# Bipolar (BJT) Single Transistor, NPN, 40 V, 600 mA, 1.5 W, SOT-223, Surface Mount

![Product image](https://novapart.co/image/farnell:3368670RL/)

**URL**: https://novapart.co/products/SPZT2222AT1G/bipolar-bjt-single-transistor-npn-40-v-600-ma-15-w
**SKU**: SPZT2222AT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.1660
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 4Pins |
| Product Range | PZT2222A |
| Qualification | AEC-Q101 |
| Power Dissipation | 1.5W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | NPN |
| Transition Frequency | 300MHz |
| Transistor Case Style | SOT-223 |
| Dc Current Gain Hfe Min | 40hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 600mA |
| Collector Emitter Voltage Max | 40V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3368670RL/)

## PZT2222A 

## NPN Silicon Planar Epitaxial Transistor 

This NPN Silicon Epitaxial transistor is designed for use in linear and switching applications. The device is housed in the SOT−223 package which is designed for medium power surface mount applications. 

## **www.onsemi.com** 

## **SOT−223 PACKAGE NPN SILICON TRANSISTOR SURFACE MOUNT** 

## **Features** 

- PNP Complement is PZT2907AT1 

- The SOT−223 Package Can be Soldered Using Wave or Reflow 

- SOT−223 Package Ensures Level Mounting, Resulting in Improved Thermal Conduction, and Allows Visual Inspection of Soldered Joints 

**==> picture [72 x 58] intentionally omitted <==**

**----- Start of picture text -----**<br>
4<br>1<br>2<br>3<br>SOT−223 (TO−261)<br>CASE 318E−04<br>STYLE 1<br>**----- End of picture text -----**<br>


- The Formed Leads Absorb Thermal Stress During Soldering, Eliminating the Possibility of Damage to the Die 

- Available in 12 mm Tape and Reel 

- S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

**==> picture [74 x 81] intentionally omitted <==**

**----- Start of picture text -----**<br>
COLLECTOR<br>2, 4<br>BASE<br>1<br>{ )<br>3<br>EMITTER<br>**----- End of picture text -----**<br>


|• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS<br>Compliant*<br>BASE<br>1<br>~~{~~)|• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS<br>Compliant*<br>BASE<br>1<br>~~{~~)|
|---|---|
||3|
|**MAXIMUM RATINGS**|EMITTER|
|**Rating**<br>**Symbol**<br>**Value**<br>**Unit**<br>Collector−Emitter Voltage<br>VCEO<br>40<br>Vdc<br>Collector−Base Voltage<br>VCBO<br>75<br>Vdc<br>Emitter−Base Voltage<br>(Open Collector)<br>VEBO<br>6.0<br>Vdc<br>Collector Current<br>IC<br>600<br>mAdc<br>Total Power Dissipation<br>up to TA= 25°C (Note 1)<br>PD<br>1.5<br>W<br>Storage Temperature Range<br>Tstg<br>−65 to +150<br>°C<br>Junction Temperature°Range<br>TJ<br>−55 to +150<br>°C<br>**MARKING DIAGRAM**<br>A<br>=  Assembly Location<br>Y<br>=  Year<br>M<br>= Month Code<br>= Pb−Free Package<br>AYM<br>P1F<br>(Note: Microdot may be in either location)<br>~~a~~||
|Stresses exceeding those listed in the Maximum Ratings table may damage the||
|device. If any of these limits are exceeded, device functionality should not be|**ORDERING INFORMATION**|
|assumed, damage may occur and reliability may be affected.<br>1. Device mounted on an epoxy printed circuit board 1.575 inches  x 1.575 inches  x<br>0.059 inches; mounting pad for the collector lead min. 0.93 inches2.<br>**THERMAL CHARACTERISTICS**<br>**Rating**<br>**Symbol**<br>**Value**<br>**Unit**<br>Thermal Resistance,<br>Junction−to−Ambient<br>R JA<br>83.3<br>°C/W<br>Lead Temperature for Soldering,<br>0.0625″from case<br>Time in Solder Bath<br>TL<br>260<br>10<br>°C<br>Sec<br>**Device**<br>**Package**<br>**Shipping**†<br>PZT2222AT1G<br>SOT−223<br>(Pb−Free)<br>1,000 Tape & Reel<br>†For information on tape and reel specifications,<br>including part orientation and tape sizes, please<br>refer to our Tape and Reel Packaging Specifications<br>Brochure, BRD8011/D.<br>PZT2222AT3G<br>SOT−223<br>(Pb−Free)<br>4,000 Tape & Reel<br>SPZT2222AT1G<br>SOT−223<br>(Pb−Free)<br>1,000 Tape & Reel<br>~~===~~||
|*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting||
|Techniques Reference Manual, SOLDERRM/D.||



Publication Order Number: **PZT2222AT1/D** 

**1** 

© Semiconductor Components Industries, LLC, 2013 **December, 2018 − Rev. 11** 

## **PZT2222A** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)|||||
|---|---|---|---|---|---|
|**Characteristic**||**Symbol**|**Min**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||
|Collector−Emitter Breakdown Voltage (IC= 10 mAdc, IB= 0)||V(BR)CEO|40|−|Vdc|
|Collector−Base Breakdown Voltage (IC= 10�Adc, IE= 0)||V(BR)CBO|°75°|−|Vdc|
|Emitter−Base Breakdown Voltage (IE= 10�Adc, IC= 0)||V(BR)EBO|6.0|−|Vdc|
|Base−Emitter Cutoff Current (VCE= 60 Vdc, VBE= −3.0 Vdc)||IBEX|−|20|nAdc|
|Collector−Emitter Cutoff Current (VCE= 60 Vdc, VBE= −3.0 Vdc)||ICEX|−|10|nAdc|
|Emitter−Base Cutoff Current (VEB= 3.0 Vdc, IC= 0)||IEBO|−|100|nAdc|
|Collector−Base Cutoff Current<br>(VCB= 60 Vdc, IE= 0)<br>(VCB= 60 Vdc, IE= 0, TA= 125°C)||ICBO|−<br>−|10<br>10|nAdc<br>�Adc|
|**ON CHARACTERISTICS**||||||
|DC Current Gain<br>(IC= 0.1 mAdc, VCE= 10 Vdc)<br>(IC= 1.0 mAdc, VCE= 10 Vdc)<br>(IC= 10 mAdc, VCE= 10 Vdc)<br>(IC= 10 mAdc, VCE= 10 Vdc, TA= −55°C)<br>(IC= 150 mAdc, VCE= 10 Vdc)<br>(IC= 150 mAdc, VCE= 1.0 Vdc)<br>(IC= 500 mAdc, VCE= 10 Vdc)||hFE|35<br>50<br>70<br>35<br>100<br>50<br>40|−<br>−<br>−<br>−<br>300<br>−<br>−|−|
|Collector−Emitter Saturation Voltages<br>(IC= 150 mAdc, IB= 15 mAdc)<br>(IC= 500 mAdc, IB= 50 mAdc)||VCE(sat)|−<br>−|0.3<br>1.0|Vdc|
|Base−Emitter Saturation Voltages<br>(IC= 150 mAdc, IB= 15 mAdc)<br>(IC= 500 mAdc, IB= 50 mAdc)||VBE(sat)|0.6<br>−|1.2<br>2.0|Vdc|
|Input Impedance°<br>(VCE= 10 Vdc, IC= 1.0 mAdc, f = 1.0 kHz)<br>(VCE= 10 Vdc, IC= 10 mAdc, f = 1.0 kHz)||°hie°|2.0<br>0.25|8.0<br>1.25|k�|
|Voltage Feedback Ratio<br>(VCE= 10 Vdc, IC= 1.0 mAdc, f = 1.0 kHz)<br>(VCE= 10 Vdc, IC= 10 mAdc, f = 1.0 kHz)||hre|−<br>−|8.0x10−4<br>4.0x10−4|−|
|Small−Signal Current Gain<br>(VCE= 10 Vdc, IC= 1.0 mAdc, f = 1.0 kHz)<br>(VCE= 10 Vdc, IC= 10 mAdc, f = 1.0 kHz)||�hfe�|50<br>75|300<br>375|−|
|Output Admittance°<br>(VCE= 10 Vdc, IC= 1.0 mAdc, f = 1.0 kHz)<br>(VCE= 10 Vdc, IC= 10 mAdc, f = 1.0 kHz)||°hoe°|5.0<br>25|35<br>200|�mhos|
|Noise Figure (VCE= 10 Vdc, IC= 100�Adc, f = 1.0 kHz)||F|−|4.0|dB|
|**DYNAMIC CHARACTERISTICS**||||||
|Current−Gain − Bandwidth Product<br>(IC= 20 mAdc, VCE= 20 Vdc, f = 100 MHz)||fT|300|−|MHz|
|Output Capacitance (VCB= 10 Vdc, IE= 0, f = 1.0 MHz)||Cc|−|8.0|pF|
|Input Capacitance (VEB= 0.5 Vdc, IC= 0, f = 1.0 MHz)||Ce|−|25|pF|
|**SWITCHING TIMES **(TA= 25°C)||||||
|Delay Time|(VCC= 30 Vdc, IC= 150 mAdc,<br>IB(on)= 15 mAdc, VEB(off)= 0.5 Vdc)<br>Figure 1|td|−|10|ns|
|Rise Time||tr|−|25||
|Storage Time|(VCC= 30 Vdc, IC= 150 mAdc,<br>IB(on)= IB(off)= 15 mAdc)<br>Figure 2|ts|−|225|ns|
|Fall Time||tf|−|60||



**www.onsemi.com** 

**2** 

**PZT2222A** 

**==> picture [354 x 97] intentionally omitted <==**

**----- Start of picture text -----**<br>
VCC<br>Vi<br>90% R2<br>R1 Vo<br>0 10% Vi D.U.T.<br>tr tp<br>**----- End of picture text -----**<br>


**Figure 1. Input Waveform and Test Circuit for Determining Delay Time and Rise Time** 

**Vi = −0.5 V to +9.9 V, VCC = +30 V, R1 = 619 � , R2 = 200 � .** 

**==> picture [360 x 36] intentionally omitted <==**

**----- Start of picture text -----**<br>
PULSE GENERATOR: OSCILLOSCOPE:<br>PULSE DURATION tp 3 200 ns INPUT IMPEDANCE Zi > 100 k �<br>RISE TIME tr 3 2 ns INPUT CAPACITANCE Ci < 12 pF<br>DUTY FACTOR � = 0.02 RISE TIME tr < 5 ns<br>**----- End of picture text -----**<br>


**==> picture [491 x 400] intentionally omitted <==**

**----- Start of picture text -----**<br>
Vi VCC<br>+16.2 V<br>R2<br>D.U.T.<br>R1<br>0 Vi R3<br>TIME<br>Vo<br>OSCILLOSCOPE<br>D1<br>R4<br>-�13.8 V<br>tf 100 �s<br>VBB<br>Figure 2. Input Waveform and Test Circuit for Determining Storage Time and Fall Time<br>TYPICAL CHARACTERISTICS<br>1 1.2<br>IC/IB = 10 1.1 I C /I B  = 10<br>1.0<br>0.9 TA = −55 ° C<br>0.8<br>0.1 TA = 25 ° C 0.7 TA = 25 ° C<br>TA = −55 ° C 0.6<br>T A  = 150 ° C 0.5<br>0.4 T A  = 150 ° C<br>0.3<br>0.01 0.2<br>0.1 1 10 100 1000 0.1 1 10 100 1000<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>, BASE−EMITTER<br>, COLLECTOR−EMITTER BE(sat)<br>VCE SATURATION VOLTAGE (V) V SATURATION VOLTAGE (V)<br>**----- End of picture text -----**<br>


**Figure 3. Collector Emitter Saturation Voltage vs. Collector Current** 

**Figure 4. Base Emitter Saturation Voltage vs. Collector Current** 

**www.onsemi.com** 

**3** 

**PZT2222A** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [491 x 591] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000 2.0<br>VCE = 6 V 1.8 TA = 25 ° C<br>TA = 150 ° C 1.6<br>T A = 25 ° C 1.4<br>1.2<br>100 TA = −55 ° C 1.0<br>0.8<br>0.6<br>0.4<br>0.2<br>10 0<br>0.1 1 10 100 1000 0.001 0.01 0.1 1 10 100<br>IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (mA)<br>Figure 5. DC Current Gain vs. Collector Figure 6. Saturation Region<br>Current<br>1.1 100<br>VCE = 2 V<br>1.0<br>0.9 T A  = −55 ° C<br>C ibo<br>0.8<br>0.7 TA = 25 ° C 10 Cobo<br>0.6<br>0.5<br>0.4<br>TA = 150 ° C<br>0.3<br>0.2 1<br>0.1 1 10 100 1000 0.1 1 10 100<br>IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (V)<br>Figure 7. Base−Emitter Turn−On Voltage vs. Figure 8. Capacitance<br>Collector Current<br>1000<br>1 s 0.0001<br>0.1<br>0.01<br>100<br>0.001<br>10<br>Single Pulse Test at T A  = 25 ° C<br>1<br>1 10 100<br>VCE, COLLECTOR EMITTER VOLTAGE (V)<br> mA<br> = 1 mAIC 10 mA 001 300 mA 600 mA<br>, DC CURRENT GAIN , COLLECTOR−EMITTER<br>FE<br>h<br>SATURATION VOLTAGE (V)<br>CE(sat)<br>V<br>C, CAPACITANCE (pF)<br>, BASE−EMITTER ON VOLTAGE (V)<br>BE(ON)<br>V<br>, COLLECTOR CURRENT (mA)<br>IC<br>**----- End of picture text -----**<br>


**Figure 9. Safe Operating Area** 

**www.onsemi.com** 

**4** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**SOT−223 (TO−261)** CASE 318E−04 ISSUE R 

**SCALE 1:1** 

## DATE 02 OCT 2018 

**DOCUMENT NUMBER: 98ASB42680B** 

**DESCRIPTION: SOT−223 (TO−261)** 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

**PAGE 1 OF 2** 

ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2018 

DATE 02 OCT 2018 

## **SOT−223 (TO−261)** CASE 318E−04 ISSUE R 

STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5: PIN 1. BASE PIN 1. ANODE PIN 1. GATE PIN 1. SOURCE PIN 1. DRAIN 2. COLLECTOR 2. CATHODE 2. DRAIN 2. DRAIN 2. GATE 3. EMITTER 3. NC 3. SOURCE 3. GATE 3. SOURCE 4. COLLECTOR 4. CATHODE 4. DRAIN 4. DRAIN 4. GATE STYLE 6: STYLE 7: STYLE 8: STYLE 9: STYLE 10: PIN 1. RETURN PIN 1. ANODE 1 CANCELLED PIN 1. INPUT PIN 1. CATHODE 2. INPUT 2. CATHODE 2. GROUND 2. ANODE 3. OUTPUT 3. ANODE 2 3. LOGIC 3. GATE 4. INPUT 4. CATHODE 4. GROUND 4. ANODE STYLE 11: STYLE 12: STYLE 13: PIN 1. MT 1 PIN 1. INPUT PIN 1. GATE 2. MT 2 2. OUTPUT 2. COLLECTOR 3. GATE 3. NC 3. EMITTER 4. MT 2 4. OUTPUT 4. COLLECTOR **GENERIC MARKING DIAGRAM*** AYW XXXXX 1 ~~|~~ A = Assembly Location Y = Year W = Work Week XXXXX = Specific Device Code = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present. Some products may not follow the Generic Marking. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98ASB42680B** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: SOT−223 (TO−261) PAGE 2 OF 2** ~~—ee~~ ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2018 

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