# Power MOSFET, N Channel, 650 V, 34.6 A, 0.1 ohm, TO-247, Through Hole

![Product image](https://novapart.co/image/farnell:1471817/)

**URL**: https://novapart.co/products/SPW35N60C3FKSA1/power-mosfet-n-channel-650-v-346-a-01-ohm-to-247
**SKU**: SPW35N60C3FKSA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €4.1700
**Stock**: 25+
**Lead Time**: 64 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:34.6A; Drain Source Voltage Vds:650V; On Resistance Rds(on):0.081ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3V; Power Diss

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 313W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-247 |
| Drain Source Voltage Vds | 650V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 34.6A |
| Drain Source On State Resistance | 0.1ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1471817/)

**SPW35N60C3** 

## **CoolMOS[TM] Power Transistor** 

## **Features** 

- New revolutionary high voltage technology 

- Ultra low gate charge 

## **Product Summary** 

|_V_DS@_T_j,max||650|||V|
|---|---|---|---|---|---|
|||||||
|_R_DS(on),max||0.1|||Ω|
|||||||
|_I_D||34.6|||A|



- Periodic avalanche rated 

- Extreme d _v_ /d _t_ rated 

- Ultra low effective capacitances 

- Improved transconductance 

**==> picture [49 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
PG-TO247<br>**----- End of picture text -----**<br>


|||||
|---|---|---|---|
|**Type**|**Package**|**Ordering Code**|**Marking**|
|||||
|SPW35N60C3|PG-TO247|Q67040-S4673|35N60C3|



## **Maximum ratings,** at _T_ j=25 °C, unless otherwise specified 

|**Maximum ratings,**at_T_j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|||
|---|---|---|---|---|
|**Parameter**|**Symbol **|**Conditions**|**Unit**<br>**Value**|**Unit**|
|Continuous drain current|_I_D|_T_C=25 °C|A<br>34.6<br>21.9<br>103.8|A|
|||_T_C=100 °C|||
|Pulsed drain current1)|_I_D,pulse|_T_C=25 °C|||
|Avalanche energy, single pulse|_E_AS|_I_D=17.3 A,_V_DD=50 V|1500<br>mJ<br>1.5|mJ|
|Avalanche energy, repetitive_t_AR<br>1),2)|_E_AR|_I_D=34.6 A,_V_DD=50 V|||
|Avalanche current, repetitive_t_AR<br>1)|_I_AR||A<br>34.6|A|
|Drain source voltage slope|d_v_/d_t_|_I_D=34.6 A,<br>_V_DS=480 V,_T_j=125 °C|V/ns<br>50|V/ns|
|Gate source voltage|_V_GS|static|V<br>±20<br>±30|V|
||_V_GS|AC (_f_>1 Hz)|||
|Power dissipation|_P_tot|_T_C=25 °C|W<br>313|W|
|Operating and storage temperature|_T_j,_T_stg||°C<br>-55 ... 150|°C|
|Reverse diode dv/dt                              dv/dt                                                                 15                      V/ns<br>6)|Reverse diode dv/dt                              dv/dt                                                                 15                      V/ns|Reverse diode dv/dt                              dv/dt                                                                 15                      V/ns|Reverse diode dv/dt                              dv/dt                                                                 15                      V/ns|Reverse diode dv/dt                              dv/dt                                                                 15                      V/ns|



Rev. 2. 5 Page 1 2008-02-11 

Please note the new package dimensions arccording to PCN 2009-134-A 

||~~Gafineon~~|||
|---|---|---|---|
||~~Gafineon~~|**SPW35N60C3**||
|**Parameter**<br>**Thermal characteristics**<br>~~es~~||**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~||
||Thermal resistance, junction - case|_R_thJC<br>-<br>-<br>0.4|K/W|
||Thermal resistance, junction -<br>ambient|_R_thJA<br>leaded<br>-<br>-<br>62||
||Soldering temperature, wavesoldering_T_sold<br>1.6 mm (0.063 in.)<br>from case for 10 s<br>-<br>-<br>260||°C|
||**Electrical characteristics,**at_T_j=25 °C, unless otherwise specified|||
||**Static characteristics**|||
||Drain-source breakdown voltage<br>Avalanche breakdown voltage<br>Gate threshold voltage<br>Zero gate voltage drain current<br>Gate-source leakage current<br>Drain-source on-state resistance<br>Gate resistance<br>Transconductance|_V_(BR)DSS _V_GS=0 V,_I_D=250 µA<br>600<br>-<br>-<br>_V_(BR)DS<br>_V_GS=0 V,_I_D=34.6 A<br>-<br>700<br>-<br>_V_GS(th)<br>_V_DS=_V_GS,_I_D=1.9 mA<br>2.1<br>3<br>3.9<br>_I_DSS<br>_V_DS=600 V,_V_GS=0 V,<br>_T_j=25 °C<br>-<br>0.1<br>1<br>_V_DS=600 V,_V_GS=0 V,<br>_T_j=150 °C<br>-<br>-<br>100<br>_I_GSS<br>_V_GS=20 V,_V_DS=0 V<br>-<br>-<br>100<br>_R_DS(on)<br>_V_GS=10 V,_I_D=21.9 A,<br>_T_j=25 °C<br>-<br>0.081<br>0.1<br>_V_GS=10 V,_I_D=21.9 A,<br>_T_j=150 °C<br>-<br>0.2<br>-<br>_R_G<br>_f_=1 MHz, open drain<br>-<br>0.6<br>-<br>_g_fs<br>|_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=21.9 A<br>-<br>36<br>-<br>~~oo~~<br>~~pf~~<br>~~| tT~~<br>~~een~~<br>~~P|~~<br>~~|~~<br>~~ee~~<br>~~ee ee ee~~<br>~~cane~~<br>~~| |~~<br>~~|~~<br>~~ee~~<br>~~ee ee ee~~<br>~~pt~~<br>~~|~~<br>~~tT~~|V<br>µA<br>nA<br>Ω<br>S|



Rev. 2. 5 Page 2 

2008-02-11 

Please note the new package dimensions arccording to PCN 2009-134-A 

**SPW35N60C3** 

|**Parameter**||**Symbol **|**Conditions**|**Values**|**Unit**|
|---|---|---|---|---|---|
|||||**min.**<br>**typ.**<br>**max.**||
|**Dynamic characteristics**||||||
|Input capacitance<br>Output capacitance|_C_iss<br>_C_oss<br>~~||~~<br>~~S|~~||_V_GS=0 V,_V_DS=25 V,<br>_f_=1 MHz|-<br>4500<br>-<br>-<br>1500<br>-<br>~~Ff]~~<br>~~Ff |~~|pF|
|Reverse transfer capacitance||_C_rss||-<br>100<br>-||
|Effective output capacitance, energy<br>related3)<br>Effective output capacitance, time<br>related4)<br>Turn-on delay time<br>Rise time<br>Turn-off delay time<br>Fall time|_C_o(er)<br>_C_o(tr)<br>_t_d(on)<br>_t_r<br>_t_d(off)<br>_t_f<br>~~S|~~<br>~~S|~~<br>~~S|~~<br>~~S|~~||_V_DD=480 V,<br>_V_GS=10 V,_I_D=34.6 A,<br>_R_G=3.3Ω<br>_V_GS=0 V,_V_DS=0 V<br>to 480 V<br>~~_~~|-<br>180<br>-<br>-<br>324<br>-<br>-<br>10<br>-<br>-<br>5<br>-<br>-<br>70<br>-<br>-<br>10<br>-<br>~~Ff |~~<br>~~Ff |~~<br>~~Ff |~~<br>~~Ff~~|ns|
|Gate Charge Characteristics||||||
|Gate to source charge||_Q_gs||-<br>18<br>-|nC|
|Gate to drain charge||_Q_gd|_V_DD=480 V,<br>_I_D=34.6 A,|-<br>70<br>-||
|Gate charge total||_Q_g|_V_GS=0 to 10 V|-<br>150<br>200||
|Gate plateau voltage||_V_plateau||-<br>5.3<br>-|V|



> 1) Pulse width limited by maximum temperature _T_ j,max only 

> 2) Repetitive avalanche causes additional power losses that can be calculated as _P_ AV= _E_ AR* _f._ 

3) _C_ o(er) is a fixed capacitance that gives the same stored energy as _C_ oss while _V_ DS is rising from 0 to 80% _V_ DSS. 

4) _C_ o(tr) is a fixed capacitance that gives the same charging time as _C_ oss while _V_ DS is rising from 0 to 80% _V_ DSS. 

6 )  ISD<=ID, di/dt<=200A/us, VDClink=400V, Vpeak<VBR, DSS, Tj<Tj,max. 

Identical low-side and high-side switch. 

Rev. 2. 5 Page 3 

2008-02-11 

Please note the new package dimensions arccording to PCN 2009-134-A 

|**Reverse Diode**|||||||
|---|---|---|---|---|---|---|
|Diode continuous forward current|_I_S|_T_C=25 °C|-|-|34.6|A|
|Diode pulse current|_I_S,pulse||-|-|103.8||
|Diode forward voltage|_V_SD|_V_GS=0 V,_I_F=34.6 A,<br>_T_j=25 °C|-|0.95|1.2|V|
|Reverse recovery time|_t_rr|_V_R=480 V,_I_F=_I_S,<br>d_i_F/d_t_=100 A/µs|-|600|-|ns|
|Reverse recovery charge|_Q_rr||-|21|-|µC|
|Peak reverse recovery current|_I_rrm||-|90|-|A|



## **Typical Transient Thermal Characteristics** 

|||**Unit**<br>K/W|**Symbol**|||
|---|---|---|---|---|---|
|**Symbol**|**Value**|||**Value**|**Unit**|
|||||||
||**typ.**|||**typ.**||
||||_C_th1|||
|_R_th1|0.00441|||0.00037|Ws/K|
||||_C_th2|||
|_R_th2|0.00608|||0.00223||
||||_C_th3|||
|_R_th3|0.0341|||0.00315||
||||_C_th4|||
|_R_th4|0.0602|||0.0179||
||||_C_th5|||
|_R_th5|0.0884|||0.098||
||||_C_th6|||
|||||4.45)||



5) _C_ th6 models the additional heat capacitance of the package in case of non-ideal cooling. It is not needed if _R_ thCA=0 K/W. 

Rev. 2. 5 Page 4 

2008-02-11 

Please note the new package dimensions arccording to PCN 2009-134-A 

**SPW35N60C3** 

## **2 Safe operating area** 

## **1 Power dissipation** 

**==> picture [469 x 652] intentionally omitted <==**

**----- Start of picture text -----**<br>
P  tot=f( T  C) I  D=f( V  DS);  T  C=25 °C;  D  =0<br>parameter:  t  p<br>400 10 [3]<br>limited by on-state<br>resistance<br>1 µs<br>300 10 [2]<br>10 µs<br>100 µs<br>200 10 [1]<br>DC 1 ms<br>10 ms<br>100 10 [0]<br>0 NaS 10 [-1]<br>0 40 80 120 160 10 [0] 10 [1] 10 [2] 10 [3]<br>T  C [°C] V  DS [V]<br>3 Max. transient thermal impedance 4 Typ. output characteristics<br>I  D=f( V  DS);  T  j=25 °C I  D=f( V  DS);  T  j=25 °C<br>parameter:  D=t  p// T parameter:  V  GS<br>10 [0] 100<br>7 V<br>20 V 6.5 V<br>0.5 80<br>6 V<br>10 [-1]<br>0.2<br>60<br>0.1<br>5.5 V<br>0.05<br>40<br>10 [-2] 0.02<br>5 V<br>0.01<br>single pulse<br>20<br>4.5 V<br>4 V<br>10 [-3] 0<br>10 [-6] 10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] 10 [0] 0 5 10 15 20<br>t  p [s] V  DS [V]<br> [W]<br> [A]<br>P  tot I  D<br> [K/W]  [A]<br>I  D<br> thJC<br>Z<br>**----- End of picture text -----**<br>


parameter: _D=t_ p// _T_ 

Rev. 2.5 Page 5 

2008-02-11 

Please note the new package dimensions arccording to PCN 2009-134-A 

**SPW35N60C3** 

## **5 Typ. output characteristics** 

_I_ D=f( _V_ DS); _T_ j=150 °C 

parameter: _V_ GS 

## **6 Typ. drain-source on-state resistance** 

_R_ DS(on)=f( _I_ D); _T_ j=150 °C parameter: _V_ GS 

**==> picture [223 x 264] intentionally omitted <==**

**----- Start of picture text -----**<br>
60<br>20 V<br>6 V<br>7 V 5.5 V<br>50<br>6.5 V<br>40<br>5 V<br>30<br>20 4.5 V<br>10<br>4 V<br>0<br>0 5 10 15 20<br>V  DS [V]<br> [A]<br>I  D<br>**----- End of picture text -----**<br>


**==> picture [222 x 264] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.8<br>0.7<br>0.6 4 V 4.5 V 5 V 5.5 V<br>0.5<br>0.4<br>6 V<br>0.3<br>0.2 20 V<br>0.1<br>0<br>0 10 20 30 40 50 60<br>I  D [A]<br>]<br>Ω<br> [<br> DS(on)<br>R<br>**----- End of picture text -----**<br>


## **7 Drain-source on-state resistance** 

_R_ DS(on)=f( _T_ j); _I_ D=21.9 A; _V_ GS=10 V 

## **8 Typ. transfer characteristics** 

_I_ D=f( _V_ GS); | _V_ DS|>2| _I_ D| _R_ DS(on)max parameter: _T_ j 

**==> picture [462 x 265] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.3 100<br>25 °C<br>0.25<br>80<br>ee<br>0.2<br>60<br>150 °C<br>0.15<br>98 % 40<br>0.1<br>typ<br>20<br>0.05<br>0 0<br>-60 -20 20 60 100 140 180 0 2 4 6 8 10<br>T  j [°C] V  GS [V]<br>]<br>[ Ω  [A]<br>I  D<br> DS(on)<br>R<br>**----- End of picture text -----**<br>


Rev. 2. 5 Page 6 

2008-02-11 

Please note the new package dimensions arccording to PCN 2009-134-A 

**SPW35N60C3** 

## **9 Typ. gate charge** 

_V_ GS=f( _Q_ gate); _I_ D=34.6 A pulsed 

parameter: _V_ DD 

## **10 Forward characteristics of reverse diode** 

_I_ F=f( _V_ SD) 

parameter: _T_ j 

**==> picture [471 x 609] intentionally omitted <==**

**----- Start of picture text -----**<br>
12 10 [3]<br>10<br>25 °C 25 °C, 98%<br>10 [2] 150  ° C, 98%<br>8 120 V<br>480 V<br>150 °C<br>6 10 [1]<br>4<br>10 [0]<br>2<br>0 ff 10 [-1]<br>0 50 100 150 200 0 0.5 1 1.5 2 2.5<br>Q  gate [nC] V  SD [V]<br>11 Avalanche SOA 12 Avalanche energy<br>I  AR=f( t  AR) E  AS=f( T  j);  I  D=17.3 A;  V  DD=50 V<br>parameter:  T  j(start)<br>40 1600<br>30 1200<br>20 800<br>125 °C 25 °C<br>10 it:inul 400 |<br>0 0<br>10 [-3] 10 [-2] 10 [-1] 10 [0] 10 [1] 10 [2] 10 [3] 20 60 100 140 180<br>t  AR [µs] T  j [°C]<br> [V]<br> [A]<br>V  GS I  F<br> [A]  [mJ]<br>I  AV E  AS<br>**----- End of picture text -----**<br>


Rev. 2. 5 Page 7 

Please note the new package dimensions arccording to PCN 2009-134-A 

2008-02-11 

**SPW35N60C3** 

## **13 Drain-source breakdown voltage** 

_V_ BR(DSS)=f( _T_ j); _I_ D=0.25 mA 

## **14 Typ. capacitances** 

_C_ =f( _V_ DS); _V_ GS=0 V; _f_ =1 MHz 

**==> picture [465 x 608] intentionally omitted <==**

**----- Start of picture text -----**<br>
700 10 [5]<br>660 10 [4]<br>Ciss<br>620 10 [3]<br>Coss<br>580 10 [2]<br>Crss<br>540 i 10 [1] i<br>-60 -20 20 60 100 140 180 0 100 200 300 400 500<br>T  j [°C] V  DS [V]<br>15 Typ.  C  oss stored energy stored energy<br> oss =  f (V  DS )<br>30<br>25<br>20<br>15<br>10<br>5<br>iL<br>0<br>0 100 200 300 400 500 600<br>V  DS [V]<br> [V]<br>  [pF]<br>C<br> BR(DSS)<br>V<br> [µJ]<br> oss<br>E<br>**----- End of picture text -----**<br>


## **15 Typ.** _**C**_ **oss stored energy stored energy** 

_E_ oss _=_ f _(V_ DS _)_ 

Rev. 2. 5 Page 8 

2008-02-11 

Please note the new package dimensions arccording to PCN 2009-134-A 

**SPW35N60C3** 

## **Definition of diode switching characteristics** 

Rev. 2. 5 Page 9 

2008-02-11 

Please note the new package dimensions arccording to PCN 2009-134-A 

**SPW35N60C3** 

**PG-TO-247-3-1** 

Rev. 2. 5 Page 10 

2008-02-11 

Please note the new package dimensions arccording to PCN 2009-134-A 

**SPW35N60C3** 

## Cinfineon 

**Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Rev. 2. 5 Page 11 

2008-02-11 

Please note the new package dimensions arccording to PCN 2009-134-A 

**Data sheet erratum PCN 2009-134-A** 

**New package outlines TO-247** 

## **1** New package outlines TO-247 

Assembly capacity extension for CoolMOSTM technology products assembled in lead-free package PG-TO247-3 at subcontractor ASE (Weihai) Inc., China (Changes are marked in blue.) 

**Figure 1 Outlines TO-247, dimensions in mm/inches** 

Final Data Sheet Erratum 

Rev. 2.0, 2010-02-01 



## Links

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