# Power MOSFET, P Channel, 60 V, 8.83 A, 0.3 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2212864/)

**URL**: https://novapart.co/products/SPD08P06PGBTMA1/power-mosfet-p-channel-60-v-883-a-03-ohm-to-252
**SKU**: SPD08P06PGBTMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2140
**Stock**: 1000+
**Lead Time**: 92 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-8.83A; Drain Source Voltage Vds:-60V; On Resistance Rds(on):0.23ohm; Rds(on) Test Voltage Vgs:-6.2V; Threshold Voltage Vgs:-3V;

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 42W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 6.2V |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 8.83A |
| Drain Source On State Resistance | 0.3ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2212864/)

**SPD08P06P G** 

## **SIPMOS[®] Power-Transistor** 

## **Product Summary** 

## **Features** 

- P-Channel 

- Enhancement mode 

|_V_DS||-60||V|
|---|---|---|---|---|
||||||
|_R_DS(on),max||0.3||Ω|
||||||
|_I_D||-8.8||A|



- Avalanche rated 

- d _v_ /d _t_ rated 

## PG-TO252-3 

- 175°C operating temperature 

## • Pb-free lead finishing; RoHS compliant ° Qualified according to AEC Q101 RoHS 

|**Type**|||**Package**||**Tape and reel information**|||**Marking**||**Lead free**||**Packing**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||||||||
|SPD08P06PG|||PG-TO252-3||1000 pcs / reel|||08P06P||Yes||Non dry|



|**Parameter**|**Symbol **|**Conditions**<br>~~fF~~|**Unit**<br>**Value**<br>**steady state**<br>~~fFPo~~|**Unit**|
|---|---|---|---|---|
|Continuous drain current|_I_D|_T_A=25 °C<br>~~i~~|A<br>-8.83<br>-6.25<br>-35.32<br>~~i~~<br>~~a~~<br>~~i~~|A<br>~~i~~|
|||_T_A=100 °C<br>~~a~~|||
|Pulsed drain current|_I_D,pulse|_T_A=25 °C|||
|Avalanche energy, single pulse|_E_AS<br>~~i~~|_I_D=8.83 A,_R_GS=25Ω<br>~~i~~|mJ<br>70<br>~~i~~|mJ|
|Avalanche energy, periodic limited by<br>Tjmax|_E AR_||4.2||
|Reverse diode d_v_/d_t_|d_v_/d_t_|_I_D=8.83 A,_V_DS=48 V,<br>d_i_/d_t_=-200 A/µs,<br>_T_j,max=175 °C|kV/µs<br>-6|kV/µs|
|Gate source voltage|_V_GS<br>~~PE~~|~~PE~~|V<br>±20<br>~~PE~~|V|
|Power dissipation|_P_tot<br>~~Pe~~|_T_A=25 °C<br>~~Pe~~|W<br>42<br>~~Pe~~|W|
|Operating and storage temperature|_T_j,_T_stg<br>~~PE~~|~~PE~~|°C<br>"-55 ... +175"<br>~~PE~~|°C|
|ESD class|~~Pe~~|~~Pe~~|~~Pe~~||
|Soldering temperature|~~PE~~|~~PE~~|260 °C<br>~~PE~~||
|IEC climatic category; DIN IEC 68-1|~~a~~|~~a~~|55/175/56<br>~~a~~||



20 12 - 09 - 10 

Rev 1. 92 

page 1 

**SPD08P06P G** _**G**_ 

||||**SPD08P06P GP G****_G_**|**SPD08P06P GP G****_G_**|**SPD08P06P GP G****_G_**|**SPD08P06P GP G****_G_**|**SPD08P06P GP G****_G_**|**SPD08P06P GP G****_G_**|
|---|---|---|---|---|---|---|---|---|
|**Parameter**<br>**Thermal characteristics**<br>~~ee~~||**Symbol **|**Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~eee~~||||||
||Thermal resistance,<br>junction - case|_R_thJC||-|-|3.6|K/W||
||Thermal resistance,<br>junction - ambient,leaded|_R_thJA||-|-|-|||
||SMD version, device on PCB:|_R_thJA|minimal footprint|-|-|75||K/W|
||||6 cm2cooling area1)|-|-|70<br>50|||



**Electrical characteristics,** at _T_ j=25 °C, unless otherwise specified 

## **Static characteristics** 

|Drain-source breakdown voltage|_V_(BR)DSS|_V_GS=0 V,_I_D=-250 µA|-60|-|-|V|
|---|---|---|---|---|---|---|
|Gate threshold voltage|_V_GS(th)|_V_DS=_V_GS,_I_D=-250 µA|-2.1|-3.0|-4||
|Zero gate voltage drain current|_I_DSS|_V_DS=-60 V,_V_GS=0 V,<br>_T_j=25 °C|-|-0.1|-1|µA|
|||_V_DS=-60 V,_V_GS=0 V,<br>_T_j=150 °C|-|-10|-100||
|Gate-source leakage current|_I_GSS|_V_GS=-20 V,_V_DS=0 V|-|-10|-100|nA|
|Drain-source on-state resistance<br>Transconductance|_R_DS(on)|_V_GS=-6.2 V,_I_D=-10 A|-|230|300|mΩ|
||_g_fs||_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=-6.2 A|2.5|4.9|-|S|



1) Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm2 ( one layer, 70µ, thick) copper area for drain connection. PCB is vertical without blown air. 

20 12 - 09 - 10 

Rev 1. 92 

page 2 

||||||**SPD08P06P G**|**SPD08P06P G**|**SPD08P06P G**|
|---|---|---|---|---|---|---|---|
|**Parameter**<br>~~ee ~~||**Symbol Conditions**<br> ~~ee~~||**min.**|**typ.**<br>**Values**|**max.**|**Unit**|
||**Dynamic characteristics**|||||||
||Input capacitance|_C_iss||-|335|420|pF|
||Output capacitance|_C_oss|_V_GS=0 V,_V_DS=-25 V,<br>_f_=1 MHz|-|105|135||
||Reverse transfer capacitance|_C_rss||-|65|95||
||Turn-on delay time|_t_d(on)||-|16.0|24.0||
||Rise time|_t_r|_V_DD=-30 V,_V_GS=-|-|46.0|69||
||||10 V,_I_D=-6.2 A,|||||
||Turn-off delay time|_t_d(off)|_R_G=6Ω|-|48|72||
||Fall time|_t_f||-|14|21||
||Gate Charge Characteristics|||||||
||Gate to source charge|_Q_gs||-|-1.9|-2.6|nC|
||Gate to drain charge|_Q_gd|_V_DD=-48 V,_I_D=-8.8 A,|-|-5|-8||
||Gate charge total|_Q_g|_V_GS=0 to -10 V|-|-10|-13||
||Gate plateau voltage|_V_plateau||-|-6|-|V|
||**Reverse Diode**|||||||
||Diode continuous forward current|_I_S||-|-|-8.80|A|
||||_T_A=25 °C|||||
||Diode pulse current|_I_S,pulse||-|-|-35.3||
||Diode forward voltage|_V_SD|_V_GS=0 V,_I_F=-8.83 A,<br>_T_j=25 °C|-|-0.98|-1.55|V|
||Reverse recovery time|_t_rr||-|60|90|ns|
||||_V_R=30 V,_I_F=|_I_S|,|||||
||Reverse recovery charge|_Q_rr|d_i_F/d_t_=100 A/µs|-|100|150|nC|



Rev 1. 92 

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20 12 - 09 - 10 

**SPD08P06P** 

## **1 Power dissipation** 

_P_ tot=f( _T_ A) 

## **2 Drain current** 

_I_ D=f( _T_ A); | _V_ GS|≥10 V 

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**----- Start of picture text -----**<br>
40<br>30<br>20<br>10<br>0<br>0 40 80 120 160<br>T  A [°C]<br> [W]<br> tot<br>P<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
9<br>8<br>7<br>6<br>5<br>4<br>3<br>2<br>1<br>0<br>0 40 80 120 160<br>T  A [°C]<br> [A]<br> D<br>-I<br>**----- End of picture text -----**<br>


## **3 Safe operating area** 

_I_ D=f( _V_ DS); _T_ A=25 °C; _D_ =0 parameter: _t_ p 

## **4 Max. transient thermal impedance** 

_Z_ thJA=f( _t_ p) parameter: _D_ = _t_ p/ _T_ 

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**----- Start of picture text -----**<br>
10 [2] 10 [1]<br>10 µs<br>limited by on-state<br>resistance 100 µs<br>10 [1] 0.5<br>1 ms<br>10 [0] 0.2<br>10 ms<br>DC 0.1<br>10 [0] 0.05<br>0.02<br>0.01<br>10 [-1] single pulse<br>1 0 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] 10 [0] 10 [1] 10 [2]<br>10 [-1]<br>10 [-2] AR<br>10 [-1] 10 [0] 10 [1] 10 [2]<br>-V  DS [V] t  p [s]<br>page 4  20 12 - 09 - 10<br> [A]  [K/W]<br> D<br>-I<br> thJS<br>Z<br>**----- End of picture text -----**<br>


Rev 1. 92 

**SPD08P06P** 

## **5 Typ. output characteristics** 

_I_ D=f( _V_ DS); _T_ j=25 °C parameter: _V_ GS 

## **6 Typ. drain-source on resistance** 

_R_ DS(on)=f( _I_ D); _T_ j=25 °C parameter: _V_ GS 

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**----- Start of picture text -----**<br>
1000<br>900<br>800<br>700<br>-4 V<br>600 -4.5 V<br>-5 V<br>500<br>-5.5 V<br>400<br>-6 V<br>300 -7 V<br>-10 V<br>200<br>-20V<br>100<br>0<br>0 2 4 6 8 10 12 14<br>-I  D [A] [A]<br>]<br>Ω<br> [m<br> DS(on)<br>R<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
-20 V<br>18 900<br>-10 V 800<br>15<br>-7 V 700 -4 V<br>12 600 -4.5 V<br>-5 V<br>500<br>9 -6 V -5.5 V<br>400<br>-6 V<br>6 -5.5 V 300 -7 V<br>-10 V<br>-5V 200<br>3 -20V<br>-4.5 V 100<br>-4 V<br>0 0<br>0 1 2 3 4 5 6 7 8 0 2 4 6 8 10 12 14<br>-V  DS [V] -I  D [A] [A]<br>7 Typ. transfer characteristics 8 Typ. forward transconductance<br>=f( V  GS); |); | V  DS|>2||>2| I  D|| R  DS(on)max g  fs=f( I  D);  T  j=25 °C<br>parameter:  T  j<br>6 6<br>5 5<br>4 4<br>3 3<br>2 2<br>1 125 °C 1<br>25 °C<br>/<br>0 0<br>0 1 2 3 4 5 6 7 8 0 2 4 6 8 10<br>-V  GS [V] -I  D [A]<br>]<br>Ω<br> [m<br> [A]<br> D<br>-I<br> DS(on)<br>R<br> [A]  [S]<br> D  fs<br>-I g<br>**----- End of picture text -----**<br>


## **7 Typ. transfer characteristics** 

_I_ D=f( _V_ GS); |); | _V_ DS|>2||>2| _I_ D|| _R_ DS(on)max parameter: _T_ j 

20 12 - 09 - 10 

Rev 1. 92 

page 5 

**SPD08P06P G** 

## **9 Drain-source on-state resistance** 

_R_ DS(on)=f( _T_ j); _I_ D=-6.2 A; _V_ GS=-10 V 

## **10 Typ. gate threshold voltage** 

_V_ GS(th)=f( _T_ j); _V_ GS= _V_ DS; _I_ D=-250 µA 

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**----- Start of picture text -----**<br>
700 5<br>4.5<br>600<br>4 max.<br>500<br>3.5<br>98 % 3 than typ.<br>400<br>2.5<br>300<br>2<br>min.<br>200 1.5<br>typ.<br>1<br>100<br>0.5<br>0 0<br>-60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180<br>T  j [°C] T  j [°C]<br>]<br>[m Ω  [V]<br> GS(th)<br> DS(on) -V<br>R<br>**----- End of picture text -----**<br>


## **11 Typ. capacitances** 

_C_ =f( _V_ DS); _V_ GS=0 V; _f_ =1 MHz 

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**----- Start of picture text -----**<br>
10 [3]<br>Ciss<br>Coss<br>10 [2]<br>Crss<br>10 [1]<br>0 5 10 15 20 25<br>-V  DS [V]<br>  [pF]<br>C<br>**----- End of picture text -----**<br>


## **12 Forward characteristics of reverse diode** 

_I_ F=f( _V_ SD) parameter: _T_ j 

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**----- Start of picture text -----**<br>
175 °C, typ<br>10 [1]<br>25  ° C, 98%<br>10 [0]<br>175 °C, 98%<br>10 [-1]<br>25 °C, typ<br>10 [-2]<br>0 0.5 1 1.5 2 2.5 3<br>-V  SD [V]<br> [A]<br>I  F<br>**----- End of picture text -----**<br>


Rev 1. 92 

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20 12 - 09 - 10 

**SPD08P06P G** 

## **13 Avalanche characteristics** 

## **14 Typ. gate charge** 

_V_ GS=f( _Q_ gate); _I_ D=-8.8 A pulsed parameter: _V_ DD 

_I_ AS=f( _t_ AV); _R_ GS=25 Ω 

parameter: _T_ j(start) 

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**----- Start of picture text -----**<br>
10 [1] 16<br>14<br>25 °C 12<br>30 V<br>100 °C 12 V<br>48 V<br>125 °C 10<br>8<br>6<br>4<br>2<br>10 [0] AW 0<br>10 [0] 10 [1] 10 [2] 10 [3] 0 3 6 9 12 15<br>t  AV [µs] Q  gate [nC]<br>15 Drain-source breakdown voltage<br> BR(DSS)=f(=f( T  j); );  I  D=-250 µA=-250 µA<br>70<br>65<br>60<br>55<br>50<br>-60 -20 20 60 100 140 180<br>T  j [°C]<br> [A]  [V]<br> AV  GS<br>-I V<br> [V]<br> BR(DSS)<br>-V<br>**----- End of picture text -----**<br>


## **15 Drain-source breakdown voltage** 

_V_ BR(DSS)=f(=f( _T_ j); ); _I_ D=-250 µA=-250 µA 

Rev 1. 92 

20 12 - 09 - 10 

page 7 

**SPD08P06P G** 

## **Package outline: PG-TO252-3** 

Rev 1. 92 

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20 12 - 09 - 10 

**SPD08P06P G** 

## **Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

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- [Supplier page](https://es.farnell.com/infineon/spd08p06pgbtma1/mosfet-p-ch-60v-8-83a-dpak/dp/2212864)
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