# Bipolar Transistor Array, PNP, 35 V, 2 A

![Product image](https://novapart.co/image/farnell:3617514/)

**URL**: https://novapart.co/products/SMBT35200MT1G/bipolar-transistor-array-pnp-35-v-2-a
**SKU**: SMBT35200MT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Bipolar Junction Transistor Arrays - BJT
**Price**: €0.1780
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (15-Jan-2018) |
| No. Of Pins | 6Pins |
| Product Range | - |
| Qualification | AEC-Q101 |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | PNP |
| Power Dissipation Npn | - |
| Power Dissipation Pnp | 1W |
| Transistor Case Style | TSOP |
| Transition Frequency Npn | - |
| Transition Frequency Pnp | 100MHz |
| Operating Temperature Max | 150°C |
| Dc Current Gain Hfe Min Npn | - |
| Dc Current Gain Hfe Min Pnp | 100hFE |
| Continuous Collector Current Npn | - |
| Continuous Collector Current Pnp | 2A |
| Collector Emitter Voltage Max Npn | - |
| Collector Emitter Voltage Max Pnp | 35V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3617514/)

**DATA SHEET www.onsemi.com** 

# High Current Surface Mount PNP Silicon Switching Transistor for Load Management in Portable Applications MBT35200MT1 

## **35 VOLTS 2.0 AMPS PNP TRANSISTOR** 

## **CASE 318G TSOP−6 STYLE 6** 

## **Features** 

- AEC−Q101 Qualified and PPAP Capable 

- S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **MAXIMUM RATINGS** (TA = 25C) 

|**MAXIMUM RATINGS**(TA= 25C)||||
|---|---|---|---|
|**Rating**|**Symbol**|**Max**|**Unit**|
|Collector-Emitter Voltage|VCEO|−35|Vdc|
|Collector-Base Voltage|VCBO|−55|Vdc|
|Emitter-Base Voltage|VEBO|−5.0|Vdc|
|Collector Current − Continuous|IC|−2.0|Adc|
|Collector Current − Peak|ICM|−5.0|A|
|Electrostatic Discharge|ESD|HBM Class 3<br>MM Class C||
|**THERMAL CHARACTERISTIC**||||



## **THERMAL CHARACTERISTICS** 

|||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Max**|**Unit**|
|Total Device Dissipation<br>TA= 25C<br>Derate above 25C|PD(Note 1)|625<br>5.0|mW<br>mW/C|
|Thermal Resistance,<br>Junction−to−Ambient|R�JA(Note 1)|200|C/W|
|Total Device Dissipation<br>TA= 25C<br>Derate above 25C|PD(Note 2)|1.0<br>8.0|W<br>mW/C|
|Thermal Resistance,<br>Junction−to−Ambient|R�JA(Note 2)|120|C/W|
|Thermal Resistance,<br>Junction−to−Lead #1|R�JL|80|C/W|
|Total Device Dissipation<br>(Single Pulse < 10 sec.)|PDsingle<br>(Notes 2 & 3)|1.75|W|
|Junction and Storage<br>Temperature Range|TJ, Tstg|−55 to<br>+150|C|



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COLLECTOR<br>1, 2, 5, 6<br>3<br>BASE<br>4<br>EMITTER<br>MARKING DIAGRAM<br>G4  M �<br>�<br>1<br>G4 = Specific Device Code<br>M = Date Code<br>� = Pb−Free Package<br>(Note: Microdot may be in either location)<br>**----- End of picture text -----**<br>


## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MBT35200MT1G|TSOP−6<br>(Pb−Free)|3,000 /<br>Tape & Reel|



## **DISCONTINUED** (Note 1) 

|SMBT35200MT1G|TSOP−6<br>(Pb−Free)|3,000 /<br>Tape & Reel|
|---|---|---|



- For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

1. **DISCONTINUED:** This device is not available. Please contact your **onsemi** representative for information. The most current information on this device may be available on www.onsemi.com. 

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−4 @ Minimum Pad 

2. FR−4 @ 1.0 X 1.0 inch Pad 

3. ref: Figure 9 

- For additional information on our Pb-Free strategy and soldering details, please download the **onsemi** Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: 

**1** 

 Semiconductor Components Industries, LLC, 2013 **January, 2026 − Rev. 7** 

**MBT35200MT1/D** 

## **MBT35200MT1** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25C unless otherwise note|d)|||||
|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typical**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||
|Collector−Emitter Breakdown Voltage<br>(IC= −10 mAdc, IB= 0)|V(BR)CEO|−35|−45|−|Vdc|
|Collector−Base Breakdown Voltage<br>(IC= −0.1 mAdc, IE= 0)|V(BR)CBO|−55|−65|−|Vdc|
|Emitter−Base Breakdown Voltage<br>(IE= −0.1 mAdc, IC= 0)|V(BR)EBO|−5.0|−7.0|−|Vdc|
|Collector Cutoff Current<br>(VCB= −35 Vdc, IE= 0)|ICBO|−|−0.03|−0.1|�Adc|
|Collector−Emitter Cutoff Current<br>(VCES= −35 Vdc)|ICES|−|−0.03|−0.1|�Adc|
|Emitter Cutoff Current<br>(VEB= −4.0 Vdc)|IEBO|−|−0.01|−0.1|�Adc|
|**ON CHARACTERISTICS**||||||
|DC Current Gain (Note 1)<br>(IC= −1.0 A, VCE= −1.5 V)<br>(IC= −1.5 A, VCE= −1.5 V)<br>(IC= −2.0 A, VCE= −3.0 V)|hFE|100<br>100<br>100|200<br>200<br>200|−<br>400<br>−||
|Collector−Emitter Saturation Voltage (Note 1)<br>(IC= −0.8 A, IB= −0.008 A)<br>(IC= −1.2 A, IB= −0.012 A)<br>(IC= −2.0 A, IB= −0.02 A)|VCE(sat)|−<br>−<br>−|−0.125<br>−0.175<br>−0.260|−0.15<br>−0.20<br>−0.31|V|
|Base−Emitter Saturation Voltage (Note 1)<br>(IC= −1.2 A, IB= −0.012 A)|VBE(sat)|−|−0.68|−0.85|V|
|Base−Emitter Turn−on Voltage (Note 1)<br>(IC= −2.0 A, VCE= −3.0 V)|VBE(on)|−|−0.81|−0.875|V|
|Cutoff Frequency<br>(IC= −100 mA, VCE= −5.0 V, f = 100 MHz)|fT|100|−|−|MHz|
|Input Capacitance (VEB= −0.5 V, f = 1.0 MHz)|Cibo|−|600|650|pF|
|Output Capacitance (VCB= −3.0 V, f = 1.0 MHz)|Cobo|−|85|100|pF|
|Turn−on Time (VCC= −10 V, IB1= −100 mA, IC= −1 A, RL= 3�)|ton|−|35|−|nS|
|Turn−off Time (VCC= −10 V, IB1= IB2= −100 mA, IC= 1 A, RL= 3�)|toff|−|225|−|nS|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

1. Pulsed Condition: Pulse Width = 300 � sec, Duty Cycle  2% 

**www.onsemi.com** 

**2** 

**MBT35200MT1** 

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**----- Start of picture text -----**<br>
0.25<br>IC/IB = 50<br>0.1 0.20<br>IC/IB = 100<br>100  C<br>50<br>0.15<br>25  C<br>10<br>0.01 0.10<br>-55  C<br>0.05<br>0.001 0<br>0.001 0.01 0.1 1.0 0.001 0.01 0.1 1.0<br>IC, COLLECTOR CURRENT (AMPS) IC, COLLECTOR CURRENT (AMPS)<br>Figure 1. Collector Emitter Saturation Voltage Figure 2. Collector Emitter Saturation Voltage<br>versus Collector Current versus Collector Current<br>1.6 1.0<br>100  C<br>1.4 -55  C<br>0.8<br>1.2<br>25  C 25  C<br>1.0<br>0.6<br>100  C<br>0.8<br>-55  C 0.4<br>0.6<br>0.4<br>0.2<br>0.2<br>0 0<br>0.001 0.01 0.1 1.0 0.001 0.01 0.1 1.0<br>IC, COLLECTOR CURRENT (AMPS) IC, COLLECTOR CURRENT (AMPS)<br>Figure 3. DC Current Gain versus Figure 4. Base Emitter Saturation Voltage<br>Collector Current versus Collector Current<br>1.1 750<br>1.0 700<br>0.9 -55  C 650<br>600<br>0.8<br>25  C 550<br>0.7<br>500<br>0.6 100  C<br>450<br>0.5<br>400<br>0.4 350<br>0.3 300<br>0.001 0.01 0.1 1.0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>IC, COLLECTOR CURRENT (AMPS) VEB, EMITTER BASE VOLTAGE (VOLTS)<br>VOLTAGE (VOLTS) VOLTAGE (VOLTS)<br>VCE(sat), COLLECTOR EMITTER SATURATION VCE(sat), COLLECTOR EMITTER SATURATION<br>VOLTAGE (VOLTS)<br>FE, DC CURRENT GAIN (NORMALIZED)h VBE(sat), BASE EMITTER SATURATION<br>Cibo, INPUT CAPACITANCE (pF)<br>, BASE EMITTER TURN-ON VOLTAGE (VOLTS)<br>VBE(on)<br>**----- End of picture text -----**<br>


**Figure 5. Base Emitter Turn−On Voltage versus Collector Current** 

**Figure 6. Input Capacitance** 

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**3** 

**MBT35200MT1** 

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**----- Start of picture text -----**<br>
225 10<br>1 s 100 ms 10 ms 1 ms 100 �s<br>200<br>175<br>150 1.0<br>125 DC<br>100<br>75 0.1<br>50<br>25 SINGLE PULSE AT Tamb = 25  C<br>0 0.01<br>0 5.0 10 15 20 25 30 35 0.1 1.0 10 100<br>VCB, COLLECTOR BASE VOLTAGE (VOLTS) VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS)<br>, COLLECTOR CURRENT (AMPS)<br>IC<br>Cobo, OUTPUT CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**Figure 7. Output Capacitance** 

**Figure 8. Safe Operating Area** 

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1.0<br>D = 0.5<br>0.2<br>0.1<br>0.1<br>0.05<br>0.02<br>0.01<br>0.01<br>SINGLE PULSE<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000<br>t, TIME (sec)<br>Figure 9. Normalized Thermal Response<br>RESISTANCE<br>r(t), NORMALIZED TRANSIENT THERMAL<br>**----- End of picture text -----**<br>


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**4** 

**MBT35200MT1** 

## **REVISION HISTORY** 

|**Revision**|**Description of Changes**|**Date**|
|---|---|---|
|7|Document Discontinued.|1/16/2026|



This document has undergone updates prior to the inclusion of this revision history table. The changes tracked here only reflect updates made on the noted approval dates. 

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**www.onsemi.com** 

**5** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

## **TSOP−6 3.00x1.50x0.90, 0.95P** 

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CASE 318G<br>ISSUE W<br>**----- End of picture text -----**<br>


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DATE 26 FEB 2024<br>**----- End of picture text -----**<br>


Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

## **DOCUMENT NUMBER:** 

**98ASB14888C** 

## **DESCRIPTION: TSOP−6 3.00x1.50x0.90, 0.95P** 

**PAGE 1 OF 2** 

**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

DATE 26 FEB 2024 

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TSOP−6 3.00x1.50x0.90, 0.95P<br>CASE 318G<br>ISSUE W<br>**----- End of picture text -----**<br>


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GENERIC<br>MARKING DIAGRAM*<br>XXXAYW � XXX M �<br>� �<br>1 1<br>IC STANDARD<br>XXX = Specific Device Code XXX = Specific Device Code<br>A =Assembly Location M = Date Code<br>Y = Year � = Pb−Free Package<br>W = Work Week<br>� = Pb−Free Package<br>**----- End of picture text -----**<br>


*This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ � ”, may or may not be present. Some products may not follow the Generic Marking. 

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STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5: STYLE 6:<br>PIN 1. DRAIN PIN 1. EMITTER 2 PIN 1. ENABLE PIN 1. N/C PIN 1. EMITTER 2 PIN 1. COLLECTOR<br>2. DRAIN 2. BASE 1 2. N/C 2. V in 2. BASE 2 2. COLLECTOR<br>3. GATE 3. COLLECTOR 1 3. R BOOST 3. NOT USED 3. COLLECTOR 1 3. BASE<br>4. SOURCE 4. EMITTER 1 4. Vz 4. GROUND 4. EMITTER 1 4. EMITTER<br>5. DRAIN 5. BASE 2 5. V in 5. ENABLE 5. BASE 1 5. COLLECTOR<br>6. DRAIN 6. COLLECTOR 2 6. V out 6. LOAD 6. COLLECTOR 2 6. COLLECTOR<br>STYLE 7: STYLE 8: STYLE 9: STYLE 10: STYLE 11: STYLE 12:<br>PIN 1. COLLECTOR PIN 1. Vbus PIN 1. LOW VOLTAGE GATE PIN 1. D(OUT)+ PIN 1. SOURCE 1 PIN 1. I/O<br>2. COLLECTOR 2. D(in) 2. DRAIN 2. GND 2. DRAIN 2 2. GROUND<br>3. BASE 3. D(in)+ 3. SOURCE 3. D(OUT)− 3. DRAIN 2 3. I/O<br>4. N/C 4. D(out)+ 4. DRAIN 4. D(IN)− 4. SOURCE 2 4. I/O<br>5. COLLECTOR 5. D(out) 5. DRAIN 5. VBUS 5. GATE 1 5. VCC<br>6. EMITTER 6. GND 6. HIGH VOLTAGE GATE 6. D(IN)+ 6. DRAIN 1/GATE 2 6. I/O<br>STYLE 13: STYLE 14: STYLE 15: STYLE 16: STYLE 17:<br>PIN 1. GATE 1 PIN 1. ANODE PIN 1. ANODE PIN 1. ANODE/CATHODE PIN 1. EMITTER<br>2. SOURCE 2 2. SOURCE 2. SOURCE 2. BASE 2. BASE<br>3. GATE 2 3. GATE 3. GATE 3. EMITTER 3. ANODE/CATHODE<br>4. DRAIN 2 4. CATHODE/DRAIN 4. DRAIN 4. COLLECTOR 4. ANODE<br>5. SOURCE 1 5. CATHODE/DRAIN 5. N/C 5. ANODE 5. CATHODE<br>6. DRAIN 1 6. CATHODE/DRAIN 6. CATHODE 6. CATHODE 6. COLLECTOR<br>**----- End of picture text -----**<br>


Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98ASB14888C** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: TSOP−6 3.00x1.50x0.90, 0.95P PAGE 2 OF 2** 

**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

**www.onsemi.com** 

~~**2**~~ 

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© Semiconductor Components Industries, LLC, 2019 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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