# Power MOSFET, N Channel, 600 V, 800 mA, 5.6 ohm, TO-251, Through Hole

![Product image](https://novapart.co/image/farnell:2781200/)

**URL**: https://novapart.co/products/SPU01N60C3BKMA1/power-mosfet-n-channel-600-v-800-ma-56-ohm-to-251
**SKU**: SPU01N60C3BKMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2730
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | CoolMOS C3 |
| Power Dissipation | 11W |
| Transistor Mounting | Through Hole |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 11W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 5.6ohm |
| Transistor Case Style | TO-251 |
| Drain Source Voltage Vds | 600V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 800mA |
| Drain Source On State Resistance | 5.6ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2781200/)

**SPU01N60C3 SPD01N60C3** 

## **Cool MOS™ Power Transistor** 

## **Feature** 

- New revolutionary high voltage technology 

**==> picture [144 x 53] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||||
|---|---|---|---|---|---|
|V|DS|@ T|jmax|650|V|
|R|6|Ω|
|DS(on)|
|I|D|0.8|A|

**----- End of picture text -----**<br>


- Ultra low gate charge 

- Periodic avalanche rated 

PG-TO252 PG-TO251 

- Extreme d _v_ /d _t_ rated 

- Ultra low effective capacitances 

- Improved transconductance 

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|||||
|---|---|---|---|
|Type|Package|Ordering Code|Marking|
|SPU01N60C3|PG-TO251|Q67040-S4193|01N60C3|
|SPD01N60C3|PG-TO252|Q67040-S4188|01N60C3|

**----- End of picture text -----**<br>


## **Maximum Ratings** 

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||||||||||
|---|---|---|---|---|---|---|---|---|
|Parameter|Symbol|Value|Unit|
|Continuous drain current|I|D|A|
|T|= 25 °C|0.8|
|C|
|T|= 100 °C|0.5|
|C|
|Pulsed drain current,|t|p limited by|T|jmax|I|D puls|1.6|
|Avalanche energy, single pulse|E|AS|20|mJ|
|I|D = 0.6 A,|V|DD = 50 V|
|Avalanche energy, repetitive|t|AR limited by|T|jmax|[1)]|E|AR|0.01|
|I|D = 0.8 A,|V|DD = 50 V|
|Avalanche current, repetitive|t|AR limited by|T|jmax|I|AR|0.8|A|
|Gate source voltage static|V|GS|±20|V|
|Gate source voltage AC (f >1Hz)|V|GS|±30|
|Power dissipation,|T|C = 25°C|P|tot|11|W|
|Operating and storage temperature|T|j ,|T|stg|-55... +150|°C|
|Reverse diode dv/dt                                                 dv/dt                         15                  V/ns3)|

**----- End of picture text -----**<br>


200 8 - 04 - 07 

Rev. 2. 5 Page 1 

## **SPU01N60C3 SPD01N60C3** 

|**Thermal Characteristics**||||||
|---|---|---|---|---|---|
|**Parameter**|**Symbol**<br>oe|**Values**<br>oe|||**Unit**|
|||**min.**<br>oe|**typ.**<br>oe|**max.**<br>oe||
|Thermal resistance, junction - case|_R_thJC<br>aee|-<br>ee|-<br>ee|11<br>ee|K/W|
|Thermal resistance, junction - ambient, leaded|_R_thJA<br>Baan|-<br>Baan|-<br>Baan|75<br>Baan||
|SMD version, device on PCB:<br>@ min. footprint<br>@ 6 cm2cooling area2)|_R_thJA<br>Baan|-<br>-<br>Baan|-<br>-<br>Baan|75<br>50<br>Baan||
|Soldering temperature,*)<br>1.6 mm (0.063 in.) from case for 10s|_T_sold<br>||-<br> ft|-<br>ft|260<br>ft|°C|



**Electrical Characteristics,** at _T_ j=25°C unless otherwise specified 

**Parameter Symbol Conditions Values Unit** ef **min. typ. max.** Drain-source breakdown voltage a _V_ (BR)DSS ee _V_ GS=0V, _I_ D=0.25mA oR 600 - - V Drain-Source avalanche _V_ (BR)DS _V_ GS=0V, _I_ D=0.8A - 700 - breakdown voltage ef tLee ee Gate threshold voltage _V_ GS(th) _I_ D=250µΑ, _V_ GS= _V_ DS 2.1 3 3.9 Zero gate voltage drain current _I_ DSS _V_ DS=600V, _V_ GS=0V, µA _T_ =25°C, - 0.1 1 j _T_ =150°C - - 50 PTL j Gate-source leakage current _I_ GSS _V_ GS=30V, _V_ DS=0V - - 100 nA Drain-source on-state resistance _R_ DS(on) _V_ GS=10V, _I_ D=0.5A, Ω _T_ =25°C - 5.6 6 j aan _T_ j=150°C - 15.1 - 

*) TO252: reflow soldering, MSL3; TO251: wavesoldering 

200 8 - 04 - 07 

Rev. 2. 5 Page 2 

**SPU01N60C3 SPD01N60C3** 

**Electrical Characteristics** , at _T_ j = 25 °C, unless otherwise specified 

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||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|Parameter|Symbol|Conditions|Values|Unit|
|min.|typ.|max.|
|ee|||[eee]|
|Transconductance|g|fs|V|DS≥2*|I|D*|R|DS(on)max,|-|0.75|-|S|
|I|D=0.5A|
|Input capacitance|||C|iss|V|GS=0V,|V|DS=25V,|ff|-|100|-|pF|
|Output capacitance|||C|oss|f|=1MHz|ff|-|40|-|
|Reverse transfer capacitance|C|rss|-|2.5|-|
|||PF|fe|
|Turn-on delay time|||t|d(on)|V|DD=350V,|V|GS=0/10V,|ff|-|30|-|ns|
|Rise time|||t|r|I|D=0.8A,|R|G=100Ω|ff|-|25|-|
|Turn-off delay time|t|d(off)|-|55|82|
|||PF|fe|
|Fall time|||t|f|Pf|-|30|45|
|Gate Charge Characteristics|
|Gate to source charge|Q|gs|V|DD=350V,|I|D=0.8A|-|0.9|-|nC|
|Gate to drain charge|Q|gd|-|2.2|-|
|Gate charge total|Q|g|V|DD=350V,|I|D=0.8A,|-|3.9|5|
|V|=0 to 10V|
|GS|
|Gate plateau voltage|V|(plateau)|V|DD=350V,|I|D=0.8A|-|5.5|-|V|

**----- End of picture text -----**<br>


1Repetitve avalanche causes additional power losses that can be calculated as _P_ AV= _E_ AR* _f_ . 

2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. 

3 ISD<=ID, di/dt<=400A/us, VDClink=400V, Vpeak<VBR, DSS, Tj<Tj,max. 

Identical low-side and high-side switch. 

200 8 - 04 - 07 

Rev. 2. 5 Page 3 

**SPU01N60C3 SPD01N60C3** 

**Electrical Characteristics** , at _T_ j = 25 °C, unless otherwise specified **Parameter Symbol Conditions Values Unit min. typ. max.** Inverse diode continuous _I_ S _T_ C=25°C - - 0.8 A forward current Soars Inverse diode direct current, _I_ SM - - 1.6 pulsed Inverse diode forward voltage aoe _V_ SD _V_ GS=0V, _I_ F= _I_ S - 1 1.2 V Reverse recovery time _t_ rr _V_ R=350V, _I_ F= _I_ S , - 570 970 ns | ft | Reverse recovery charge So _Q_ rr d _i_ F/d _t_ =100A/µs - 0.75 - µC 

## **Typical Transient Thermal Characteristics** 

|**Symbol**|**Value**|**Unit**|**Symbol**|**Value**|**Unit**|
|---|---|---|---|---|---|
||**typ.**|||**typ.**||
|Thermal resistance|||Thermal capacitance|||
|_R_th1|0.225|K/W|_C_th1|0.00001221|Ws/K|
|_R_th2|0.395||_C_th2|0.00005037||
|_R_th3|0.603||_C_th3|0.0000809||
|_R_th4|0.995||_C_th4|0.0002915||
|_R_th5|0.691||_C_th5|0.001844||
|_R_th6|0.148||_C_th6|0.412||



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External Heatsink<br>T j R th1 R th,n T case<br>P tot (t)<br>C th1 C th2 C th,n<br>T amb<br>**----- End of picture text -----**<br>


200 8 - 04 - 07 

Rev. 2. 5 Page 4 

**SPU01N60C3 SPD01N60C3** 

## **1 Power dissipation** 

_P_ tot = _f_ ( _T_ C) 

## **2 Safe operating area** 

_I_ D = _f_ ( _V_ DS ) parameter : _D_ = 0 , _T_ C=25°C 

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12 SPU01N60C3 10 1<br>W<br> A<br>\ a eel<br>109 PLONE I TTT<br>8 10 0<br>TENT EET TTT ED antimsauil<br>7<br>rt TTT TN IS TT ST TST<br>6<br>PTT | | TT WUE OE NES 7ST TTT<br>5<br> TTT TT NELLY E/N Ce<br>4 Nt 10 -1 Et tp = 0.001 ms OLLI<br>tp = 0.01 ms<br>3 tp = 0.1 ms<br>\ =H tp = 1 ms { t St<br>2<br>POTN Tt DC Nt<br>1<br>00 CECE 20 40 60 80 100 120 EN °C 160 10 -210 Bl [0] 10 [1] Ian 10 [2]  V 10 [3]<br>T C V DS<br>P tot I D<br>**----- End of picture text -----**<br>


## **3 Transient thermal impedance** 

_Z_ thJC = _f_ ( _t_ p) 

parameter: _D_ = _t_ p/ _T_ 

## **4 Typ. output characteristic** 

_I_ D = _f_ ( _V_ DS); _T_ j=25°C 

parameter: _t_ p = 10 µs, _V_ GS 

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10 2 2.5<br> K/W 20V<br>10V<br> A<br>LTT TTT TTT TTT TTT Pf f | os<br>7V<br>10 1<br>6.5V<br>1.5<br>10 0<br>6V<br>1<br>D = 0.5<br>SAA TT D = 0.2 (nA / Po<br>10 -1 D = 0.1 5.5V<br>D = 0.05<br>D = 0.02 0.5<br>D = 0.01 5V<br>Wau a single pulse (nA<br>10 -210 A [-7] 10 [-6] 10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] iil  s 10 [1] 00 Ann 5 10 15  V 25<br>t p V DS<br>thJC<br>Z I D<br>**----- End of picture text -----**<br>


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Rev. 2. 5 Page 5 

**SPU01N60C3 SPD01N60C3** 

## **5 Drain-source on-state resistance** 

_R_ DS(on) = _f_ ( _T_ j) 

parameter : _I_ D = 0.5 A, _V_ GS = 10 V 

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## **7 Typ. gate charge** 

_V_ GS = = _f_ ( _Q_ Gate)) 

parameter: _I_ D = 0.8 A pulsed = 0.8 A pulsed 

## **6 Typ. transfer characteristics** 

_I_ D= _f_ ( _V_ GS ); _V_ DS≥ 2 x _I_ D x _R_ DS(on)max parameter: _t_ p = 10 µs 

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## **8 Forward characteristics of body diode** 

_I_ F = _f_ (VSD) 

parameter: _T_ j , tp = 10 µs 

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Rev. 2. 5 Page 6 

200 8 - 04 - 07 

**SPU01N60C3 SPD01N60C3** 

## **9 Avalanche SOA** 

_I_ AR = _f_ ( _t_ AR) 

par.: _T_ j ≤ 150 °C 

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**----- Start of picture text -----**<br>
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## **10 Avalanche energy** 

_E_ AS = _f_ ( _T_ j) par.: _I_ D = 0.6 A, _V_ DD = 50 V 

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## **11 Drain-source breakdown voltage** 

_V_ (BR)DSS = _f_ ( _T_ j) 

## **12 Typ. capacitances** 

_C_ = _f_ ( _V_ DS) 

parameter: _V_ GS=0V, _f_ =1 MHz 

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Rev. 2. 5 Page 7 

**SPU01N60C3 SPD01N60C3** 

## Definition of diodes switching characteristics 

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Rev. 2. 5 Page 8 

**SPU01N60C3 SPD01N60C3** 

## PG-TO-252-3-1 (D-PAK), PG-TO-252-3-11 (D-PAK), PG-TO-252-3-21 (D-PAK) 

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Rev. 2. 5 Page 9 

**SPU01N60C3 SPD01N60C3** 

## PG-TO-251-3-1 (I-PAK), PG-TO-25 1 -3-21 (I-PAK) 

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**SPU01N60C3 SPD01N60C3** 

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Rev. 2. 5 Page 11 



## Links

- [View this product on Novapart](https://novapart.co/products/SPU01N60C3BKMA1/power-mosfet-n-channel-600-v-800-ma-56-ohm-to-251)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/en-ES/infineon/spu01n60c3bkma1/mosfet-n-ch-600v-0-8a-to-251-3/dp/2781200)
---

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