144] intentionally omitted <==**

**==> picture [191 x 20] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 9: Normalized gate threshold voltage<br>vs temperature<br>**----- End of picture text -----**<br>


**==> picture [166 x 143] intentionally omitted <==**

**==> picture [416 x 377] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 10: Normalized on-resistance vs  Figure 11: Normalized V(BR)DSS vs temperature<br>temperature<br>Figure 12: Output capacitance stored energy  Figure 13: Source-drain diode forward<br>characteristics<br>**----- End of picture text -----**<br>


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## **Electrical characteristics** 

**Figure 14: Maximum avalanche energy vs starting TJ** 

**==> picture [157 x 142] intentionally omitted <==**

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**Test circuits** 

## **3 Test circuits** 

**==> picture [416 x 377] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 15: Test circuit for resistive load  Figure 16: Test circuit for gate charge<br>switching times  behavior<br>Figure 17: Test circuit for inductive load  Figure 18: Unclamped inductive load test<br>switching and diode recovery times  circuit<br>**----- End of picture text -----**<br>


**==> picture [403 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 19: Unclamped inductive waveform Figure 20: Switching time waveform<br>**----- End of picture text -----**<br>


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**Package information** 

## **4 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _**www.st.com**_ . ECOPACK[®] is an ST trademark. 

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**Package information** 

## **4.1 TO-220FP package information** 

**Figure 21: TO-220FP package outline** 

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**STF10LN80K5** 

**Package information** 

**Table 10: TO-220FP package mechanical data** 

|**Dim.**||**mm**||
|---|---|---|---|
||**Min.**|**Typ.**|**Max.**|
|A|4.4||4.6|
|B|2.5||2.7|
|D|2.5||2.75|
|E|0.45||0.7|
|F|0.75||1|
|F1|1.15||1.70|
|F2|1.15||1.70|
|G|4.95||5.2|
|G1|2.4||2.7|
|H|10||10.4|
|L2||16||
|L3|28.6||30.6|
|L4|9.8||10.6|
|L5|2.9||3.6|
|L6|15.9||16.4|
|L7|9||9.3|
|Dia|3||3.2|



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**Revision history** 

## **5 Revision history** 

**Table 11: Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|26-May-2015|1|First release.|
|21-Oct-2015|2|Modified: RDS(on)value in cover page.<br>Modified: Table 2: "Absolute maximum ratings", Table 4: "Avalanche<br>characteristics", Table 5: "On/off-state", Table 6: "Dynamic", Table 7:<br>"Switching times", Table 8: "Source-drain diode". Added: Section 3.1:<br>"Electrical characteristics (curves)".<br>Minor text changes.|
|01-Dec-2015|3|Modified:_Table 2: "Absolute maximum ratings"_, and_Table 3: "Thermal_<br>_data"_.|



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## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

- © 2015 STMicroelectronics – All rights reserved 

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- [Supplier page](https://es.farnell.com/stmicroelectronics/stf10ln80k5/mosfet-n-ch-800v-8a-to-220fp-3/dp/2668695)
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