# Power MOSFET, N Channel, 800 V, 11 A, 0.45 ohm, TO-220FP, Through Hole

![Product image](https://novapart.co/image/farnell:1095692/)

**URL**: https://novapart.co/products/SPA11N80C3XKSA1/power-mosfet-n-channel-800-v-11-a-045-ohm-to-220fp
**SKU**: SPA11N80C3XKSA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.9570
**Stock**: 100+
**Lead Time**: 85 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:11A; Drain Source Voltage Vds:800V; On Resistance Rds(on):0.39ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3V; Power Di

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 41W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220FP |
| Drain Source Voltage Vds | 800V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 11A |
| Drain Source On State Resistance | 0.45ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1095692/)

**SPA11N80C3** 

## **CoolMOS[TM] Power Transistor** 

## **Features** 

- New revolutionary high voltage technology 

- Extreme dv/dt rated 

## **Product Summary** 

|**Product Summary**|||
|---|---|---|
||||
|_V_DS|800|V|
||||
|_R_DS(on)max@ T_j_ = 25°C|0.45|Ω|
||||
|_Q_g,typ|64|nC|



- High peak current capability 

- Qualified according to JEDEC[1)  ] for target applications 

- Pb-free lead plating; RoHS compliant 

- Ultra low gate charge 

- Ultra low effective capacitances 

- Fully isolated package (2500 VAC; 1 minute) 

## **CoolMOS[TM] 800V designed for:** 

- Industrial application with high DC bulk voltage 

- Switching Application ( i.e. active clamp forward ) 

|**Parameter**<br>**Symbol**<br>~~rr~~|**Symbol **<br>~~rr~~|**Conditions**<br>~~rr~~|**Unit**<br>**Value**<br>~~rr~~|**Unit**|
|---|---|---|---|---|
|Continuous drain current2)<br>_I_<br>~~EE~~|_I_D<br>~~EE~~|_T_C=25 °C<br>~~EE~~|A<br>11<br>7.1<br>33<br>~~EE~~<br>~~rr~~<br>~~a~~|A|
|||_T_C=100 °C<br>~~EE~~<br>~~rr~~|||
|Pulsed drain current3)<br>_I_<br>~~a~~|_I_D,pulse<br>~~a~~|_T_C=25 °C<br>~~a~~|||
|Avalanche energy, single pulse<br>_E_<br>~~rr~~|_E_AS<br>~~rr~~|_I_D=2.2 A,_V_DD=50 V<br>~~rr~~|470<br>mJ<br>0.2<br>~~rr~~<br>~~a~~|mJ|
|Avalanche energy, repetitive_t_AR<br>3),4)<br>_E_<br>~~a~~|_E_AR<br>~~a~~|_I_D=11 A,_V_DD=50 V<br>~~a~~|||
|Avalanche current, repetitive_t_AR<br>3),4)<br>_I_<br>~~rr~~|_I_AR<br>~~rr~~|~~rr~~|A<br>11<br>~~rr~~|A|
|MOSFET d_v_/d_t_ruggedness<br>d<br>~~re~~|d_v_/d_t_<br>~~re~~|_V_DS=0…640 V<br>~~re~~|V/ns<br>50<br>~~re~~|V/ns|
|Gate source voltage<br>_V_<br>~~———~~|_V_GS<br>~~———~~|static<br>~~———~~|V<br>±30<br>±20<br>~~———~~<br>~~rr~~|V|
|||AC (_f_>1 Hz)<br>~~———~~<br>~~rr~~|||
|Power dissipation<br>_P_<br>~~rr~~|_P_tot<br>~~rr~~|_T_C=25 °C<br>~~rr~~|W<br>34<br>~~rr~~|W|
|Operating and storage temperature<br>_T_<br>~~a~~|_T_j,_T_stg<br>~~a~~|~~a~~|°C<br>-55 ... 150<br>~~a~~|°C|
|Mounting torque<br>~~rr~~|~~rr~~|M2.5 screws<br>~~rr~~|50<br>Ncm<br>~~rr~~|Ncm|



Rev. 2.93 

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**SPA11N80C3** 

**Maximum ratings,** at _T_ j=25 °C, unless otherwise specified 

||**Parameter**||**Symbol **|**Conditions**||**Value**||**Unit**|
|---|---|---|---|---|---|---|---|---|
||Continuous diode forward current||_I_S|||11||A|
|||||_T_C=25 °C|||||
||Diode pulse current3)||_I_S,pulse|||33|||
||Reverse diode d_v_/d_t_ 5)||d_v_/d_t_|||4||V/ns|
|**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~|||||||||
||**Thermal characteristics**||||||||
||Thermal resistance, junction - case||_R_thJC||-|-|3.7|K/W|
||Thermal resistance, junction -<br>ambient||_R_thJA|leaded|-|-|80||
||Soldering temperature,<br>wave soldering only allowed at leads|wave soldering only allowed at leads|wave soldering only allowed at leads_T_sold|1.6 mm (0.063 in.)<br>from case for 10s|-|-|260|°C|
||**Electrical characteristics,**at_T_j=25 °C, unless otherwise specified|=25 °C, unless otherwise specified||=25 °C, unless otherwise specified|||||
||**Static characteristics**||||||||
||Drain-source breakdown voltage||_V_(BR)DSS|_V_GS=0 V,_I_D=250 µA|800|-|-|V|
||Avalanche breakdown voltage||_V_(BR)DS|_V_GS=0 V,_I_D=11 A|-|870|-||
||Gate threshold voltage||_V_GS(th)|_V_DS=_V_GS,_I_D=0.68 mA|2.1|3|3.9||
||Zero gate voltage drain current<br>Gate-source leakage current||_I_DSS<br>_V_DS=800 V,_V_GS=0 V,<br>_T_j=25 °C<br>-<br>-<br>20<br>_V_DS=800 V,_V_GS=0 V,<br>_T_j=150 °C<br>-<br>100<br>-<br>_I_GSS<br>_V_GS=20 V,_V_DS=0 V<br>-<br>-<br>100<br>~~ieeeee~~|||||µA<br>nA|
||Drain-source on-state resistance<br>Gate resistance||_R_DS(on)<br>_V_GS=10 V,_I_D=7.1 A,<br>_T_j=25 °C<br>-<br>0.39<br>0.45<br>_V_GS=10 V,_I_D=7.1 A,<br>_T_j=150 °C<br>-<br>1.05<br>-<br>_R_G<br>_f_=1 MHz, open drain<br>-<br>1.2<br>-<br>~~ieseee~~|||||Ω<br>Ω|



Rev. 2.93 

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**SPA11N80C3** 

|~~ee~~|**Parameter**<br>**Dynamic characteristics**<br>~~ee~~|**Symbol Conditions**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~<br>~~ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|
||Input capacitance<br>Output capacitance|_C_iss<br>-<br>1600<br>-<br>_C_oss<br>-<br>65<br>-<br>_V_GS=0 V,_V_DS=100 V,<br>_f_=1 MHz<br>~~oe~~|pF|
||Effective output capacitance, energy<br>related6)<br>Effective output capacitance, time<br>related7)|_C_o(er)<br>-<br>50<br>-<br>_C_o(tr)<br>-<br>140<br>-<br>_V_GS=0 V,_V_DS=0 V<br>to 480 V<br>~~een~~<br>~~a~~<br>~~| |~~||
||Turn-on delay time<br>Rise time<br>Turn-off delay time<br>Fall time<br>**Gate Charge Characteristics**|_t_d(on)<br>-<br>25<br>-<br>_t_r<br>-<br>15<br>-<br>_t_d(off)<br>-<br>72<br>-<br>_t_f<br>-<br>10<br>-<br>_V_DD=400 V,<br>_V_GS=0/10 V,_I_D=11 A,<br>_R_G=7.5 ? , T_j_= 25°C<br>~~S~~E~~ES~~<br>~~pe~~<br>~~|~~<br>~~|~~|ns|
||Gate to source charge|_Q_gs<br>-<br>8<br>-|nC|
||Gate to drain charge|_Q_gd<br>-<br>30<br>-<br>_V_DD=640 V,_I_D=11 A,||
||Gate charge total|_Q_g<br>-<br>64<br>85<br>_V_GS=0 to 10 V||
||Gate plateau voltage|_V_plateau<br>-<br>5.5<br>-|V|



## **Reverse Diode** 

|**Reverse Diode**|||||||
|---|---|---|---|---|---|---|
|Diode forward voltage|_V_SD|_V_GS=0 V,_I_F=_I_S=11 A,<br>_T_j=25 °C|-|1|1.2|V|
|Reverse recovery time|_t_rr|_V_R=400 V,<br>_I_F=_I_S=11 A,<br>d_i_F/d_t_=100 A/µs|-|550|-|ns|
|Reverse recovery charge|_Q_rr||-|10|-|µC|
|Peak reverse recovery current|_I_rrm||-|33|-|A|



- 1) J-STD20 and JESD22 

- 2) Limited only by maximum temperature 

- 3) Pulse width _t_ p limited by _T_ j,max 

- 4) Repetitive avalanche causes additional power losses that can be calculated as _P_ AV= _E_ AR* _f._ 

- 5) ISD=ID, di/dt=400A/µs, VDClink = 400V,  Vpeak<V(BR)DSS, Tj<T _jmax_ , identical low side and high side switch 

- 6) _C_ o(er) is a fixed capacitance that gives the same stored energy as _C_ oss while _V_ DS is rising from 0 to 80% _V_ DSS. 

- 7) _C_ o(tr) is a fixed capacitance that gives the same charging time as _C_ oss while _V_ DS is rising from 0 to 80% _V_ DSS. 

Rev. 2.93 

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2018-02-12 

**SPA11N80C3** 

_P_ tot=f( _T_ C) 

## **1 Power dissipation** 

## **2 Safe operating area** 

_I_ D=f( _V_ DS); _T_ C=25 °C; _D_ =0 

parameter: _t_ p 

**==> picture [473 x 610] intentionally omitted <==**

**----- Start of picture text -----**<br>
40 10 [2]<br>limited by on-state<br>resistance<br>30 10 µs 1 µs<br>10 [1]<br>100 µs<br>1 ms<br>20<br>10 ms<br>10 [0]<br>10 DC<br>Na<br>0 10 [-1]<br>0 25 50 75 100 125 150 1 10 100 1000<br>T  C [°C] V  DS [V]<br>3 Max. transient thermal impedance 4 Typ. output characteristics<br>ZthJC=f(tP) I  D=f( V  DS);  T  j=25 °C;  t  p=10 µs<br>parameter:  D=t  p/ T parameter:  V  GS<br>10 [1] 40<br>20 V<br>0.5 30<br>10 V<br>10 [0]<br>0.2<br>0.1<br>20<br>6.5 V<br>0.05<br>0.02<br>10 [-1] 6 V<br>0.01<br>10<br>5.5 V<br>single pulse<br>5 V<br>wi<br>10 [-2] 0<br>10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] 10 [0] 10 [1] 0 5 10 15 20 25<br>t  p [s] V  DS [V]<br>Z<br> [W]  [A]<br>P  tot I  D<br> [K/W]  [A]<br>I  D<br> thJC<br>Z<br>**----- End of picture text -----**<br>


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**SPA11N80C3** 

## **5 Typ. output characteristics** 

_I_ D=f( _V_ DS); _T_ j=150 °C; _t_ p=10 µs parameter: _V_ GS 

## **6 Typ. drain-source on-state resistance** 

_R_ DS(on)=f( _I_ D); _T_ j=150 °C 

parameter: _V_ GS 

**==> picture [461 x 609] intentionally omitted <==**

**----- Start of picture text -----**<br>
21 1.8<br>10 V 20 V<br>18<br>6 V<br>1.6<br>10 V<br>15<br>6.5 V<br>5.5 V 1.4<br>12<br>20 V<br>6 V<br>9<br>5 V 1.2 4 V 4.5 V 5 V<br>6<br>4.5 V<br>1<br>3<br>0 0.8<br>0 5 10 15 20 25 0 5 10 15 20 25 30<br>V  DS [V] [V] I  D [A]<br>7 Drain-source on-state resistance 8 Typ. transfer characteristics<br> DS(on)=f(=f( T  j); );  I  D=7.1 A; =7.1 A;  V  GS=10 V=10 V I  D=f( V  GS); | V  DS|>2| I  D| R  DS(on)max;  t  p=10 µs<br>parameter:  T  j<br>1.2 40<br>25 °C<br>1<br>30<br>0.8<br>150 °C<br>0.6 20<br>98 %<br>typ<br>0.4<br>10<br>0.2<br>0 0<br>-60 -20 20 60 100 140 180 0 2 4 6 8 10<br>T  j [°C] V  GS [V]<br>[a]<br>]<br>Ω<br> [A]  [<br>I  D<br> DS(on)<br>R<br>]<br>[ Ω  [A]<br>I  D<br> DS(on)<br>R<br>**----- End of picture text -----**<br>


**==> picture [223 x 265] intentionally omitted <==**

**----- Start of picture text -----**<br>
21<br>10 V 20 V<br>18<br>6 V<br>15<br>5.5 V<br>12<br>9<br>5 V<br>6<br>4.5 V<br>3<br>0<br>0 5 10 15 20 25<br>V  DS [V] [V]<br> [A]<br>I  D<br>**----- End of picture text -----**<br>


## **7 Drain-source on-state resistance** 

_R_ DS(on)=f(=f( _T_ j); ); _I_ D=7.1 A; =7.1 A; _V_ GS=10 V=10 V 

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**SPA11N80C3** 

## **9 Typ. gate charge** 

## **10 Forward characteristics of reverse diode** 

_V_ GS=f( _Q_ gate); _I_ D=11 A pulsed parameter: _V_ DD 

_I_ F=f( _V_ SD); _t_ p=10 µs parameter: _T_ j 

**==> picture [464 x 610] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 10 [2]<br>8 160 V<br>150°C (98%)<br>25 °C<br>640 V<br>10 [1]<br>aay/A<br>6 150 °C<br>ff 25°C (98°C)<br>rey<br>4<br>10 [0]<br>2<br>po ae<br>0 10 [-1]<br>0 10 20 30 40 50 60 70 0 0.5 1 1.5 2<br>Q  gate [nC] V  SD [V]<br>11 Avalanche energy 12 Drain-source breakdown voltage<br> AS=f(=f( T  j); );  I  D=2.2 A; =2.2 A;  V  DD=50 V=50 V V  BR(DSS)=f( T  j);  I  D=0.25 mA<br>500 960<br>920<br>wane<br>400<br>880<br>anne<br>300<br>840<br>800<br>200 PN<br>760<br>100 Eanes<br>720<br>oN<br>0 680<br>25 50 75 100 125 150 -60 -20 20 60 100 140 180<br>T  j [°C] T  j [°C]<br> [V]  [A]<br>V  GS I  F<br> [V]<br> [mJ]<br> AS<br>E  BR(DSS)<br>V<br>**----- End of picture text -----**<br>


## **11 Avalanche energy** 

_E_ AS=f(=f( _T_ j); ); _I_ D=2.2 A; =2.2 A; _V_ DD=50 V=50 V 

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**SPA11N80C3** 

**13 Typ. capacitances** 

_C_ =f( _V_ DS); _V_ GS=0 V; _f_ =1 MHz 

## **14 Typ. Coss stored energy** 

_E_ oss _=_ f _(V_ DS _)_ 

**==> picture [464 x 266] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 [4] 12<br>Ciss 10<br>10 [3]<br>rm ay<br>8<br>10 [2] 6<br>Ve Goh<br>Coss<br>4<br>10 [1] Crss<br>SSee /<br>2<br>PA ACE<br>10 [0] 0<br>0 100 200 300 400 500 600 700 800 0 100 200 300 400 500 600 700 800<br>V  DS [V] V  DS [V]<br> [µJ]<br>  [pF]<br>C  oss<br>E<br>**----- End of picture text -----**<br>


Rev. 2.93 

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Page 7 

**SPA11N80C3** 

## **Definition of diode switching characteristics** 

Rev. 2.93 

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**SPA11N80C3** 

**Outline PG­TO220 FullPAK** 

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**SPA11N80C3** 

## SPA11N80C3 

|Previous Revision|Previous Revision||
|---|---|---|
|Revision|Date|Subjects (major changes since last revision)|
|2.92|2014-02-21|Ptot change according to diagramme 1 "power dissipation"|
|2.93|2018-02-27|Outline PG-TO-220 FullPAK update|



## **erratum@infineon.com** 

## **Information** 

**www.infineon.com** ). 

## **Warnings** 

10 



## Links

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- [Supplier page](https://es.farnell.com/infineon/spa11n80c3xksa1/mosfet-n-coolmos-to-220fp/dp/1095692)
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