# Power MOSFET, N Channel, 650 V, 11 A, 0.38 ohm, TO-220F, Through Hole

![Product image](https://novapart.co/image/farnell:1471771/)

**URL**: https://novapart.co/products/SPA11N65C3XKSA1/power-mosfet-n-channel-650-v-11-a-038-ohm-to-220f
**SKU**: SPA11N65C3XKSA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.8960
**Stock**: 50+
**Lead Time**: 85 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:11A; Drain Source Voltage Vds:650V; On Resistance Rds(on):0.34ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3V; Power Dissip

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 33W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220F |
| Drain Source Voltage Vds | 650V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 11A |
| Drain Source On State Resistance | 0.38ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1471771/)

## **SPP11N65C3,SPA11N65C3 SPI11N65C3** 

## **Cool MOS™ Power Transistor** 

## **Feature** 

- New revolutionary high voltage technology 

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|||||
|---|---|---|---|
|V|650|V|
|DS|
|R|0.38|Ω|
|DS(on)|
|I|D|11|A|

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- Ultra low gate charge 

- Periodic avalanche rated 

PG-TO262             PG-TO220FP      PG-TO220 

- Extreme d _v_ /d _t_ rated 

- High peak current capability 

- Improved transconductance 

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|||||
|---|---|---|---|
|Type|Package|Ordering Code|Marking|
|SPP11N65C3|PG-TO220|Q67040-S4557|11N65C3|
|SPA11N65C3|PG-TO220FP|SP000216318|11N65C3|
|SPI11N65C3|PG-TO262|Q67040-S4561|11N65C3|

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## **Maximum Ratings** 

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|||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
|Parameter|Symbol|Value|Unit|
|SPP_I|SPA|
|||-——|
|Continuous drain current|I|D|A|
|T|C = 25 °C|11|11|[1)]|
|T|C = 100 °C|7|7|[1)]|
|Pulsed drain current,|t|p limited by|T|jmax|aa|I|D puls|33|33|A|
|Avalanche energy, single pulse|E|AS|340|340|mJ|
|I|D=2.5A,|V|DD=50V|
|Avalanche energy, repetitive|t|AR limited by|T|jmax|[2)]|E|AR|0.6|0.6|
|I|D=4A,|V|DD=50V|
|Avalanche current, repetitive|t|AR limited by|T|jmax|a|I|AR|a|4|4|A|
|Gate source voltage|V|GS|±20|±20|V|
|a|ee|
|Gate source voltage AC (f >1Hz)|a|V|GS|±30|±30|
|Power dissipation,|T|C = 25°C|a|P|tot|a|125|33|W|
|Operating and storage temperature|a|T|j|,|T|stg|-55...+150|°C|

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200 9 - 11 -30 

Rev. 2.9 1 Page 1 

**SPP11N65C3,SPA11N65C3** Cinfineon **SPI11N65C3 Maximum Ratings Parameter Symbol Value Unit** Drain Source voltage slope d _v_ /d _t_ 50 V/ns _V_ DS = 480 V, _I_ D = 11 A, _T_ j = 125 °C ee ee **Thermal Characteristics Parameter Symbol Values Unit** eee **min. typ. max.** Thermal resistance, junction - case _R_ thJC - - 1 K/W Thermal resistance, junction - case, FullPAK ee _R_ thJC_FP - - 3.8 Thermal resistance, junction - ambient, leaded _R_ thJA - - 62 Thermal resistance, junction - ambient, FullPAK ee _R_ thJA_FP - - 80 SMD version, device on PCB: _R_ thJA @ min. footprint - - 62 @ 6 cm[2] cooling area[3)] - 35 - ae Soldering temperature, wavesoldering _T_ sold - - 260 °C 1.6 mm (0.063 in.) from case for 10s | |tt 

## **SPP11N65C3,SPA11N65C3 SPI11N65C3** 

|j=25°C unless otherwise specified<br>**Parameter**|j=25°C unless otherwise specified<br>**Symbol**<br>a=|j=25°C unless otherwise specified<br>**Conditions**<br>a=|j=25°C unless otherwise specified<br>**Values**<br>a=|j=25°C unless otherwise specified<br>**Values**<br>a=|j=25°C unless otherwise specified<br>**Values**<br>a=|**Unit**|
|---|---|---|---|---|---|---|
||||**min.**<br>a=|**typ.**<br>a=|**max.**<br>a=||
|Drain-source breakdown voltage|_V_(BR)DSS<br>a=<br>pf|_V_GS=0V, _I_D=0.25mA<br>a=<br>pf<br>ft|650<br>a=<br>ft|-<br>a=<br>|-<br>a=<br>|V|
|Drain-Source avalanche<br>breakdown voltage|_V_(BR)DS<br>pf<br>P||_V_GS=0V, _I_D=4A<br>pf<br>ft<br>P||-<br>ftft<br>|730<br>ft<br>|-<br>ft<br>||
|Gate threshold voltage|_V_GS(th)<br>pf<br>P||_I_D=500µA, _V_GS=VDS<br>pf<br>ft<br>P||2.1<br>ftft<br>|3<br>ft<br>|3.9<br>ft<br>||
|Zero gate voltage drain current|GS(th)<br>_I_DSS<br>pf<br>P|<br>p||_V_DS=600V,_V_GS=0V,<br>_T_j=25°C<br>_T_j=150°C<br>pf<br>ft<br>P|ft<br>p||-<br>-<br>ftft<br>ft<br>|0.1<br>-<br>ft<br>ft<br>|1<br>100<br>ft<br>ft<br>|µA|
|Gate-source leakage current|_I_GSS<br>P|<br>p||_V_GS=20V,_V_DS=0V<br><br>P|ft<br>p||-<br>ft<br>ft<br>|-<br>ft<br>ft<br>|100<br>ft<br>ft<br>|nA|
|Drain-source on-state resistance|_R_DS(on)<br>P|<br>p||_V_GS=10V,_I_D=7A<br>_T_j=25°C<br>_T_j=150°C<br><br>P| ft<br>p|tid|-<br>-<br>ft<br>ft<br>tid|0.34<br>0.92<br>ft<br>ft<br>tid|0.38<br>-<br>ft<br>ft<br>tid|Ω|
|Gate input resistance|_R_G<br><br>p||_f_=1MHz, open drain<br> ft<br>p|tid|-<br>ft<br>tid|0.86<br>ft<br>tid|-<br>ft<br>tid||



**SPP11N65C3,SPA11N65C3 SPI11N65C3** 

## **Electrical Characteristics** 

|**Electrical Characteristics**|||||||
|---|---|---|---|---|---|---|
|**Parameter**<br>——|**Symbol**<br>—-—<br>——|**Conditions**<br>—-—<br>ft|**Values**<br>—-—|||**Unit**|
||||**min.**<br>—-—<br>fttL|**typ.**<br>—-—<br>tL|**max.**<br>—-—||
|Transconductance<br>——|_g_fs<br>|<br>——|_V_DS≥2*_I_D*_R_DS(on)max,<br>_I_D=7A<br>|<br>ft|-<br>|<br>fttL|8.3<br>|<br>tL|-<br>||S|
|Input capacitance<br>——|_C_iss<br>——<br>i|_V_GS=0V, _V_DS=25V,<br>_f_=1MHz<br>ft<br>i<br>oe|-<br>fttL<br>es<br>i|1200<br>tL<br>es<br>i|-<br>es<br>i|pF|
|Output capacitance<br>——|_C_oss<br>——<br>i<br>——||-<br>ft tL<br>i<br>ee|390<br>tL<br>i<br>ee|-<br>i<br>ee||
|Reverse transfer capacitance|_C_rss<br>i<br>——||-<br>i<br>ee<br>||30<br>i<br>ee<br>ft|-<br>i<br>ee<br>ft||
|Effective output capacitance,4)<br>energy related|_C_o(er)<br>——|_V_GS=0V,<br>_V_DS=0V to 480V<br>oe|-<br>ee<br>||45<br>ee<br>ft|-<br>ee<br>ft||
|Effective output capacitance,5)<br>time related|_C_o(tr)||-<br>||85<br>ft|-<br>ft||
|Turn-on delay time|_t_d(on)|_V_DD=380V,_V_GS=0/10V,<br>_I_D=11A,<br>_R_G=6.8Ω<br>oe|-<br>| <br>Pd|10<br> ft<br>Pd|-<br>ft<br>Pd|ns|
|Rise time<br>——<br>F|_t_r<br>—<br>——<br>F||-<br>es<br>es|5<br>es<br>es<br>ee|-<br>es<br>es||
|Turn-off delay time<br>——<br>F|_t_d(off)<br>——<br>F||-<br>es|44<br>es<br>ee|70<br>es||
|Fall time<br>——<br>F|_t_f<br>——<br>F||-<br>es<br>Ff]|5<br>es<br>ee<br>Ff]|9<br>es<br>Ff]||



1Limited only by maximum temperature 

2Repetitve avalanche causes additional power losses that can be calculated as _P_ AV= _E_ AR* _f_ . 

3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. 

4 _C_ o(er) is a fixed capacitance that gives the same stored energy as _C_ oss while _V_ DS is rising from 0 to 80% _V_ DSS. 

5 _C_ o(tr) is a fixed capacitance that gives the same charging time as _C_ oss while _V_ DS is rising from 0 to 80% _V_ DSS. 

200 9 - 11 -30 

Rev. 2.9 1 Page 3 

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|||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|SPP11N65C3,SPA11N65C3|
|Cinfineon|SPI11N65C3|
|Electrical Characteristics|
|Parameter|Symbol|Conditions|Values|Unit|
|||min.|typ.|max.|
|Inverse diode continuous|I|S|T|C=25°C|-|-|11|A|
|forward current|
|Inverse diode direct current,|I|SM|-|-|33|
|pulsed|
|ee||
|Inverse diode forward voltage|or|V|SD|V|GS=0V,|I|F=|I|S|-|1|1.2|V|
|Reverse recovery time|t|rr|V|R=480V,|I|F|=|I|S ,|-|400|600|ns|
|Reverse recovery charge|Q|rr|d|i|F/d|t|=100A/µs|-|6|-|µC|
|Peak reverse recovery current|oe—|I|rrm|TT|-|41|-|A|
|Peak rate of fall of reverse|di|rr|/dt|T|j=25°C|-|1200|-|A/µs|
|recovery current|P|tT|
|Typical Transient Thermal Characteristics|
|Symbol|Value|Unit|Symbol|Value|Unit|
|SPP_I|SPA|SPP_I|SPA|
|R|th1|ET|0.015|0.15|K/W|C|th1|0.0001878|0.0001878|Ws/K|
|R|th2|—|0.03|0.03|OF|C|th2|0.0007106|0.0007106|
|R|th3|sO|0.056|0.056|C|th3|0.000988|0.000988|
|R|th4|OE|0.197|0.194|C|th4|0.002791|0.002791|
|R|th5|OE|0.216|0.413|C|th5|0.007285|0.007401|
|R|th6|0.083|2.522|C|th6|0.063|0.412|
|External Heatsink|
|Tj|R th1|R th,n|Tcase|
|P|tot|(t)|
|Cth1|Cth2|Cth,n|
|Tamb|

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## **SPP11N65C3,SPA11N65C3 SPI11N65C3** 

200 9 - 11 -30 

Rev. 2.9 1 Page 4 

**SPP11N65C3,SPA11N65C3 SPI11N65C3** 

## **1 Power dissipation** 

_P_ tot = _f_ ( _T_ C) 

## **2 Power dissipation FullPAK** 

_P_ tot = _f_ ( _T_ C) 

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SPP11N65C3<br>140 35<br>W<br>TET EE TT TTT TTT  W TN<br>120 Pen EE EEE EEE BEAN<br>110<br>ANS TANTEI<br>100 PTT EN EE EEE EEL 25 \<br>90<br>NTT<br>80 20<br>PTT TEEN EEE EET N<br>70<br>TTT TT EN TTT SN<br>60 15<br>1 50 PET T TTT TEN EEE EET \<br>CONT ] TTT NTT<br>40 PTT ETT ETT EN EET 10 \<br>30<br>PTET TTT TT ETN ET ETN<br>20 PTT EET EEE NV 5 \\<br>100 [TELE] [L] [EEN] [|] 0 \<br>0 20 40 60 80 100 120 °C 160 0 20 40 60 80 100 120  °C 160<br>CEPTET [EET] CE = ULETTTETETTTND<br>T C T C<br>tot tot<br>P P<br>**----- End of picture text -----**<br>


## **3 Safe operating area** 

## _I_ D = _f_ ( _V_ DS ) 

parameter : _D_ = 0 , _T_ C=25°C 

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10 2<br> A<br>PT SS 7<br>10 1<br>HAI FT DNITAZ ON Hitt<br>10 0<br>tp = 0.0008 ms<br>_ tp = 0.01 ms Lat FEA<br>10 -1 tp = 0.1 ms<br>tp = 1 ms<br>DC<br>r Co<br>10 -2 a a I<br>10 0 10 1 10 2  V 10 3<br>V<br>——_ P DS<br>I D<br>**----- End of picture text -----**<br>


## **4 Safe operating area FullPAK** 

_I_ D = _f_ ( _V_ DS) 

parameter: _D_ = 0, _T_ C = 25°C 

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10 2<br> A<br>ees 7.<br>10 1<br>ZINES ONT<br>10 0<br>tp = 0.0008 ms<br>tp = 0.01 ms<br>AA MES I<br>10 -1 tp = 0.1 ms<br>tp = 1 ms<br>tp = 10 ms<br>DC<br>|<br>10 -210 0 10 1 aa 10 2  V Il 10 3<br>V<br>——_ DS<br>I D<br>**----- End of picture text -----**<br>


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Rev. 2.9 1 Page 5 

**SPP11N65C3,SPA11N65C3 SPI11N65C3** 

## **5 Transient thermal impedance FullPAK** 

_Z_ thJC = _f_ ( _t_ ) p 

parameter: _D_ = _t_ / _t_ p 

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10 1<br> K/W<br>10 0<br>10 -1<br>D = 0.5<br>D = 0.2<br>D = 0.1<br>10 -2 D = 0.05<br>D = 0.02<br>D = 0.01<br>single pulse<br>10 -3<br>sme<br>10 -4 A -7 -6 -5 -4 -3 -2 -1 1<br>10 10 10 10 10 10 10  s 10<br>t<br>p<br>thJC<br>Z<br>**----- End of picture text -----**<br>


## **6 Typ. output characteristic** 

_I_ D = _f_ ( _V_ DS); _T_ j=25°C parameter: _t_ p = 10 µs, _V_ GS 

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40<br>20V<br>A<br>10V<br>8V<br>32 7V<br>28<br>24 6,5V<br>20<br>6V<br>16<br>12 5,5V<br>8<br>5V<br>4 4,5V<br>FESS SES<br>0 rr [tTtrtfrtfrtfytty]<br>0 3 6 9 12 15 18 21 V 27<br>V DS<br>D<br>I<br>**----- End of picture text -----**<br>


## **7 Typ. output characteristic** 

_I_ D = _f_ ( _V_ DS); _T_ j=150°C parameter: _t_ p = 10 µs, _V_ GS 

## **8 Typ. drain-source on resistance** 

_R_ DS(on)= _f_ ( _I_ D) 

parameter: _T_ j=150°C, _V_ GS 

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22 2<br> A 20V<br>8V Ω<br>7V<br>18 7.5V 4V 4.5V 5V 5.5V 6V<br>6V<br>asa 1.6 ot<br>16 TK Lane<br>14 1.4<br>5.5V<br>12 fe LUE<br>1.2<br>10<br>Sf Ty<br>8 5V 1<br>| ony Ae ee a<br>2 —— BAZ<br>6<br>0.8<br>4.5V<br>4 fl a LDBAI 6.5V<br>| | | aT |<br>4V 0.6 8V<br>2 Aor FH 20V<br>J Tey<br>0 0.4 TE TE<br>0 5 10 15  V 25 0 2 4 6 8 10 12 14 16  A 20<br>V DS I D<br>DS(on)<br>I D R<br>**----- End of picture text -----**<br>


200 9 - 11 -30 

Rev. 2.9 1 Page 6 

## **SPP11N65C3,SPA11N65C3 SPI11N65C3** 

## **9 Drain-source on-state resistance** 

## _R_ DS(on) = _f_ ( _T_ j) 

## parameter : _I_ D = 7 A, _V_ GS = 10 V 

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SPP11N65C3<br>2.1<br>Ω PTT Pta tT tT TTT | | ttt TTT Tyr<br>1.8<br>Pt<br>| tT tT | tT ht hE rt<br>1.6 FREE| | |  EEE| | | tTEEEtt<br>1.4<br>|<br>| | [| | | | ft | ft ft fe<br>1.2 PtPt tTtT tTtT || |ttrt etet<br>1 Pt | tT | | rt rE rt<br>|<br>0.8 Pt tT tT | | rt ey<br>| | t | fT | ft | tt a<br>0.6 SERS_<br>98%<br>0.4<br>0.2 otaT [ | typ | TT__§_tT yy<br>i<br>0 Pt tT tt ft | te ct ht eT eT<br>-60 -20 20 60 100 °C 180<br>— T j<br> DS(on)<br>R<br>**----- End of picture text -----**<br>


## **10 Typ. transfer characteristics** 

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I D=  f  (  V GS );  V DS≥ 2 x  I D x  R DS(on)max<br>parameter:  t p = 10 µs<br>40 rt ttt | |) pr<br> A<br>1 tf ttt! ft! 1 ttt|<br>25°C<br>dd<br>rs<br>32<br>ft tttit iftttttt dt<br>a<br>28<br>SEDSEUSEGnEEeE<br>ee<br>riot t ttt fibre tl totter<br>24<br>a 150°C<br>Prerot bob tpl bob to tt<br>20<br>es ge |  2k fe<br>16<br>bobo baba bo bobo tatototatatatd<br>4 rr oe<br>12 FOR OP OP OCC ReeTt<br>Ptotdt t tytlototettbt tt<br>tt<br>8<br>4 SeeOY eeeeeeeeee<br>TT ATT TT<br>0 ee<br>0 2 4 6 8 10 12  V 15<br>> V GS<br>D<br>I<br>**----- End of picture text -----**<br>


## **11 Typ. gate charge** _V_ GS = _f_ ( _Q_ Gate) parameter: _I_ D = 11 A pulsed 

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SPP11N65C3<br>16 COT TTT TIT OTT IO 1<br>hott tot t t t t tote t t td<br>V eeas aefGy 4|7 -<br>a ae ae ee ee ee ee ee ee ee | |<br>eerTeetttthtftttWystitee es ee es | 1 ot |<br>12 Pip-titi4i4i tpi i4_ YA14<br>| es Ge es es Ge es A A |<br>or oe or rn eo 0,2 V DS max er —{1 1!<br>10 es es es eS ery 47 0,8 A V DS max<br>riot ot ot dd Pit tt tt<br>8 ry.tdttveytttot4<br>A | es ee ee ee eee es ee ee ee ee ee ee<br>|| 6 I|eCTTtot eee eesotTTesttes ey A AttTTee GeotTTtt1 |TTtt<br>1 | | a | | | | | |<br>|p—P—4t—4—4—-4—-+--}-4 -4-4-4--4--} -]<br>| | | | | | | | | | |<br>4 batt<br>PREP | | ptt| | | | httI ot ol | | | Fd| |<br>| | | | | | | to tol | | | | |<br>2 | pif_—4f—4f-_j__|_ _}] _}t _4___j__]|_ttt_] _]<br>A<br>i a le i Geen De ee es<br>0 tt tt tt bt ttt<br>0 10 20 30 40 50 nC 70<br>—— Q Gate<br>GS<br>V<br>**----- End of picture text -----**<br>


## **12 Forward characteristics of body diode** _I_ F = _f_ (V SD) parameter: _T_ j , tp = 10 µs 

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10 2 SPP11N65C3<br>FoFoPFIFIFLTFIRFLFLAT=ALSALSFA=A=A=3A=]<br>botrtrtr tr tr tartar tr tr tat A= 4<br>CLIT TTU TT ITI TT TT AT AT AT AT AT AT AT<br>A t-t-F-t-4-4-4-4-4-4-4-4-4- 4-4-4<br>CTT TTT TTT TTT TT TTT<br>bette[tot t idLdt dtWA ee Lm |__|}tt<br>t-+-t-t-1-1 9 1 =-|——-4|-4|--|--|<br>ne Ap Ace<br>10 1 fatatataI | t tod dA feta| tf  addat | od It | | od<br>t-+-+-t+ y -+-4-4-4-4-4---4----<br>ratddd [toto]<br>|| L-tet_etPota eotof | teteePtotottet Oe tdttt bt ddtot<br>1| 10 0 Ltt1 tf t Web1 SS tr obaot eebt bot btDeot tot dt<br>f-t-1-4Fot—+— Hi=o ee T j = 25 °C typ J=4-4-4{-A-4-44<br>T j = 150 °C typ<br>Lettror or we i }rs1 ~~ Jedror ot<br>--+—-—+—[—_11 ot ot Wand| erw—+>. T j = 25 °C (98%) i-A-—A4-4(occtf | tod<br>ttt EP T j = 150 °C (98%) 4<br>1 1 | | roto ot |<br>10 -1 Ltt #i tt ft tt tt ttt<br>0 0.4 0.8 1.2 1.6 2 2.4 V 3<br>—-—_ — V SD<br>F<br>I<br>**----- End of picture text -----**<br>


Rev. 2.9 1 Page 7 

200 9 - 11 -30 

**SPP11N65C3,SPA11N65C3 SPI11N65C3** 

## **13 Typ. switching time** 

## **14 Typ. switching time** 

_t_ = _f_ ( _I_ D), inductive load, _T_ j=125°C 

_t_ = _f_ ( _R_ G), inductive load, _T_ j=125°C par.: _V_ DS=380V, _V_ GS=0/+13V, _I_ D=11 A 

par.: _V_ DS=380V, _V_ GS=0/+13V, _R_ G=6.8Ω 

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70 350<br> ns RGR<br> ns<br>60<br>55 td(off)<br>50 Pid 250<br>45 ett dT | AAT TT VA<br>40 PTT t tT | Pe 200 Pt tt |]<br>35 PT dT tt tT TE TT td(off)<br>td(on)<br>30 Pt TdT ttt Ty tT 150 anys tr<br>tf<br>| 25 ttt} te ty Varn<br>20 tf 100<br>PEE | BEEZ<br>15<br>td(on)<br>10 50<br>NSE« =  CLE<br>5 tr<br>PreeEERRETT [eee<br>0 0<br>0 2 4 6 8  A 12 0 10 20 30 40 50 Ω 70<br>I D R G<br>15 Typ. drain current slope 16 Typ. drain source voltage slope<br>i /d t  = f( R G), inductive load, ), inductive load,  T j = 125°C = 125°C d v /d t  = f( R G), inductive load,  T j = 125°C<br>par.:  V DS=380V,=380V,  V GS=0/+13V,=0/+13V,  I D=11A=11A par.:  V DS=380V,  V GS=0/+13V,  I D=11A<br>3000 140<br> V/ns<br> A/µs 120 dv/dt(off)<br>AU) eS<br>110<br>100<br>2000<br>ATT), REE<br>90<br>80<br>1500<br>NET) 70 RE<br>60<br>1000<br>50<br>LENE § ARERR<br>di/dt(off)<br>40 dv/dt(on)<br>500 di/dt(on) 30<br>HUSS<br>20<br>TE lt ] NSE<br>0 10<br>0 20 40 60 TTPRS 80 Ω 120 ) = 0 EER 10 20 30 SSeS 40 50 Ω 70<br>R R<br>G G<br>t t<br>/d it /d tv<br>d d<br>**----- End of picture text -----**<br>


## **15 Typ. drain current slope** 

d _i_ /d _t_ = f( _R_ G), inductive load, ), inductive load, _T_ j = 125°C = 125°C par.: _V_ DS=380V,=380V, _V_ GS=0/+13V,=0/+13V, _I_ D=11A=11A 

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**SPP11N65C3,SPA11N65C3 SPI11N65C3** 

## **17 Typ. switching losses** 

## **18 Typ. switching losses** 

## _E_ = _f_ ( _I_ D), inductive load, _T_ j=125°C 

_E_ = _f_ ( _R_ G), inductive load, _T_ j=125°C 

par.: _V_ DS=380V, _V_ GS=0/+13V, _R_ G=6.8Ω 

par.: _V_ DS=380V, _V_ GS=0/+13V, _I_ D=11A 

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**----- Start of picture text -----**<br>
0.04 0.24<br>*) Eon includes SPD06S60 diode *) Eon includes SPD06S60 diode<br>    commutation losses     commutation losses<br> mWs |<br> mWs<br>0.03<br>AL TELLEL EL. TTT YL<br>0.16<br>Eoff<br>0.025<br>SUREERREO/43 ape<br>0.02 0.12<br>ny<br>0.015<br>rn” Au ma 0.08 naysche<br>Eon*<br>0.01 Eon*<br>sinn te 0.04 Saleen<br>0.005 TAT JZ.<br>Eoff<br>LLL<br>0 Tht SO 0 IL<br>0 2 4 6 8  A 12 0 10 20 30 40 50 Ω 70<br>I D R G<br>19 Avalanche SOA 20 Avalanche energy<br>AR =  =  f  ( t AR)) E AS =  f  ( T j)<br>par.:  T j ≤ 150 °C ≤ 150 °C 150 °C par.:  I D = 2.5 A,  V DD = 50 V<br>4 350<br> A  mJ<br>I }=8=86oNne<br>3 T j(Start) =25°C<br>0 OA A 250<br>2.5<br>A INIA NETL<br>200<br>2<br>10 T j(Start)=125°C A AY 150 Se<br>1.5<br>tg NP<br>100<br>1<br>PWN A UG 4 \<br>50<br>0.5<br>| ETT<br>TCC CECE<br>0 -3 -2 -1 0 1 2 4 0<br>10 10 10 10 10 10  µs 10 20 40 60 80 100 120  °C 160<br>t AR T j<br>E E<br>AS<br>I AR E<br>**----- End of picture text -----**<br>


## **19 Avalanche SOA** 

_I_ AR =  = _f_ ( _t_ AR)) par.: _T_ j ≤ 150 °C ≤ 150 °C 150 °C 

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**SPP11N65C3,SPA11N65C3 SPI11N65C3** 

## **21 Drain-source breakdown voltage** 

_V_ = _f_ ( _T_ ) (BR)DSS j 

## **22 Avalanche power losses** 

## _P_ AR = _f_ ( _f_ ) 

parameter: _E_ AR=0.6mJ 

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**----- Start of picture text -----**<br>
785 rf} ft ft | ety te 300<br>V<br>S rf | | | | ttaft  W LTT ET<br>745 rfrf || || || ft| tttttt<br>725<br>SL LTT EI<br>rt | | | ft | | LA 200<br>705 Pit ey et Ty<br>eeSA TTT /IIIIII<br>685 150<br>665 rf} | | | TA LE<br>Strt tt tT ye tT | tt TTT /OHIOHI<br>645 Pi TP VET tT ty 100<br>625 APil iA TT } ty tt yt LIVI<br>50<br>Lr i|A”7 | | | tt] tt tf yal<br>605<br>585-60 Ao EEE -20 20 60 eee 100 °C 180 01010 Tl_+-+T]|_+-+T]| 4 10 5  Hz 10<br>T j f<br>23 Typ. capacitances 24 Typ.  C oss  stored energy<br> =  f  ( V DS)) E oss= f ( V DS)<br>parameter:  V GS=0V,=0V,  f =1 MHz<br>10 4<br>7.5<br> µJ<br> pF<br>C iss<br>6<br>10 3 Saee ee See FEEELELE ELIZ<br>Ja2SSeeSS=== 5.5 Coe<br>5<br>a eR<br>rt] | | | | | | | [ fT fT 4.5 4<br>10 2 4<br>We C oss 3.5 CECEFEEEEEEL EAEYALL<br>3<br>=== ===———— = eee<br>2.5<br>10 1 C rss 2<br>+ SSS 1.5 FEECERES ELVELE<br>1<br>==_-======Se SSPE EEE EEE<br>0.5<br>10 0 PEELE 0 7ECC EEL EEL<br>0 100 200 300 400  V 600 0 100 200 300 400  V 600<br>V V<br>DS DS<br>AR<br>(BR)DSS<br>V P<br>oss<br>C E<br>**----- End of picture text -----**<br>


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300<br> W LTT ET<br>LTT EI<br>200 TTT /IIIIII<br>150 TTT /OHIOHI<br>100 LIVI<br>50<br>yal<br>Tl_+-+T]|_+-+T]|<br>01010 4 10 5  Hz 10 6<br>f<br>AR<br>P<br>**----- End of picture text -----**<br>


## **23 Typ. capacitances** 

_C_ = _f_ ( _V_ DS)) 

## parameter: _V_ GS=0V,=0V, _f_ =1 MHz 

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Rev. 2.9 1 Page 10 

**SPP11N65C3,SPA11N65C3 SPI11N65C3** 

## Definition of diodes switching characteristics 

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## **SPP11N65C3, SPA11N65C3 SPI11N65C3** 

## PG-TO220-3-1, PG-TO220-3-21 

Rev. 2.91                                                                   Page 12 

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**SPP11N65C3, SPA11N65C3 SPI11N65C3** 

## PG-TO220-3-31/3-111 Fully isolated package ( 2500 VAC; 1 minute ) 

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## **SPP11N65C3, SPA11N65C3 SPI11N65C3** 

## PG-TO262-3-1, PG-TO262-3-21 (I²-PAK) 

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Rev. 2.9 1 Page 14 

**SPP11N65C3,SPA11N65C3 SPI11N65C3** 

## **Published by Infineon Technologies AG 81726 Munich, Germany © 2007 Infineon Technologies AG All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

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Rev. 2.9 1 Page 15 



## Links

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---

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