# TCXO, 25 MHz, 0.5 ppm, SMD, 5mm x 3.2mm, LVCMOS, 3.3 V, SiT5156

![Product image](https://novapart.co/image/farnell:2908694/)

**URL**: https://novapart.co/products/SIT5156AI-FK-33E0-25.000000X/tcxo-25-mhz-05-ppm-smd-5mm-x-32mm-lvcmos-33-v
**SKU**: SIT5156AI-FK-33E0-25.000000X
**Manufacturer**: SITIME
**Category**: Crystals & Oscillators || Oscillators || Temperature Compensated - TCXO Oscillators
**Price**: €37.3300
**Stock**: 10+
**Lead Time**: 169 days (indicative)

## Description

Frequency Nom:25MHz; Frequency Stability + / -:0.5ppm; Oscillator Case:SMD, 5mm x 3.2mm; Oscillator Output Compatibility:LVCMOS; Supply Voltage Nom:3.3V; Product Range:SiT5156 Serie

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (27-Jun-2024) |
| Frequency Nom | 25MHz |
| Product Range | SiT5156 |
| Supply Voltage Nom | 3.3V |
| Frequency Stability + / - | 0.5ppm |
| Operating Temperature Max | 85°C |
| Operating Temperature Min | -40°C |
| Oscillator Case / Package | SMD, 5mm x 3.2mm |
| Oscillator Output Compatibility | LVCMOS |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2908694/)

**SiT5156** 1 MHz to 60 MHz, ±0.5 to ±2.5 ppm, Elite Platform™ Super-TCXO 

## **Description** 

The SiT5156 is a ±0.5 ppm to ±2.5 ppm MEMS SuperTCXO that is engineered for best dynamic performance. It is ideal for high reliability telecom, wireless and networking, industrial, precision GNSS and audio/video applications. 

Leveraging SiTime’s unique DualMEMS™ temperature sensing and TurboCompensation™ technologies, the SiT5156 delivers the best dynamic performance for timing stability in the presence of environmental stressors such as air flow, temperature perturbation, vibration, shock, and electromagnetic interference. This device also integrates multiple on-chip regulators to filter power supply noise, eliminating the need for a dedicated external LDO. 

The SiT5156 offers three device configurations that can be ordered using Ordering Codes for: 

- 1) TCXO with non-pullable output frequency, 

- 2) VCTCXO allowing voltage control of output 

## **Features** 

- Any frequency from 1 MHz to 60 MHz in 1 Hz steps 

- Factory programmable options for short lead times 

- Best dynamic stability under airflow, thermal shock 

   - ±0.5 ppm stability across temperature 

   - ±15 ppb/°C typical frequency slope (ΔF/ΔT) 

- -40°C to +105°C operating temperature 

- No activity dips or micro jumps 

- Resistant to shock, vibration and board bending 

- On-chip regulators eliminate the need for external LDOs 

- Digital frequency pulling (DCTCXO) via I[2] C 

   - Digital control of output frequency and pull range  Up to ±3200 ppm pull range 

   - Frequency pull resolution down to 5 ppt 

- 2.5 V, 2.8 V, 3.0 V and 3.3 V supply voltage 

- LVCMOS or clipped sinewave output 

- RoHS and REACH compliant 

- Pb-free, Halogen-free, Antimony-free 

## **Applications** 

- 3) DCTCXO, enabling digital control of output frequency 

- Precision GNSS systems 

- Microwave backhaul 

- Network routers and switches 

The SiT5156 can be factory programmed for any combination of frequency, stability, voltage, and pull range. Programmability enables designers to optimize clock configurations while eliminating long lead times and customization costs associated with quartz devices where each frequency is custom built. 

- Professional audio and video equipment 

- Storage and servers 

- Test and measurement 

Refer to Manufacturing Guideline for proper reflow profile and PCB cleaning recommendations to ensure best performance. 

## **Block Diagram** 

## **5.0 mm x 3.2 mm Package Pinout** 

**==> picture [124 x 102] intentionally omitted <==**

**----- Start of picture text -----**<br>
SDA / NC<br>OE / VC / NC 1 10 9 VDD<br> SCL / NC 2 8 NC<br>NC 3 7 NC<br>GND 4 5 6 CLK<br>A0 / NC<br>**----- End of picture text -----**<br>


**Figure 1. SiT5156 Block Diagram** 

**Figure 2. Pin Assignments (Top view)** (Refer to Table 13 for Pin Descriptions) 

Rev 1.06 

May 23, 2020 

www.sitime.com 

**SiT5156** 1 MHz to 60 MHz, ±0.5 to ±2.5 ppm, Elite Platform™ Super-TCXO 

## **Ordering Information** 

The part number guide illustrated below is for reference only, in which boxes identify order codes having more than one option. To customize and build an exact part number, use the SiTime Part Number Generator. To validate the part number, use the SiTime Part Number Decoder. 

|**Part**<br>**Family**<br>**Silicon**<br>**Revision**<br>**Package Size**<br>"F": 5.0 mm x 3.2 mm|**Pin 1 Function**–_TCXO mode only_<br>"E": Output Enable|
|---|---|
|SiT5156AC - FK - 33 E 0 - 19.123456  T<br>SiT5156AC - FK - 33 V T - 19.123456  T<br>SiT5156AC - FKG33 J R - 19.123456  T<br>**Letter**<br>**Pull Range**–_DCTCXO mode only_<br>"T": ±6.25 ppm<br>"R": ±10 ppm<br>"Q": ±12.5 ppm<br>"M":±25 ppm<br>"B": ±50 ppm<br>"C": ±80 ppm<br>"E": ±100 ppm<br>"F": ±125 ppm<br>"G": ±150 ppm<br>"H": ±200 ppm<br>"X": ±400 ppm<br>"L": ±600 ppm<br>"Y": ±800 ppm<br>"S": ±1200 ppm<br>"Z": ±1600 ppm<br>"U": ±3200 ppm<br>**Supply Voltage**<br>"25": 2.5 V±10%<br>"28": 2.8 V±10%<br>"30": 3.0 V±10%<br>"33": 3.3 V±10%<br>**Frequency**<br>1.000000 MHz to 60.000000 MHz<br>**Pin 1 Function**–_DCTCXO mode only_<br>"I": Output Enable<br>"J": No Connect, software OE control<br>**Temperature Range**<br>"I": Industrial, -40 to 85°C<br>"C": Extended Commercial, -20 to 70°C<br>"E": Extended Industrial, -40 to 105°C<br>**Output Waveform**<br>"-": LVCMOS**[1]**<br>"C": Clipped Sinewave<br>**Frequency Stability**<br>"K": for±0.5 ppm<br>"A": for±1.0 ppm<br>"D": for±2.5 ppm<br> <br>"N": No Connect<br>**I2C Address Mode **–_DCTCXO mode only_<br>“0”, “1”, “2”, “3”, “4”, “5”, “6”, “7”, “8”, “9”, “A”, “B”,<br>“C”, “D”, “E”, “F”:  Order code representing hex<br>value of I2C address. When the I2C address is<br>factory programmed using this code, pin A0 is no<br>connect (NC).<br>“G”: I2C pin addressable mode. Address is set by<br>the logic on A0 pin.<br>**Packaging**<br>"T": 12 mm Tape & Reel, 3 ku reel<br>"Y": 12 mm Tape & Reel, 1 ku reel<br>“X”: 12 mm Tape & Reel, 250 u reel<br>(blank): bulk[2]<br>**TCXO**<br>**VCTCXO**<br>**DCTCXO**|<br>"N": No Connect|
||**Supply Voltage**<br>"25": 2.5 V±10%<br>"28": 2.8 V±10%<br>"30": 3.0 V±10%<br>"33": 3.3 V±10%|



## **Notes:** 

1. “-“ corresponds to the default rise/fall time for LVCMOS output as specified in Table 1 (Electrical Characteristics). Contact SiTime for other rise/fall time options for best EMI or driving multiple loads. For differential outputs, contact SiTime. 

2. Bulk is available for sampling only 

Page 2 of 38 

Rev 1.06 

www.sitime.com 

**SiT5156** 1 MHz to 60 MHz, ±0.5 to ±2.5 ppm, Elite Platform™ Super-TCXO 

## **TABLE OF CONTENTS** 

Description ................................................................................................................................................................................... 1 Features ....................................................................................................................................................................................... 1 Applications ................................................................................................................................................................................. 1 Block Diagram ............................................................................................................................................................................. 1 5.0 mm x 3.2 mm Package Pinout ............................................................................................................................................... 1 Ordering Information .................................................................................................................................................................... 2 Electrical Characteristics .............................................................................................................................................................. 4 Device Configurations and Pin-outs ............................................................................................................................................. 9 Pin-out Top Views................................................................................................................................................................. 9 Test Circuit Diagrams for LVCMOS and Clipped Sinewave Outputs ......................................................................................... 10 Waveforms ................................................................................................................................................................................. 12 Timing Diagrams ........................................................................................................................................................................ 13 Typical Performance Plots ......................................................................................................................................................... 14 Architecture Overview ................................................................................................................................................................ 16 Frequency Stability ............................................................................................................................................................. 16 Output Frequency and Format ............................................................................................................................................ 16 Output Frequency Tuning ................................................................................................................................................... 16 Pin 1 Configuration (OE, VC, or NC) .................................................................................................................................. 17 Device Configurations ................................................................................................................................................................ 17 TCXO Configuration ........................................................................................................................................................... 17 VCTCXO Configuration ...................................................................................................................................................... 18 DCTCXO Configuration ...................................................................................................................................................... 19 VCTCXO-Specific Design Considerations ................................................................................................................................. 20 Linearity .............................................................................................................................................................................. 20 Control Voltage Bandwidth ................................................................................................................................................. 20 FV Characteristic Slope KV ................................................................................................................................................. 20 Pull Range, Absolute Pull Range ........................................................................................................................................ 21 DCTCXO-Specific Design Considerations ................................................................................................................................. 22 Pull Range and Average Pull Range .................................................................................................................................. 22 Output Frequency ............................................................................................................................................................... 23 I[2] C Control Registers .......................................................................................................................................................... 25 Register Descriptions .......................................................................................................................................................... 25 Register Address: 0x00. Digital Frequency Control Least Significant Word (LSW) ............................................................ 25 Register Address: 0x01. OE Control, Digital Frequency Control Most Significant Word (MSW) ......................................... 26 Register Address: 0x02. DIGITAL PULL RANGE CONTROL[[15]] ....................................................................................... 27 Serial Interface Configuration Description .......................................................................................................................... 28 Serial Signal Format ........................................................................................................................................................... 28 Parallel Signal Format ........................................................................................................................................................ 29 Parallel Data Format ........................................................................................................................................................... 29 I[2] C Timing Specification ...................................................................................................................................................... 31 I[2] C Device Address Modes ................................................................................................................................................. 32 Schematic Example ............................................................................................................................................................ 33 Dimensions and Patterns ........................................................................................................................................................... 34 Layout Guidelines ...................................................................................................................................................................... 35 Manufacturing Guidelines .......................................................................................................................................................... 35 Additional Information ................................................................................................................................................................ 36 Revision History ......................................................................................................................................................................... 37 

Page 3 of 38 

Rev 1.06 

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**SiT5156** 1 MHz to 60 MHz, ±0.5 to ±2.5 ppm, Elite Platform™ Super-TCXO 

## **Electrical Characteristics** 

All Min and Max limits are specified over temperature and rated operating voltage with 15 pF output load unless otherwise stated. Typical values are at 25°C and 3.3 V Vdd. 

## **Table 1. Output Characteristics** 

|**Parameters**|**Symbol**|**Min.**|**Typ.**|**Max.**|**Unit**|**Condition**|
|---|---|---|---|---|---|---|
|||**Frequency Coverage**|||||
|**Nominal Output Frequency Range**|F_nom|1|–|60|MHz||
|||**Temperature Range **|||||
|**Operating Temperature Range**|T_use|-20|–|+70|°C|Extended Commercial, ambient temperature|
|||-40|–|+85|°C|Industrial, ambient temperature|
|||-40|–|+105|°C|Extended Industrial, ambient temperature|
|||**Frequency Stability**|||||
|**Frequency Stability over**<br>**Temperature**|F_stab|–|–|±0.5|ppm|Referenced to (max frequency + min frequency)/2 over the<br>rated temperature range. Vc=Vdd/2 for VCTCXO|
|||–|–|±1.0|ppm||
|||–|–|±2.5|ppm||
|**Initial Tolerance**|F_init|–|–|±1|ppm|Initial frequencyat 25°C at 48 hours after 2 reflows|
|**Supply Voltage Sensitivity**|F_Vdd|–|±7.10|±16.25|ppb|±0.5ppm F_stab,Vdd ±5%|
|||–|±11.83|±32.50|ppb|±1.0ppm  F_stab,Vdd ±5%|
|||–|±28.40|±65.0|ppb|±2.5ppm F_stab,Vdd ±5%|
|**Output Load Sensitivity**|F_load|–|±0.81|±2.75|ppb|±0.5 ppm F_stab. LVCMOS output, 15 pF ±10%. Clipped<br>sinewave output, 10 kΩ||10pF ±10%|
|||–|±1.35|±5.50|ppb|±1.0 ppm F_stab. LVCMOS output, 15 pF ±10%. Clipped<br>sinewave output,10 kΩ||10pF ±10%|
|||–|±3.24|±11.00|ppb|±2.5 ppm F_stab. LVCMOS output, 15 pF ±10%. Clipped<br>sinewave output, 10 kΩ||10pF ±10%|
|**Frequency vs. Temperature Slope**|ΔF/ΔT|–|±15|±25|ppb/°C|±0.5ppm F_stab,0.5°C/min ramprate,-40 to 105°C|
|||–|±25|±50|ppb/°C|±1.0ppm F_stab,0.5°C/min ramprate,-40 to 105°C|
|||–|±60|±100|ppb/°C|±2.5ppm F_stab,0.5°C/min ramprate,-40 to 105°C|
|**Dynamic Frequency Change during**<br>**Temperature Ramp**|F_dynamic|–|±0.13|±0.21|ppb/s|±0.5ppm F_stab, 0.5°C/min ramprate, -40 to 105°C|
|||–|±0.21|±0.42|ppb/s|±1.0ppm F_stab,0.5°C/min ramprate,-40 to 105°C|
|||–|±0.50|±0.83|ppb/s|±2.5ppm F_stab,0.5°C/min ramprate,-40 to 105°C|
|**One-Year Aging**|F_1y|–|±1|–|ppm|At 25°C, after 2-days of continued operation. Aging is<br>measured with respect to day3|
|**20-Year Aging**|F_20y|–|±2|–|ppm|At 25°C, after 2-days of continued operation. Aging is<br>measured with respect to day3|
|||**LVCMOS Output Characteristics**|||||
|**Duty Cycle**|DC|45|–|55|%||
|**Rise/Fall Time**|Tr, Tf|0.8|1.2|1.9|ns|10% - 90% Vdd|
|**Output Voltage High **|VOH|90%|–|–|Vdd|IOH = +3 mA|
|**Output Voltage Low**|VOL|–|–|10%|Vdd|IOL = -3 mA|
|**Output Impedance**|Z_out_c|–|17|–|Ohms|Impedance lookinginto output buffer,Vdd = 3.3 V|
|||–|17|–|Ohms|Impedance lookinginto output buffer,Vdd = 3.0 V|
|||–|18|–|Ohms|Impedance lookinginto output buffer,Vdd = 2.8 V|
|||–|19|–|Ohms|Impedance lookinginto output buffer,Vdd = 2.5 V|
|||**Clipped Sinewave Output Characteristics**|||||
|**Output Voltage Swing**|V_out|0.8|–|1.2|V|Clipped sinewave output, 10 kΩ||10pF ±10%|
|**Rise/Fall Time**|Tr, Tf|–|3.5|4.6|ns|20% - 80% Vdd, F = 19.2 MHz|
||||**Start-up Characteristics**||||
|**Start-up Time**|T_start|–|2.5|3.5|ms|Time to first pulse, measured from the time Vdd reaches<br>90% of its final value. Vdd ramp time = 100 µs from 0V to<br>Vdd|
|**Output Enable Time**|T_oe|–|–|680|ns|F_nom = 10 MHz. SeeTimingDiagramssection below.|
|**Time to Rated Frequency Stability**|T_stability|–|5|45|ms|Time to first accurate pulse within rated stability, measured<br>from the time Vdd reaches 90% of its final value. Vdd<br>ramptime = 100µs|



Page 4 of 38 

Rev 1.06 

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**SiT5156** 1 MHz to 60 MHz, ±0.5 to ±2.5 ppm, Elite Platform™ Super-TCXO 

## **Table 2. DC Characteristics** 

|**Parameters**|**Symbol**|**Min.**|**Typ.**|**Max.**|**Unit**|**Condition**|
|---|---|---|---|---|---|---|
||||**Supply Voltage **||||
|**Supply Voltage**|Vdd|2.25|2.5|2.75|V|ContactSiTimefor 2.25 V to 3.63 V continuous supply<br>voltage support|
|||2.52|2.8|3.08|V||
|||2.7|3.0|3.3|V||
|||2.97|3.3|3.63|V||
||||**Current Consumption**||||
|**Current Consumption**|Idd|–|44|53|mA|F_nom = 19.2 MHz, No Load, TCXO and DCTCXO modes|
|||–|48|57|mA|F_nom = 19.2 MHz, No Load, VCTCXO mode|
|**OE Disable Current**|I_od|–|43|51|mA|OE = GND,output weakly pulled down. TCXO,DCTCXO|
|||–|47|55|mA|OE = GND, output weakly pulled down. VCTCXO mode|



## **Table 3. Input Characteristics** 

|**Parameters**|**Symbol**|**Min.**|**Typ. **|**Max.**|**Unit**|**Condition**|
|---|---|---|---|---|---|---|
||**Input Characteristics– OE Pin**||||||
|**Input Impedance**|Z_in|75|–|–|kΩ|Internalpull upto Vdd|
|**Input High Voltage **|VIH|70%|–|–|Vdd||
|**Input Low Voltage **|VIL|–|–|30%|Vdd||
||**Frequency Tuning Range – Voltage Control or I2C mode**||||||
|**Pull Range**|PR|±6.25|–|–|ppm|VCTCXO mode;contactSiTimefor ±12.5 and ±25ppm|
|||±6.25<br>±10<br>±12.5<br>±25<br>±50<br>±80<br>±100<br>±125<br>±150<br>±200<br>±400<br>±600<br>±800<br>±1200<br>±1600<br>±3200|–|–|ppm|DCTCXO mode|
|**Absolute Pull Range[3]**|APR|±2.75|–|–|ppm|±0.5ppm F_stab,DCTCXO,VCTCXO for PR = ±6.25ppm|
|||±2.25|–|–|ppm|±1.0ppm F_stab, DCTCXO, VCTCXO for PR = ±6.25ppm|
|||±0.75|–|–|ppm|±2.5ppm F_stab,DCTCXO,VCTCXO for PR = ±6.25ppm|
|**Upper Control Voltage **|VC_U|90%|–|–|Vdd|VCTCXO mode|
|**Lower Control Voltage **|VC_L|–|–|10%|Vdd|VCTCXO mode|
|**Control Voltage Input Impedance**|VC_z|8|–|–|MΩ|VCTCXO mode|
|**Control Voltage Input Bandwidth**|VC_bw|–|10|–|kHz|VCTCXO mode; contactSiTimefor other bandwidth options|
|**Frequency Control Polarity**|F_pol|Positive||||VCTCXO mode|
|**Pull Range Linearity**|PR_lin|–|0.5|1.0|%|VCTCXO mode|
||**I2C Interface Characteristics,  **|||**200 Ohm, 550pF (Max I2C Bus Load)**|||
|**Bus Speed**|F_I2C||≤ 400||kHz|-40 to 105°C|
||||≤ 1000||kHz|-40 to 85°C|
|**Input Voltage Low**|VIL_I2C|–|–|30%|Vdd|DCTCXO mode|
|**Input Voltage High **|VIH_I2C|70%|–|–|Vdd|DCTCXO mode|
|**Output Voltage Low**|VOL_I2C|–|–|0.4|V|DCTCXO mode|
|**Input Leakage current**|IL|0.5|–|24|µA|0.1 VDD< VOUT < 0.9 VDD.Includes typical leakage current<br>from 200 kΩpull resister to VDD. DCTCXO mode|
|**Input Capacitance**|CIN|–|–|5|pF|DCTCXO mode|



## **Note:** 

3. APR = PR – initial tolerance – 20-year aging – frequency stability over temperature. Refer to Table 17 for APR with respect to other pull range options. 

Page 5 of 38 

Rev 1.06 

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**SiT5156** 1 MHz to 60 MHz, ±0.5 to ±2.5 ppm, Elite Platform™ Super-TCXO 

**Table 4. Jitter & Phase Noise – LVCMOS, -40°C to 85°C** 

|**Parameters**|**Symbol**|**Min.**|**Typ.**|**Max.**|**Unit**|**Condition**|
|---|---|---|---|---|---|---|
||||**Jitter**||||
|**RMS Phase Jitter (random)**|T_phj|–|0.31|0.48|ps|F_nom = 10 MHz,Integration bandwidth = 12 kHz to 5 MHz|
|||–|0.31|0.48|ps|F_nom = 50 MHz,Integration bandwidth = 12 kHz to 20 MHz|
|**RMS Period Jitter**|T_jitt_per|–|0.8|1.1|ps|F_nom = 10 MHz, population 10 k|
|**Peak Cycle-to-Cycle Jitter**|T_jitt_cc|–|6|9|ps|F_nom = 10 MHz, population 1 k, measured as absolute<br>value|
||||**Phase Noise**||||
|**1 Hz offset**||–|-80|-74|dBc/Hz|F_nom = 10 MHz<br>TCXO and DCTCXO modes, and VCTCXO mode with<br>±6.25 ppm pull range|
|**10 Hz offset**||–|-108|-102|dBc/Hz||
|**100 Hz offset**||–|-127|-123|dBc/Hz||
|**1 kHz offset**||–|-148|-145|dBc/Hz||
|**10 kHz  offset**||–|-154|-151|dBc/Hz||
|**100 kHz offset**||–|-154|-150|dBc/Hz||
|**1 MHz offset**||–|-167|-163|dBc/Hz||
|**5 MHz offset**||–|-168|-164|dBc/Hz||
|**Spurious**|T_spur|–|-112|-105|dBc|F_nom = 10 MHz, 1 kHz to 5 MHz offsets|



## **Table 5. Jitter & Phase Noise – Clipped Sinewave, -40°C to 85°C** 

|**Parameters**|**Symbol**|**Min.**|**Typ.**|**Max.**|**Unit**|**Condition**|
|---|---|---|---|---|---|---|
||||**Jitter**||||
|**RMS Phase Jitter (random)**|T_phj|–|0.31|0.45|ps|F_nom = 19.2 MHz,Integration bandwidth = 12 kHz to 5 MHz|
|||–|0.31|0.48|ps|F_nom = 60 MHz,Integration bandwidth = 12 kHz to 20 MHz|
||||**Phase Noise**||||
|**1 Hz offset**||–|-74|-68|dBc/Hz|F_nom = 19.2 MHz<br>TCXO and DCTCXO modes, and VCTCXO mode with<br>±6.25 ppm pull range|
|**10 Hz offset**||–|-102|-97|dBc/Hz||
|**100 Hz offset**||–|-121|-117|dBc/Hz||
|**1 kHz offset**||–|-142|-140|dBc/Hz||
|**10 kHz  offset**||–|-148|-146|dBc/Hz||
|**100 kHz offset**||–|-149|-145|dBc/Hz||
|**1 MHz offset**||–|-162|-159|dBc/Hz||
|**5 MHz offset**||–|-164|-160|dBc/Hz||
|**Spurious**|T_spur|–|-109|-104|dBc|F_nom = 19.2 MHz, 1 kHz to 5 MHz offsets|



Page 6 of 38 

Rev 1.06 

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**SiT5156** 1 MHz to 60 MHz, ±0.5 to ±2.5 ppm, Elite Platform™ Super-TCXO 

**Table 6. Jitter & Phase Noise – LVCMOS, -40°C to 105°C** 

|**Parameters**|**Symbol**|**Min.**|**Typ.**|**Max.**|**Unit**|**Condition**|
|---|---|---|---|---|---|---|
||||**Jitter**||||
|**RMS Phase Jitter (random)**|T_phj|–|0.31|0.48|ps|F_nom = 10 MHz,Integration bandwidth = 12 kHz to 5 MHz|
|||–|0.31|0.50|ps|F_nom = 50 MHz,Integration bandwidth = 12 kHz to 20 MHz|
|**RMS Period Jitter**|T_jitt_per|–|0.8|1.1|ps|F_nom = 10 MHz, population 10 k|
|**Peak Cycle-to-Cycle Jitter**|T_jitt_cc|–|6|9|ps|F_nom = 10 MHz, population 1 k, measured as absolute<br>value|
||||**Phase Noise**||||
|**1 Hz offset**||–|-80|-74|dBc/Hz|F_nom = 10 MHz<br>TCXO and DCTCXO modes, and VCTCXO mode with<br>±6.25 ppm pull range.|
|**10 Hz offset**||–|-108|-102|dBc/Hz||
|**100 Hz offset**||–|-127|-123|dBc/Hz||
|**1 kHz offset**||–|-148|-145|dBc/Hz||
|**10 kHz  offset**||–|-154|-151|dBc/Hz||
|**100 kHz offset**||–|-154|-150|dBc/Hz||
|**1 MHz offset**||–|-167|-162|dBc/Hz||
|**5 MHz offset**||–|-168|-164|dBc/Hz||
|**Spurious**|T_spur|–|-112|-101|dBc|F_nom = 10 MHz,1 kHz to 5 MHz offsets,Vdd = 2.5 V|
|||–|-112|-106|dBc|F_nom = 10 MHz, 1 kHz to 5 MHz offsets, Vdd = 2.8 V,<br>3.0 V, 3.3 V|
|**Table 7. Jitter & Phase Noise –**|**Clipped Sinewave,**||**-40°C to**|**105°C**|||
|**Parameters**|**Symbol**|**Min.**|**Typ.**|**Max.**|**Unit**|**Condition**|
|||||**Jitter**|||
|**RMS Phase Jitter (random)**|T_phj|–|0.31|0.46|ps|F_nom = 19.2 MHz, Integration bandwidth = 12 kHz to 5 MHz|
|||–|0.31|0.50|ps|F_nom = 60 MHz,Integration bandwidth = 12 kHz to 20 MHz|
||||**Phase Noise**||||
|**1 Hz offset**||–|-74|-68|dBc/Hz|F_nom = 19.2 MHz<br>TCXO and DCTCXO modes, and VCTCXO mode with<br>±6.25 ppm pull range|
|**10 Hz offset**||–|-102|-97|dBc/Hz||
|**100 Hz offset**||–|-121|-117|dBc/Hz||
|**1 kHz offset**||–|-142|-140|dBc/Hz||
|**10 kHz  offset**||–|-148|-146|dBc/Hz||
|**100 kHz offset**||–|-149|-145|dBc/Hz||
|**1 MHz offset**||–|-162|-158|dBc/Hz||
|**5 MHz offset**||–|-164|-159|dBc/Hz||
|**Spurious**|T_spur|–|-109|-103|dBc|F_nom = 19.2 MHz, 1 kHz to 5 MHz offsets|



Page 7 of 38 

Rev 1.06 

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**SiT5156** 1 MHz to 60 MHz, ±0.5 to ±2.5 ppm, Elite Platform™ Super-TCXO 

## **Table 8. Absolute Maximum Limits** 

Attempted operation outside the absolute maximum ratings may cause permanent damage to the part. Actual performance of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings. 

|**Parameter**|**Test Conditions**|**Value**|**Unit**|
|---|---|---|---|
|**Storage Temperature**||-65 to 125|°C|
|**Continuous Power Supply Voltage Range (Vdd)**||-0.5 to 4|V|
|**Human Body Model (HBM) ESD Protection**|JESD22-A114|2000|V|
|**Soldering Temperature (follow standard Pb-free soldering guidelines)**||260|°C|
|**Junction Temperature[4]**||130|°C|
|**Input Voltage, Maximum**|Any input pin|Vdd + 0.3|V|
|**Input Voltage, Minimum**|Any input pin|-0.3|V|



## **Note:** 

4. Exceeding this temperature for an extended period of time may damage the device. 

## **Table 9. Thermal Considerations[[5]]** 

|**Package**|θ**JA[6](°C/W)**|θ**JC, Bottom (°C/W)**|
|---|---|---|
|**Ceramic 5.0 mm x 3.2 mm**|54|15|



## **Note:** 

5. Measured in still air. Refer to JESD51 for θJA and θJC definitions. 

6. Devices soldered on a JESD51 2s2p compliant board. 

## **Table 10. Maximum Operating Junction Temperature[[7]]** 

|**Max Operating Temperature (ambient)**|**Maximum Operating Junction Temperature**|
|---|---|
|**70°C**|**80°C**|
|**85°C**|**95°C**|
|**105°C**|**115°C**|



## **Note:** 

7. Datasheet specifications are not guaranteed if junction temperature exceeds the maximum operating junction temperature. 

## **Table 11. Environmental Compliance** 

|**Parameter**|**Test Conditions**|**Value**|**Unit**|
|---|---|---|---|
|**Mechanical Shock Resistance**|**MIL-STD-883F, Method 2002**|**30000**|_g_|
|**Mechanical Vibration Resistance**|**MIL-STD-883F, Method 2007**|**70**|_g_|
|**Temperature Cycle**|**JESD22, Method A104**|–|–|
|**Solderability**|**MIL-STD-883F, Method 2003**|–|–|
|**Moisture Sensitivity Level**|**MSL1 @260°C**|–|–|



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## **Device Configurations and Pin-outs** 

**Table 12. Device Configurations** 

|**Configuration**|**Pin 1**|**Pin 5**|**I2C Programmable Parameters**|
|---|---|---|---|
|TCXO|OE/NC|NC|–|
|VCTCXO|VC|NC|–|
|DCTCXO|OE/NC|A0/NC|Frequency Pull Range, Frequency Pull Value, Output Enable control.|



## **Pin-out Top Views** 

**==> picture [478 x 113] intentionally omitted <==**

**----- Start of picture text -----**<br>
NC NC SDA<br>OE/NC 1 10 9 VDD VC 1 10 9 VDD OE / NC 1 10 9 VDD<br>NC 2 8 NC NC 2 8 NC  SCL 2 8 NC<br>NC 3 7 NC NC 3 7 NC NC 3 7 NC<br>GND 4 5 6 CLK GND 4 5 6 CLK GND 4 5 6 CLK<br>NC NC A0 / NC<br>**----- End of picture text -----**<br>


**Figure 3. TCXO** 

**Figure 4. VCTCXO** 

**Figure 5. DCTCXO** 

**Table 13. Pin Description** 

|**Pin**|**Symbol**|**I/O**|**Internal Pull-up/Pull Down**<br>**Resistor**|**Function**|**Function**|
|---|---|---|---|---|---|
|1|OE/NC[10]/VC|OE – Input|100 kΩ Pull-Up|H[8]: specified frequency output<br>L: output is high impedance. Only output driver is disabled.||
|||NC – No Connect|–|H or L or Open: No effect on output frequency or other device functions||
|||VC – Input|–|Control Voltage in VCTCXO Mode||
|2|SCL / NC[10]|SCL – Input|200 kΩ Pull-Up|I2C serial clock input.||
|||No Connect||H or L or Open: No effect on output frequency or other device functions||
|3|NC[10]|No Connect|–|H or L or Open: No effect on output frequency or other device functions||
|4|GND|Power|–|Connect to ground||
|5|A0 / NC[10]|A0 – Input|100 kΩ  Pull-Up|Device I2C address when the address selection mode is via the A0 pin.<br>This pin is NC when the I2C device address is specified in the ordering<br>code.<br>A0 Logic Level I2C Address<br>0                         1100010<br>1                         1101010||
|||NC – No Connect|–|H or L or Open:|No effect on output frequency or other device functions.|
|6|CLK|Output|–|LVCMOS, or clipped sinewave oscillator output||
|7|NC[10]|No Connect|–|H or L or Open: No effect on output frequency or other device functions||
|8|NC[10]|No Connect|–|H or L or Open: No effect on output frequency or other device functions||
|9|VDD|Power|–|Connect to power supply[9]||
|10|SDA / NC[10]|SDA – Input/Output|200 kΩ Pull Up|I2C Serial Data.||
|||NC – No Connect|–|H or L or Open: No effect on output frequency or other device functions.||



## **Notes:** 

8. In OE mode for noisy environments, a pull-up resistor of 10 kΩ or less is recommended if pin 1 is not externally driven. If pin 1 needs to be left floating, use the NC option. 

9. A 0.1 μF capacitor in parallel with a 10 μF capacitor are required between VDD and GND. The 0.1 μF capacitor is recommended to place close to the device, and place the 10 μF capacitor less than 2 inches away. 

10. All NC pins can be left floating and do not need to be soldered down. 

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## **Test Circuit Diagrams for LVCMOS and Clipped Sinewave Outputs** 

**==> picture [232 x 115] intentionally omitted <==**

**----- Start of picture text -----**<br>
Test Point<br>VDD CLK<br>+ 9 8 7 6<br>0.1µF<br>SupplyPower  10 5 15pF<br>- 10µF 1 2 3 4 (including probe and fixture<br>capacitance)<br>Vdd<br>OE Function<br>**----- End of picture text -----**<br>


**==> picture [241 x 109] intentionally omitted <==**

**----- Start of picture text -----**<br>
Test Point<br>VDD CLK<br>+ 9 8 7 6<br>Power  0.1µF 10 5 10pF 10kΩ<br>Supply<br>- 10µF 1 2 3 4 (including probe and fixture<br>resistance and<br>capacitance)<br>Vdd<br>OE Function<br>**----- End of picture text -----**<br>


**Figure 6. LVCMOS Test Circuit (OE Function)** 

**Figure 7. Clipped Sinewave Test Circuit (OE Function) for AC and DC Measurements** 

**==> picture [227 x 113] intentionally omitted <==**

**----- Start of picture text -----**<br>
Test Point<br>VDD CLK<br>+ 9 8 7 6<br>0.1µF<br>SupplyPower  10 5 15pF<br>- 10µF 1 2 3 4 (including probe and fixture<br>capacitance)<br>Control<br>Voltage<br>VC Function<br>**----- End of picture text -----**<br>


**==> picture [244 x 113] intentionally omitted <==**

**----- Start of picture text -----**<br>
Test Point<br>VDD CLK<br>+ 9 8 7 6<br>Power  0.1µF 10 5 10pF 10kΩ<br>Supply<br>- 10µF 1 2 3 4 (including probe and fixture<br>resistance and<br>capacitance)<br>Control<br>Voltage<br>VC Function<br>**----- End of picture text -----**<br>


**Figure 8. LVCMOS Test Circuit (VC Function)** 

**Figure 9. Clipped Sinewave Test Circuit (VC Function) for AC and DC Measurements** 

**==> picture [231 x 117] intentionally omitted <==**

**----- Start of picture text -----**<br>
Test Point<br>VDD CLK<br>+ 9 8 7 6<br>SupplyPower  0.1µF 10 5 15pF<br>- 10µF 1 2 3 4 (including probe and fixture<br>capacitance)<br>Any state<br>or floating<br>NC Function<br>**----- End of picture text -----**<br>


**==> picture [249 x 117] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDD CLK Test Point<br>+ 9 8 7 6<br>Power  0.1µF 10 5 10pF 10kΩ<br>Supply<br>- 10µF 1 2 3 4 (including probe and fixture<br>resistance and<br>capacitance)<br>Any state<br>or floating<br>NC Function<br>**----- End of picture text -----**<br>


**Figure 10. LVCMOS Test Circuit (NC Function)** 

**Figure 11. Clipped Sinewave Test Circuit (NC Function) for AC and DC Measurements** 

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## **Test Circuit Diagrams for LVCMOS and Clipped Sinewave Outputs (continued)** 

**==> picture [265 x 120] intentionally omitted <==**

**----- Start of picture text -----**<br>
Test Point<br>VDD CLK<br>+ 9 8 7 6 A0/NC<br>0.1µF<br>SupplyPower  10 5 15pF<br>- 10µF SDA [[11]] 1 2 3 4 (including probe and fixture<br>capacitance)<br>Any state<br>or floating SCL<br>NC<br>Function<br>**----- End of picture text -----**<br>


**Figure 12. LVCMOS Test Circuit (I[2] C Control), DCTCXO mode for AC and DC Measurements** 

**==> picture [287 x 120] intentionally omitted <==**

**----- Start of picture text -----**<br>
Test Point<br>VDD CLK<br>+ 9 8 7 6 A0/NC<br>Power  0.1µF 10 5 10pF 10kΩ<br>Supply<br>- 10µF 1 2 3 4 (including probe and fixture<br>SDA [[11]] resistance and<br>capacitance)<br>Any state<br>or floating SCL<br>NC<br>Function<br>**----- End of picture text -----**<br>


**Figure 13. Clipped Sinewave Test Circuit (I[2] C Control), DCTCXO mode for AC and DC Measurements** 

**==> picture [339 x 111] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDD CLK<br>Test Point<br>+ 9 8 7 6 A0/NC<br>Power  0.1µF 10 5 10pF 10kΩ<br>Supply<br>- 10µF 1 2 3 4 (including probe and fixture<br>resistance and<br>capacitance)<br>Any state<br>or floating<br>NC Function<br>**----- End of picture text -----**<br>


**Figure 14. Clipped Sinewave Test Circuit for Phase Noise Measurements, Applies to All Configurations (NC Function shown for example only)** 

## **Note:** 

11. SDA is open-drain and may require pull-up resistor if not present in I[2] C test setup. 

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## **Waveforms** 

**==> picture [279 x 144] intentionally omitted <==**

**----- Start of picture text -----**<br>
tr tf<br>90 % Vdd<br>50 % Vdd<br>10 % Vdd<br>High Pulse  Low Pulse<br>(TH) (TL)<br>Period<br>**----- End of picture text -----**<br>


**Figure 15. LVCMOS Waveform Diagram[[12]]** 

**==> picture [322 x 144] intentionally omitted <==**

**----- Start of picture text -----**<br>
tr tf<br>80 % Vout<br>50 % Vout Vou t<br>20 % Vout<br>High Pulse  Low Pulse<br>(TH) (TL)<br>Period<br>**----- End of picture text -----**<br>


**Figure 16. Clipped Sinewave Waveform Diagram[[12]]** 

## **Note:** 

12. Duty Cycle is computed as Duty Cycle = TH/Period. 

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## **Timing Diagrams** 

**==> picture [143 x 108] intentionally omitted <==**

**----- Start of picture text -----**<br>
Vdd<br>90% Vdd<br>Vdd Pin T_start<br>Voltage<br>CLK Output<br>HZ<br>T_start: Time to start from power-off<br>**----- End of picture text -----**<br>


**Figure 17. Startup Timing** 

**==> picture [161 x 109] intentionally omitted <==**

**----- Start of picture text -----**<br>
Vdd<br>50% Vdd<br>T_oe<br>OE Voltage<br>CLK Output<br>HZ<br>T_oe: Time to re-enable the clock output<br>**----- End of picture text -----**<br>


**Figure 18. OE Enable Timing (OE Mode Only)** 

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## **Typical Performance Plots** 

**==> picture [246 x 626] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.5 V 2.8 V 3.0 V 3.3 V<br>55<br>53<br>51<br>49<br>47<br>45<br>10 20 30 40 50 60<br>Frequency (MHz)<br>Figure 19. Duty Cycle (LVCMOS)<br>2.5 V 2.8 V 3.0 V 3.3 V<br>48<br>47<br>46<br>45<br>44<br>43<br>42<br>41<br>40<br>10 20 30 40 50 60<br>Frequency (MHz)<br>Figure 21. IDD TCXO (LVCMOS)<br>2.5 V 2.8 V 3.0 V 3.3 V<br>500<br>400<br>300<br>200<br>100<br>0<br>10 20 30 40 50 60<br>Frequency (MHz)<br>Figure 23. RMS Phase Jitter, DCTCXO, TCXO (LVCMOS)<br>2.5 V 2.8 V 3.0 V 3.3 V<br>48<br>47<br>46<br>45<br>44<br>43<br>42<br>41<br>40<br>10 20 30 40 50 60<br>Frequency (MHz)<br>Duty cycle (%)<br>Current consumption (mA)<br>Phase Jitter (fs RMS)<br>Current consumption (mA)<br>**----- End of picture text -----**<br>


**Figure 25. IDD DCTCXO (LVCMOS)** 

**==> picture [246 x 465] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.5 V 2.8 V 3.0 V 3.3 V<br>1,25<br>1,20<br>1,15<br>1,10<br>1,05<br>1,00<br>0,95<br>0,90<br>10 20 30 40 50 60<br>Frequency (MHz)<br>Figure 20. Rise Time (LVCMOS)<br>2.5 V 2.8 V 3.0 V 3.3 V<br>52<br>51<br>50<br>49<br>48<br>47<br>46<br>45<br>44<br>10 20 30 40 50 60<br>Frequency (MHz)<br>Figure 22. IDD VCTCXO (LVCMOS)<br>2.5 V 3.3 V<br>1,90<br>1,70<br>1,50<br>1,30<br>1,10<br>0,90<br>0,70<br>0,50<br>10 20 30 40 50 60<br>Frequency (MHz)<br>Rise time (ns)<br>Current consumption (mA)<br>Period Jitter (ps RMS)<br>**----- End of picture text -----**<br>


**Figure 24. RMS Period Jitter (LVCMOS)** 

**==> picture [246 x 141] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.5 V 2.8 V 3.0 V 3.3 V<br>500<br>400<br>300<br>200<br>100<br>0<br>10 20 30 40 50 60<br>Frequency (MHz)<br>Phase Jitter (fs RMS)<br>**----- End of picture text -----**<br>


**Figure 26. RMS Phase Jitter, VCTCXO (LVCMOS)** 

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## **Typical Performance Plots (continued)** 

**==> picture [505 x 625] intentionally omitted <==**

**----- Start of picture text -----**<br>
6,25 2.5 V 2.8 V 3.0 V 3.3 V<br>5 3,80<br>3,75 3,60<br>2,5<br>1,25 3,40<br>0<br>3,20<br>-1,25<br>-2,5 3,00<br>-3,75<br>2,80<br>-5<br>-6,25 2,60<br>-6,25 -5 -3,75 -2,5 -1,25 0 1,25 2,5 3,75 5 6,25 10 15 20 25 30 35 40 45 50 55 60<br>DCTCXO pull (ppm) Frequency (MHz)<br>Figure 27. DCTCXO frequency pull characteristic Figure 28. Rise Time (Clipped Sinewave)<br>2.5 V 2.8 V 3.0 V 3.3 V 2.5 V 2.8 V 3.0 V 3.3 V<br>45,5 50<br>49<br>45,0<br>48<br>44,5 47<br>44,0 46<br>45<br>43,5<br>44<br>43,0 43<br>10 15 20 25 30 35 40 45 50 55 60 10 15 20 25 30 35 40 45 50 55 60<br>Frequency (MHz) Frequency (MHz)<br>Figure 29. IDD TCXO (Clipped Sinewave) Figure 30. IDD VCTCXO (Clipped Sinewave)<br>2.5 V 2.8 V 3.0 V 3.3 V 2.5 V 2.8 V 3.0 V 3.3 V<br>500 46,5<br>46,0<br>400<br>45,5<br>300 45,0<br>44,5<br>200<br>44,0<br>100 43,5<br>43,0<br>0<br>10 15 20 25 30 35 40 45 50 55 60<br>10 20 30 40 50 60<br>Frequency (MHz) Frequency (MHz)<br>Figure 31. RMS Phase Jitter, DCTCXO, TCXO (Clip Sine) Figure 32. IDD DCTCXO (Clipped Sinewave)<br>2.5 V 2.8 V 3.0 V 3.3 V 2.5 V 2.8 V 3.0 V 3.3 V<br>500 55<br>400 53<br>300 51<br>200 49<br>100 47<br>0 45<br>10 20 30 40 50 60 10 15 20 25 30 35 40 45 50 55 60<br>Frequency (MHz) Frequency (MHz)<br>Rise Time (ns)<br>Frequency deviation (ppm)<br>Current consumption (mA) Current consumption (mA)<br>Phase Jitter (fs RMS)<br>Current consumption (mA)<br>Duty cycle (%)<br>Phase Jitter (fs RMS)<br>**----- End of picture text -----**<br>


**Figure 33. RMS Phase Jitter, VCTCXO (Clipped Sine)** 

**Figure 34. Duty Cycle (Clipped Sinewave)** 

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## **Architecture Overview** 

Based on SiTime’s innovative Elite Platform™, the SiT5156 delivers exceptional dynamic performance, i.e. resilience to environmental stressors such as shock, vibration, and fast temperature transients. Underpinning the Elite platform are SiTime’s unique DualMEMS™ temperature sensing architecture and TurboCompensation™ technologies. 

DualMEMS is a noiseless temperature compensation scheme. It consists of two MEMS resonators fabricated on the same die substrate. The TempFlat™ MEMS resonator is designed with a flat frequency characteristic over temperature whereas the temperature sensing resonator is by design sensitive to temperature changes. The ratio of frequencies between these two resonators provides an accurate reading of the resonator temperature with 20 µK resolution. 

By placing the two MEMS resonators on the same die, this temperature sensing scheme eliminates any thermal lag and gradients between resonator and temperature sensor, thereby overcoming an inherent weakness of legacy quartz TCXOs. 

The DualMEMS temperature sensor drives a state-of-theart CMOS temperature compensation circuit. The TurboCompensation design, with >100 Hz compensation bandwidth, achieves a dynamic frequency stability that is far superior to any quartz TCXO. The digital temperature compensation enables additional optimization of frequency stability and frequency slope over temperature within any chosen temperature range for a given system design. 

The Elite platform also incorporates a high resolution, low noise frequency synthesizer along with the industry standard I[2] C bus. This unique combination enables system designers to digitally control the output frequency in steps as low as 5 ppt and over a wide range up to ±3200 ppm. 

For more information regarding the Elite platform and its benefits please visit: 

## **Functional Overview** 

The SiT5156 is designed for maximum flexibility with an array of factory programmable options, enabling system designers to configure this precision device for optimal performance in a given application. 

## **Frequency Stability** 

The SiT5156 comes in three factory-trimmed stability grades. 

**Table 14. Stability Grades vs. Ordering Codes** 

|**Frequency Stability Over Temperature**|**Ordering Code**|
|---|---|
|±0.5ppm|K|
|±1.0ppm|A|
|±2.5ppm|D|



## **Output Frequency and Format** 

The SiT5156 can be factory programmed for an output frequency without sacrificing lead time or incurring an upfront customization cost typically associated with customfrequency quartz TCXOs. 

The device supports both LVCMOS and clipped sinewave output. Ordering codes for the output format are shown below: 

**Table 15. Output Formats vs. Ordering Codes** 

|**Output Format**|**Ordering Code**|
|---|---|
|LVCMOS|“-“|
|Clipped Sinewave|“C”|



## **Output Frequency Tuning** 

In addition to the non-pullable TCXO, the SiT5156 can also support output frequency tuning through either an analog control voltage (VCTCXO), or I[2] C interface (DCTCXO). The I[2] C interface enables 16 factory programmed pull-range options from ±6.25 ppm to ±3200 ppm.  The pull range can also be reprogrammed via I[2] C to any supported pull-range value. 

Refer to Device Configuration section for details. 

- SiTime's breakthroughs section 

- TechPaper: DualMEMS Temperature Sensing Technology 

- TechPaper: DualMEMS Resonator TDC 

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## **Pin 1 Configuration (OE, VC, or NC)** 

Pin 1 of the SiT5156 can be factory programmed to support three modes: Output Enable (OE), Voltage Control (VC), or No Connect (NC). 

## **Table 16. Pin Configuration Options** 

|**Pin 1 Configuration**|**Operating Mode**|**Output**|
|---|---|---|
|OE|TCXO/DCTCXO|Active or High-Z|
|NC|TCXO/DCTCXO|Active|
|VC|VCTCXO|Active|



## **Device Configurations** 

The SiT5156 supports 3 device configurations – TCXO, VCTCXO, and DCTCXO. The TCXO and VCTCXO options are directly compatible with the quartz TCXO and VCTCXO. The DCTCXO configuration provides performance enhancement by eliminating VCTCXO’s sensitivity to control voltage noise with an I[2] C digital interface for frequency tuning. 

When pin 1 is configured as OE pin, the device output is guaranteed to operate in one of the following two states: 

- Clock output with the frequency specified in the part number when Pin 1 is pulled to logic high 

- Hi-Z mode with weak pull down when pin 1 is pulled to logic low. 

When pin 1 is configured as NC, the device is guaranteed to output the frequency specified in the part number at all times, regardless of the logic level on pin 1. 

In the VCTCXO configuration, the user can fine-tune the output frequency from the nominal frequency specified in the part number by varying the pin 1 voltage. The guaranteed allowable variation of the output frequency is specified as pull range. A VCTCXO part number must contain a valid pull-range ordering code. 

**Figure 35. Block Diagram – TCXO** 

## **TCXO Configuration** 

The TCXO generates a fixed frequency output, as shown in Figure 35. The frequency is specified by the user in the frequency field of the device ordering code and then factory programmed. Other factory programmable options include supply voltage, output types (LVCMOS or clipped sinewave), and pin 1 functionality (OE or NC). 

Refer to the Ordering Information section at the end of the datasheet for a list of all ordering options. 

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## **VCTCXO Configuration** 

A VCTCXO, shown in Figure 36, is a frequency control device whose output frequency is an approximately linear function of control voltage applied to the voltage control pin. VCTCXOs have a number of use cases including the VCO portion of a jitter attenuation/jitter cleaner PLL Loop. 

The SiT5156 achieves a 10x better pull range linearity of <0.5% via a high-resolution fractional PLL and low-noise precision analog-to-digital converter. By contrast, quartz-based VCTCXOs change output frequency by varying the capacitive load of a crystal resonator using varactor diodes, which results in linearity of 5% to 105%. 

Note that the output frequency of the VCTCXO is proportional to the analog control voltage applied to pin 1. Because this control signal is analog and directly controls the output frequency, care must be taken to minimize noise on this pin. 

The nominal output frequency is factory programmed per the customer’s request to 6 digits of precision and is defined as the output frequency when the control voltage equals Vdd/2. The maximum output frequency variation from this nominal value is set by the pull range, which is also factory programmed to the customer’s desired value and specified by the ordering code. The Ordering Information section shows all ordering options and associated ordering codes. 

Refer to VCTCXO-Specific Design Considerations for more information on critical VCTCXO parameters including pull range linearity, absolute pull range, control voltage bandwidth, and Kv. 

**Figure 36. Block Diagram – VCTCXO** 

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## **DCTCXO Configuration** 

The SiT5156 offers digital control of the output frequency, as shown in Figure 37. The output frequency is controlled by writing frequency control words over the I[2] C interface. 

There are several advantages of DCTCXOs relative to VCTCXOs: 

- 1) Frequency control resolution as low as 5 ppt. This 

- 5) arte wesnanien is’ via "ie fractional ocdback 

**Figure 37. Block Diagram** 

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## **VCTCXO-Specific Design Considerations** 

## **Linearity** 

In any VCTCXO, there will be some deviation of the frequency-voltage (FV) characteristic from an ideal straight line. Linearity is the ratio of this maximum deviation to the total pull range, expressed as a percentage. Figure 38 below shows the typical pull linearity of a SiTime VCTCXO. The linearity is excellent (1% maximum) relative to most quartz offerings because the frequency pulling is achieved with a PLL rather than varactor diodes. 

**==> picture [71 x 20] intentionally omitted <==**

**----- Start of picture text -----**<br>
Best Straight<br>Line Fit<br>**----- End of picture text -----**<br>


**==> picture [198 x 161] intentionally omitted <==**

**----- Start of picture text -----**<br>
Input Voltage Range<br>INPUT VOLTAGE<br>FREQEUNCY<br> TOTAL PULL RANGE<br>**----- End of picture text -----**<br>


**Figure 38. Typical SiTime VCTCXO Linearity** 

## **Control Voltage Bandwidth** 

Control voltage bandwidth, sometimes called “modulation rate” or “modulation bandwidth”, indicates how fast a VCO can respond to voltage changes at its input. The ratio of the output frequency variation to the input voltage variation, previously denoted by KV, has a low-pass characteristic in most VCTCXOs. The control voltage bandwidth equals the modulating frequency where the output frequency deviation equals 0.707 (e.g. -3 dB) of its DC value, for DC inputs swept in the same voltage range. 

## **FV Characteristic Slope KV** 

The slope of the FV characteristic is a critical design parameter in many low bandwidth PLL applications. The slope is the derivative of the FV characteristic – the deviation of frequency divided by the control voltage change needed to produce that frequency deviation, over a small voltage span, as shown below: 

**==> picture [63 x 32] intentionally omitted <==**

It is typically expressed in kHz/Volt, MHz/Volt, ppm/Volt, or similar units. This slope is usually called “KV” based on terminology used in PLL designs. 

The extreme linear characteristic of the SiTime SiT5156 VCTCXO family means that there is very little KV variation across the whole input voltage range (typically <1%), significantly reducing the design burden on the PLL designer. Figure 39 below illustrates the typical KV variation. 

**==> picture [207 x 155] intentionally omitted <==**

**----- Start of picture text -----**<br>
KV varies <1% over input<br>voltage range<br>Average<br>Kv<br>Input Voltage Range<br>INPUT VOLTAGE<br>V<br>K<br>**----- End of picture text -----**<br>


**Figure 39. Typical SiTime KV Variation** 

For example, a part with a ±6.25 ppm pull range and a 0-3V control voltage can be regarded as having an average KV of 4.17 ppm/V (12.5 ppm/3 V = 4.17 ppm/V). Applying an input of 1.5 V DC ± 0.5 V (1.0 V to 2.0 V) causes an output frequency change of 4.17 ppm (±2.08 ppm). If the control voltage bandwidth is specified as 10 kHz, the peak-to-peak value of the output frequency change will be reduced to 4.33 ppm/√2 or 2.95 ppm, as the frequency of the control voltage change is increased to 10 kHz. 

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## **Pull Range, Absolute Pull Range** 

Pull range (PR) is the amount of frequency deviation that will result from changing the control voltage over its maximum range under nominal conditions. 

Absolute pull range (APR) is the guaranteed controllable frequency range over all environmental and aging conditions. Effectively, it is the amount of pull range remaining after taking into account frequency stability, tolerances over variables such as temperature, power supply voltage, and aging, i.e.: 

**==> picture [123 x 12] intentionally omitted <==**

> where Fstability is the device frequency stability due to initial tolerance and variations on temperature, power supply, and load. 

Figure 40 shows a typical SiTime VCTCXO FV characteristic. The FV characteristic varies with conditions, so that the frequency output at a given input voltage can vary by as much as the specified frequency stability of the VCTCXO. For such VCTCXOs, the frequency stability and APR are independent of each other. This allows very wide range of pull options without compromising frequency stability. 

**==> picture [238 x 161] intentionally omitted <==**

**----- Start of picture text -----**<br>
FREQUENCY STABILITY<br>(Temp, Voltage, Aging, etc)<br>APR<br>Input Voltage Range<br>VC_L VC_U<br>FREQUENCY<br>TOTAL PULL RANGE<br>**----- End of picture text -----**<br>


## **Figure 40. Typical SiTime VCTCXO FV Characteristic** 

The upper and lower control voltages are the specified limits of the input voltage range as shown in Figure 40 above. Applying voltages beyond the upper and lower voltages do not result in noticeable changes of output frequency. In other words, the FV characteristic of the VCTCXO saturates beyond these voltages. Figures 1 and 2 show these voltages as Lower Control Voltage (VC_L) and Upper Control Voltage (VC_U). 

Table 17 below shows the pull range and corresponding APR values for each of the frequency vs. temperature ordering options. 

**Table 17. VCTCXO Pull Range, APR Options[[13]]** Typical unless specified otherwise. Pull range (PR) is ±6.25 ppm. 

|**Pull Range**<br>**Ordering Code**|**Device Option(s)**|**APR ppm**|**APR ppm**|**APR ppm**|
|---|---|---|---|---|
|||**±0.5 ppm option**|**±1.0 ppm option**|**±2.5 ppm option**|
|||<br>**±2 ppm 20-year aging**|<br>**±2 ppm 20-year aging**|<br>**±2 ppm 20-year aging**|
|T|VCTCXO|±2.75|±2.25|±0.7|



## **Notes:** 

13. APR includes initial tolerance, frequency stability vs. temperature, and the corresponding 20-year aging. 

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## **DCTCXO-Specific Design Considerations** 

## **Pull Range and Average Pull Range** 

Pull range and absolute pull range are described in the previous section. Table 18 below shows the pull range and corresponding APR values for each of the frequency vs. temperature ordering options. 

## **Table 18. APR Options[[14]]** 

|**Pull Range**<br>**Ordering Code**||**APR ppm**|**APR ppm**|**APR ppm**|
|---|---|---|---|---|
||**Pull Range**||||
|||**±0.5 ppm option**|**±1.0 ppm option**|**±2. 5 ppm option**|
||**ppm**|<br>**±2 ppm 20-year aging**|<br>**±2 ppm 20-year aging**|<br>**±2 ppm 20-year aging**|
||||||
|T|±6.25|±2.75|±2.97|±0.75|
|R|±10|±6.50|±6.0|±4.5|
|Q|±12.5|±9.0|±8.5|±7.0|
|M|±25|±21.5|±21.0|±19.5|
|B|±50|±46.5|±46.0|±44.5|
|C|±80|±76.5|±76.0|±74.5|
|E|±100|±96.5|±96.0|±94.5|
|F|±125|±121.5|±121.0|±119.5|
|G|±150|±146.5|±146.0|±144.5|
|H|±200|±196.5|±196.0|±194.5|
|X|±400|±396.5|±396.0|±394.5|
|L|±600|±596.5|±596.0|±594.5|
|Y|±800|±796.5|±796.0|±794.5|
|S|±1200|±1196.5|±1196.0|±1194.5|
|Z|±1600|±1596.5|±1596.0|±1594.5|
|U|±3200|±3196.5|±3196.0|±3194.5|



## **Notes:** 

14. APR includes initial tolerance, frequency stability vs. temperature, and the corresponding 20-year aging. 

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## **Output Frequency** 

The device powers up at the nominal operating frequency and pull range specified by the ordering code. After powerup both pull range and output frequency can be controlled via I[2] C writes to the respective control registers. The maximum output frequency change is constrained by the pull range limits. 

The pull range is specified by the value loaded in the digital pull-range control register. The 16 pull range choices are specified in the control register and range from ±6.25 ppm to ±3200 ppm. 

The ppm frequency offset is specified by the 26 bit DCXO frequency control register in two’s complement format as described in the I[2] C Register Descriptions. The power up default value is 00000000000000000000000000b which sets the output frequency at its nominal value (0 ppm). To change the output frequency, a frequency control word is written to 0x00[15:0] (Least Significant Word) and 0x01[9:0] (Most Significant Word). The LSW value should be written first followed by the MSW value; the frequency change is initiated after the MSW value is written. 

Table 19 below shows the frequency resolution versus pull range programmed value 

**Table 19. Frequency Resolution versus Pull Range** 

|**Programmed Pull Range**|**Frequency Resolution**|
|---|---|
|±6.25 ppm|5x10-12|
|±10 ppm|5x10-12|
|±12.5 ppm|5x10-12|
|±25 ppm|5x10-12|
|±50 ppm|5x10-12|
|±80 ppm|5x10-12|
|±100 ppm|5x10-12|
|±120 ppm|5x10-12|
|±150 ppm|5x10-12|
|±200 ppm|5x10-12|
|±400 ppm|1x10-11|
|±600 ppm|1.4x10-11|
|±800 ppm|2.1x10-11|
|±1200 ppm|3.2x10-11|
|±1600 ppm|4.7x10-11|
|±3200 ppm|9.4x10-11|



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**Figure 41. Pull Range and Frequency Control Word** 

Figure 41 shows how the two’s complement signed value of the frequency control word sets the output frequency within the ppm pull range set by 0x02:[3:0]. This example shows use of the ±200 ppm pull range. Therefore, to set the desired output frequency, one just needs to calculate the fraction of full scale value ppm, convert to two’s complement binary, and then write these values to the frequency control registers. 

To summarize, the procedure for calculating the frequency control word associated with a given ppm offset is as follows: 

The following formula generates the control word value: 

**Control word value = RND((2[25] -1) × ppm shift from nominal/pull range),** where RND is the rounding function which rounds the number to the nearest whole number. Two examples follow, assuming a ±200 ppm pull range: 

## **Example 1:** 

- Default Output Frequency = 19.2 MHz 

- Desired Output Frequency = 19.201728 MHz (+90 ppm) 

2[25] -1 corresponds to +200 ppm, and the fractional value required for +90 ppm can be calculated as follows. 

- 90 ppm / 200 ppm × (2[25] -1) = 15,099,493.95. 

Rounding to the nearest whole number yields 15,099,494 and converting to two’s complement gives a binary value of 111001100110011001100110, or E66666 in hex. 

It is important to note that the maximum Digital Control update rate is 38 kHz regardless of I[2] C bus speed. 

## **Example 2:** 

- Default Output Frequency = 10 MHz 

- Desired Output Frequency = 9.9995 MHz (-50 ppm) 

Following the formula shown above, 

- (-50 ppm / 200 ppm) × (2[25] ) = -8,388,608. 

Converting this to two’s complement binary results in 11100000000000000000000000, or 3800000 in hex. 

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## **I[2] C Control Registers** 

The SiT5156 enables control of frequency pull range, frequency pull value, and Output Enable via I[2] C writes to the control registers. Table 20 below shows the register map summary, and detailed register descriptions follow. 

**Table 20.  Register Map Summary** 

|**Address**|**Bits**|**Access**|**Description**|
|---|---|---|---|
|0x00|[15:0]|RW|DIGITAL FREQUENCY CONTROL LEAST SIGNIFICANT WORD (LSW)|
|0x01|[15:11]|R|NOT USED|
||[10]|RW|OE Control. This bit is only active if the output enable function is under software control. If the device<br>is configured for hardware control using the OE pin, writing to this bit has no effect.|
||[9:0]|RW|DIGITAL FREQUENCY CONTROL MOST SIGNIFICANT WORD (MSW)|
|0x02|[15:4]|R|NOT USED|
||[3:0]|RW|DIGITAL PULL RANGE CONTROL|



## **Register Descriptions** 

## **Register Address: 0x00. Digital Frequency Control Least Significant Word (LSW)** 

|**Bit**|**15**|**14**|**13**|**12**|**11**|**10**|**9**|**8**|**7**|**6**|**5**|**4**|**3**|**2**|**1**|**0**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**Access**|RW|RW|RW|RW|RW|RW|RW|RW|RW|RW|RW|RW|RW|RW|RW|RW|
|**Default**|0|0|0|0|0|0|0|0|0|0|0|0|0|0|0|0|
|**Name**|DIGITAL FREQUENCY CONTROL LEAST SIGNIFICANT WORD (LSW)[15:0]||||||||||||||||



|**Bits**|**Name**|**Access**|**Description**|
|---|---|---|---|
|15:0|DIGITAL FREQUENCY CONTROL<br>LEAST SIGNIFICANT WORD|RW|Bits [15:0] are the lower 16 bits of the 26 bit FrequencyControlWord and are the<br>Least Significant Word (LSW). The upper 10 bits are in regsiter 0x01[9:0] and are the<br>Most Significant  Word (MSW). The lower 16 bits together with  the upper 10 bits<br>specify a 26-bit frequency control word.<br>This power-up default values of all 26 bits are 0 which sets the output frequency at its<br>nominal value. After power-up, the system can write to these two registers to pull the<br>frequency across the pull range. The register values are two’s complement to<br>support positive and negative control values. The LSW value should be written<br>before the MSW value because the frequency change is initiated when the new<br>values are loaded into the MSW. More details and examples are discussed in the<br>previous section.|



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## **Register Address: 0x01. OE Control, Digital Frequency Control Most Significant Word (MSW)** 

|**Bit**|**15**|**14**|**13**|**12**|**11**|**11**|**10**||**9**|**8**|**7**|**6**|**5**|**4**|**3**|**2**|**1**|**0**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**Access**|R|R|R|R|R||RW||RW|RW|RW|RW|RW|RW|RW|RW|RW|RW|
|**Default**|0|0|0|0|0||0||0|0|0|0|0|0|0|0|0|0|
|**Name**|NOT USED||||||OE||DCXO FREQUENCY CONTROL[9:0] MSW||||||||||
||||||||||||||||||||
|**Bits**|**Name**|||||**Access**|||**Description**||||||||||
|15:11|NOT USED|||||R|||Bits [15:10] are read only and return all 0’s when read. Writing to these bits has no<br>effect.||||||||||
|10|OE Control|||||RW|||Output Enable Software Control. Allows the user to enable and disable the output<br>driver via I2C.<br>0 = Output Disabled (Default)<br>1 = Output Enabled<br>This bit is only active if the Output Enable function is under software control. If the<br>device is configured for hardware control using the OE pin, writing to this bit has no<br>effect.||||||||||
|9:0|DIGITAL FREQUENCY CONTROL<br>MOST SIGNIFICANT WORD (MSW)|||||RW|||Bits [9:0] are the upper 10 bits of the 26 bit FrequencyControlWord and are the Most<br>Significant Word (MSW). The lower 16 bits are in register 0x00[15:0] and are the<br>Least Significant Word (LSW). These lower 16 bits together with the upper 10 bits<br>specify a 26-bit frequency control word.<br>This power-up default values of all 26 bits are 0 which sets the output frequency at its<br>nominal value. After power-up, the system can write to these two registers to pull the<br>frequency across the pull range. The register values are two’s complement to support<br>positive and negative control values. The LSW value should be written before the<br>MSW value because the frequency change is initiated when the new values are<br>loaded into the MSW. More details and examples are discussed in the previous<br>section.||||||||||



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## **Register Address: 0x02. DIGITAL PULL RANGE CONTROL[[15]]** 

|**Bit**|**15**|**14**|**13**|**12**|**11**|**10**|**9**|**8**|**7**|**6**|**5**|**4**|**3**|**2**|**1**|**0**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**Access**|R|R|R|R|R|R|R|R|R|R|R|R|RW|RW|RW|RW|
|**Default**|0|0|0|0|0|0|0|0|0|0|0|0|X|X|X|X|
|**Name**|NONE||||||||||||DIGITAL PULL RANGE CONTROL||||



**Notes:** 

15. Default values are factory set but can be over-written after power-up. 

|**Bits**|**Name**|**Access**|**Description**|
|---|---|---|---|
|15:4|NONE|R|Bits [15:4] are read only and return all 0’s when read. Writing to these bits has no<br>effect.|
|3:0|DIGITAL PULL RANGE CONTROL|RW|Sets the digital pull range of the DCXO. The table below shows the available pull range<br>values and associated bit settings. The default value is factory programmed.<br>**Bit**<br>**3 2 1 0**<br>0 0 0 0: ±6.25 ppm<br>0 0 0 1: ±10 ppm<br>0 0 1 0: ±12.5 ppm<br>0 0 1 1: ±25 ppm<br>0 1 0 0: ±50 ppm<br>0 1 0 1: ±80 ppm<br>0 1 1 0: ±100 ppm<br>0 1 1 1: ±125 ppm<br>1 0 0 0: ±150 ppm<br>1 0 0 1: ±200 ppm<br>1 0 1 0: ±400 ppm<br>1 0 1 1: ±600 ppm<br>1 1 0 0: ±800 ppm<br>1 1 0 1: ±1200 ppm<br>1 1 1 0: ±1600 ppm<br>1 1 1 1: ±3200 ppm|



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## **Serial Interface Configuration Description** 

The SiT5156 includes an I[2] C interface to access registers that control the DCTCXO frequency pull range, and frequency pull value. The SiT5156 I[2] C slave-only interface supports clock speeds up to 1 Mbit/s. The SiT5156 I[2] C module is based on the I[2] C specification, UM1024 (Rev.6 April 4, 2014 of NXP Semiconductor). 

## **Serial Signal Format** 

The SDA line must be stable during the high period of the SCL. SDA transitions are allowed only during SCL low level for data communication. Only one transition is allowed during the low SCL state to communicate one bit of data. Figure 42 shows the detailed timing diagram. 

An idle I[2] C bus state occurs when both SCL and SDA are not being driven by any master and are therefore in a logic HI state due to the pull up resistors. Every transaction begins with a START (S) signal and ends with a STOP (P) signal. A START condition is defined by a high to low transition on the SDA while SCL is high. A STOP condition is defined by a low to high transition on the SDA while SCL is high. START and STOP conditions are always generated by the master. This slave module also supports repeated START (Sr) condition which is same as START condition instead of STOP condition (the blue-color line shows repeated START in Figure 43). 

**==> picture [445 x 83] intentionally omitted <==**

**----- Start of picture text -----**<br>
SDA<br>SCL<br>data line stable:  change of data  setup time<br>data valid allowed<br>**----- End of picture text -----**<br>


**Figure 42. Data and clock timing relation in I[2] C bus** 

**==> picture [400 x 74] intentionally omitted <==**

**----- Start of picture text -----**<br>
SDA<br>hold time hold time<br>setup time<br>SCL<br>S P<br>START Condition STOP Condition<br>**----- End of picture text -----**<br>


**Figure 43. START and STOP (or repeated START, blue line) condition** 

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## **Parallel Signal Format** 

Every data byte is 8 bits long. The number of bytes that can be transmitted per transfer is unrestricted. Data is transferred with the MSB (Most Significant Bit) first. The detailed data transfer format is shown in Figure 45 below. 

The acknowledge bit must occur after every byte transfer and it allows the receiver to signal the transmitter that the byte was successfully received and another byte may be sent. The acknowledge signal is defined as follows: the transmitter releases the SDA line during the acknowledge clock pulse so the receiver can pull the SDA line low and it remains stable low during the high period of this clock pulse. Setup and hold times must also be taken into account. When SDA remains high during this ninth clock pulse, this is defined as the Not-Acknowledge signal (NACK). The master can then generate either a STOP condition to abort the transfer, or a repeated START condition to start a new transfer. The only condition that leads to the generation of NACK from the SiT5156 is when the transmitted address does not match the slave address. When the master is reading data from the SiT5156, the SiT5156 expects the ACK from the master at the end of received data, so that the slave releases the SDA line and the master can generate the STOP or repeated START. If there is a NACK signal at the end of the data, then the SiT5156 tries to send the next data. If the first bit of the next data is “0”, then the SiT5156 holds the SDA line to “0”, thereby blocking the master from generating a STOP/(re)START signal. 

## **Parallel Data Format** 

This I[2] C slave module supports 7-bit device addressing format. The 8[th] bit is a read/write bit and “1” indicates a read transaction and a “0” indicates a write transaction. The register addresses are 8-bits long with an address range of 0 to 255 (00h to FFh). Auto address incrementing is supported which allows data to be transferred to contiguous addresses without the need to write each address beyond the first address. Since the maximum register address value is 255, the address will roll from 255 back to 0 when auto address incrementing is used. Obviously, auto address incrementing should only be used for writing to contiguous addresses. The data format is 16-bit (two bytes) with the most significant byte being transferred first. For a read operation, the starting register address must be written first. If that is omitted, reading will start from the last address in the autoincrement counter of the device, which has a startup default of 0x00. 

**==> picture [410 x 93] intentionally omitted <==**

**----- Start of picture text -----**<br>
SDA<br>MSB acknowledge  acknowledge<br>from slave from slave<br>SCL S or  1 2 7 8 9 1 2 3 to 8 9 P or<br>Sr ACK ACK Sr<br>START Condition STOP Condition<br>**----- End of picture text -----**<br>


**Figure 44. Parallel signaling format** 

**==> picture [484 x 91] intentionally omitted <==**

**----- Start of picture text -----**<br>
SDA<br>1 to 7 8 9 1 to 8 9 1 to 8 9 1 to 8 9<br>SCL S P<br>START  slave W ACK register  ACK data-MSB ACK data-LSB ACK STOP<br>condition address address condition<br>**----- End of picture text -----**<br>


**Figure 45. Parallel data byte format, write operation** 

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**==> picture [393 x 92] intentionally omitted <==**

**----- Start of picture text -----**<br>
SDA<br>1 to 7 8 9 1 to 8 9 1 to 8 9<br>SCL S P<br>START  slave R ACK data-MSB ACK data-LSB ACK STOP<br>condition address condition<br>**----- End of picture text -----**<br>


**Figure 46. Parallel data byte format, read operation** 

Figure 47 below shows the I[2] C sequence for writing the 4-byte control word using auto address incrementing. 

Digital Frequency Control – Least Significant Word (LSW) [15:0] 

|St|D_Address[6:0]|W|A|R_Address[7:0]=00|A|LSW[15:8]|A|LSW[7:0]|A|
|---|---|---|---|---|---|---|---|---|---|
|0x00[15:8]<br>0x00[7:0]||||||||||



Digital Frequency Control – Most Significant Word (MSW) [9:0] 

**==> picture [432 x 300] intentionally omitted <==**

**----- Start of picture text -----**<br>
X X X X X OE 9 8 A MSW[7:0] A Sp<br>0x01[15:8] 0x01[7:0]<br>STOP<br>condition f0 + f1 ±0.5%<br>Output f0 Tsettle<br>Frequency<br>Tfdelay<br>Slave  Drives Bit(s) on Bus<br>Master  Drives Bit(s) on Bus<br>St      Start<br>Sp      Stop<br>W       Write<br>R       Read<br>A      Acknowledge<br>OE   Output Enable<br>X     “Don’t Care” Register Bit not used.<br>**----- End of picture text -----**<br>


**Figure 47. Writing the Frequency Control Word** 

**Table 21. DCTCXO Delay and Settling Time** 

|**Parameter**|**Symbol**|**Minimum**|**Typical**|**Maximum**|**Units**|**Notes**|
|---|---|---|---|---|---|---|
|Frequency Change Delay|Tfdelay|–|103|140|µs|Time from end of 0x01 reg MSW to start of frequency pull, as<br>shown inFigure 47|
|Frequency Settling Time|Tsettle|–|16.5|20|µs|Time to settle to 0.5% of frequency offset, as shown inFigure 47|



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## **I[2] C Timing Specification** 

The below timing diagram and table illustrate the timing relationships for both master and slave. 

**==> picture [185 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
master spec  both  ( slave/master) spec<br>**----- End of picture text -----**<br>


**Figure 48. I[2] C Timing Diagram** 

## **Table 22. I[2] C Timing Requirements** 

|**Parameter**|**Speed Mode**|**Value**|**Unit**|
|---|---|---|---|
|tSETUP|FM+ (1 MHz)|> 50|nsec|
||FM (400 KHz)|> 100|nsec|
||SM (100 KHz)|> 250|nsec|
|tHOLD|FM+ (1 MHz)|> 0|nsec|
||FM (400 KHz)|> 0|nsec|
||SM (100 KHz)|> 0|nsec|
|tVD:AWK|FM+|> 450|nsec|
||FM (400 KHz)|> 900|nsec|
||SM (100 KHz)|> 3450|nsec|
|t**VD:DAT**||NA (s-awk + s-data)/(m-awk/s-data)||



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## **I[2] C Device Address Modes** 

## There are two I[2] C address modes: 

## **Table 24. Pin Selectable I[2] C Address Control[[17]]** 

|**A0**<br>**Pin 5**|**I2C Address**|
|---|---|
|0|1100010|
|1|1101010|



## **Notes:** 

17. Table 24 is only valid for the DCTCXO device option which supports I[2] C control and A0 Device Address Control Pin. 

## **Table 23. Factory Programmed I[2] C Address Control[[16]]** 

|**I2C Address Ordering Code**|**Device I2C Address**|
|---|---|
|0|1100000|
|1|1100001|
|2|1100010|
|3|1100011|
|4|1100100|
|5|1100101|
|6|1100110|
|7|1100111|
|8|1101000|
|9|1101001|
|A|1101010|
|B|1101011|
|C|1101100|
|D|1101101|
|E|1101110|
|F|1101111|



## **Notes:** 

16. Table 23 is only valid for the DCTCXO device option which supports I[2] C Control. 

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## **Schematic Example** 

**Figure 49. DCTCXO schematic example** 

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## **Dimensions and Patterns** 

**==> picture [128 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
Package Size – Dimensions (Unit: mm)<br>**----- End of picture text -----**<br>


**Recommended Land Pattern (Unit: mm)** 

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## **Layout Guidelines** 

- The SiT5156 uses internal regulators to minimize the impact of power supply noise. For further reduction of noise, it is essential to use two bypass capacitors (0.1 μF and 10 μF). Place the 0.1 μF capacitor as close to the VDD pin as possible, typically within 1 mm to 2 mm. Place the 10 μF capacitor within 2 inches of the device VDD and VSS pins. 

- It is also recommended to connect all NC pins to the ground plane and place multiple vias under the GND pin for maximum heat dissipation. 

- For additional layout recommendations, refer to the Best Design Layout Practices. 

## **Manufacturing Guidelines** 

The SiT5156 Super-TCXOs are precision timing devices. **Proper PCB solder and cleaning processes** must be followed to ensure best performance and long-term reliability. 

- **No Ultrasonic or Megasonic Cleaning:** Do not subject the SiT5156 to an ultrasonic or megasonic cleaning environment. Otherwise, permanent damage or long-term reliability issues to the device may result. 

- **No external cover.** Unlike legacy quartz TCXOs, the SiT5156 is engineered to operate reliably, without performance degradation in the presence of ambient disturbers such as airflow and sudden temperature changes. Therefore, the use of an external cover typically required by quartz TCXOs is not needed. 

- **Reflow profile:** For mounting these devices to the PCB, IPC/JEDEC J-STD-020 compliant reflow profile must be used. Device performance is not guaranteed if soldered manually or with a non-compliant reflow profile. 

- **PCB cleaning:** After the surface mount (SMT)/reflow process, solder flux residues may be present on the PCB and around the pads of the device. Excess residual solder flux may lead to problems such as pad corrosion, elevated leakage currents, increased frequency aging, or other performance degradation. For optimal device performance and long-term reliability, thorough cleaning to remove all the residual flux and drying of the PCB is required as shortly after the reflow process as possible. Water soluble flux is recommended. In addition, it is highly recommended to avoid the use of any “no clean” flux. However, if the reflow process necessitates the use of “no clean” flux, then utmost care should be taken to remove all residual flux between SiTime device and the PCB. Note that ultrasonic PCB cleaning should not be used with SiTime oscillators. 

- For additional manufacturing guidelines and marking/ tape-reel instructions, refer to SiTime Manufacturing Notes. 

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## **Additional Information** 

## **Table 25. Additional Information** 

|**Document**|**Description**|**Download Link**|
|---|---|---|
|**ECCN #: EAR99**|Five character designation used on the commerce<br>Control List (CCL) to identify dual use items for export<br>controlpurposes.|—|
|**HTS Classification Code:**<br>**8542.39.0000**|A Harmonized Tariff Schedule (HTS) code developed by<br>the World Customs Organization to classify/define<br>internationallytradedgoods.|<br>—|
|**Evaluation Boards**|SiT6722EB Evaluation Board User Manual|https://www.sitime.com/support/user-guides|
|**Demo Board**|SiT6702DB Demo Board User Manual|https://www.sitime.com/support/user-guides|
|**Time Machine II**|MEMS oscillator programmer|http://www.sitime.com/support/time-machine-oscillator-programmer|
|**Time Master Web-based**<br>**Configurator**|Web tool to establish proper programming|https://www.sitime.com/time-master-web-based-configurator|
|**Manufacturing Notes**|Tape & Reel dimension, reflow profile and other<br>manufacturing related info|https://www.sitime.com/support/resource-library?filter=531|
|**Qualification Reports**|RoHS report, reliability reports, composition reports|http://www.sitime.com/support/quality-and-reliability|
|**Performance Reports**|Additional performance data such as phase noise,<br>current consumption and jitter for selected frequencies|http://www.sitime.com/support/performance-measurement-report|
|**Termination Techniques**|Termination design recommendations|http://www.sitime.com/support/application-notes|
|**Layout Techniques**|Layout recommendations|http://www.sitime.com/support/application-notes|



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## **Revision History** 

## **Table 26. Revision History** 

|**Version**|**Release Date**|**Change Summary**|
|---|---|---|
|0.1|05/10/2016|First release,advanced  information|
|0.15|08/04/2016|Replaced QFN package with SOIC-8 package<br>Added 10 µF bypass cap requirement<br>Updated test circuits to reflect both new bypass cap requirement and SOIC-8 package<br>Update Table 1(Electrical Characteristics)|
|0.16|09/12/2016|Updated test circuit diagrams|
|0.2|09/21/2016|Revised Table 1(Electrical Characteristics)|
|0.4|12/19/2016|Added DCTCXO mode<br>Added I2C information<br>Added I2C|
|0.5|07/21/2017|Added 5.0 mm x 3.2 mm package information<br>Updated Table 1(Electrical Characteristics)|
|0.51|08/20/2017|Changed to preliminary<br>Updated 5.0 mm x 3.2 mm package dimensions<br>Updated test circuits<br>Updated Table 1 (Electrical Characteristics)<br>Updated part ordering info<br>Misc. corrections|
|0.52|11/24/2017|Updated the Thermal Characteristics table<br>Added more on ManufacturingGuideline section|
|0.55|02/05/2018|Added View labels to Package Drawings<br>Updated the frequency vs. output type changes to 60 MHz<br>Updated links and notes|
|0.60|03/01/2018|Added 105°C support,updated OrderingInformation|
|1.0|06/26/2018|Updated Electrical Characteristics tables.<br>Added Performance Plots.<br>Improved readability.<br>Fixed bad hyperlinks.|
|1.01|07/03/2018|Updated I2C specifications in Table 3(Input Characteristics).|
|1.02|07/04/2018|Updated Mechanical Shock Resistance,Table 11(Environmental Compliance)|
|1.03|08/03/2018|Added test circuit for clipped sinewave phase noise.<br>Revised phase noise specifications. Updated package outline drawing.<br>Updated conditions for one day and one year aging specs.<br>Various formattingupdates.|
|1.04|12/04/2018|Formatting updates<br>Fixed APR typo for 125 ppm pull range and 0.5 ppm stability, Table 18<br>Fixed test condition typo (10 MHz to 50 MHz) for phase jitter in Table 4<br>Corrected typos in package drawing dimensions<br>Added nominal value for LVCMOS output impedance<br>Increased Mechanical Shock Resistance to 30000g<br>Added “X” ordering code for 250u Tape and Reel<br>Improved I2C bus frequency specification<br>Updated ManufacturingGuidelines to recommend water soluble flux|
|1.05|03/28/2020|Corrected typos for write/read I2C polarity<br>Clarified PCB cleaning instructions<br>Added link to SiT6702DB<br>Added ECCN and HTS codes<br>Formatting updates<br>Added note for Theta JA<br>Updated DCTCXO Delay and Settling Time table<br>Added max and min input voltage to the Absolute Maximum Limits table<br>Updated output impedance typical spec<br>Clarified Initial Tolerance specification condition<br>Relabeled “First Pulse Accuracy”parameter to “Time to Rated FrequencyStability” for clarity|
|1.06|05/23/2020|Revised Parallel Data Format section description and figures|



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## **SiTime Corporation** , 5451 Patrick Henry Drive, Santa Clara, CA 95054, USA | **Phone:** +1-408-328-4400 | **Fax:** +1-408-328-4439 

> © SiTime Corporation 2016-2020. The information contained herein is subject to change at any time without notice. SiTime assumes no responsibility or liability for any loss, damage or defect of a Product which is caused in whole or in part by (i) use of any circuitry other than circuitry embodied in a SiTime product, (ii) misuse or abuse including static discharge, neglect or accident, (iii) unauthorized modification or repairs which have been soldered or altered during assembly and are not capable of being tested by SiTime under its normal test conditions, or (iv) improper installation, storage, handling, warehousing or transportation, or (v) being subjected to unusual physical, thermal, or electrical stress. 

> **Disclaimer:** SiTime makes no warranty of any kind, express or implied, with regard to this material, and specifically disclaims any and all express or implied warranties, either in fact or by operation of law, statutory or otherwise, including the implied warranties of merchantability and fitness for use or a particular purpose, and any implied warranty arising from course of dealing or usage of trade, as well as any common-law duties relating to accuracy or lack of negligence, with respect to this material, any SiTime product and any product documentation. Products sold by SiTime are not suitable or intended to be used in a life support application or component, to operate nuclear facilities, or in other mission critical applications where human life may be involved or at stake. All sales are made conditioned upon compliance with the critical uses policy set forth below. 

## CRITICAL USE EXCLUSION POLICY 

BUYER AGREES NOT TO USE SITIME'S PRODUCTS FOR ANY APPLICATION OR IN ANY COMPONENTS USED IN LIFE SUPPORT DEVICES OR TO OPERATE NUCLEAR FACILITIES OR FOR USE IN OTHER MISSION-CRITICAL APPLICATIONS OR COMPONENTS WHERE HUMAN LIFE OR PROPERTY MAY BE AT STAKE. 

SiTime owns all rights, title and interest to the intellectual property related to SiTime's products, including any software, firmware, copyright, patent, or trademark. The sale of SiTime products does not convey or imply any license under patent or other rights. SiTime retains the copyright and trademark rights in all documents, catalogs and plans supplied pursuant to or ancillary to the sale of products or services by SiTime. Unless otherwise agreed to in writing by SiTime, any reproduction, modification, translation, compilation, or representation of this material shall be strictly prohibited. 

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## Links

- [View this product on Novapart](https://novapart.co/products/SIT5156AI-FK-33E0-25.000000X/tcxo-25-mhz-05-ppm-smd-5mm-x-32mm-lvcmos-33-v)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/sitime/sit5156ai-fk-33e0-25-000000x/tcxo-25mhz-lvcmos-smd-5mm-x-3/dp/2908694)
---

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