# Power MOSFET, N Channel, 600 V, 20.7 A, 0.22 ohm, TO-220F, Through Hole

![Product image](https://novapart.co/image/farnell:1471775/)

**URL**: https://novapart.co/products/SPA20N60CFDXKSA1/power-mosfet-n-channel-600-v-207-a-022-ohm-to-220f
**SKU**: SPA20N60CFDXKSA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €2.1000
**Stock**: 10+
**Lead Time**: 21 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:20.7A; Drain Source Voltage Vds:600V; On Resistance Rds(on):0.19ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V; Power Diss

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 35W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220F |
| Drain Source Voltage Vds | 600V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 20.7A |
| Drain Source On State Resistance | 0.22ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1471775/)

**SPA20N60CFD** 

## **CoolMOS[TM] Power Transistor** 

## **Product Summary** 

## **Features** 

- New revolutionary high voltage technology • Intrinsic fast-recovery body diode 

|_V_DS|600|V|
|---|---|---|
|_R_DS(on),max|0.22|W|
|_I_D<br>1)|20.7|A|



- Extremely low reverse recovery charge 

- Ultra low gate charge 

PG-TO220-3-31 

- Extreme d _v_ /d _t_ rated 

- High peak current capability 

- Periodic avalanche rated • Qualified for industrial grade applications according to JEDEC[0)] 

- Pb-free lead plating; RoHS compliant 

|**Type**|**Package**|**Ordering Code**|**Marking**|
|---|---|---|---|
|SPA20N60CFD|PG-TO220-3-31|SP000216361|20N60CFD|



**Maximum ratings,** at _T_ **j** =25 °C, unless otherwise s **p** ecified 

|**Parameter**|**Symbol **|**Conditions**|**Value**|**Unit**|
|---|---|---|---|---|
|Continuous drain current1)|_I_D|_T_C=25 °C|20.7|A|
|||_T_C=100 °C|13.1||
|Pulsed drain current2)|_I_D,pulse|_T_C=25 °C|52||
|Avalanche energy, single pulse|_E_AS|_I_D=10 A,_V_DD=50 V|690|mJ|
|Avalanche energy, repetitive_t_AR<br>2),3)|_E_AR|_I_D=20 A,_V_DD=50 V|1||
|Avalanche current, repetitive_t_AR<br>2),3)|_I_AR||20|A|
|Drain source voltage slope|d_v_/d_t_|_I_D=20.7 A,<br>_V_DS=480 V,<br>_T_j=125 °C|80|V/ns|
|Reverse diode d_v_/d_t_|d_v_/d_t_|_I_S=20.7 A,<br>_V_DS=480 V,<br>_T_j=125 °C|40|V/ns|
|Maximum diode commutation speed|d_i_/d_t_||900|A/µs|
|Gate source voltage|_V_GS|static|±20|V|
|||AC (_f_>1 Hz)|±30||
|Power dissipation|_P_tot|_T_C=25 °C|35|W|
|Operating and storage temperature|_T_j,_T_stg||-55 ... +150|°C|



**Rev. 1.4** 

**page 1** 

**2012-02-19** 

## **SPA20N60CFD** 

|(<br>Infineon<br>technologies<br>:|||||**SPA20N60CFD**|**SPA20N60CFD**|**SPA20N60CFD**|
|---|---|---|---|---|---|---|---|
|**Parameter**||**Symbol **|**Conditions**||**Values**||**Unit**|
|||||**min.**|**typ.**|**max.**||
|**Thermal characteristics**||||||||
|Thermal resistance, junction - case||_R_thJC||-|-|3.6|K/W|
|Thermal resistance, junction -<br>ambient||_R_thJA|leaded|-|-|62||
|Soldering temperature, wave<br>soldering||_T_sold|1.6 mm (0.063 in.)<br>from case for 10 s|-|-|260|°C|
|**Electrical characteristics,**at_T_j=25 °C, unless otherwise specified|=25 °C, unless otherwise specified||=25 °C, unless otherwise specified|||||
|**Static characteristics**||||||||
|Drain-source breakdown voltage||_V_(BR)DSS|_V_GS=0 V,_I_D=250 µA|600|-|-|V|
|Avalanche breakdown voltage||_V_(BR)DS|_V_GS=0 V,_I_D=20 A|-|700|-||
|Gate threshold voltage<br>**Z**<br>**t**<br>**lt**<br>**d**<br>**i**<br>**t**<br>ero ga e vo age<br>ra n curren||_V_GS(th)<br>_V_DS=_V_GS,_I_D=1000µA<br>**_I_**<br>**_V_** **DS**=**600 V,** **_V_** **GS**=**0 V,**<br>DSS<br>_T_j=25 °C<br>~~ee ~~||3<br>4<br>5<br>**2** **1**<br>-<br>.<br>-<br> ~~eee~~|||**A**<br>µ|
||||_V_DS=600 V,_V_GS=0 V,<br>_T_j=150 °C|-|1700|-||
|Gate-source leakage current<br>Drain-source on-state resistance||_I_GSS<br>_R_DS(on)<br>~~a ee~~|_V_GS=20 V,_V_DS=0 V<br>-<br>-<br>100<br>_V_GS=10 V,_I_D=13.1 A,<br>_T_j=25 °C<br>-<br>0.19<br>0.22<br>~~ee~~<br>~~eee~~||||nA<br>W|
||||_V_GS=10 V,_I_D=13.1 A,<br>_T_j=150 °C|-|0.43|-||
|Gate resistance||_R_G|_f_=1 MHz, open drain|-|0.54|-||
|Transconductance||_g_fs<br>|_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=13.1 A<br>~~ee~~||-<br>17.5<br>-<br>~~ee~~|||S|



**Rev. 1.4** 

**page 2** 

**2012-02-19** 

|_<br>(<br>Infineon||||||
|---|---|---|---|---|---|
|(<br>Infineon<br>technologies<br>;||||**SPA20N60CFD**||
|||||||
|**Parameter**||**Symbol **|**Conditions**|**Values**|**Unit**|
|||||**min.**<br>**typ.**<br>**max.**||
|**Dynamic characteristics**||||||
|Input capacitance<br>Output capacitance<br>Reverse transfer capacitance<br>Effective output capacitance, energy<br>related4)<br>Effective output capacitance, time<br>related5)|_C_iss<br>-<br>2400<br>-<br>_C_oss<br>-<br>780<br>-<br>_C_rss<br>-<br>50<br>-<br>_C_o(er)<br>-<br>83<br>-<br>_C_o(tr)<br>-<br>160<br>-<br>_V_GS=0 V,_V_DS=25 V,<br>_f_=1 MHz<br>_V_GS=0 V,_V_DS=0 V<br>to 480 V<br>~~||~~<br>~~Pf~~<br>~~||~~<br>~~Pf~~<br>~~eee~~||||pF|
|Turn-on delay time<br>Rise time<br>Turn-off delay time<br>Fall time|_t_d(on)<br>_t_r<br>_t_d(off)<br>_t_f<br>~~||~~<br>~~||~~<br>~~||~~<br>~~||~~||_V_DD=380 V,<br>_V_GS=10 V,_I_D=20.7 A,<br>_R_G=3.6W|-<br>12<br>-<br>-<br>15<br>-<br>-<br>59<br>-<br>-<br>6.4<br>-<br>~~Pf~~<br>~~Pf~~<br>~~Pf~~<br>~~Ff~~|ns|
|Gate Charge Characteristics||||||
|Gate to source charge||_Q_gs||-<br>15<br>-|nC|
|Gate to drain charge||_Q_gd|_V_DD=480 V,<br>_I_D=20.7 A,|-<br>54<br>-||
|Gate charge total||_Q_g|_V_GS=0 to 10 V|-<br>95<br>124||
|Gate plateau voltage||_V_plateau||-<br>7.0<br>-|V|



0) J-STD20 and JESD22 

> 1) Limited only by maximum temperature. 

> 2) Pulse width _t_ p limited by _T_ j,max 

> 3) Repetitive avalanche causes additional power losses that can be calculated as _P_ AV= _E_ AR* _f._ 

4) _C_ o(er) is a fixed capacitance that gives the same stored energy as _C_ oss while _V_ DS is rising from 0 to 80% _V_ DSS. 

5) _C_ o(tr) is a fixed capacitance that gives the same charging time as _C_ oss while _V_ DS is rising from 0 to 80% _V_ DSS. 

**Rev. 1.4** 

**page 3** 

**2012-02-19** 

|**Reverse Diode**|||||||
|---|---|---|---|---|---|---|
|Diode continuous forward current1)|_I_S|_T_C=25 °C|-|-|20.7|A|
|Diode pulse current2)|_I_S,pulse||-|-|52||
|Diode forward voltage|_V_SD|_V_GS=0 V,_I_F=20.7 A,<br>_T_j=25 °C|-|1.0|1.2|V|
|Reverse recovery time|_t_rr|_V_R=480 V,_I_F=_I_S,<br>d_i_F/d_t_=100 A/µs|-|150|-|ns|
|Reverse recovery charge|_Q_rr||-|1|-|µC|
|Peak reverse recovery current|_I_rrm||-|13|-|A|



## **Typical Transient Thermal Characteristics** 

|**Symbol**|**Value**|**Unit**|**Symbol**|**Value**|**Unit**|
|---|---|---|---|---|---|
||**typ.**|||**typ.**||
|**_R_th1**|**0.00862**|**K/W**|**_C_th1**|**0.000205**|**Ws/K**|
|**_R_th2**|**0.0471**||**_C_th2**|**0.00198**||
|_R_th3|0.119||_C_th3|0.0068||
|_R_th4|0.476||_C_th4|0.0482||
|_R_th5|1.57||_C_th5|0.957||
||||_C_th6|0.1||



5) _C_ th6 models the additional heat capacitance of the package in case of non-ideal cooling. It is not needed if _R_ thCA=0 K/W. 

**Rev. 1.4** 

**page 4** 

**2012-02-19** 

**SPA20N60CFD** 

**1 Power dissipation** 

_P_ TOT=f( _T_ C) 

## **2 Safe operating area** 

_I_ D=f( _V_ DS); _T_ C=25 °C; _D_ =0 

parameter: _t_ p 

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**----- Start of picture text -----**<br>
40<br>30<br>20<br>10<br>0<br>0 40 80 120 160<br>T C [°C]<br> [W]<br>tot<br>P<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
10 [2]<br>limited by on-state<br>resistancelimi ed by on-state<br>resistance<br>1 µs<br>10 µs<br>10 [1]<br>100 µs<br>1 ms<br>10 [0]<br>10 ms<br>DC<br>10 [-1]<br>10 [0] 10 [1] 10 [2] 10 [3]<br>V DS [V]<br> [A]<br>I D<br>**----- End of picture text -----**<br>


## **3 Max. transient thermal impedance** 

_Z thJC_ =f(tP) parameter: _D=t_ p/ _T_ 

## **4 Typ. output characteristics** 

_I_ D=f( _V_ DS); _T_ j=25 °C parameter: _V_ GS 

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**----- Start of picture text -----**<br>
10 [1] 60<br>10 V<br>50<br>8 V<br>0.5<br>10 [0] 40<br>0.2 7.5 V<br>0.1 30<br>0.05<br>0.02<br>7 V<br>10 [-1] 0.01 20<br>single pulse<br>6.5 V<br>10<br>6 V<br>5.5 V<br>5 V<br>10 [-2] 0<br>10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] 10 [0] 10 [1] 0 5 10 15 20 25<br>t p [s] V DS [V]<br> [K/W]  [A]<br>I D<br>thJC<br>Z<br>**----- End of picture text -----**<br>


**Rev. 1.4** 

**2012-02-19** 

**page 5** 

**SPA20N60CFD** ~~technologies re~~ 

## **5 Typ. output characteristics** 

_I_ D=f( _V_ DS); Tj=150°C 

parameter: _V_ GS 

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**----- Start of picture text -----**<br>
40<br>20 V<br>7.5 V<br>30<br>7 V<br>20 — aaf 6.5 V<br>6 V<br>Lf<br>10<br>f——<br>fe 5.5 V<br>fe| | 5 V<br>4.5 V<br>0 fp<br>0 4 8 12 16 20 24<br>V DS [V]<br> [A]<br>I D<br>**----- End of picture text -----**<br>


## **7 Drain-source on-state resistance** 

_R_ DS(on)=f( _T_ j); _I_ D=13.1 A; _V_ GS=10 V 

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**----- Start of picture text -----**<br>
0.6<br>el TIT<br>st 0.5 SERRELEEE TTT TT Ty<br>0.4<br>2 tt t ttttt ttt tytttyt<br>0.3 SEE<br>SEE<br>0.2<br>EE ee<br>0.1 ,aRREREP7 Anan<br>ete<br>cert 0 "CTE | tT<br>“60-20 -60 -20 20 20 T j [°C] «60 60 TTT «100 100 CS 140 (‘180 180<br>]<br>W<br> [<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


## **6 Typ. drain-source on-state resistance** 

_R_ DS(on)=f( _I_ D); _T_ j=150 °C parameter: _V_ GS 

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**----- Start of picture text -----**<br>
1.5<br>1.2<br>0.9<br>4.5 V<br>5 V 5.5 V 6 V 6.5 V 7 V 7.5 V<br>0.6 20 V<br>) LZ"<br>——<br>0.3 P|<br>0<br>0 5 10 15 20 25 30 35<br>I D [A]<br>][ W<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


## **8 Typ. transfer characteristics** 

_I_ D=f( _V_ GS); | _V_ DS|>2| _I_ D| _R_ DS(on)max parameter: _T_ j 

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**----- Start of picture text -----**<br>
70<br>60 Pt | |<br>25 °C<br>50 |<br>|<br>40<br>|<br>150 °C<br>30<br>|<br>20 i<br>10<br>}<br>]J<br>0<br>0 4 8 12 16 20<br>V GS [V]<br> [A]<br>I D<br>**----- End of picture text -----**<br>


**Rev. 1.4** 

**page 6** 

**2012-02-19** 

**SPA20N60CFD** 

**9 Typ. gate charge** 

## **10 Forward characteristics of reverse diode** 

_V_ GS=f( _Q_ gate); _I_ D=20.7 A pulsed 

_I_ F=f( _V_ SD) 

parameter: _V_ DD 

parameter: _T_ j 

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**----- Start of picture text -----**<br>
15 10 [2]<br>25°C, 98%<br>10 120 V 480 V 10 [1]<br>150 °C<br>150°C 98%<br>25 °C<br>5<br>|<br>0 10 [-1]<br>0 50 100 150 0 0.5 1 1.5 2<br>Q gate [nC] V SD [V]<br>11 Avalanche SOA 12 Avalanche energy<br> AR=f(=f( t  AR)) E  AS=f( T  j);  I  D=10 A;  V  DD=50 V<br>parameter:  T  j(start)<br>20 750<br>600<br>15<br>450<br>10<br>25 °C<br>125 °C<br>300<br>5<br>150<br>0 0<br>10 [-3] 10 [-2] 10 [-1] 10 [0] 10 [1] 10 [2] 10 [3] 10 [4] 20 60 100 140 180<br>t AR [µs] T j [°C]<br> [V]  [A]<br>V GS I F<br> [A]  [mJ]<br>I AV E AS<br>**----- End of picture text -----**<br>


## **11 Avalanche SOA** 

_I_ AR=f(=f( _t_ AR)) 

parameter: _T_ j(start) 

**Rev. 1.4** 

**2012-02-19** 

**page 7** 

**SPA20N60CFD** 

**13 Drain-source breakdown voltage** 

_V_ BR(DSS)=f(T _j_ ); _I_ D=10mA 

## **14 Typ. capacitances** 

_C_ =f( _V_ DS); _V_ GS=0 V; _f_ =1 MHz 

**==> picture [465 x 611] intentionally omitted <==**

**----- Start of picture text -----**<br>
700 10 [5]<br>10 [4]<br>660<br>Ciss<br>10 [3]<br>620<br>10 [2] Coss<br>—<br>580<br>Crss<br>10 [1]<br>=<br>540 10 [0]<br>-60 -20 20 60 100 140 180 0 100 200 300 400 500<br>T j [°C] V DS [V]<br>15 Typ.  C  oss stored energy stored energy 16 Typ. reverse recovery charge<br> oss =  f (V  DS ) Q  rr=f( T  j);  I  S=20.7 A<br>14 1.8<br>12<br>1.6<br>fi |<br>10<br>7<br>8<br>1.4<br>Anna<br>6<br>4<br>1.2<br>2<br>0 Z Z| 1 Zann<br>0 200 400 600 25 50 75 100 125<br>V DS [V] T j [°C]<br> [V]<br> [pF]<br>C<br>BR(DSS)<br>V<br> [µJ]<br> [µC]<br>oss rr<br>E Q<br>**----- End of picture text -----**<br>


## **15 Typ.** _**C**_ **oss stored energy stored energy** 

_E_ oss _=_ f _(V_ DS _)_ 

**Rev. 1.4** 

**page 8** 

**2012-02-19** 

**SPA20N60CFD** 

**17 Typ. reverse recovery charge** 

Q _rr =_ f _(I_ S _);_ d _i_ /d _t_ =100A/µs 

parameter: _T_ j 

## **18 Typ. reverse recovery charge** 

_Q_ rr=f(d _i_ /d _t_ ); _I D_ =20.7 A 

parameter: _T_ j 

**==> picture [466 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
2 3.5<br>- -<br>3<br>1.5<br>P Ee 125 °C coeeee] Ey<br>125 °C<br>2.5<br>1<br>25 °C<br>2<br>0.5 C o e 25 °C<br>1.5<br>0 AnH] 1 G EE<br>2 4 6 8 10 12 14 16 18 20 100 300 500 700 900<br>I S [A] di/ d t  [A/µs]<br> [µC]  [µC]<br>rr rr<br>Q Q<br>**----- End of picture text -----**<br>


**Rev. 1.4** 

**page 9** 

**2012-02-19** 

**SPA20N60CFD** 

## **Definition of diode switching characteristics** 

**Rev. 1.4** 

**page 10** 

**2012-02-19** 

**SPA20N60CFD** 

**PG-TO220-3-31: Outline** 

Dimensions in mm 

**Rev. 1.4** 

**page 11** 

**2012-02-19** 

**SPA20N60CFD** 

## **Published by** 

**Infineon Technologies AG D-81726 München, Germany** 

## **© Infineon Technologies AG 2006 All Rights Reserved.** 

## **Attention please!** 

The information herein is given to describe certain components and shall not be considered as warranted characteristics. 

Terms of delivery and rights to technical change reserved. 

We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. 

Infineon Technologies is an approved CECC manufacturer. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact your nearest Infineon Technologies office in Germany or our Infineon Technologies representatives worldwide (see address list). 

## **Warnings** 

Due to technical re **q** uirements, com **p** onents ma **y** contain dan **g** erous substances. For information on the types in question, please contact your nearest Infineon Technologies office. 

Infineon Technologies' components may only be used in life-support devices or systems with the expressed written approval of Infineon Technologies if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

**Rev. 1.4** 

**page 12** 

**2012-02-19** 



## Links

- [View this product on Novapart](https://novapart.co/products/SPA20N60CFDXKSA1/power-mosfet-n-channel-600-v-207-a-022-ohm-to-220f)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/spa20n60cfdxksa1/mosfet-n-600v-to-220f/dp/1471775)
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