# TVS Diode, TRANSZORB eSMP, Bidirectional, 56 V, DO-214AC (SMA), 2 Pins
**URL**: https://novapart.co/products/SMP30-62/tvs-diode-transzorb-esmp-bidirectional-56-v-do
**SKU**: SMP30-62
**Manufacturer**: STMICROELECTRONICS
**Category**: Circuit Protection || TVS - Transient Voltage Suppressors || TVS Diodes
**Price**: €0.1470
**Stock**: 1000+
**Lead Time**: 120 days (indicative)
## Description
Product Range:TRANSZORB eSMP Series; TVS Polarity:Bidirectional; Reverse Stand-Off Voltage Vrwm:56V; Clamping Voltage Vc Max:-; Diode Case Style:DO-214AC; No. of Pins:2Pins; Breakdown Voltage
## Specifications
| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Tvs Polarity | Bidirectional |
| Product Range | TRANSZORB eSMP |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | DO-214AC (SMA) |
| Clamping Voltage Max | - |
| Reverse Standoff Voltage | 56V |
| Maximum Breakdown Voltage | 62V |
| Minimum Breakdown Voltage | - |
| Operating Temperature Max | 150°C |
| Peak Pulse Power Dissipation | - |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:1749374RL/)
**SMP30**
Trisil™ for telecom equipment protection
**==> picture [61 x 39] intentionally omitted <==**
## **Features**
- Bidirectional crowbar protection
- Voltage range from 62 V to 270 V
- Low capacitance from 10 pF to 20 pF typ.@ 50 V
- Low leakage current: IR = 2 µA max.
- Holding current: IH = 150 mA min.
- Repetitive peak pulse current: IPP = 30 A (10/1000 µs)
**==> picture [65 x 54] intentionally omitted <==**
**SMA (JEDEC DO-214AC)**
## **Benefits**
- Trisils are not subject to ageing and provide a fail safe mode in short circuit for a better protection.
- This device can be used to help equipment meet various standards such as UL1950, IEC950 / CSA C22.2, UL1459 and FCC part 68.
- Trisils have UL94 V0 approved resin.
- SMA package is JEDEC registered (DO-214AC).
- Trisils are UL497B approved (file: E136224).
## **Applications**
Telecommunication equipment such as:
- Analog and digital line cards (xDSL, T1/E1, ISDN...).
- Terminals (phone, fax, modem...) and central office equipment.
## **Figure 1. Device configuration**
**==> picture [79 x 115] intentionally omitted <==**
## **Description**
The SMP30 series has been designed to protect telecommunication equipment against lightning and transient induced by AC power lines. The package / die size ratio has been optimized by using the SMA package.
**TM** : Trisil is a trademark of STMicroelectronics.
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Doc ID 5603 Rev 7
_www.st.com_
**Characteristics**
**SMP30**
## **1 Characteristics**
## **Table 1. Compliant with the following standards**
|**STANDARD**|**Peak surge**
**voltage**
**(V)**|**Waveform**
**voltage**|**Required peak**
**current (A)**|**Current**
**waveform**|**Minimum serial**
**resistor to**
**meet standard**
**(**Ω**)**|
|---|---|---|---|---|---|
|GR-1089 Core
First level|2500
1000|2/10 µs
10/1000 µs|500
100|2/10 µs
10/1000 µs|20
24|
|GR-1089 Core
Second level|5000|2/10 µs|500|2/10 µs|40|
|GR-1089 Core
Intra-building|1500|2/10 µs|100|2/10 µs|0|
|ITU-T-K20/K21|6000
1500|10/700 µs|150
37.5|5/310 µs|110
0|
|ITU-T-K20
(IEC61000-4-2)|8000
15000|1/60 ns|ESD contact discharge
ESD air discharge||0
0|
|VDE0433|4000
2000|10/700 µs|100
50|5/310 µs|60
10|
|VDE0878|4000
2000|1.2/50 µs|100
50|1/20 µs|18
0|
|IEC61000-4-5|4000
4000|10/700 µs
1.2/50 µs|100
100|5/310 µs
8/20 µs|60
18|
|FCC Part 68, lightning
surge type A|1500
800|10/160 µs
10/560 µs|200
100|10/160 µs
10/560 µs|26
15|
|FCC Part 68, lightning
surge type B|1000|9/720 µs|25|5/320 µs|0|
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Doc ID 5603 Rev 7
**SMP30**
**Characteristics**
## **Table 2. Absolute ratings (Tamb = 25 °C)**
|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|IPP|Repetitive peak pulse current|10/1000 µs
8/20 µs
10/560 µs
5/310 µs
10/160 µs
1/20 µs
2/10 µs|30
70
35
40
45
70
100|A|
|IFS|Fail-safe mode : maximum current(1)|8/20 µs|2.5|kA|
|ITSM|Non repetitive surge peak on-state current (sinusoidal)|t = 0.2 s
t = 1 s
t = 2 s
t = 15 mn|14
10.5
9
3|A|
|I²t|I²t value for using|t = 16.6 ms
t = 20 ms|5.7
4.9|A²s|
|Tstg|Storage temperature range||-55 to + 150|°C|
|Tj|Maximum junction temperature||150|°C|
|TL|Maximum lead temperature for soldering during 10 s.||260|°C|
1. In fail safe mode, the device acts as a short circuit.
**Table 3. Thermal resistances**
|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|Rth(j-a)|Junction to ambient (with recommended footprint)|120|°C/W|
|Rth(j-l)|Junction to leads|30|°C/W|
## **Table 4. Electrical characteristics - definitions (Tamb = 25 °C)**
|**Symbol**|**Parameter**|||
|---|---|---|---|
|VRM|Stand-off voltage|||
|VBR|Breakdown voltage|||
|VBO|Breakover voltage|||
|IRM|Leakage current|||
|IPP|Peak pulse current|||
|IBO|Breakover current|||
|IH|Holding current|||
|VR|Continuous reverse voltage|||
|IR|Leakage current at VR|||
|C|Capacitance|||
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**Characteristics**
**SMP30**
**Table 5. Electrical characteristics - values (Tamb = 25 °C)**
|**Types**|**IRM @ VRM**
**max.**
**µA**
**V**|**IRM @ VRM**
**max.**
**µA**
**V**|**IR (1)**
**max.**
**µA**|**@ VR**
**V**|**Dynamic**
**VBO**
**max.**
**V**|**Static**
**VBO @ IBO**
**max.**
**max.**
**V**
**mA**|**Static**
**VBO @ IBO**
**max.**
**max.**
**V**
**mA**|**IH**
**min.**
**mA**|**C(2)**
**typ.**
**pF**|**C(3)**
**typ.**
**pF**|
|---|---|---|---|---|---|---|---|---|---|---|
|SMP30-62|2|56|5|62|85|82
90
133
160
173
240
267
293
320
360|800|150|20|40|
|SMP30-68||61||68|93||||20|40|
|SMP30-100||90||100|135||||16|35|
|SMP30-120||108||120|160||||16|30|
|SMP30-130||117||130|173||||14|30|
|SMP30-180||162||180|235||||12|25|
|SMP30-200||180||200|262||||12|25|
|SMP30-220||198||220|285||||10|20|
|SMP30-240||216||240|300||||10|20|
|SMP30-270||243||270|350||||10|20|
1. IR measured at VR guarantee VBR min ≥ VR
2. VR = 50 V bias, VRMS = 1 V, F = 1 MHz
3. VR = 2 V bias, VRMS = 1 V, F = 1 MHz
**Figure 2. Pulse waveform**
**Figure 3. Non repetitive surge peak on-state current versus overload duration**
**==> picture [462 x 146] intentionally omitted <==**
**----- Start of picture text -----**
% I ITSM(A)
PP
25
10 0 Repetitive peak pulse current F=50Hz
tr = rise time (µs) 20
tp = pulse duration time (µs)
15
50
10
5
0 t(s)
t
t t 0
r p 1E-2 1E-1 1E+0 1E+1 1E+2 1E+3
**----- End of picture text -----**
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**SMP30**
**Characteristics**
**Figure 4. On-state voltage versus on-state Figure 5. Relative variation of holding current (typical values) current versus junction temperature**
**==> picture [462 x 146] intentionally omitted <==**
**----- Start of picture text -----**
IT(A) IH[T ] / Ij H[T =25°C]j
50 2.0
1.8
20 Tj=25°C 1.6
1.4
10 1.2
1.0
5 0.8
0.6
2 0.4
VT(V) 0.2 T (°C)j
1 0.0
0 1 2 3 4 5 6 7 8 9 10 -40 -20 0 20 40 60 80 100 120
**----- End of picture text -----**
## **Figure 6. Relative variation of breakover voltage versus junction temperature**
## **Figure 7. Relative variation of leakage current versus reverse voltage applied (typical values)**
**==> picture [462 x 147] intentionally omitted <==**
**----- Start of picture text -----**
VBO[T ] / Vj BO[T =25°C]j IRM[T ] / Ij RM[T =25°C]j
1.10 2000
VR=VRM
1000
1.05
100
1.00 270 V
10
0.95
62 V
T (°C)j
0.90 T (°C)j 1
25 50 75 100
-40 -20 0 20 40 60 80 100 125
**----- End of picture text -----**
## **Figure 8. Variation of thermal impedance junction to ambient versus pulse duration**
## **Figure 9. Relative variation of junction capacitance versus reverse voltage applied (typical values)**
**==> picture [462 x 146] intentionally omitted <==**
**----- Start of picture text -----**
C[VR] / C[VR=50V]
Zth(j-a)(°C/W) 2.5
Tj=25°C
1E+2 Printed circuit board FR4, F=1MHz
copper thickness = 35 µm, VRMS=1V
recommended pad layout 2.0
1E+1 1.5
1.0
1E+0
0.5
1E-1 tp(s) VR(V)
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 0.0
1 2 5 10 20 50 100 300
**----- End of picture text -----**
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Doc ID 5603 Rev 7
**Ordering information scheme**
**SMP30**
## **2 Ordering information scheme**
**==> picture [198 x 11] intentionally omitted <==**
**----- Start of picture text -----**
Figure 10. Ordering information scheme
**----- End of picture text -----**
**==> picture [234 x 140] intentionally omitted <==**
**----- Start of picture text -----**
SMP 30 - xxx
Trisil surface mount
Repetitive peak pulse current
30 = 30 A
Voltage
100 = 100 V
**----- End of picture text -----**
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**SMP30**
**Package mechanical data**
## **3 Package mechanical data**
- Epoxy meets UL94, V0
- Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark.
## **Table 6. SMA dimensions**
|**C**|||||||||**b**|**b**|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||||||**Millimeters**||**Inches**||
|||**E1**||||**L**
**D**
**A1**
**A2**||||||||||
|||||||||||||**Min.**|**Max.**|**Min.**|**Max.**|
|||||||||||||||||
||||||||||||A1|1.90|2.45|0.075|0.094|
||||||||||||A2|0.05|0.20|0.002|0.008|
|||||||||||||||||
|||**E**|||||||||b|1.25|1.65|0.049|0.065|
||||||||||||c|0.15|0.40|0.006|0.016|
|||||||||||||||||
||||||||||||D|2.25|2.90|0.089|0.114|
|||||||||||||||||
||||||||||||E|4.80|5.35|0.189|0.211|
|||||||**L**|||**b**|||||||
||||||||||||E1|3.95|4.60|0.156|0.181|
|||||||||||||||||
||||||||||||L|0.75|1.50|0.030|0.059|
## **Figure 11. Footprint (dimensions in mm)**
**==> picture [185 x 92] intentionally omitted <==**
**----- Start of picture text -----**
1.4 2.63 1.4
(0.055) (0.103) (0.055)
1.64
(0.064)
5.43
(0.214)
**----- End of picture text -----**
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**Ordering information**
**SMP30**
## **4 Ordering information**
## **Table 7. Ordering information**
|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|SMP30-62|QAA|SMA|0.06 g|5000|Tape and reel|
|SMP30-68|QAB|||||
|SMP30-100|QAC|||||
|SMP30-120|QAD|||||
|SMP30-130|QAE|||||
|SMP30-180|QAF|||||
|SMP30-200|QAG|||||
|SMP30-220|QAH|||||
|SMP30-240|QAI|||||
|SMP30-270|QAJ|||||
## **5 Revision history**
## **Table 8. Document revision history**
|**Date**|**Revision**|**Changes**|
|---|---|---|
|November-2002|4B|Last update.|
|10-Nov-2004|5|SMA package dimensions update. Reference A1 max.
changed from 2.70mm (0.106 inch) to 2.03mm
(0.080 inch).|
|13-Dec-2004|6|Figure 7 text legend corrected from “... reverse voltage
applied” to “... junction capacitance”.|
|01-Jul-2010|7|Added ECOPACK statement. Updated trademark
statement. Removed section on test circuits.|
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**SMP30**
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Doc ID 5603 Rev 7
## Links
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