# Power MOSFET, P Channel, 100 V, 4.2 A, 0.85 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2212868/)

**URL**: https://novapart.co/products/SPD04P10PLGBTMA1/power-mosfet-p-channel-100-v-42-a-085-ohm-to-252
**SKU**: SPD04P10PLGBTMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2650
**Stock**: 500+
**Lead Time**: 92 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-4.2A; Drain Source Voltage Vds:-100V; On Resistance Rds(on):0.55ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:-1.

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 38W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 4.2A |
| Drain Source On State Resistance | 0.85ohm |
| Gate Source Threshold Voltage Max | 1.5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2212868/)

**SPD04P10PL G** 

## **SIPMOS[®] Power-Transistor** 

## **Product Summary** 

## **Features** 

- P-Channel 

- Enhancement mode 

|**Product Summary**|||
|---|---|---|
||||
|_V_DS|-100|V|
||||
|_R_DS(on),max|850|mΩ|
||||
|_I_D|-4.2|A|



- Logic level 

- Avalanche rated 

- Pb-free lead plating; RoHS compliant 

° Qualified according to AEC Q101 

**==> picture [57 x 66] intentionally omitted <==**

**----- Start of picture text -----**<br>
PG-TO-252-3<br>4<br>**----- End of picture text -----**<br>


||||||**Tape and reel information**|
|---|---|---|---|---|---|
|**Type**|**Package**|**Marking**|**Lead free**|**Packing**||
||||||1000 pcs / reel|
|SPD04P10PL G|PG-TO252-3|04P10PL|Yes|Non dry||



**Maximum ratings,** at _T_ j=25 °C, unless otherwise specified 

|**Parameter**|**Symbol **|**Conditions**|**Unit**<br>**Value**<br>**steady state**|**Unit**|
|---|---|---|---|---|
|Continuous drain current|_I_D|_T_C=25 °C|A<br>-4.2<br>3.0<br>-16.8|A|
|||_T_C=100 °C|||
|Pulsed drain current|_I_D,pulse|_T_C=25 °C|||
|Avalanche energy, single pulse|_E_AS|_I_D=-4.2 A,_R_GS=25Ω|mJ<br>57|mJ|
|Gate source voltage|_V_GS||V<br>±20|V|
|Power dissipation|_P_tot|_T_C=25 °C|W<br>38|W|
|Operating and storage temperature|_T_j,_T_stg||°C<br>-55 ... 175|°C|
|ESD class||JESD22-A114-HBM|1A (250 V to 500 V)||
|Soldering temperature|||260 °C||
|IEC climatic category; DIN IEC 68-1|||55/175/56||



Rev 1. 6 

20 12 -0 9 - 10 

page 1 

**SPD04P10PL G** 

|**SPD04P10PL G**|**SPD04P10PL G**|**SPD04P10PL G**|**SPD04P10PL G**|**SPD04P10PL G**|**SPD04P10PL G**|**SPD04P10PL G**|**SPD04P10PL G**|
|---|---|---|---|---|---|---|---|
|**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~Tt~~||||||||
||**Thermal characteristics**|||||||
||Thermal resistance,<br>junction - soldering point|_R_thJC||-|-|3.9|K/W|
||Thermal resistance,<br>junction - ambient|_R_thJA|minimal footprint,<br>steady state|-|-|75||
||||6 cm2cooling area1),<br>steady state|-|-|50||



**Electrical characteristics,** at _T_ j=25 °C, unless otherwise specified 

## **Static characteristics** 

|**Static characteristics**|||||||
|---|---|---|---|---|---|---|
|Drain-source breakdown voltage|_V_(BR)DSS|_V_GS=0 V,_I_D=-250 mA|-100|-|-|V|
|Gate threshold voltage|_V_GS(th)|_V_DS=_V_GS,_I_D=-380 µA|-1|-1.5|-2||
|Zero gate voltage drain current|_I_DSS|_V_DS=-100 V,_V_GS=0 V,<br>_T_j=25 °C|=0 V,<br>-|-0.1|-1|µA|
|||_V_DS=-100 V,_V_GS=0 V,<br>_T_j=150 °C|=0 V,<br>-|-10|-100||
|Gate-source leakage current|_I_GSS|_V_GS=-20 V,_V_DS=0 V|-|-10|-100|nA|
|Drain-source on-state resistance|_R_DS(on)|_V_GS=-4.5 V,_I_D=-<br>2.75 A|-|787|1050|mΩ|
|||_V_GS=-10 V,_I_D=-3.0 A|-|550|850||
|Transconductance|_g_fs||_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=-3.0 A|1.5|3.0|-|S|



1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 

Rev 1. 6 

20 12 -0 9 - 10 

page 2 

**SPD04P10PL G Parameter Symbol Conditions Values Unit min. typ. max. Dynamic characteristics** Input capacitance _C_ iss - 280 372 pF Output capacitance _C_ oss _V_ GS=0 V, _V_ DS=-25 V, - 70 94 _f_ =1 MHz Reverse transfer capacitance _C_ rss - 34 51 Turn-on delay time _t_ d(on) - 4.6 6.9 ns Rise time _t_ r _V_ DD=-50 V, _V_ GS=5.7 8.6 10 V, _I_ D=-4.2 A, Turn-off delay time _t_ d(off) _R_ G=6 Ω - 18 27 Fall time _t_ f - 5.0 7.5 ~~=~~ Gate Charge Characteristics[2)] Gate to source charge _Q_ gs - 1.1 1.5 nC Gate to drain charge _Q_ gd _V_ DD=-80 V, _I_ D=-4.2 A, - 4.6 6.9 Gate charge total _Q_ g _V_ GS=0 to -10 V - 12 16 Gate plateau voltage _V_ plateau - 4.1 - V **Reverse Diode** ~~==~~ Diode continuous forward current _I_ S ~~EE~~ - - -4.2 A _T_ C=25 °C Diode pulse current _I_ S,pulse - - 16.8 _V_ GS=0 V, _I_ F=-4.2 A, Diode forward voltage _V_ SD - 0.94 1.2 V _T_ j=25 °C Reverse recovery time _t_ rr - 68 85 ns _V_ R=50 V, _I_ F=| _I_ S|, Reverse recovery charge _Q_ rr d _i_ F/d _t_ =100 A/µs - 178 223 nC ~~et~~ 2) See figure 16 for gate charge parameter definition 

Rev 1. 6 

20 12 -0 9 - 10 

page 3 

**SPD04P10PL G** 

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1 Power dissipation<br>**----- End of picture text -----**<br>


_P_ tot=f( _T_ C) 

## **2 Drain current** 

_I_ D=f( _T_ C); | _V_ GS|≥10 V 

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40 4.5<br>4<br>35<br>3.5<br>30<br>3<br>25<br>2.5<br>20<br>2<br>15<br>1.5<br>10<br>1<br>5 0.5<br>0 0<br>0 40 80 120 160 0 40 80 120 160<br>T  C [°C] T  C [°C]<br>3 Safe operating area 4 Max. transient thermal impedance<br>=f( V  DS); );  T  C=25 °C; =25 °C;  D  =0 Z  thJC=f( t  p)<br>parameter:  t  p parameter:  D  = t  p/ T<br>10 [2] 10 [1]<br>1 µs<br>10 µs<br>10 [1] 0.5<br>100 µs<br>10 [0]<br>0.2<br>1 ms<br>0.1<br>10 [0] limited by on-state 10 ms<br>resistance<br>0.05<br>DC<br>0.02<br>0.01<br>single pulse<br>10 [-1] At 10 [-1]<br>10 [0] 10 [1] 10 [2] 10 [3] 10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] 10 [0]<br>-V  DS [V] t  p [s]<br>page 4  20 12 -0 9 - 10<br> [W]  [A]<br> tot -I  D<br>P<br> [A]  [K/W]<br> D<br>-I<br> thJS<br>Z<br>**----- End of picture text -----**<br>


## **3 Safe operating area** 

_I_ D=f( _V_ DS); ); _T_ C=25 °C; =25 °C; _D_ =0 parameter: _t_ p 

Rev 1. 6 

## **SPD04P10PL G** 

**5 Typ. output characteristics** 

## **6 Typ. drain-source on resistance** 

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**----- Start of picture text -----**<br>
I  D=f( V  DS);  T  j=25 °C R  DS(on)=f( I  D);  T  j=25 °C<br>parameter:  V  GS parameter:  V  GS<br>8 1600<br>7 -10 V -5 V 1400<br>-4.5 V<br>6 -2.8 V<br>1200 -3 V<br>-3.2 V -3.5 V<br>5<br>-4 V 1000 -4 V<br>4 -4.5 V<br>800 -5 V<br>3<br>-3.5 V<br>600<br>2 -3.2 V -10 V<br>-3 V<br>-2.8 V 400<br>1<br>0 ae 200<br>0 2 4 6 8 10 0 2 4 6 8<br>-V  DS [V] -I  D [A]<br>7 Typ. transfer characteristics 8 Typ. forward transconductance<br>I  D=f( V  GS); | V  DS|>2| I  D| R  DS(on)max g  fs=f( I  D);  T  j=25 °C<br>parameter:  T  j<br>8 5<br>7<br>4<br>6<br>25 °C<br>5<br>3<br>4<br>125 °C 2<br>3<br>2<br>1<br>1<br>0 Le. 0<br>0 2 4 6 8 0 2 4 6 8<br>-V  GS [V] -I  D [A]<br>page 5  20 12 -0 9 - 10<br>]<br>Ω<br> [m<br> [A]<br> D<br>-I<br> DS(on)<br>R<br> [A]  [S]<br> D  fs<br>-I g<br>**----- End of picture text -----**<br>


Rev 1. 6 

## **SPD04P10PL G** 

## **9 Drain-source on-state resistance** 

_R_ DS(on)=f( _T_ j); _I_ D=-3 A; _V_ GS=-10 V 

## **10 Typ. gate threshold voltage** 

_V_ GS(th)=f( _T_ j); _V_ GS= _V_ DS; _I_ D=-380 µA 

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2500 3<br>2000<br>2 max.<br>1500<br>98 %<br>typ.<br>1000<br>1<br>min.<br>500<br>typ.<br>0 0<br>-60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180<br>T  j [°C] T  j [°C]<br>]<br>[m Ω  [V]<br> GS(th)<br> DS(on) -V<br>R<br>**----- End of picture text -----**<br>


## **11 Typ. capacitances** 

_C_ =f( _V_ DS); _V_ GS=0 V; _f_ =1 MHz 

**12 Forward characteristics of reverse diode** 

_I_ F=f( _V_ SD) 

parameter: _T_ j 

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10 [3] 10 [2]<br>25 °C, typ<br>Ciss 10 [1]<br>175 °C, 98%<br>175 °C, typ<br>10 [2] Coss 10 [0]<br>Crss<br>25 °C, 98%<br>10 [-1]<br>10 [1] 10 [-2]<br>0 5 10 15 20 25 0 0.5 1 1.5<br>-V  DS [V] -V  SD [V]<br>C   [pF]  [A] I  F<br>**----- End of picture text -----**<br>


Rev 1. 6 

20 12 -0 9 -1 0 

page 6 

**SPD04P10PL G** 

**13 Avalanche characteristics** 

_I_ AS=f( _t_ AV); _R_ GS=25 Ω parameter: _T_ j(start) 

## **14 Typ. gate charge** 

_V_ GS=f( _Q_ gate); _I_ D=-4.2 A pulsed parameter: _V_ DD 

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10 10<br>9<br>8 50 V<br>20 V<br>80 V<br>7<br>100 °C 25 °C<br>125 °C<br>6<br>1 5<br>4<br>3<br>2<br>1<br>0.1 0<br>1 10 100 1000 0 5 10 15<br>t  AV [µs] -  Qgate [nC]<br>15 Drain-source breakdown voltage 16 Gate charge waveforms<br>V  BR(DSS)=f( T  j);  I  D=-250 µA<br>130<br>V GS<br>120 Q g<br>110<br>100<br>V gs(th)<br>90<br>80<br>Q g(th) Q sw Q gate<br>70 Q  gs Q  gd<br>-60 a -20 20 60 100 140 180<br>T  j [°C]<br> [A]  [V]<br> AV GS<br>-I  V -<br> [V]<br> BR(DSS)<br>-V<br>**----- End of picture text -----**<br>


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page 7 

**SPD04P10PL G** 

## **Package Outline: PG-TO-252-3** 

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• Logic level<br>**----- End of picture text -----**<br>


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**SPD04P10PL G** 

## **Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Rev 1. 6 

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page 9 



## Links

- [View this product on Novapart](https://novapart.co/products/SPD04P10PLGBTMA1/power-mosfet-p-channel-100-v-42-a-085-ohm-to-252)
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- [Supplier page](https://es.farnell.com/infineon/spd04p10plgbtma1/mosfet-p-ch-100v-4-2a-to252-3/dp/2212868)
---

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