# Small Signal Diode, Single, 250 V, 200 mA, 1.25 V, 50 ns, 625 mA

![Product image](https://novapart.co/image/farnell:3368118RL/)

**URL**: https://novapart.co/products/SMMSD103T1G/small-signal-diode-single-250-v-200-ma-125-50-ns
**SKU**: SMMSD103T1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Small Signal Diodes
**Price**: €0.0560
**Stock**: 10+
**Lead Time**: 99 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | - |
| Qualification | AEC-Q101 |
| Diode Mounting | Surface Mount |
| Diode Case Style | SOD-123 |
| Diode Configuration | Single |
| Forward Voltage Max | 1.25V |
| Forward Surge Current | 625mA |
| Reverse Recovery Time | 50ns |
| Average Forward Current | 200mA |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 250V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3368118RL/)

## MMSD103T1G, SMMSD103T1G 

## High Voltage Switching Diode 

## **Features** 

**http://onsemi.com** 

- AEC−Q101 Qualified and PPAP Capable 

- S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant* 

**SOD−123 CASE 425 STYLE 1** 

## **MAXIMUM RATINGS** 

**Rating Symbol Value Unit** Continuous Reverse Voltage VR 250 V Peak Forward Current IF 200 mA Peak Forward Surge Current ~~ae~~ IFM(surge) 625 mA **THERMAL CHARACTERISTICS Characteristic Symbol Value Unit** ~~es~~ Forward Power Dissipation, FR−5 Board PF (Note 1) @ TA = 25C 400 mW Derate above 25C 3.2 mW/C ~~ee a~~ Thermal Resistance, R JL C/W Junction−to−Case 174 ~~a~~ Thermal Resistance, R JA C/W Junction−to−Ambient 492 ~~>~~ Junction and Storage TJ, Tstg −55 to +150 C Temperature Range ~~a~~ 

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−5 = 1.0 0.75 0.062 in. 

1 2 Cathode Anode **MARKING DIAGRAM** ~~ot~~ 

**==> picture [88 x 64] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 JS M<br>JS = Device Code<br>M = Date Code<br>= Pb−Free Package<br>**----- End of picture text -----**<br>


(Note: Microdot may be in either location) 

**ORDERING INFORMATION** 

**Device Package Shipping**[†] MMSD103T1G SOD−123 3,000 / Tape & Reel (Pb−Free) SMMSD103T1G SOD−123 3,000 / Tape & Reel (Pb−Free) ~~+~~ †For information on tape and reel specifications, ~~—~~ including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

> *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: **MMSD103T1/D** 

**1** 

 Semiconductor Components Industries, LLC, 2011 **November, 2011 − Rev. 6** 

## **MMSD103T1G, SMMSD103T1G** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25C unless otherwise noted)|||||
|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**|||||
|Reverse Voltage Leakage Current<br>(VR= 200 V)<br>(VR= 200 V, TJ= 150C)|IR|−<br>−|1.0<br>100|�A|
|Reverse Breakdown Voltage<br>(IBR= 100�A)|V(BR)|250|−|V|
|Forward Voltage<br>(IF= 100 mA)<br>(IF= 200 mA)|VF|−<br>−|1000<br>1250|mV|
|Diode Capacitance<br>(VR= 0, f = 1.0 MHz)|CD|−|5.0|pF|
|Reverse Recovery Time<br>(IF= IR= 30 mA, RL= 100�)|trr|−|50|ns|



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820 �<br>IF<br>+10 V 2.0 k 0.1 �F tr t p t<br>100 �H IF 10% t rr t<br>0.1 �F<br>D.U.T. 90%<br>50 � OUTPUT 50 � INPUT IR(REC) = 3.0 mA<br>IR<br>PULSE SAMPLING VR OUTPUT PULSE<br>GENERATOR OSCILLOSCOPE INPUT SIGNAL<br>(IF = IR = 30 mA; MEASURED<br>at IR(REC) = 3.0 mA)<br>**----- End of picture text -----**<br>


Notes: 1. A 2.0 k � variable resistor adjusted for a Forward Current (IF) of 30 mA. Notes: 2. Input pulse is adjusted so IR(peak) is equal to 30 mA. Notes: 3. tp » trr 

**Figure 1. Recovery Time Equivalent Test Circuit** 

**http://onsemi.com** 

**2** 

**MMSD103T1G, SMMSD103T1G** 

**==> picture [493 x 392] intentionally omitted <==**

**----- Start of picture text -----**<br>
1200 7000<br>1000 TA = −55C 25C 50006000 TA = 150C<br>4000<br>800 3000<br>150C<br>600 6<br>5<br>400 4<br>3<br>200 2 TA = 25C<br>1 TA = −55C<br>1 0<br>1 10 100 1000 1 2 5 10 20 50 100 200 300<br>FORWARD CURRENT (mA) REVERSE VOLTAGE (V)<br>Figure 2. Forward Voltage Figure 3. Reverse Leakage<br>0.75<br>0.7<br>0.65<br>0.6<br>0.55<br>0.5<br>0.45<br>0.4<br>0.35<br>0.3<br>0 1 2 3 4 5 6 7 8 9 10<br>VR, REVERSE VOLTAGE (V)<br>FORWARD VOLTAGE (mV) REVERSE CURRENT (nA)<br>, DIODE CAPACITANCE (pF)<br>d<br>C<br>**----- End of picture text -----**<br>


**Figure 4. Diode Capacitance** 

**http://onsemi.com** 

**3** 

**MMSD103T1G, SMMSD103T1G** 

## **PACKAGE DIMENSIONS** 

**SOD−123** CASE 425−04 ISSUE G 

**==> picture [426 x 342] intentionally omitted <==**

**----- Start of picture text -----**<br>
D<br>A NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI<br>A1 Y14.5M, 1982.<br>2. CONTROLLING DIMENSION: INCH.<br>1<br>ÂÂÂÂ MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>ÂÂÂÂ A 0.94 1.17 1.35 0.037 0.046 0.053<br>A1 0.00 0.05 0.10 0.000 0.002 0.004<br>b 0.51 0.61 0.71 0.020 0.024 0.028<br>HE E c --- --- 0.15 --- --- 0.006<br>D 1.40 1.60 1.80 0.055 0.063 0.071<br>E 2.54 2.69 2.84 0.100 0.106 0.112<br>HE 3.56 3.68 3.86 0.140 0.145 0.152<br>L 0.25 --- --- 0.010 --- ---<br>0  --- 10  0  --- 10 <br>2<br>iam<br>STYLE 1:<br>b L PIN 1. CATHODE2. ANODE<br>Uh C - i=aeeee<br>SOLDERING FOOTPRINT*<br>0.91<br>0.036<br>ÉÉ ÉÉ<br>1.22<br>ÉÉ ÉÉ 0.048<br>qo<br>ÉÉ ÉÉ<br>2.36<br>0.093<br>4.19<br>| 0.165<br>SCALE 10:1 mm<br>: inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : **N. American Technical Support** : 800−282−9855 Toll Free **ON Semiconductor Website** : **www.onsemi.com** Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA **Europe, Middle East and Africa Technical Support: Order Literature** : http://www.onsemi.com/orderlit **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Japan Customer Focus Center** For additional information, please contact your local **Email** : orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative 

## **LITERATURE FULFILLMENT** : 

**MMSD103T1/D** 

**http://onsemi.com 4** 



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