# TVS Diode, TRANSZORB SMA6F, Unidirectional, 5 V, 13.4 V, DO-221AC, 2 Pins

![Product image](https://novapart.co/image/farnell:2353646/)

**URL**: https://novapart.co/products/SMA6F5.0A-TR/tvs-diode-transzorb-sma6f-unidirectional-5-v-134
**SKU**: SMA6F5.0A-TR
**Manufacturer**: STMICROELECTRONICS
**Category**: Circuit Protection || TVS - Transient Voltage Suppressors || TVS Diodes
**Price**: €0.0930
**Stock**: 10+

## Description

Product Range:TRANSZORB SMA6F Series; TVS Polarity:Unidirectional; Reverse Stand-Off Voltage Vrwm:5V; Clamping Voltage Vc Max:13.4V; Diode Case Style:DO-221AC; No. of Pins:2Pins; B

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 2Pins |
| Tvs Polarity | Unidirectional |
| Product Range | TRANSZORB SMA6F |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | DO-221AC |
| Clamping Voltage Max | 13.4V |
| Reverse Standoff Voltage | 5V |
| Maximum Breakdown Voltage | 7.07V |
| Minimum Breakdown Voltage | 6.4V |
| Operating Temperature Max | 175°C |
| Peak Pulse Power Dissipation | 600W |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2353646/)

High junction temperature Transil™ 

**==> picture [61 x 39] intentionally omitted <==**

## **SMA6F** 

## **Features** 

- ECOPACK[®] 2 compliant product 

- Peak pulse power: 

   - 600 W (10/1000 µs) 

   - 4 kW (8/20 µs) 

- Stand off voltage: 5, 12 or 13 V 

- Unidirectional type 

- Low clamping voltage versus standard series 

- Low leakage current, 0.2 µA at 25 °C 

- Operating Tj max: 175 °C 

- JEDEC registered package outline 

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A<br>K<br>Unidirectional<br>SMAflat<br>**----- End of picture text -----**<br>


## **Complies with the following standards** 

- IEC 61000-4-2 level 4: 

   - 15 kV (air discharge) 

   - 8 kV (contact discharge) 

- MIL STD 883G-Method 3015-7: class3B 

   - 25 kV (human body model) 

## **Description** 

The SMA6F Transil series has been designed to protect sensitive equipment against electro-static discharges according to IEC 61000-4-2, MIL STD 883 Method 3015, and electrical over stress such as IEC 61000-4-4 and 5. They are generally for surges below 600 W 10/1000 µs. 

This planar technology makes it compatible with high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. Their low clamping voltages provides a better safety margin to protect sensitive circuits with extended life time expectancy. 

Packaged in SMAflat non exposed pad, this minimizes PCB space consumption (footprint in accordance with IPC 7531 standard). 

TM: Transil is a trademark of STMicroelectronics 

September 2011 

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Doc ID 14996 Rev 2 

_www.st.com_ 

**Characteristics** 

**SMA6F** 

## **1 Characteristics** 

## **Table 1. Absolute ratings (Tamb = 25 °C)** 

|**Table 1.**|**Absolute ratings (Tamb = 25 °C)**||||
|---|---|---|---|---|
|**Symbol**|**Parameter**||**Value**|**Unit**|
|PPP|Peak pulse power dissipation(1)|Tjinitial = Tamb|600|W|
|P|Power dissipation on infinite heatsink|Tlead= 55 °C|6|W|
|IFSM|Non repetitive surge peak forward current for<br>unidirectional types|tp= 10 ms<br>Tjinitial = Tamb|60|A|
|Tstg|Storage temperature range||-65 to +175|°C|
|Tj|Operating junction temperature range||-55 to +175|°C|
|TL|Maximum lead temperature for soldering during 10 s||260|°C|



1. For a surge greater than the maximum values, the diode will fail in short-circuit. 

## **Table 2. Thermal resistance** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|Rth (j-l)|Junction to leads|20|°C/W|



## **Table 3. Electrical characteristics - definitions (Tamb = 25 °C)** 

|**Symbol**|**Parameter**||**VCLVBR VRM**<br>**IRM**<br>**IR**<br>**IPP**<br>**V**<br>**I**<br>**IF**<br>**VF**|**VCLVBR VRM**<br>**IRM**<br>**IR**<br>**IPP**<br>**V**<br>**I**<br>**IF**<br>**VF**|
|---|---|---|---|---|
|VRM|Stand-off voltage||||
|VBR|Breakdown voltage||||
|VCL|Clamping voltage||||
|IRM|Leakage current @ VRM||||
||||||
|IPP|Peak pulse current||||
|αT|Voltage temperature coefficient||||
|VF|Forward voltage drop||||
|RD|Dynamic resistance||||
||||||



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**SMA6F** 

**Characteristics** 

**Table 4. Electrical characteristics - values (Tamb = 25 °C)** 

|**Type**|**IRM max@VRM**|**IRM max@VRM**|**IRM max@VRM**|**VBR @IR**<br>**(1)**|**VBR @IR**<br>**(1)**|**VBR @IR**<br>**(1)**|**VBR @IR**<br>**(1)**|**VCL @IPP**<br>**10/1000 µs**|**VCL @IPP**<br>**10/1000 µs**|**RD**<br>**(2)**<br>**10/1000 µs**|**VCL @IPP**<br>**8/20 µs**|**VCL @IPP**<br>**8/20 µs**|**RD**<br>**(2)**<br>**8/20 µs**|α**T(3)**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||**25 °C **|**85 °C**||**min**|**typ**|**max**||**max**|||**max**|||**max**|
||**µA (Max)**||**V**|**V**|||**mA**|**V**|**A**|Ω|**V**|**A**|Ω|**10-4/°C**|
|SMA6F5.0A|10|50|5.0|6.40|6.74|7.07|10|9.2|68|0.029|13.4|298|0.021|5.7|
|SMA6F12AVCL|0.2|1|12|13.2|13.7|14.3|1|18.5|31|0.135|22.9|157|0.055|7.8|
|SMA6F13A|0.2|1|13|14.4|15.2|15.9|1|20.4|29|0.154|23.9|147|0.054|8.3|
|**Figure 1.**<br>**Definition of Ipp pulse**<br>1.<br>Pulse test: tp<50ms.<br>2.<br>To calculate maximum clamping voltage at other surge currents, use the following formula<br>VCLmax= RDx IPP+ VBRmax<br>3.<br>To calculate VBRversus junction temperature, use the following formula:<br>VBR@ Tj= VBR@ 25  °C x (1 +αT x (Tj- 25))|||||||||||||||
|100<br>50<br>%IPP<br>tr<br>tp<br>0<br>t<br>Repetitive peak pulse current<br>tr = rise time (µs)<br>tp = pulse duration time (µs)|||||||||||||||



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Figure 2. Relative peak power dissipation  Figure 3. Peak pulse power versus<br>versus initial junction temperature  exponential pulse duration<br>(Tj initial = 25 °C)<br>PPP[Tj initial] / PPP[Tj initial=25°C] PPP(kW)<br>1.1 100.0<br>1.0 Tj initial = 25 °C<br>0.9<br>0.8<br>0.7 10.0<br>0.6<br>0.5<br>0.4<br>1.0<br>0.3<br>0.2<br>0.1 Tj initial (°C) tp(ms)<br>0.0 0.1<br>0 25 50 75 100 125 150 175 200 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01<br>**----- End of picture text -----**<br>


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**Characteristics** 

**SMA6F** 

**Figure 4. Clamping voltage versus peak pulse current (exponential waveform, maximum values)** 

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IPP(A)<br>1000.0<br>Tj initial=25 °C<br>SMA6F5.0A<br>SMA6F12AVCL<br>100.0<br>SMA6F13A<br>10.0<br>1.0<br>tp = 8/20 µs<br>tp = 10/1000 µs<br>VCL(V)<br>0.1<br>5 10 15 20 25<br>**----- End of picture text -----**<br>


## **Figure 5. Junction capacitance versus reverse applied voltage (typical values)** 

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C(pF)<br>10000<br>F=1 MHz<br>VOSC=30 mVRMS<br>Tj=25 °C<br>SMA6F5.0A<br>1000<br>SMA6F12AVCL<br>SMA6F13A<br>VR(V)<br>100<br>1 10 100<br>**----- End of picture text -----**<br>


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**SMA6F** 

**Characteristics** 

**Figure 6. Peak forward voltage drop versus Figure 7. Relative variation of thermal peak forward current (typical impedance junction to ambient values) versus pulse duration** 

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IFM(A) Zth(j-a)/Rth(j-a)<br>1.0E+02 1.00<br>On recommended pad layout.<br>Printed circuit board, FR4<br>copper thickness = 35 µm<br>copper surface = 1 cm²<br>1.0E+01<br>0.10<br>1.0E+00 Tj =125 °C Tj =25 °C<br>0.01<br>1.0E-01<br>VFM(V) tp(S)<br>1.0E-02 0.00<br>0.0 0.5 1.0 1.5 2.0 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03<br>Figure 8. Thermal resistance junction to  Figure 9. Leakage current versus junction<br>ambient versus copper surface  temperature (typical values)<br>under each lead<br>Rth(j-a)(°C/W) IR(nA)<br>200 1.E+04<br>Printed circuit board, FR4<br>180 copper thickness = 35 µm<br>160<br>1.E+03<br>140<br>120 VBR=11.7V<br>100 1.E+02<br>80<br>60 VBR>11.7V<br>1.E+01<br>40<br>20 SCU(cm2) T (°C)j VR=VRM<br>0 1.E+00<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 25 50 75 100 125 150 175<br>**----- End of picture text -----**<br>


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**Ordering information scheme** 

**SMA6F** 

## **2 Ordering information scheme** 

## **Figure 10. Ordering information scheme** 

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SM    A  6F    xx      A    - TR<br>Surface mount<br>Package<br>A = SMAflat package<br>Surge rating<br>6F = 600 W<br>Stand off voltage<br>example: 5.0 = 5.0 V<br>Type<br>A = Unidirectional<br>Delivery mode<br>TR = Tape and reel<br>**----- End of picture text -----**<br>


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**SMA6F** 

**Package information** 

## **3 Package information** 

- Case: JEDEC DO-221AC molded plastic over Planar junction 

- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 

- Polarity: Band indicates cathode 

- Flammability: Epoxy rated UL94V-0 

- RoHS package 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _www.st.com_ . ECOPACK[®] is an ST trademark. 

**Table 5. SMAflat (non exposed pad) dimensions** 

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Dimensions<br>Ref. Millimeters Inches<br>A Min. Typ. Max. Min. Typ. Max.<br>c<br>D A 0.90 1.10 0.035 0.043<br>b 1.25 1.65 0.049 0.065<br>L 2x<br>L1 2x c 0.15 0.40 0.006 0.016<br>E E1 D 2.25 2.95 0.088 0.116<br>E 4.80 5.60 0.189 0.220<br>L<br>L2 2x E1 3.95 4.60 0.156 0.181<br>b<br>L 0.75 1.50 0.030 0.059<br>L1 0.50 0.019<br>L2 0.50 0.019<br>Figure 11. SMAflat footprint dimensions Figure 12. Marking information<br>5.52<br>(0.217)<br>Cathode bar (unidirectional devices only )<br>1.52<br>(0.060) ECOPACK status<br>XXX: Marking<br>x x x Z:Y: ManufacturingYear location<br>WW: week<br>z y w w<br>1.20 3.12 1.20<br>(0.047) (0.123) (0.047)<br>millimeters<br>(inches)<br>**----- End of picture text -----**<br>


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**Ordering information** 

**SMA6F** 

## **4 Ordering information** 

## **Table 6. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty **|**Delivery mode**|
|---|---|---|---|---|---|
|SMA6F5.0A-TR|SUA|SMAflat|0.035 g|10000|Tape and reel|
|SMA6F12AVCL|SUJ|||||
|SMA6F13A-TR|SUG|||||



For the latest information on available order codes see the product pages on www.st.com. 

## **5 Revision history** 

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Table 7.          Rev 2 Document revision history<br>**----- End of picture text -----**<br>


|**Date**|**Revision**|**Changes**|
|---|---|---|
|04-Sep-2008|1|First issue.|
|01-Sep-2011|2|Updated order code in_Table 6_.|



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