# Power MOSFET, N Channel, 800 V, 4.3 A, 1.27 ohm, TO-251, Through Hole

![Product image](https://novapart.co/image/farnell:2932937/)

**URL**: https://novapart.co/products/SIHU4N80E-GE3/power-mosfet-n-channel-800-v-43-a-127-ohm-to-251
**SKU**: SIHU4N80E-GE3
**Manufacturer**: VISHAY
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.9050
**Stock**: 10+

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:4.3A; Drain Source Voltage Vds:800V; On Resistance Rds(on):1.1ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (07-Nov-2024) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | E |
| Qualification | - |
| Power Dissipation | 69W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-251 |
| Drain Source Voltage Vds | 800V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 4.3A |
| Drain Source On State Resistance | 1.27ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2932937/)

**SiHU4N80E** 

Vishay Siliconix 

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www.vishay.com<br>**----- End of picture text -----**<br>


## **E Series Power MOSFET** 

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**----- Start of picture text -----**<br>
D<br>IPAK<br>(TO-251)<br>D<br>G<br>[S]<br>G [D] S<br>N-Channel MOSFET<br>**----- End of picture text -----**<br>


## **PRODUCT SUMMARY** 

|**PRODUCT SUMMARY**|**PRODUCT SUMMARY**|**PRODUCT SUMMARY**|
|---|---|---|
|VDS(V) at TJmax.|850||
|RDS(on)typ. () at 25 °C|VGS= 10 V|1.1|
|Qgmax. (nC)|32||
|Qgs(nC)|4||
|Qgd(nC)|6||
|Configuration|Single||



## **FEATURES** 

- Low figure-of-merit (FOM) Ron x Qg 

- Low input capacitance (Ciss) 

- Reduced switching and conduction losses 

- Ultra low gate charge (Qg) 

- Avalanche energy rated (UIS) 

- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 

## **APPLICATIONS** 

- Server and telecom power supplies 

- Switch mode power supplies (SMPS) 

- Power factor correction power supplies (PFC) 

- Lighting 

- High-intensity discharge (HID) 

- Fluorescent ballast lighting 

- Industrial 

- Welding 

- Induction heating 

- Motor drives 

- Battery chargers 

- Renewable energy 

- Solar (PV inverters) 

**ORDERING INFORMATION** Package IPAK (TO-251) Lead (Pb)-free and halogen-free SiHU4N80E-GE3 

|**ABSOLUTE MAXIMUM RATINGS**(TC= 25 °C, unless otherwise noted)|**ABSOLUTE MAXIMUM RATINGS**(TC= 25 °C, unless otherwise noted)|**ABSOLUTE MAXIMUM RATINGS**(TC= 25 °C, unless otherwise noted)|**ABSOLUTE MAXIMUM RATINGS**(TC= 25 °C, unless otherwise noted)|||
|---|---|---|---|---|---|
|**PARAMETER**|||**SYMBOL**|**LIMIT**|**UNIT**|
|Drain-source voltage|||VDS|800|V|
|Gate-source voltage|||VGS|± 30||
|Continuous drain current (TJ= 150 °C)|VGSat 10 V|TC= 25 °C|ID|4.3|A|
|||TC= 100 °C||2.7||
|Pulsed drain currenta|||IDM|11||
|Linear deratingfactor||||0.56|W/°C|
|Single pulse avalanche energyb|||EAS|56|mJ|
|Maximum power dissipation|||PD|69|W|
|Operatingjunction and storage temperature range|||TJ, Tstg|-55 to +150|°C|
|Drain-source voltage slope|TJ= 125 °C||dv/dt|70|V/ns|
|Reverse diode dv/dtd||||0.3||
|Solderingrecommendations (peak temperature)c|For 10 s|||300|°C|



## **Notes** 

a. Repetitive rating; pulse width limited by maximum junction temperature 

b. VDD = 140 V, starting TJ = 25 °C, L = 28.2 mH, Rg = 25  , IAS = 2.0 A 

c. 1.6 mm from case 

d. ISD  ID, di/dt = 100 A/μs, starting TJ = 25 °C 

S17-1345-Rev. A, 04-Sep-17 

**1** 

Document Number: 92018 

For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHU4N80E** 

www.vishay.com 

Vishay Siliconix 

**==> picture [59 x 48] intentionally omitted <==**

## **THERMAL RESISTANCE RATINGS** 

|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|
|---|---|---|---|---|---|---|---|---|
|**PARAMETER**|**SYMBOL**|**TYP.**||**MAX.**||**UNIT**|||
|Maximum junction-to-ambient|RthJA|-||62||°C/W|||
|Maximum junction-to-case (drain)|RthJC|-||1.8|||||
||||||||||
|**SPECIFICATIONS**(TJ= 25 °C, unless otherwise noted)|||||||||
|**PARAMETER**|**SYMBOL**|**TEST CONDITIONS**|||**MIN.**|**TYP.**|**MAX.**|**UNIT**|
|**Static**|||||||||
|Drain-source breakdown voltage|VDS|VGS= 0 V, ID= 250 μA|||800|-|-|V|
|VDStemperature coefficient|VDS/TJ|Reference to 25 °C, ID= 1 mA|||-|1.1|-|V/°C|
|Gate-source threshold Voltage (N)|VGS(th)|VDS= VGS, ID= 250 μA|||2.0|-|4.0|V|
|Gate-source leakage|IGSS|VGS= ± 20 V|||-|-|± 100|nA|
|||VGS= ± 30 V|||-|-|± 1|μA|
|Zero gate voltage drain current|IDSS|VDS= 800 V, VGS= 0 V|||-|-|1|μA|
|||VDS= 640 V, VGS= 0 V, TJ= 125 °C|||-|-|10||
|Drain-source on-state resistance|RDS(on)|VGS= 10 V|ID= 2 A||-|1.1|1.27||
|Forward transconductance|gfs|VDS= 30 V, ID= 2 A|||-|1.5|-|S|
|**Dynamic**|||||||||
|Input capacitance|Ciss|VGS= 0 V,<br>VDS= 100 V,<br>f = 1 MHz|||-|622|-|pF|
|Output capacitance|Coss||||-|34|-||
|Reverse transfer capacitance|Crss||||-|5|-||
|Effective output capacitance, energy<br>relateda|Co(er)|VDS= 0 V to 480 V, VGS= 0 V|||-|21|-||
|Effective output capacitance, time<br>relatedb|Co(tr)||||-|91|-||
|Totalgate charge|Qg|VGS= 10 V|ID= 2 A, VDS= 480 V||-|16|32|nC|
|Gate-source charge|Qgs||||-|4|-||
|Gate-drain charge|Qgd||||-|6|-||
|Turn-on delay time|td(on)|VDD= 480 V, ID= 2 A,<br>VGS= 10 V, Rg= 9.1|||-|12|24|ns|
|Rise time|tr||||-|7|14||
|Turn-off delay time|td(off)||||-|26|52||
|Fall time|tf||||-|20|40||
|Gate input resistance|Rg|f = 1 MHz, open drain|||0.6|1.2|2.4||
|**Drain-Source Body Diode Characteristics**|||||||||
|Continuous source-drain diode current|IS|MOSFET symbol<br>showing the<br>integral reverse<br>p - n junction diode<br>S<br>D<br>G|||-|-|4.4|A|
|Pulsed diode forward current|ISM||||-|-|11||
|Diode forward voltage|VSD|TJ= 25 °C, IS= 2 A, VGS= 0 V|||-|-|1.2|V|
|Reverse recovery time|trr|TJ= 25 °C, IF= IS= 2 A,<br>di/dt = 100 A/μs, VR= 25 V|||-|248|496|ns|
|Reverse recovery charge|Qrr||||-|1.4|2.8|μC|
|Reverse recovery current|IRRM||||-|9.2|-|A|



## **Notes** 

a. Coss(er) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 V to 480 V VDSS 

b. Coss(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 V to 480 V VDSS 

S17-1345-Rev. A, 04-Sep-17 

Document Number: 92018 

**2** 

For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHU4N80E** 

Vishay Siliconix 

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www.vishay.com<br>**----- End of picture text -----**<br>


## **TYPICAL CHARACTERISTICS** (25 °C, unless otherwise noted) 

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12<br>TOP         15 V14 V TJ = 25 °C<br>13 V<br>12 V<br>11 V<br>9 10 V9 V<br>8 V<br>7 V<br>6 V<br>BOTTOM   5 V<br>6<br>3<br>0<br>0 5 10 15 20<br>VDS, Drain-to-Source Voltage (V)<br>, Drain-to-Source Current (A)<br>ID<br>**----- End of picture text -----**<br>


**Fig. 1 - Typical Output Characteristics** 

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3.0<br>ID = 2 A<br>2.5<br>2.0<br>1.5<br>1.0<br>0.5 VGS = 10 V<br> 0<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>TJ, Junction Temperature (°C)<br>(Normalized)<br>, Drain-to-Source On-Resistance<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**Fig. 4 - Normalized On-Resistance vs. Temperature** 

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6<br>TOP         15 V14 V TJ = 150 °C<br>13 V<br>12 V<br>11 V<br>10 V<br>9 V<br>4 8 V7 V<br>6 V<br>BOTTOM   5 V<br>2<br>0<br>0 5 10 15 20<br>VDS, Drain-to-Source Voltage (V)<br>, Drain-to-Source Current (A)<br>ID<br>**----- End of picture text -----**<br>


**Fig. 2 - Typical Output Characteristics** 

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  10 000<br> 1000 Ciss<br>V GS  = 0 V, f = 1 MHz<br>C iss = C gs + C gd , C ds shorted<br> 100 Crss = Cgd<br>Coss = Cds + Cgd<br>Coss<br> 10<br>Crss<br> 1<br>0 100 200 300 400 500 600<br>VDS, Drain-to-Source Voltage (V)<br>C, Capacitance (pF)<br>**----- End of picture text -----**<br>


**Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage** 

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12<br>TJ = 25 °C<br>9<br>TJ = 150 °C<br>6<br>3<br>VDS = 31.2 V<br>0<br>0 5 10 15 20<br>VGS, Gate-to-Source Voltage (V)<br>, Drain-to-Source Current (A)<br>ID<br>**----- End of picture text -----**<br>


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  10 000 4.5<br>4.0<br>3.5<br> 1000 3.0<br>E oss 2.5<br>Coss 2.0<br> 100 1.5<br>1.0<br>0.5<br> 10 0<br>0 100 200 300 400 500 600<br>VDS, Drain-to-Source Voltage (V)<br>, Output Capacitance (pF)<br>oss<br>C<br>, Output Capacitance Stored Energy (μJ)<br>oss<br>E<br>**----- End of picture text -----**<br>


**Fig. 3 - Typical Transfer Characteristics** 

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 Fig. 6 - Coss and Eoss vs. VDS<br>**----- End of picture text -----**<br>


S17-1345-Rev. A, 04-Sep-17 

Document Number: 92018 

**3** For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHU4N80E** 

www.vishay.com 

Vishay Siliconix 

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12<br>VDS = 480 V<br>VDS = 300 V<br>VDS = 120 V<br>9<br>6<br>3<br>0<br>0 5 10 15 20<br>Qg, Total Gate Charge (nC)<br>, Gate-to-Source Voltage (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**Fig. 7 - Typical Gate Charge vs. Gate-to-Source Voltage** 

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100<br>10<br>TJ = 150 °C TJ = 25 °C<br>1<br>VGS = 0 V<br>0.1<br>0.0 0.3 0.6 0.9 1.2 1.5<br>VSD, Source-Drain Voltage (V)<br>, Reverse Drain Current (A)<br>ISD<br>**----- End of picture text -----**<br>


**Fig. 8 - Typical Source-Drain Diode Forward Voltage** 

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5<br>4<br>3<br>2<br>1<br>0<br>25 50 75 100 125 150<br>TC, Case Temperature (°C)<br> Fig. 10 - Maximum Drain Current vs. Case Temperature<br>1050<br>1025<br>1000<br>975<br>950<br>925<br>900<br>875<br>850<br>825<br>800<br>ID = 250 μA<br>775<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>TJ, Junction Temperature (°C)<br>, Drain Current (A)<br>ID<br>, Drain-to-Source Breakdown Voltage (V)<br>DS<br>V<br>**----- End of picture text -----**<br>


**Fig. 10 - Maximum Drain Current vs. Case Temperature** 

**Fig. 11 - Temperature vs. Drain-to-Source Voltage** 

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100<br>Operation in this area<br>limited by R DS(on) IDM limited<br>10<br>100 μs<br>1<br>Limited by RDS(on)*<br>0.1 TC = 25 °C 1 ms<br>T J = 150 °C 10 ms<br>single pulse<br>BVDSS limited<br>0.01<br>1 10 100 1000<br>VDS, Drain-to-Source Voltage (V)<br>* VGS > minimum VGS at which RDS(on) is specified<br>, Drain Current (A)<br>ID<br>**----- End of picture text -----**<br>


**Fig. 9 - Maximum Safe Operating Area** 

S17-1345-Rev. A, 04-Sep-17 

Document Number: 92018 

**4** For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHU4N80E** 

Vishay Siliconix 

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www.vishay.com 

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1<br>Duty cycle = 0.5<br>0.2<br>0.1<br>0.1<br>0.05<br>0.02<br>Single pulse<br>0.01<br>0.0001 0.001 0.01 0.1 1<br>Pulse Time (s)<br>Thermal Impedance<br>Normalized Effective Transient<br>**----- End of picture text -----**<br>


**Fig. 12 - Normalized Thermal Transient Impedance, Junction-to-Case** 

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RD<br>VDS<br>VGS<br>D.U.T.<br>R<br>g +<br>- VDD<br>10 V<br>Pulse width ≤ 1 μs<br>Duty factor ≤ 0.1 %<br>**----- End of picture text -----**<br>


**Fig. 13 - Switching Time Test Circuit** 

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VDS<br>90 %<br>10 %<br>VGS<br>td(on) tr td(off) tf<br>**----- End of picture text -----**<br>


**Fig. 14 - Switching Time Waveforms** 

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VDS<br>tp<br>VDD<br>VDS<br>IAS<br> Fig. 16 - Unclamped Inductive Waveforms<br>Qg<br>10 V<br>Qgs Qgd<br>VG<br>Charge<br>**----- End of picture text -----**<br>


**Fig. 16 - Unclamped Inductive Waveforms** 

**Fig. 17 -  Basic Gate Charge Waveform** 

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L<br>VDS<br>Vary tp to obtain<br>required IAS<br>Rg D.U.T. +<br>-  [V][DD]<br>IAS<br>10 V<br>tp 0.01 Ω<br>**----- End of picture text -----**<br>


**Fig. 15 - Unclamped Inductive Test Circuit** 

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Current regulator<br>Same type as D.U.T.<br>50 kΩ<br>12 V 0.2 μF<br>0.3 μF<br>+<br>D.U.T. - VDS<br>VGS<br>3 mA<br>IG ID<br>Current sampling resistors<br>**----- End of picture text -----**<br>


**Fig. 18 - Gate Charge Test Circuit** 

Document Number: 92018 

S17-1345-Rev. A, 04-Sep-17 

**5** 

For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHU4N80E** 

Vishay Siliconix 

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www.vishay.com<br>**----- End of picture text -----**<br>


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Peak Diode Recovery dV/dt Test Circuit<br>+ Circuit layout considerations<br>D.U.T.<br>   •  Low stray inductance<br>3  •  Ground plane<br> •  Low leakage inductance<br>current transformer<br>-<br>+<br>2<br>- - 4 +<br>1<br>Rg •  dV/dt controlled by Rg +<br>•  I•  Driver same type as D.U.T.SD controlled by duty factor “D” - VDD<br>•  D.U.T. - device under test<br>1 Driver gate drive<br>P.W.<br>Period D =<br>P.W. Period<br>VGS = 10 V  [a]<br>2 D.U.T. ISD waveform<br>Reverse<br>recovery Body diode forward<br>current current<br>dI/dt<br>3 D.U.T. VDS waveform Diode recovery<br>dV/dt<br>VDD<br>Re-applied<br>voltage<br>Body diode forward drop<br>Inductor current<br>4<br>Ripple ≤ 5 % ISD<br>Note<br>a. VGS = 5 V for logic level devices<br>**----- End of picture text -----**<br>


**Fig. 19 - For N-Channel** 

_Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?92018._ 

S17-1345-Rev. A, 04-Sep-17 

Document Number: 92018 

**6** 

For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Package Information** Vishay Siliconix 

www.vishay.com 

## **Case Outline for TO-251AA (High Voltage)** 

## **OPTION 1:** 

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4 3 A<br>E1 Thermal PAD E A<br>4<br>b4 0.010 0.25 M C A B c2<br>L2 4 A<br>θ2 θ1<br>D1 4<br>B<br>C<br>3<br>Seating<br>5 plane<br>L1 L3 C C<br>(Datum A)<br>L<br>B B<br>A<br>A1<br>3  x b2<br>c<br>3 x b<br>View A - A 2 x e 0.010 0.25 M C A B<br>Base<br>5 metal<br>Plating<br>b1, b3<br>Lead tip<br>(c) c1 5<br>( b, b2)<br>Section B - B and C - C<br>D<br>**----- End of picture text -----**<br>


||**MILLIMETERS**|**MILLIMETERS**|**INCHES**|**INCHES**||**MILLIMETERS**<br>**INCHES**<br>**DIM.**<br>**MIN.**<br>**MAX.**<br>**MIN.**<br>**MAX.**<br>D1<br>5.21<br>-<br>0.205<br>-<br>E<br>6.35<br>6.73<br>0.250<br>0.265<br>E1<br>4.32<br>-<br>0.170<br>-<br>e<br>2.29 BSC<br>2.29 BSC<br>L<br>8.89<br>9.65<br>0.350<br>0.380<br>L1<br>1.91<br>2.29<br>0.075<br>0.090<br>L2<br>0.89<br>1.27<br>0.035<br>0.050<br>L3<br>1.14<br>1.52<br>0.045<br>0.060<br>θ1<br>0'<br>15'<br>0'<br>15'<br>θ2<br>25'<br>35'<br>25'<br>35'|**MILLIMETERS**|**MILLIMETERS**|**INCHES**|**INCHES**|
|---|---|---|---|---|---|---|---|---|---|---|
|**DIM.**|**MIN.**|**MAX.**|**MIN.**|**MAX.**|||**MIN.**|**MAX.**|**MIN.**|**MAX.**|
|A|2.18|2.39|0.086|0.094|||5.21|-|0.205|-|
|A1|0.89|1.14|0.035|0.045|||6.35|6.73|0.250|0.265|
|b|0.64|0.89|0.025|0.035|||4.32|-|0.170|-|
|b1|0.65|0.79|0.026|0.031|||2.29 BSC||2.29 BSC||
|b2|0.76|1.14|0.030|0.045|||8.89|9.65|0.350|0.380|
|b3|0.76|1.04|0.030|0.041|||1.91|2.29|0.075|0.090|
|b4|4.95|5.46|0.195|0.215|||0.89|1.27|0.035|0.050|
|c|0.46|0.61|0.018|0.024|||1.14|1.52|0.045|0.060|
|c1|0.41|0.56|0.016|0.022|||0'|15'|0'|15'|
|c2|0.46|0.86|0.018|0.034|||25'|35'|25'|35'|
|D|5.97|6.22|0.235|0.245|||||||
|ECN: E21-0605-Rev. B, 25-Oct-2021<br>DWG: 5968|||||||||||
||||||||||||



## **Notes** 

- Dimensioning and tolerancing per ASME Y14.5M-1994 

- Dimension are shown in inches and millimeters 

- Dimension D and E do not include mold flash. Mold flash shall not exceed 0.13 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body 

- Thermal pad contour optional with dimensions b4, L2, E1 and D1 

- Lead dimension uncontrolled in L3 

- Dimension b1, b3 and c1 apply to base metal only 

- Outline conforms to JEDEC[®] outline TO-251AA 

Revision: 25-Oct-2021 

Document Number: 91362 

**1** 

For technical questions, contact: hvmos.techsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Package Information** 

Vishay Siliconix 

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**----- Start of picture text -----**<br>
www.vishay.com<br>**----- End of picture text -----**<br>


## **OPTION 2: FACILITY CODE = N** 

|Ø 1.00<br>x 0.10 deep<br>L2<br>L4<br>L3|Ø 1.00<br>x 0.10 deep<br>L2<br>L4<br>L3|L2||E<br>b4<br>CL|E<br>b4<br>CL|E<br>b4<br>CL||D<br>L1<br>C<br>B<br>L|θ1<br><br>θ1|θ1<br><br>θ1|θ1<br><br>θ1|||A1<br>D1<br>Third angle<br>projection|||||||c1<br>D2|c1<br>D2|c1<br>D2|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||||||||||||||||||
|||||||||||θ1||c|A<br>2|A1||||||||||
||||||||||||||||D1||E1|||||||
|||||||||||||||||||||||||
|||||||||||||||||||||||D2||
|||||||||||θ1||||||||||||||
|||||||||||||||||||||||||
|||||||||||||||||||||||||
|||L4||||||||||||||||||||||
|||||b2<br>b<br>e<br>C<br>B||||||||||||||||||||
|||L3||||||||||||||||||||||
|||||||||||||||||||||||||
|||||||||||||||||||||||||
||||||||||||||c|||c|b1, b3<br>b, b2<br><br>Section “B-B” a|||nd “C-C”||||
||||||e|||||||||||||||||||
|||||||||θ2||||||||||||||||
|||||||||||||||||||||||||
|||||||||||||||||||||||||
|||||||||||||||||||||||||
|**DIM.**|||**MIN.**|||**MAX.**||**MAX.**||||||**DIM.**|||**MIN.**|||**MAX.**|||**MAX.**|
|A|||2.180|||2.285||2.390||||||D2|||5.380|||-|||-|
|A1|||0.890|||1.015||1.140||||||E|||6.350|||6.540|||6.730|
|b|||0.640|||0.765||0.890||||||E1|||4.32|||-|||-|
|b1|||0.640|||0.715||0.790||||||e|||2.29 BSC|||||||
|b2|||0.760|||0.950||1.140||||||L|||8.890||9.270||||9.650|
|b3|||0.760|||0.900||1.040||||||L1|||1.910||2.100||||2.290|
|b4|||4.950|||5.205||5.460||||||L2|||0.890||1.080||||1.270|
|c|||0.460|||-||0.610||||||L3|||1.140||1.330||||1.520|
|c1|||0.410|||-||0.560||||||L4|||1.300||1.400||||1.500|
|c2|||0.460|||-||0.610||||||θ1|||0°||7.5°||||15°|
|D|||5.970|||6.095||6.220||||||θ2|||4°||-||||-|
|D1|||4.300|||-||-||||||||||||||||
|ECN: E21-0605-Rev. B, 25-Oct-2021<br>DWG: 5968||||||||||||||||||||||||
|||||||||||||||||||||||||



## **Notes** 

- Dimensioning and tolerancing per ASME Y14.5M-1994 

- All dimension are in millimeters, angles are in degrees 

- Heat sink side flash is max. 0.8 mm 

Revision: 25-Oct-2021 

Document Number: 91362 

**2** 

For technical questions, contact: hvmos.techsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Application Note 826** 

**==> picture [60 x 50] intentionally omitted <==**

## Vishay Siliconix 

## **RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)** 

**==> picture [203 x 287] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.224<br>(5.690)<br>0.180 0.055<br>(4.572) (1.397)<br>0.243 (6.180)<br>0.420<br>(10.668)<br>0.087 (2.202)<br>0.090 (2.286)<br>**----- End of picture text -----**<br>


Recommended Minimum Pads Dimensions in Inches/(mm) 

> Return to Index Return to Index 

Document Number: 72594 Revision: 21-Jan-08 

www.vishay.com 

3 

**Legal Disclaimer Notice** Vishay 

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## **Disclaimer** 

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 

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Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of any of the products, services or opinions of the corporation, organization or individual associated with the third-party website. Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website or for that of subsequent links. 

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_**© 2021 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED**_ 

Revision: 09-Jul-2021 

Document Number: 91000 

**1** 



## Links

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---

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