# Power MOSFET, N Channel, 650 V, 20.7 A, 0.19 ohm, TO-263 (D2PAK), Surface Mount

![Product image](https://novapart.co/image/farnell:1056541RL/)

**URL**: https://novapart.co/products/SPB20N60C3ATMA1/power-mosfet-n-channel-650-v-207-a-019-ohm-to-263
**SKU**: SPB20N60C3ATMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.5100
**Stock**: 1000+
**Lead Time**: 64 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:20.7A; Drain Source Voltage Vds:650V; On Resistance Rds(on):0.19ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3V; Power Di

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 208W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-263 (D2PAK) |
| Drain Source Voltage Vds | 650V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 20.7A |
| Drain Source On State Resistance | 0.19ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1056541RL/)

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Cool MOS™ Power Transistor<br>**----- End of picture text -----**<br>


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V T<br>DS jmax<br>Ω<br>P G -1026 3<br>**----- End of picture text -----**<br>


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G 

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|||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
|T|C|=|25°C|20.7|
|T|
|C|
|t|T|
|Pulsed|drain|current,|p|limited|by|jmax|‘In pus|||621|||| A|
|Avalanche|energy,|single|pulse|Ens|mJ|
|V|DD|
|Avalanche|energy,|repetitive|tap|limited|by|T|jmax|2)|E|AR|1|
|V|DD|
|T|
|Avalanche|current,|repetitive|tap limited|by|jmax|‘Ia|||20|||| A|
|Gate source voltage static|||V|GS|0|||ly|
|Gate source voltage AC|(f >1Hz)|||V|GS|±|30 ||
|Power dissipation,|T|C = 25°C|a|P|tot|ee|
|Operating|and|storage|temperature|°C|
|Reverse diode dv/dt                                                     dv/dt                        15                     V/ns|7)|
|ee|

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11 - 11 - 20 

Rev. 2. 7 

Source voltage slope _T_ = 480 V,Ip=20.7A, =125°C 

_V T_ DS 

_R_ thJC Thermal resistance, junction - case fe |e | 08 | K/W _R_ thJA Thermal resistance, junction - ambient, leaded pf |e 62 | SMD version, device on PCB: RinJA @ min. footprint - 62 @ 6 cm2 cooling area 3) me) le reflow soldering, MSL1 6 Soldering temperature, Lae ee ee ca °C Electrical Characteristics, at 7;=25°C unless otherwise specified Parameter [Symbol] Condivons |_min. ____Values —_—_ Unit | typ. | max. | _V V_ Drain-source breakdown voltage | (BR)DSS | GS =0v,fp20.25ma] 600 | - | - | V _V_ GS breakdown voltage Drain-Source avalanche Memos] smeorme Y= | 00) Gate threshold voltage µ _V V_ Zero gate voltage drain current |/pss DS =600V, GS =0V, UA _T_ =25°C 0.1 1 j _T_ BE j _V V_ Gate-source leakage current ‘less | GS =30v, DS =ov | - | - | 100, nA _V_ GS Ω Drain-source on-state resistance |Rpgion) =10V, Ip=13.1A _T_ j =25°C 0.16 | 0.19 _T_ =150°C 0.43 - j _R_ Gate input resistance || G RIMHz, open drain | - | 0.54; - | 

11 - 09 - 20 

Rev. 2. 7 

|Transconductance||_g_fs<br>ee|_V_DS≥<br>2*Ip*RDS(on)max:<br>ee|ee||<br>ee|| typ. |<br>17.5<br>ee||max.<br>ee|
|---|---|---|---|---|---|---|---|
|Input capacitance||_C_iss|_V_GS<br>_V_DS|||||
|Output capacitance||_C_oss|_f_|||||
|Reverse transfer capacitance<br>Effective output capacitance,<br>>)<br>energy related||_C_rss<br>||_V_GS<br>_V_DS<br>=0V,<br>=0V to 480V||= | 5 | -|<br>fe|||
|Effective output capacitance,<br>®)<br>time related|||||fey|fey|fey|
|Turn-on delay time||_t_d(on)|_V_DD<br>_V_GS<br>=380V,<br>=0/13V,|||10||
||||Ip=20.7A,|||||
||||_R_G<br>Ω_T_j<br>=3.6<br>,<br>=125|||||
|Rise time||_t_r|_V_DD<br>_V_GS|||||
|Turn-off delay time||_t_d(off)||||||
|Fall time||_t_f|_R_G<br>Ω|||||
|Gate to source charge<br>Gate to drain charge<br>Gate Charge Characteristics|<br>Gate charge total||_Q_gs<br>_V_DD<br>_Q_gd<br>_V_DD<br>_V_GS<br>_V_DD<br>||<br>s480V, Ip=20.7A <br>|<br>=480V, Ip=20.7A,<br>| stern||| - | 11 | -<br>= | 8]<br>87<br>114<br>| |||||



_E_ AR _f_ 

> oss while _V_ DS _C_ oss while _V_ DS 

> 7 ISD<=ID, di/dt<=400A/us, VDClink=400V, Vpeak<VBR, DSS, Tj<Tj,max. Identical low-side and high-side switch. 

11 - 09 - 20 

Rev. 2. 7 

|Inversediodecontinuous|Is|=25°C|
|---|---|---|
|Inverse diode continuous|Is|_T_C<br>=25°C|
|forward current|||
|Inverse diode direct current,|_I_SM||
|pulsed|||
|||_V_GS|
|Reverse recovery time|_t_rr|_V_R|
|Reverse recovery charge<br>Peak reverse recovery current<br>Peak rate offall of reverse|_Q_rr<br>_I_rrm<br>di,/at|d_i_F/d_t_<br>_T_j<br>=25°C|



11 - 09 - 20 

Rev. 2. 7 

**2** 

## _T_ C 

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we<br>Pee eee<br>20 UN<br>SOE<br>ELLA\<br>SANG<br>20<br>LELEELL ELE LL ELN<br>0 20 40 60 80 100 120 °C<br>—r T C<br>tot<br>P<br>**----- End of picture text -----**<br>


## **3** 

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T<br>C =25°C<br>= SEIN<br>At TTT<br>con coon<br>FLED10 Vv<br>—_ V DS<br>**----- End of picture text -----**<br>


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4 Typ. output<br>V T<br>Ip=f( DS ); — j =25°C<br>V<br>parameter: fp = 10 us, GS<br>**----- End of picture text -----**<br>


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11 - 09 - 20 

Rev. 2. 7 

**6** 

## **5 Typ. drain­source on resistance** 

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RDS(on)= f(ID)<br>parameter: Tj= 150°C, VGS<br>Ω<br>AE<br>**----- End of picture text -----**<br>


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V DS +); T j ~=-=150°C<br>V<br>f, = 10 us, GS<br>**----- End of picture text -----**<br>


_V_ DS 

**7** 

## **8** 

Ip=F( Ves )i Vos ≥ 2X Ip X Rps(on)max 

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V<br>: Ip = 13.1A, GS =10V<br>“ Ω TTITTTTT T s<br>**----- End of picture text -----**<br>


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_V_ GS 

11 - 09 - 20 

Rev. 2. 7 

## **9** Typ. gate charge _V_ GS 

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0<br>1 Typ. switching time<br>R T<br>t=f( _ G ), inductive load, j<br>V V<br>DS GS<br>**----- End of picture text -----**<br>


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d i /d t = f( R G J inductive load, 3 T<br>V V<br>par.: DS =380V, GS =0/+13V,<br>5000<br>lus<br>4000 AEE ET<br>—\<br>SCRECCCA<br>/d i d t neon<br>**----- End of picture text -----**<br>


## **12** _V_ (BR)DSS = f ( _T_ 

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_T_ ~~1~~ j 11 - 09 - 20 

Rev. 2. 7 

**4** 

**3** 

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inductive load, T =125°C<br>V V R Ω<br>DS GS G<br>**----- End of picture text -----**<br>


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## **15** 

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**16** 

_V_ DS ) _V_ GS 

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11 - 09 - 20 

Rev. 2. 7 

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1 7 Typ. drain source voltage slope 1 8 Typ. switching losses<br>d v /d t =f( R G  ), inductive load, T j =125°C E =f (Ip), inductive load, T j =125°C<br>V V V V R Ω<br>par.: DS =380V, GS =0/+13V, Ip=20.7A par.: DS =380V, GS =0/+13V, G =3.6<br>mWs commutation losses<br>“ yee BRR<br>° ei tt YT<br>i Atty 2 voi<br>R aNIAL TLL te. tlta tTALans é<br>: —— Bear a2en<br>%ETL 85 «10 15 20 25 PRE) 30 Ω 40 | “C% 3 6 9 er 12 15 A<br>—_r R G —r. /d<br>1 9 Typ. switching losses 20 Avalanche SOA<br>R T<br>E=f( _ G ), inductive load, =125°C Inn = f (tar)<br>V V T ≤<br>par.: DS =380V, GS =0/+13V, Ip=20.7A par.: 150 °C<br>0.405) Eon includes SPDO6S60 diode 20 Bin<br>mWs commutation losses / |<br>ey VA e<br>off<br>ee J |<br>0.2 L| 7 10<br>tA et :<br>ALA | |<br>01 fx 5 Tj(Start)=125°C \ \<br>0.05 ms |<br>Zan e nist<br>0 5 10 15 20 25 30 Ω 40 10° 10% 10° 10° 10° 10? us<br>— R G —w r. ‘ar<br>/d t<br>v<br>d<br>**----- End of picture text -----**<br>


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Rev. 2. 7 

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11 - 09 - 20 

Rev. 2. 7 

## PG-TO263-3- 2 / PG-TO263-3-5/ PG-TO263-3-22 

11 - 09 - 20 

Rev. 2. 7 

## **Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. 

Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

11 09 20 

Rev. 2. 7 

3 



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- [Supplier page](https://es.farnell.com/infineon/spb20n60c3atma1/mosfet-n-coolmos-d2-pak/dp/1056541RL)
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