# Oscillator, LVPECL, 156.25 MHz, 25 ppm, SMD, 7mm x 5mm, 3.3 V, SiT9365 Series

![Product image](https://novapart.co/image/farnell:2850180RL/)

**URL**: https://novapart.co/products/SIT9365AC-1E2-33E156.250000X/oscillator-lvpecl-15625-mhz-25-ppm-smd-7mm-x-5mm
**SKU**: SIT9365AC-1E2-33E156.250000X
**Manufacturer**: SITIME
**Category**: Crystals & Oscillators || Oscillators || MEMS Oscillators
**Price**: €5.1900
**Stock**: 50+
**Lead Time**: 50 days (indicative)

## Description

Frequency Nom:156.25MHz; Frequency Stability + / -:25ppm; Oscillator Case:SMD, 7mm x 5mm; Supply Voltage Nom:3.3V; Product Range:SiT9365 Series; Operating Temperature Min:-20°C; Oper

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (27-Jun-2024) |
| Frequency Nom | 156.25MHz |
| Product Range | SiT9365 |
| Supply Voltage Nom | 3.3V |
| Frequency Stability + / - | 25ppm |
| Operating Temperature Max | 70°C |
| Operating Temperature Min | -20°C |
| Oscillator Case / Package | SMD, 7mm x 5mm |
| Oscillator Output Compatibility | LVPECL |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2850180RL/)

**SiT9365** Standard Frequency Ultra-low Jitter Differential Oscillator 

## **Description** 

The SiT9365 is a differential MEMS XO supporting standard frequencies between 25 MHz and 325 MHz, and engineered for low-jitter applications. Utilizing SiTime’s unique DualMEMS[®] temperature sensing and TurboCompensation[®] technology, the SiT9365 delivers exceptional dynamic performance by providing resistance to airflow, thermal gradients, shock and vibration. This device also integrates multiple on-chip regulators to filter power supply noise, eliminating the need for a dedicated external LDO. 

The SiT9365 can be factory programmed for specific combinations of frequency, stability, voltage, and output signaling. Programmability enables designers to optimize clock configurations while eliminating long lead times and customization costs associated with quartz devices where each frequency is custom built. 

## **Features** 

- 32 standard frequencies from 25 MHz to 325 MHz (For additional frequencies, refer to SiT9366 and SiT9367 datasheets) 

- LVPECL, Low-swing LVPECL,  LVDS and HCSL output signaling 

- 0.1 ps RMS phase jitter (random) for Ethernet applications 

- Frequency stability as low as ±10 ppm 

- Wide temperature ranges from -40°C to 105°C 

- Industry-standard packages: 3.2 x 2.5 mm[2] , 7.0 x 5.0 mm[2] and 5.0 x 3.2 mm[2] package 

## **Applications** 

- 10/40/100 Gbps Ethernet, SONET, SATA, SAS, Fibre Channel 

- Telecom, networking, instrumentation, storage, servers 

Standard frequencies and programmability makes this device ideal for telecom, networking, and industrial applications that require a variety of frequencies and operate in noisy environments. 

Refer to Manufacturing Notes for proper reflow profile, tape and reel dimension, and other manufacturing related information. 

## **Block Diagram** 

## **Package Pinout** 

**==> picture [106 x 65] intentionally omitted <==**

**----- Start of picture text -----**<br>
OE/NC 1_ 1 rlid 6 VDD<br>NC [_.i --5 2 |--41 5 OUT-<br>ri Loy<br>GND |;! 3 4 | OUT+<br>ri Lia<br>**----- End of picture text -----**<br>


**Figure 1. SiT9365 Block Diagram** 

**Figure 2. Pin Assignments (Top view)** (Refer to Table 7 for Pin Descriptions) 

Rev 1.1 

20 July 2021 

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**SiT9365** Standard Frequency Ultra-low Jitter Differential Oscillator 

## **Ordering Information** 

## SiT9365AC -1B2-33E125.000000T 

**==> picture [401 x 337] intentionally omitted <==**

**----- Start of picture text -----**<br>
Part Family Packaging<br>“SiT9365” “T”, “Y”, “D” or “E”<br>Refer to table below for packing method<br>Leave Blank for Bulk [[1]]<br>Revision Letter<br>“A” is the revision of Silicon<br>Frequency<br>See supported frequency list below<br>Temperature Range<br>“C”: Extended Commercial, -20 to 70°C<br>“I”:  Industrial, -40 to 85°C Feature Pin<br>“B”: -40 to 95 °C “N”: No Connect<br>“E”: Extended Industrial, -40 to 105°C “E”: Output Enable<br>Signalling Type<br>Voltage Supply<br>“1”:  LVPECL<br>“25”: 2.5 V ±10%<br>“2”:  LVDS<br>“28”: 2.8 V ±10%<br>“4”:  HCSL<br>“30”: 3.0 V ±10%<br>“5”:  Low-swing LVPECL “33”: 3.3 V ±10%<br>Package Size<br>“B”:  3.2 x 2.5 mm<br>“C”: 5.0 x 3.2 mm with center pad<br>“E”:  7.0 x 5.0 mm with center pad<br>Frequency Stability<br>“F”:  ±10 ppm<br>“1”:  ±20 ppm<br>“2”:  ±25 ppm<br>“3”:  ±50 ppm<br>**----- End of picture text -----**<br>


**Notes:** 

1. Bulk is available for sampling only. 

## **Table 1. Supported Frequencies** 

|25.000000  MHz|30.720000 MHz|50.000000  MHz|53.125000  MHz|61.440000  MHz|62.500000 MHz|74.175824  MHz|74.250000  MHz|
|---|---|---|---|---|---|---|---|
|75.000000  MHz|77.760000  MHz|98.304000  MHz|100.000000 MHz|106.250000 MHz|122.880000 MHz|125.000000 MHz|133.333333 MHz|
|148.351648 MHz|150.000000 MHz|153.600000 MHz|155.520000 MHz|156.250000 MHz|159.375000 MHz|160.000000 MHz|161.132813 MHz|
|166.666666 MHz|168.040678 MHz|200.000000  MHz|212.500000 MHz|250.000000 MHz|300.000000 MHz|322.265625 MHz|325.000000 MHz|



**Table 2. Ordering Codes for Supported Tape & Reel Packing Method** 

||||||||
|---|---|---|---|---|---|---|
|**Device Size**|**8 mm T&R**|**8 mm T&R**|**12 mm T&R**|**12 mm T&R**|**16 mm T&R**|**16 mm T&R**|
|**(mm x mm)**|**(3ku)**|**(1ku)**|**(3ku)**|**(1ku)**|**(3ku)**|**(1ku)**|
||||||||
|7.0 x 5.0|—|—|—|—|T|Y|
|5.0 x 3.2|||T|Y|||
|3.2 x 2.5|D|E|||—|—|



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## **TABLE OF CONTENTS** 

Description ................................................................................................................................................................................... 1 Features ....................................................................................................................................................................................... 1 Applications .................................................................................................................................................................................. 1 Block Diagram .............................................................................................................................................................................. 1 Package Pinout ............................................................................................................................................................................ 1 Ordering Information .................................................................................................................................................................... 2 Electrical Characteristics .............................................................................................................................................................. 4 Waveform Diagrams..................................................................................................................................................................... 9 Timing Diagrams ........................................................................................................................................................................ 10 Termination Diagrams ................................................................................................................................................................ 11 LVPECL and Low-swing LVPECL ....................................................................................................................................... 11 LVDS ................................................................................................................................................................................... 12 HCSL .................................................................................................................................................................................. 12 Dimensions and Patterns ― 3.2 x 2.5 mm[2] ................................................................................................................................ 13 Dimensions and Patterns ― 5.0 x 3.2 mm[2] ................................................................................................................................ 13 Dimensions and Patterns ― 7.0 x 5.0 mm[2] ................................................................................................................................ 14 Additional Information ................................................................................................................................................................. 15 Revision History ......................................................................................................................................................................... 16 

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## **Electrical Characteristics** 

All Min and Max limits in the Electrical Characteristics tables are specified over temperature and rated operating voltage with standard output termination shown in the termination diagrams. Typical values are at 25°C and nominal supply voltage. 

**Table 3. Electrical Characteristics – Common to LVPECL, Low-swing LVPECL, LVDS and HCSL** (All temperature ranges) 

|**Parameter**|**Symbol**|**Min.**|**Typ.**|**Max.**|**Unit**|**Condition**|
|---|---|---|---|---|---|---|
|||**Frequency Range **|||||
|**Output Frequency Range**|f|32 standard frequencies between<br>25 MHz and 325.000000 MHz|||MHz||
||||**Frequency Stability**||||
|**Frequency Stability**|F_stab|-10|–|+10|ppm|Inclusive of initial tolerance, operating temperature, rated power<br>supply voltage and load variations|
|||-20|–|+20|ppm||
|||-25|–|+25|ppm||
|||-50|–|+50|ppm||
|**First Year Aging**|F_1y|-0.7|±0.4|+0.7|ppm|At 85°C|
|**5 Year Aging**|F_5y|-1.1|±0.7|+1.1|ppm|At 85°C|
|**10 Year Aging**|F_10y|-1.3|±0.8|+1.3|ppm|At 85°C|
|**20 Year Aging**|F_20y|-1.5|±1.0|+1.5|ppm|At 85°C|
||||**Temperature Range**||||
|**Operating Temperature Range**|T_use|-20|–|+70|°C|Extended Commercial|
|||-40|–|+85|°C|Industrial|
|||-40|–|+95|°C||
|||-40|–|+105|°C|Extended Industrial|
||||**Supply Voltage **||||
|**Supply Voltage**|Vdd|2.97|3.30|3.63|V||
|||2.70|3.00|3.30|V||
|||2.52|2.80|3.08|V||
|||2.25|2.50|2.75|V||
||||**Input Characteristics**||||
|**Input Voltage High **|VIH|70%|–|–|Vdd|Pin 1,OE|
|**Input Voltage Low**|VIL|–|–|30%|Vdd|Pin 1,OE|
|**Input Pull-up Impedance**|Z_in|–|100|–|kΩ|Pin 1,OE logic high or logic low|
||||**Output Characteristics**||||
|**Duty Cycle**|DC|45|–|55|%||
||||**Startup and OE Timing**||||
|**Startup Time**|T_start|–|–|3.0|ms|Measured from the time Vdd reaches its rated minimum value.|
|**OE Enable/Disable Time**|T_oe|–|–|3.8|µs|f = 156.25 MHz. Measured from the time OE pin reaches rated<br>VIH and VIL to the time clock pins reach 90% of swing and<br>high-Z. SeeFigure 8 andFigure 9.|



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**Table 4. Electrical Characteristics – LVPECL, Low-swing LVPECL** 

|**Parameter**|**Symbol**|**Min.**|**Typ.**|**Max.**|**Unit**|**Condition**|
|---|---|---|---|---|---|---|
|||**Current Consumption**|||||
|**Current Consumption**|Idd|–|–|89|mA|ExcludingLoad Termination Current,Vdd = 3.3 V or 2.5 V|
|**OE Disable Supply Current**|I_OE|–|–|58|mA|OE = Low|
|**Output Disable Leakage Current**|I_leak|–|0.15|–|µA|OE = Low|
|**Maximum Output Current**|I_driver|–|–|30|mA|Maximum average current drawn from OUT+ or OUT-|
|||**Output Characteristics for LVPECL**|||||
|**Output High Voltage **|VOH|Vdd-1.1|–|Vdd-0.7|V|SeeFigure 4|
|**Output Low Voltage **|VOL|Vdd-1.9|–|Vdd-1.5|V|SeeFigure 4|
|**Output Differential Voltage Swing**|V_Swing|1.2|1.6|2.0|V|SeeFigure 5|
|**Rise/Fall Time**|Tr,Tf|–|225|290|ps|20% to 80%. SeeFigure 5|
|||**Output Characteristics for Low-swing LVPECL**|||||
|**Output High Voltage **|VOH|Vdd-1.2|–|Vdd-0.75|V|SeeFigure 4|
|**Output Low Voltage **|VOL|Vdd-1.8|–|Vdd-1.25|V|SeeFigure 4|
|**Output Differential Voltage Swing**|V_Swing|0.4|1|1.2|V|Output frequencyless than or equal to 220 MHz,SeeFigure 5|
|||0.4|1|1.6|V|Output frequency greater than 220 MHz,SeeFigure 5|
|**Rise/Fall Time**|Tr,Tf|–|225|290|ps|20% to 80%. SeeFigure 5|
||||**Jitter –**|**7.0 x 5.0 mm Package**|||
|**RMS Period Jitter[2]**|T_jitt|–|1.0|1.6|ps|f = 100,156.25 or 212.5 MHz,Vdd = 3.3 V or 2.5 V|
|**RMS Phase Jitter (random)**|T_phj|–|0.225|0.270|ps|f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,<br>all Vdd levels, includes spurs. Temperature ranges -20 to 70ºC<br>and -40 to 85ºC|
|||–|0.225|0.300|ps|f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,<br>all Vdd levels, includes spurs. Temperature ranges -40 to 95ºC<br>and -40 to 105ºC|
|||–|0.1|–|ps|f = 156.25 or 322.265625 MHz, IEEE802.3-2005 10GbE jitter<br>mask integration bandwidth = 1.875 MHz to 20 MHz, includes<br>spurs, all Vdd levels.|
|||**Jitter –**|**5.0 x 3.2**|**mm and 3.2 x 2.5 mm**||**Packages**|
|**RMS Period Jitter[2]**|T_jitt|–|1.0|1.6|ps|f = 100,156.25 or 212.5 MHz,Vdd = 3.3V or 2.5V|
|**RMS Phase Jitter (random)**||–|0.225|0.275|ps|f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,<br>all Vdd levels, includes spurs. Temperature ranges -20 to 70ºC<br>and -40 to 85ºC|
|||–|0.225|0.340|ps|f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,<br>all Vdd levels, includes spurs. Temperature ranges -40 to 95ºC<br>and -40 to 105ºC|
|||–|0.1|–|ps|f = 156.25 or 322.265625 MHz, IEEE802.3-2005 10GbE jitter<br>mask integration bandwidth = 1.875 MHz to 20 MHz, includes<br>spurs,all Vdd levels.|



## **Notes:** 

2. Measured according to JESD65B. 

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**Table 5. Electrical Characteristics – LVDS** 

|**Parameter**|**Symbol**|**Min.**|**Typ.**|**Max.**|**Unit**|**Condition**|
|---|---|---|---|---|---|---|
|||**Current Consumption**|||||
|**Current Consumption**|Idd|–|–|79|mA|ExcludingLoad Termination Current,Vdd = 3.3 V or 2.5 V|
|**OE Disable Supply Current**|I_OE|–|–|58|mA|OE = Low|
|**Output Disable Leakage Current**|I_leak|–|0.15|–|µA|OE = Low|
|||**Output Characteristics**|||||
|**Differential Output Voltage **|VOD|300|–|450|mV|SeeFigure 6|
|**Delta VOD**|ΔVOD|–|–|50|mV|SeeFigure 6|
|**Offset Voltage **|VOS|1.125|–|1.375|V|SeeFigure 6|
|**Delta VOS**|ΔVOS|–|–|50|mV|SeeFigure 6|
|**Rise/Fall Time**|Tr, Tf|–|400|470|ps|Measured with 2 pF capacitive loading to GND, 20% to 80%.<br>SeeFigure 7|
|||**Jitter – 7.0 x 5.0 m**|||**m Package**||
|**RMS Period Jitter[3]**|T_jitt|–|1.0|1.6|ps|f = 100,156.25 or 212.5 MHz,Vdd = 3.3 V or 2.5 V|
|**RMS Phase Jitter (random)**|T_phj|–|0.215|0.265|ps|f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,<br>all Vdd levels, includes spurs. Temperature ranges -20 to 70ºC<br>and -40 to 85ºC|
|||–|0.215|0.300|ps|f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,<br>all Vdd levels, includes spurs. Temperature ranges -40 to 95ºC<br>and -40 to 105ºC|
|||–|0.1|–|ps|f = 156.25 or 322.265625 MHz, IEEE802.3-2005 10GbE jitter<br>mask integration bandwidth = 1.875 MHz to 20 MHz, includes<br>spurs,all Vdd levels.|
|||**Jitter – 5.0 x 3.2 and 3.2 x**|||**2.5 mm Packages**||
|**RMS Period Jitter[1]**|T_jitt|–|1.0|1.6|ps|f = 100,156.25 or 212.5 MHz,Vdd = 3.3 V or 2.5 V|
|**RMS Phase Jitter (random)**|T_phj|–|0.235|0.275|ps|f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,<br>all Vdd levels, includes spurs. Temperature ranges -20 to 70ºC<br>and -40 to 85ºC|
|||–|0.235|0.320|ps|f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,<br>all Vdd levels, includes spurs. Temperature ranges -40 to 95ºC<br>and -40 to 105ºC|
|||–|0.1|–|ps|f = 156.25 or 322.265625 MHz, IEEE802.3-2005 10GbE jitter<br>mask integration bandwidth = 1.875 MHz to 20 MHz, includes<br>spurs, all Vdd levels.|



## **Notes:** 

3. Measured according to JESD65B. 

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**Table 6. Electrical Characteristics – HCSL** 

|**Parameter**|**Symbol**|**Min.**|**Typ.**|**Max.**|**Unit**|**Condition**|
|---|---|---|---|---|---|---|
|**Current Consumption**<br>~~es~~|||||||
|**Current Consumption**<br>~~es~~|Idd|–|–|89|mA|ExcludingLoad Termination Current,Vdd = 3.3 V or 2.5 V|
|**OE Disable Supply Current**<br>~~es~~<br>~~ee~~|I_OE|–|–|58|mA|OE = Low|
|**Output Disable Leakage Current**<br>~~es~~<br>~~ee~~|I_leak|–|0.15|–|µA|OE = Low|
|**Maximum Output Current**<br>~~ee~~<br>~~a~~|I_driver|–|–|35|mA|Maximum average current drawn from OUT+ or OUT-|
|**Output Characteristics**<br>~~ee~~<br>~~a~~|||||||
|**Output High Voltage **<br>~~a~~<br>~~es~~|VOH|0.60|–|0.90|V|See Figure 4|
|**Output Low Voltage **<br>~~a~~<br>~~es~~|VOL|-0.05|–|0.08|V|SeeFigure 4|
|**Output Differential Voltage Swing**<br>~~es~~<br>~~rs~~|V_Swing<br>~~ns~~|1.2<br>~~ee~~|1.4<br>~~ee~~|1.80|V|SeeFigure 5|
|**Rise/Fall Time**<br>~~es~~<br>~~rs~~<br>~~es~~|Tr, Tf<br>~~ns~~<br>|–<br>~~ee~~<br>~~a~~|360<br>~~ee~~<br>~~a~~|465|ps|Measured with 2 pF capacitive loading to GND, 20% to 80%.<br>See Figure 5|
|**Jitter – 7.0 x 5.0 mm Package**<br>~~rs ns ee~~<br>~~esa~~|||||||
|**RMS Period Jitter[4]**<br>~~es~~|T_jitt<br>|–<br>~~a~~|1.0<br>~~a~~|1.6|ps|f = 100,156.25 or 212.5 MHz,Vdd = 3.3 V or 2.5 V|
|**RMS Phase Jitter (random)**<br>~~es ~~<br>~~a~~|T_phj<br>|–<br>~~a~~<br>~~ff~~|0.220<br>~~a~~<br>~~ff~~|0.270<br>~~ff~~|ps<br>|f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,<br>all Vdd levels, includes spurs. Temperature ranges -20 to 70ºC<br>and -40 to 85ºC<br>|
|||–<br>~~ff~~<br>~~ef~~|0.220<br>~~ff~~<br>~~ef~~|0.300<br>~~ff|p~~|ps<br>~~|p~~|f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,<br>all Vdd levels, includes spurs. Temperature ranges -40 to 95ºC<br>and -40 to 105ºC<br>~~|p~~|
|||–<br>~~ff~~<br>~~ef~~|0.1<br>~~ff~~<br>~~ef~~<br>~~|~~|–<br>~~ff|p~~<br>~~|~~|ps<br>~~|p~~<br>~~fe~~|f = 156.25 or 322.265625 MHz, IEEE802.3-2005 10GbE jitter<br>mask integration bandwidth = 1.875 MHz to 20 MHz, includes<br>spurs,all Vdd levels.<br>~~|p~~<br>~~fe~~|
|**Jitter – 5.0 x 3.2 and 3.2 x 2.5 mm Packages**<br>~~|p~~<br>~~ef~~<br>~~|~~<br>~~|fe~~<br>~~a~~|||||||
|**RMS Period Jitter[4]**<br>~~a~~|T_jitt|–|1.0<br>~~|~~|1.6<br>~~|~~|ps<br>~~fe~~|f = 100,156.25 or 212.5 MHz,Vdd = 3.3 V or 2.5 V<br>~~fe~~|
|**RMS Phase Jitter (random)**<br>~~a~~|T_phj|–<br>~~a~~|0.230<br>~~|~~<br>~~a~~|0.275<br>~~|~~|ps<br>~~fe~~|f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,<br>all Vdd levels, includes spurs. Temperature ranges -20 to 70ºC<br>and -40 to 85ºC<br>~~fe~~|
|||–<br>~~a~~<br>~~a~~<br>|0.230<br>~~a~~<br>~~a~~<br>~~ft~~|0.340<br>~~ft~~|ps<br>|f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,<br>all Vdd levels, includes spurs. Temperature ranges -40 to 95ºC<br>and -40 to 105ºC<br>|
|||–<br>~~a~~<br>~~|~~|0.1<br>~~a~~<br>~~|ft~~|–<br>~~ft|p~~|ps<br>~~|p~~|f = 156.25 or 322.265625 MHz, IEEE802.3-2005 10GbE jitter<br>mask integration bandwidth = 1.875 MHz to 20 MHz, includes<br>spurs, all Vdd levels.<br>~~|p~~|



## **Notes:** 

4. Measured according to JESD65B. 

**Table 7. Pin Description** 

|**Pin**|**Map**|**Functionality**|**Functionality**|
|---|---|---|---|
|1|OE/NC|Output Enable<br>(OE)|H[5]: specified frequency output<br>L: output is high impedance|
|||Non Connect<br>(NC)|H or L or Open: No effect on output frequency or other device<br>functions|
|2|NC|NA|No Connect; Leave it floating or connect to GND for better<br>heat dissipation|
|3|GND|Power|VDD Power SupplyGround|
|4|OUT+|Output|Oscillator output|
|5|OUT-|Output|Complementaryoscillator output|
|6<br>~~5.~~|VDD|Power|Power supplyvoltage[6]|



## **Notes:** 

5. In OE mode, a pull-up resistor of 10 kΩ or less is recommended if pin 1 is not externally driven. 

6. A capacitor of value 0.1 µF or higher between VDD and GND is required. An additional 10 µF capacitor between VDD and GND is required for the best phase jitter performance. 

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## **Table 8. Absolute Maximum Ratings** 

Attempted operation outside the absolute maximum ratings may cause permanent damage to the part. Actual performance of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings. 

|**Parameter**|**Min.**|**Max.**|**Unit**|
|---|---|---|---|
|Vdd|-0.5|4.0|V|
|VIH||Vdd + 0.3V|V|
|VIL|-0.3||V|
|Storage Temperature|-65|150|ºC|
|Maximum Junction Temperature||130|ºC|
|SolderingTemperature(follow standard Pb-free soldering guidelines)||260|ºC|



## **Table 9. Thermal Considerations[[7]]** 

|**Package**|θ**JA, 4 Layer Board (°C/W)**|θ**JC, Bottom (°C/W)**|
|---|---|---|
|**3225, 6-pin**|80|30|
|**5032, 6-pin**|53|20|
|**7050, 6-pin**|52|19|



## **Notes:** 

7. Refer to JESD51 for θJA and θJC definitions, and reference layout used to determine the θJA and θJC values in the above table. 

**Table 10. Maximum Operating Junction Temperature[[8]]** 

|**Max Operating Temperature (ambient)**|**Maximum Operating Junction Temperature**|
|---|---|
|70°C|95°C|
|85°C|110°C|
|95°C|120°C|
|105°C|130°C|



## **Notes:** 

8. Datasheet specifications are not guaranteed if junction temperature exceeds the maximum operating junction temperature. 

## **Table 11. Environmental Compliance** 

|**Parameter**|**Test Conditions**|**Value**|**Unit**|
|---|---|---|---|
|Mechanical Shock Resistance|MIL-STD-883F,Method 2002|10,000|_g_|
|Mechanical Vibration Resistance|MIL-STD-883F,Method 2007|70|_g_|
|SolderingTemperature(follow standard Pb free soldering guidelines)|MIL-STD-883F,Method 2003|260|°C|
|Moisture SensitivityLevel|MSL1@260°C|||
|Electrostatic Discharge(HBM)|HBM,JESD22-A114|2,000|V|
|Charge-Device Model ESD Protection|JESD220C101|750|V|
|Latch-upTolerance|JESD78 Compliant|||



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## **Waveform Diagrams** 

**==> picture [298 x 102] intentionally omitted <==**

**----- Start of picture text -----**<br>
OUT-<br>VOH<br>OUT+<br>VOL<br>GND<br>**----- End of picture text -----**<br>


**Figure 4. LVPECL, Low-swing LVPECL, and HCSL Voltage Levels per Differential Pin (i.e. OUT+, or OUT-)** 

**==> picture [230 x 193] intentionally omitted <==**

**----- Start of picture text -----**<br>
V<br>80% 80%<br>V_ Swing<br>0 V<br>t<br>20% 20%<br>Tr Tf<br>**----- End of picture text -----**<br>


**Figure 5. LVPECL, Low-swing LVPECL, and HCSL Voltage Levels Across Differential Pair (i.e. OUT+ minus OUT-)** 

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## **Waveform Diagrams (continued)** 

**==> picture [388 x 125] intentionally omitted <==**

**----- Start of picture text -----**<br>
OUT-<br>VOD<br>OUT+<br>VOS<br>**----- End of picture text -----**<br>


**==> picture [16 x 6] intentionally omitted <==**

**----- Start of picture text -----**<br>
GND<br>**----- End of picture text -----**<br>


**Figure 6. LVDS Voltage Levels per Differential Pin (i.e. OUT+, or OUT-)** 

**==> picture [187 x 193] intentionally omitted <==**

**----- Start of picture text -----**<br>
V<br>80% 80%<br>0 V<br>t<br>20% 20%<br>Tr Tf<br>**----- End of picture text -----**<br>


**Figure 7. LVDS Differential Waveform (i.e. OUT+ minus OUT-)** 

## **Timing Diagrams** 

**==> picture [432 x 110] intentionally omitted <==**

**----- Start of picture text -----**<br>
Vdd Vdd<br>OE Voltage<br>VIH<br>VIL<br>T_oe_hw<br>OE Voltage<br>T_oe_hw<br>OUT- 90% OUT-<br>HZ HZ<br>OUT+ OUT+<br>GND GND<br>**----- End of picture text -----**<br>


**Figure 8. Hardware OE Enable Timing** 

**Figure 9. Hardware OE Disable Timing** 

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## **Termination Diagrams** 

## **LVPECL and Low-swing LVPECL** 

**==> picture [307 x 107] intentionally omitted <==**

**----- Start of picture text -----**<br>
Shunt Bias Termination<br>LVPECL network 0.1μF<br>OUT+ Zo = 50Ω D+<br>OUT- Zo = 50Ω D-<br>0.1μF<br>RB RB VDD RB 50 Ω 50 Ω<br>3.3 V 100 Ω<br>2.5 V 48.7 Ω VT<br>**----- End of picture text -----**<br>


**Figure 10. LVPECL and Low-swing LVPECL with AC-coupled Termination** 

**==> picture [307 x 134] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDD<br>Thevenin-equivalent<br>Termination network<br>LVPECL R1 R1<br>OUT+ Zo = 50Ω D+<br>OUT- Zo = 50Ω D-<br>VDD R1 R2 R2 R2<br>3.3 V 127 Ω 82.5 Ω<br>2.5 V 250 Ω 62.5 Ω<br>**----- End of picture text -----**<br>


**Figure 11. LVPECL and Low-swing LVPECL DC-coupled Load Termination with Thevenin Equivalent Network** 

**==> picture [303 x 139] intentionally omitted <==**

**----- Start of picture text -----**<br>
Y-Bias Termination<br>network<br>LVPECL<br>OUT+ Zo = 50Ω D+<br>OUT- Zo = 50Ω D-<br>R1 R2<br>VDD R1 R2 R3<br>3.3 V 50 Ω 50 Ω 50 Ω C1 R3<br>0.1μF<br>2.5 V 50 Ω 50 Ω 18 Ω<br>**----- End of picture text -----**<br>


**Figure 12. LVPECL and Low-swing LVPECL with Y-Bias Termination** 

**==> picture [288 x 102] intentionally omitted <==**

**----- Start of picture text -----**<br>
Shunt Bias Termination<br>LVPECL network<br>OUT+ Zo = 50Ω D+<br>OUT- Zo = 50Ω D-<br>50 Ω 50 Ω<br>VT=VDD-2V<br>**----- End of picture text -----**<br>


**Figure 13. LVPECL and Low-swing LVPECL with DC-coupled Parallel Shunt Load Termination** 

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## **Termination Diagrams (continued)** 

## **LVDS** 

**==> picture [319 x 93] intentionally omitted <==**

**----- Start of picture text -----**<br>
LVDS<br>OUT+ Zo = 50Ω OUT+<br>100 Ω<br>OUT- Zo = 50Ω OUT-<br>**----- End of picture text -----**<br>


**Figure 14. LVDS Single DC Termination at the Load** 

**==> picture [319 x 93] intentionally omitted <==**

**----- Start of picture text -----**<br>
LVDS 0.1μF<br>OUT+ Zo = 50Ω OUT+<br>100 Ω 100 Ω 0.1μF<br>OUT- Zo = 50Ω OUT-<br>**----- End of picture text -----**<br>


**Figure 15. LVDS double AC Termination with Capacitor Close to the Load** 

**==> picture [319 x 93] intentionally omitted <==**

**----- Start of picture text -----**<br>
LVDS<br>OUT+ Zo = 50Ω OUT+<br>100 Ω 100 Ω<br>OUT- Zo = 50Ω OUT-<br>**----- End of picture text -----**<br>


**Figure 16. LVDS Double DC Termination** 

**HCSL** 

**==> picture [341 x 115] intentionally omitted <==**

**----- Start of picture text -----**<br>
R1<br>OUT+ Zo = 50Ω D+<br>OUT- Zo = 50Ω D-<br>R2<br>50Ω 50Ω<br>R1 = R2 = 33 Ω<br>**----- End of picture text -----**<br>


**Figure 17. HCSL Interface Termination** 

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## **Dimensions and Patterns ― 3.2 x 2.5 mm[2]** 

**==> picture [480 x 138] intentionally omitted <==**

**----- Start of picture text -----**<br>
Package Size – Dimensions (Unit: mm) [[9]] Recommended Land Pattern (Unit: mm) [[10]]<br>3.2 x 2.5 x 0.85 mm  3.2 x 2.5 x 0.85 mm<br>[Toa THickNess | A _| 0.800 | 0.850 | 0.900 |<br>+21 __. 7 fe] [stanoorrlecovsze[ueDwioTH |}|iy]|__|2eAt_| _}| [2so0asc]  0.000 0880__samese_] || 0.035ooo ||  0.6500.050| || 2.25<br>PIN1 4 | i] al éL jeapercH |e | t.tooasc |<br>io . [E] [PACKAGE TOLERNCE| aaa |<br>lz) [Mou FLATNEss | bob | [0100] 0.100<br>a ILI UE Cpe [comananrry | ae | 0an0 | |<br>nals (T) I (Pp) jompcewotH| tT |otsorer |<br>jomecetenctH<br>TOP VIEW BOTTOM VIEW [owerecePTH|| a2P|| o.tsoREotooRe F |<br>aeG) (A2) Notes 0.65 1.05 a<br>1.6<br>1.00<br>**----- End of picture text -----**<br>


## **Dimensions and Patterns ― 5.0 x 3.2 mm[2 ]** 

**==> picture [480 x 23] intentionally omitted <==**

**----- Start of picture text -----**<br>
Package Size – Dimensions (Unit: mm) [[9]] Recommended Land Pattern (Unit: mm) [[10]]<br>5.0 x 3.2 x 0.85 mm [[11]] 5.0 x 3.2 x 0.85 mm [[11]]<br>**----- End of picture text -----**<br>


## **Notes:** 

9. Top Marking: Y denotes manufacturing origin and XXXX denotes manufacturing lot number. The value of “Y” will depend on the assembly location of the device. 

10. A capacitor of value 0.1 µF or higher between VDD and GND is required. An additional 10 µF capacitor between VDD and GND is required for the best phase jitter performance. 

11. The center pad has no electrical function. Soldering down the center pad to the GND is recommended for best thermal dissipation, but is optional. 

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## **Dimensions and Patterns ― 7.0 x 5.0 mm[2 ]** 

**==> picture [480 x 23] intentionally omitted <==**

**----- Start of picture text -----**<br>
Package Size – Dimensions (Unit: mm) [[12]] Recommended Land Pattern (Unit: mm) [[13]]<br>7.0 x 5.0 x 0.85 mm [[14]] 7.0 x 5.0 x 0.85 mm [[14]]<br>**----- End of picture text -----**<br>


## **Notes:** 

12. Top Marking: Y denotes manufacturing origin and XXXX denotes manufacturing lot number. The value of “Y” will depend on the assembly location of the device. 

13. A capacitor of value 0.1 µF or higher between VDD and GND is required. An additional 10 µF capacitor between VDD and GND is required for the best phase jitter performance. 

14. The center pad has no electrical function. Soldering down the center pad to the GND is recommended for best thermal dissipation, but is optional. 

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## **Additional Information** 

## **Table 12. Additional Information** 

|**Document**|**Description**|**Download Link**|
|---|---|---|
|**ECCN #: EAR99**|Five character designation used on the<br>commerce Control List (CCL) to identify dual<br>use items for export controlpurposes.|—|
|**HTS Classification Code:**<br>**8542.39.0000**|A Harmonized Tariff Schedule (HTS) code<br>developed by the World Customs Organization<br>to classify/define internationallytradedgoods.|—|
|**Part number Generator**|Tool used to create the part number based on<br>desired features.|https://www.sitime.com/part-number-generator|
|**Manufacturing Notes**|Tape & Reel dimension, reflow profile and<br>other manufacturingrelated info|https://www.sitime.com/sites/default/files/gated/Manufacturing-Notes-for-SiTime-<br>Products.pdf|
|**Qualification Reports**|RoHS report, reliability reports,<br>composition reports|http://www.sitime.com/support/quality-and-reliability|
|**Performance Reports**|Additional performance data such as phase<br>noise, current consumption and jitter for<br>selected frequencies|http://www.sitime.com/support/performance-measurement-report|
|**Termination Techniques**|Termination design recommendations|http://www.sitime.com/support/application-notes|
|**Layout Techniques**|Layout recommendations|http://www.sitime.com/support/application-notes|
|**Evaluation Boards**|SiT6085/6EB rev. 3.0, SiT6085EB rev.3.1 and<br>SiT6097EB rev. 2.0 Evaluation Boards for<br>Differential Oscillators User Manual|https://www.sitime.com/support/user-guides|



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## **Revision History** 

## **Table 13. Revision History** 

|**Revision**|**Release Date**|**Change Summary**|
|---|---|---|
|1.0|6-Sep-2017|Final release|
|1.04|17-Apr-2018|Added 5032 package<br>Added -40 to 95°C and -40 to 105°C temperature ranges<br>Corrected minor errors|<br>Added Additional Information Table|
|1.05|3-Jul-2018|Performed minor edits and updated OrderingInformation|
|1.06|25-Oct-2018|Removed “Contact SiTime” for ±10ppm|
|1.07|30-Jul-2019|Updated package Dimensions Drawings<br>Updated Table 9 Thermal Considerations for 5032 package<br>Updated Table 3 specification for First Year Aging<br>Added 5, 10, and 20 year aging specs<br>Added Evaluation Boards SiT6085EB reference in Table 12<br>Rearranged layout, added Description, Block Diagram and TOC<br>Tightened LVDS minimum VOD specification<br>Added HTS code<br>Added low-swingLVPECLpackage code and specifications|
|1.08|17-Aug-2019|Formattingchanges|
|1.09|9-Mar-2021|Updated L1 and Dimple Width package dimensions for 3.2 x 2.5 mm package<br>Updated trademarks,hyperlinks and changed rev table date format|
|1.1|20-Jul-2021|Updated pin direction in package dimensions for 3.2 x 2.5 mm package|



## **SiTime Corporation** , 5451 Patrick Henry Drive, Santa Clara, CA 95054, USA | **Phone:** +1-408-328-4400 | **Fax:** +1-408-328-4439 

> © SiTime Corporation 2017-2021. The information contained herein is subject to change at any time without notice. SiTime assumes no responsibility or liability for any loss, damage or defect of a Product which is caused in whole or in part by (i) use of any circuitry other than circuitry embodied in a SiTime product, (ii) misuse or abuse including static discharge, neglect or accident, (iii) unauthorized modification or repairs which have been soldered or altered during assembly and are not capable of being tested by SiTime under its normal test conditions, or (iv) improper installation, storage, handling, warehousing or transportation, or (v) being subjected to unusual physical, thermal, or electrical stress. 

> **Disclaimer:** SiTime makes no warranty of any kind, express or implied, with regard to this material, and specifically disclaims any and all express or implied warranties, either in fact or by operation of law, statutory or otherwise, including the implied warranties of merchantability and fitness for use or a particular purpose, and any implied warranty arising from course of dealing or usage of trade, as well as any common-law duties relating to accuracy or lack of negligence, with respect to this material, any SiTime product and any product documentation. Products sold by SiTime are not suitable or intended to be used in a life support application or component, to operate nuclear facilities, or in other mission critical applications where human life may be involved or at stake. All sales are made conditioned upon compliance with the critical uses policy set forth below. 

## CRITICAL USE EXCLUSION POLICY 

BUYER AGREES NOT TO USE SITIME'S PRODUCTS FOR ANY APPLICATION OR IN ANY COMPONENTS USED IN LIFE SUPPORT DEVICES OR TO OPERATE NUCLEAR FACILITIES OR FOR USE IN OTHER MISSION-CRITICAL APPLICATIONS OR COMPONENTS WHERE HUMAN LIFE OR PROPERTY MAY BE AT STAKE. 

SiTime owns all rights, title and interest to the intellectual property related to SiTime's products, including any software, firmware, copyright, patent, or trademark. The sale of SiTime products does not convey or imply any license under patent or other rights. SiTime retains the copyright and trademark rights in all documents, catalogs and plans supplied pursuant to or ancillary to the sale of products or services by SiTime. Unless otherwise agreed to in writing by SiTime, any reproduction, modification, translation, compilation, or representation of this material shall be strictly prohibited. 

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## Links

- [View this product on Novapart](https://novapart.co/products/SIT9365AC-1E2-33E156.250000X/oscillator-lvpecl-15625-mhz-25-ppm-smd-7mm-x-5mm)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/sitime/sit9365ac-1e2-33e156-250000x/oscillator-156-25mhz-7x5mm-lvpecl/dp/2850180RL)
---

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