# Power MOSFET, N Channel, 500 V, 18 A, 0.27 ohm, TO-220, Through Hole

![Product image](https://novapart.co/image/farnell:1869883/)

**URL**: https://novapart.co/products/SIHP18N50C-E3/power-mosfet-n-channel-500-v-18-a-027-ohm-to-220
**SKU**: SIHP18N50C-E3
**Manufacturer**: VISHAY
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.7500
**Stock**: 500+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:18A; Drain Source Voltage Vds:500V; On Resistance Rds(on):0.225oh; Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (17-Dec-2014) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 223W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220 |
| Drain Source Voltage Vds | 500V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 18A |
| Drain Source On State Resistance | 0.27ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1869883/)

**SiHP18N50C** 

Vishay Siliconix 

www.vishay.com 

## **Power MOSFET** 

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**----- Start of picture text -----**<br>
D<br>TO-220AB<br>G<br>S<br>D<br>G S<br>N-Channel MOSFET<br>**----- End of picture text -----**<br>


## **FEATURES** 

- Low figure-of-merit Ron x Qg 

• 100 % avalanche tested Available • High peak current capability Available • dv/dt ruggedness • RoHS* 

- Improved trr/Qrr 

- Improved gate charge 

- High power dissipations capability 

- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 

## **PRODUCT SUMMARY** 

|**PRODUCT SUMMARY**|**PRODUCT SUMMARY**|**PRODUCT SUMMARY**|
|---|---|---|
|VDS(V) at TJmax.|560||
|RDS(on)()|VGS= 10 V|0.225|
|Qgmax. (nC)|76||
|Qgs(nC)|21||
|Qgd(nC)|29||
|Configuration|Single||



## **Note** 

- This    datasheet    provides    information    about    parts    that    are RoHS-compliant and / or parts that are non RoHS-compliant.  For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details 

## **ORDERING INFORMATION** 

Package TO-220AB Lead (Pb)-free and halogen-free SiHP18N50C-E3 

**ABSOLUTE MAXIMUM RATINGS** (TC = 25 °C, unless otherwise noted) **PARAMETER SYMBOL LIMIT UNIT** ~~es~~ Drain-source voltage V ~~ee~~ DS 500 V ~~ee~~ Gate-source voltage TC = 25 °C ~~ee~~ VGS ~~eee~~ ± 3018 ~~Me~~ Continuous drain current (TJ = 150 °C)[a] VGS at 10 V ID TC = 100 °C 11 A ~~poa~~ Pulsed drain current[ b] IDM 72 Linear derating factor 1.8 W/°C ~~oo~~ Single pulse avalanche energy[ c] EAS 361 mJ Maximum power dissipation PD 223 W Reverse diode dv/dt[ d] dv/dt 5 V/ns ~~ee~~ Operating junction and storage temperature range TJ, Tstg -55 to +150 °C ~~i~~ Soldering recommendations (peak temperature)[ d] For 10 s 300 ~~Meee~~ **Notes** a. Drain current limited by maximum junction temperature 

- b. Repetitive rating; pulse width limited by maximum junction temperature 

- c. VDD = 50 V, starting TJ = 25 °C, L = 2.5 mH, Rg = 25  , IAS = 17 A 

- d. ISD  18 A, di/dt  380 A/μs, VDD  VDS, TJ  150 °C 

- e. 1.6 mm from case 

## **THERMAL RESISTANCE RATINGS** 

|**PARAMETER**|**SYMBOL**|**TYP.**|**MAX.**|**UNIT**|
|---|---|---|---|---|
|Maximum junction-to-ambient|RthJA|-|62|°C/W|
|Maximum junction-to-case (drain)|RthJC|-|0.56||



S17-1726-Rev. E, 20-Nov-17 

Document Number: 91374 

**1** For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHP18N50C** 

www.vishay.com 

Vishay Siliconix 

**==> picture [59 x 48] intentionally omitted <==**

|**SPECIFICATIONS**(TJ= 25 °C,unless otherwise noted)|**SPECIFICATIONS**(TJ= 25 °C,unless otherwise noted)|**SPECIFICATIONS**(TJ= 25 °C,unless otherwise noted)|**SPECIFICATIONS**(TJ= 25 °C,unless otherwise noted)|||||
|---|---|---|---|---|---|---|---|
|**PARAMETER**|**SYMBOL**|**TEST CONDITIONS**||**MIN.**|**TYP.**|**MAX.**|**UNIT**|
|**Static**||||||||
|Drain-source breakdown voltage|VDS|VGS= 0 V, ID= 250 μA||500|-|-|V|
|VDStemperature coefficient|VDS/TJ|Reference to 25 °C, ID= 1 mA||-|0.6|-|V/°C|
|Gate-source threshold voltage (N)|VGS(th)|VDS= VGS, ID= 250 μA||3.0|-|5.0|V|
|Gate-source leakage|IGSS|VGS= ± 30 V||-|-|± 100|nA|
|Zero gate voltage drain current|IDSS|VDS= 500 V, VGS= 0 V||-|-|25|μA|
|||VDS= 400 V, VGS= 0 V, TJ= 125 °C||-|-|250||
|Drain-source on-state resistance|RDS(on)|VGS= 10 V|ID= 10 A|-|0.225|0.270||
|Forward transconductancea|gfs|VDS= 50 V, ID= 10 A||-|6.4|-|S|
|**Dynamic**||||||||
|Input capacitance|Ciss|VGS= 0 V,<br>VDS= 25 V,<br>f = 1 MHz||-|2451|2942|pF|
|Output capacitance|Coss|||-|300|360||
|Reverse transfer capacitance|Crss|||-|26|32||
|Totalgate charge|Qg|VGS= 10 V|ID= 18 A, VDS= 400 V|-|65|76|nC|
|Gate-source charge|Qgs|||-|21|-||
|Gate-drain charge|Qgd|||-|29|-||
|Turn-on delay time|td(on)|VDD= 250 V, ID= 18 A,<br>VGS= 10 V, Rg= 7.5||-|80|-|ns|
|Rise time|tr|||-|27|-||
|Turn-off delay time|td(off)|||-|32|-||
|Fall time|tf|||-|44|-||
|Gate input resistance|Rg|f = 1 MHz, open drain||-|1.1|-||
|**Drain-Source Body Diode Characteristics**||||||||
|Continuous source-drain diode current|IS|MOSFET symbol<br>showing the<br>integral reverse<br>p - n junction diode<br>S<br>D<br>G||-|-|18|A|
|Pulsed diode forward current|ISM|||-|-|72||
|Diode forward voltage|VSD|TJ= 25 °C, IS= 18 A, VGS= 0 V||-|-|1.5|V|
|Reverse recovery time|trr|TJ= 25 °C, IF= IS,<br>di/dt = 100 A/μs, VR= 35 V||-|503|-|ns|
|Reverse recovery charge|Qrr|||-|6.7|-|μC|
|Reverse recovery current|IRRM|||-|30|-|A|



## **Notes** 

a. Repetitive rating; pulse width limited by maximum junction temperature 

The information shown here is a preliminary product proposal, not a commercial product datasheet. Vishay Siliconix is not committed to produce this or any similar product. This information should not be used for design purposes, nor construed as an offer to furnish or sell such products. 

S17-1726-Rev. E, 20-Nov-17 

Document Number: 91374 

**2** For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHP18N50C** 

Vishay Siliconix 

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www.vishay.com<br>**----- End of picture text -----**<br>


## **TYPICAL CHARACTERISTICS** (25 °C, unless otherwise noted) 

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70<br>Top 15 VVGS TJ = 25 °C<br>60 14 V<br>13 V<br>12 V<br>50 11 V<br>10 V<br>9.0 V<br>40 8.0 V<br>7.0 V<br>6.0 V<br>30 Bottom 5.0 V<br>20<br>7.0 V<br>10<br>0<br>0 6 12  18  24  30<br>VDS, Drain-to-Source Voltage (V)<br>, Drain Current (A)<br>ID<br>**----- End of picture text -----**<br>


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3<br>ID = 17 A<br>2.5<br>2<br>1.5<br>VGS = 10 V<br>1<br>0.5<br>0<br>- 60 - 40 - 20 0 20 40 60 80 100 120 140 160<br>TJ, Junction Temperature (°C)<br>(Normalized)<br>, Drain-to-Source On Resistance<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**Fig. 1 - Typical Output Characteristics, TC = 150 °C** 

**Fig. 4 - Normalized On-Resistance vs. Temperature** 

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40<br>Top 15 VVGS TJ = 150 °C<br>14 V<br>13 V<br>30 12 V<br>11 V<br>10 V<br>9.0 V<br>8.0 V<br>7.0 V<br>20 6.0 V<br>Bottom 5.0 V<br>7.0 V<br>10<br>0<br>0 6 12 18 24 30<br>VDS, Drain-to-Source Voltage (V)<br> Fig. 2 - Typical Output Characteristics, TC = 150 °C<br>100<br>T J = 150 °C<br>     10<br>T J = 25 °C<br>     1<br>  0.1<br>0.01<br>5 6 7 8 9 10<br>VGS, Gate-to-Source Voltage (V)<br>, Drain Current (A)<br>ID<br>, Drain Current (A)<br>ID<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
10 [5]<br>VGS = 0 V, f = 1 MHz<br>Ciss = Cgs + Cgd, Cds shorted<br>C rss  = C gd<br>10 [4] Coss = Cds + Cgd<br>C iss<br>10 [3]<br>10 [2] Coss<br>10 Crss<br>1 10 100 1000<br>VDS, Drain-to-Source Voltage (V)<br> Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage<br>20<br>ID = 17 A<br>16 VDS = 400 V<br>VDS = 250 V<br>VDS = 100 V<br>12<br>8<br>4<br>0<br>0 30 60 90 120<br>QG, Total Gate Charge (nC)<br>Capacitance (pF)<br>, Gate-to-Source Voltage (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage** 

**Fig. 3 - Typical Transfer Characteristics** 

**Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage** 

S17-1726-Rev. E, 20-Nov-17 

Document Number: 91374 

**3** For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHP18N50C** 

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## Vishay Siliconix 

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100 10 [3]<br>Operation in this area limited<br>by RDS(on)<br>10 [2]<br>TJ = 150 °C TJ = 25 °C<br>10<br>10 100 µs<br>1 1 ms<br>1 TC = 25  ° C<br>TJ = 150  ° C 10 ms<br>Single pulse<br>VGS = 0 V<br>0.1 0.1<br>0.2 0.5 0.8 1.1 1.4 10 10 [2] 10 [3] 10 [4]<br>VSD, Source-to-Drain Voltage (V) VDS, Drain-to-Source Voltage (V)<br>, Drain Current (A)<br>ID<br>, Reverse Drain Current (A)<br>ISD<br>**----- End of picture text -----**<br>


**Fig. 7 - Typical Source-Drain Diode Forward Voltage** 

**Fig. 8 - Maximum Safe Operating Area** 

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20<br>15<br>10<br>5<br>0<br>25 50 75 100 125 150<br>TC, Case Temperature (°C)<br>, Drain Current (A)<br>ID<br>**----- End of picture text -----**<br>


**Fig. 9 - Maximum Drain Current vs. Case Temperature** 

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     1<br>Duty Cycle = 0.5<br>0.2<br>0.1<br> 0.1<br>0.05<br>0.02<br>Single Pulse<br>0.01<br>10 [-4] 10 [-3] 10 [-2] 0.1 1<br>Pulse Time (s)<br>Thermal Impedance<br>Normalized Effective Transient<br>**----- End of picture text -----**<br>


**Fig. 10 - Normalized Thermal Transient Impedance, Junction-to-Case** 

S17-1726-Rev. E, 20-Nov-17 

Document Number: 91374 

**4** For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHP18N50C** 

Vishay Siliconix 

**==> picture [59 x 48] intentionally omitted <==**

www.vishay.com 

**==> picture [151 x 235] intentionally omitted <==**

**----- Start of picture text -----**<br>
RD<br>VDS<br>VGS<br>D.U.T.<br>RG +- VDD<br>10 V<br>Pulse width ≤ 1 µs<br>Duty factor ≤ 0.1 %<br> Fig. 11 - Switching Time Test Circuit<br>VDS<br>90 %<br>10 %<br>VGS<br>td(on) tr td(off) tf<br>**----- End of picture text -----**<br>


**Fig. 12 - Switching Time Waveforms** 

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L<br>VDS<br>Vary tp to obtain<br>required IAS<br>RG D.U.T +<br>- [V][DD]<br>IAS<br>10 V<br>tp 0.01 Ω<br>**----- End of picture text -----**<br>


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QG<br>10 V<br>QGS QGD<br>VG<br>Charge<br>**----- End of picture text -----**<br>


**Fig. 15 -  Basic Gate Charge Waveform** 

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Current regulator<br>Same type as D.U.T.<br>50 kΩ<br>12 V 0.2 µF<br>0.3 µF<br>+<br>D.U.T. - VDS<br>VGS<br>3 mA<br>IG ID<br>Current sampling resistors<br>**----- End of picture text -----**<br>


**Fig. 16 - Gate Charge Test Circuit** 

**Fig. 13 - Unclamped Inductive Test Circuit** 

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VDS<br>t<br>p<br>VDD<br>VDS<br>IAS<br>**----- End of picture text -----**<br>


**Fig. 14 - Unclamped Inductive Waveforms** 

S17-1726-Rev. E, 20-Nov-17 

Document Number: 91374 

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**SiHP18N50C** 

Vishay Siliconix 

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www.vishay.com<br>**----- End of picture text -----**<br>


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Peak Diode Recovery dV/dt Test Circuit<br>**----- End of picture text -----**<br>


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+ Circuit layout considerations<br>D.U.T.<br>•  Low stray inductance<br>•  Ground plane<br>•  Low leakage inductance<br>current transformer<br>-<br>+<br>- - +<br>Rg •  dV/dt controlled by Rg +<br>••   Driver same type as D.U.T.ISD controlled by duty factor “D” - VDD<br>•  D.U.T. - device under test<br>Driver gate drive<br>Period D = P.W.<br>P.W. Period<br>VGS = 10 V [a]<br>D.U.T. lSD waveform<br>Reverse<br>recovery Body diode forward<br>current current dI/dt<br>D.U.T. VDS waveform Diode recovery<br>dV/dt<br>VDD<br>Re-applied<br>voltage<br>Body diode forward drop<br>Inductor current<br>Ripple ≤ 5 % ISD<br>Note<br>a. VGS = 5 V for logic level devices<br>**----- End of picture text -----**<br>


**Fig. 17 - For N-Channel** 

_Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91374._ 

S17-1726-Rev. E, 20-Nov-17 

Document Number: 91374 

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**Package Information** 

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Vishay Siliconix 

**TO-220-1** 

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A MILLIMETERS INCHES<br>E DIM.<br>MIN. MAX. MIN. MAX.<br>F<br>A 4.24 4.65 0.167 0.183<br>Ø P b 0.69 1.02 0.027 0.040<br>b(1) 1.14 1.78 0.045 0.070<br>c 0.36 0.61 0.014 0.024<br>D 14.33 15.85 0.564 0.624<br>E 9.96 10.52 0.392 0.414<br>m et | SS<br>e 2.41 2.67 0.095 0.105<br>e(1) 4.88 5.28 0.192 0.208<br>F 1.14 1.40 0.045 0.055<br>H(1) 6.10 6.71 0.240 0.264<br>1 2 3<br>J(1) 2.41 2.92 0.095 0.115<br>L 13.36 14.40 0.526 0.567<br>L(1) 3.33 4.04 0.131 0.159<br>M [*] Ø P 3.53 3.94 0.139 0.155<br>Q 2.54 3.00 0.100 0.118<br>a b(1)<br>ECN: X15-0364-Rev. C, 14-Dec-15<br>DWG: 6031<br>Note<br>• M* = 0.052 inches to 0.064 inches (dimension including<br>protrusion), heatsink hole for HVM<br>C<br>b<br>e<br>7 | t J(1) | =———<br>oT e(1)<br>Package Picture<br>ASE Xi’an<br>———<br>Q<br>H(1)<br>D<br>L(1)<br>L<br>**----- End of picture text -----**<br>


Revison: 14-Dec-15 

Document Number: 66542 

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**Package Information** Vishay Siliconix 

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www.vishay.com 

## **TO-220 FULLPAK (High Voltage)** 

## **OPTION 1: FACILITY CODE = 9** 

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A<br>E F<br>A3<br>3 x b2 Mold flash<br>3 x b1 bleeding  Q<br>Exposed Cu<br>3 x b<br>2 x e C Bottom view<br>Ø R<br>1<br>Q<br>G<br>D<br>L1<br>L<br>**----- End of picture text -----**<br>


||**MILLIMETERS**|**MILLIMETERS**|**MILLIMETERS**|
|---|---|---|---|
|**DIM.**|**MIN.**|**NOM.**|**MAX.**|
|A|4.60|4.70|4.80|
|b|0.70|0.80|0.91|
|b1|1.20|1.30|1.47|
|b2|1.10|1.20|1.30|
|C|0.45|0.50|0.63|
|D|15.80|15.87|15.97|
|e|2.54 BSC|||
|E|10.00|10.10|10.30|
|F|2.44|2.54|2.64|
|G|6.50|6.70|6.90|
|L|12.90|13.10|13.30|
|L1|3.13|3.23|3.33|
|Q|2.65|2.75|2.85|
|Q1|3.20|3.30|3.40|
|Ø R|3.08|3.18|3.28|



## **Notes** 

1. To be used only for process drawing 

2. These dimensions apply to all TO-220 FULLPAK leadframe versions 3 leads 

3. All critical dimensions should C meet Cpk > 1.33 

4. All dimensions include burrs and plating thickness 

5. No chipping or package damage 

6. Facility code will be the 1[st] character located at the 2[nd] row of the unit marking 

Revision: 08-Apr-2019 

Document Number: 91359 

**1** 

For technical questions, contact: hvmos.techsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Package Information** 

Vishay Siliconix 

**==> picture [59 x 48] intentionally omitted <==**

www.vishay.com 

## **OPTION 2: FACILITY CODE = Y** 

|<br>|<br>||||E|b3<br>Ø P<br>L1<br>d3<br>D<br>c|b3<br>Ø P<br>L1<br>d3<br>D<br>c|<br>A2<br>u<br>V<br>A1<br>A|<br>A2<br>u<br>V<br>A1<br>A|
|---|---|---|---|---|---|---|---|---|---|
|||||<br>n|<br>|Ø P||||
|||d1||||||||
|||||||||||
|||||||||||
|||||||||||
|||||||||||
|||L|||b2<br>|||||
|||||||b3||||
|||b||||||||
|||||||||||
|||||||||||
|||||**MILLIMETERS**||||**INCHES**||
|**DIM.**||**MIN.**|||**MAX.**|||**MIN.**|**MAX.**|
|A||4.570|||4.830|||0.180|0.190|
|A1||2.570|||2.830|||0.101|0.111|
|A2||2.510|||2.850|||0.099|0.112|
|b||0.622|||0.890|||0.024|0.035|
|b2||1.229|||1.400|||0.048|0.055|
|b3||1.229|||1.400|||0.048|0.055|
|c||0.440|||0.629|||0.017|0.025|
|D||8.650|||9.800|||0.341|0.386|
|d1||15.88|||16.120|||0.622|0.635|
|d3||12.300|||12.920|||0.484|0.509|
|E||10.360|||10.630|||0.408|0.419|
|e||||2.54 BSC||||0.100 BSC||
|L||13.200|||13.730|||0.520|0.541|
|L1||3.100|||3.500|||0.122|0.138|
|n||6.050|||6.150|||0.238|0.242|
|Ø P||3.050|||3.450|||0.120|0.136|
|u||2.400|||2.500|||0.094|0.098|
|V||0.400|||0.500|||0.016|0.020|
|ECN: E19-0180-Rev. D, 08-Apr-2019<br>DWG: 5972||||||||||



## **Notes** 

1. To be used only for process drawing 

2. These dimensions apply to all TO-220 FULLPAK leadframe versions 3 leads 

3. All critical dimensions should C meet Cpk > 1.33 

4. All dimensions include burrs and plating thickness 

5. No chipping or package damage 

6. Facility code will be the 1[st] character located at the 2[nd] row of the unit marking 

Document Number: 91359 

Revision: 08-Apr-2019 

**2** 

For technical questions, contact: hvmos.techsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Legal Disclaimer Notice** Vishay 

www.vishay.com 

**==> picture [59 x 48] intentionally omitted <==**

## **Disclaimer** 

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product.  To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. 

Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications.  Such statements are not binding statements about the suitability of products for a particular application.  It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time.  All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts.  Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. 

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. 

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.  Product names and markings noted herein may be trademarks of their respective owners. 

_**© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED**_ 

Revision: 08-Feb-17 

Document Number: 91000 

**1** 



## Links

- [View this product on Novapart](https://novapart.co/products/SIHP18N50C-E3/power-mosfet-n-channel-500-v-18-a-027-ohm-to-220)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/vishay/sihp18n50c-e3/mosfet-n-ch-w-dio-500v-18a-to220ab/dp/1869883)
---

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