# Power MOSFET, N Channel, 600 V, 33 A, 0.099 ohm, TO-247AC, Through Hole

![Product image](https://novapart.co/image/farnell:2291550/)

**URL**: https://novapart.co/products/SIHG33N60E-GE3/power-mosfet-n-channel-600-v-33-a-0099-ohm-to
**SKU**: SIHG33N60E-GE3
**Manufacturer**: VISHAY
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.3300
**Stock**: 10+

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:33A; Drain Source Voltage Vds:600V; On Resistance Rds(on):0.083ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:2V; Po

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | E |
| Qualification | - |
| Power Dissipation | 278W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-247AC |
| Drain Source Voltage Vds | 600V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 33A |
| Drain Source On State Resistance | 0.099ohm |
| Gate Source Threshold Voltage Max | 2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2291550/)

**SiHG33N60E** 

Vishay Siliconix 

www.vishay.com 

## **E Series Power MOSFET** 

|**PRODUCT SUMMARY**|**PRODUCT SUMMARY**|**PRODUCT SUMMARY**|
|---|---|---|
|VDS(V) at TJmax.|650||
|RDS(on)max. at 25 °C (Ω)|VGS= 10 V|0.099|
|Qg(Max.) (nC)|150||
|Qgs(nC)|24||
|Qgd(nC)|42||
|Configuration|Single||



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**----- Start of picture text -----**<br>
D<br>TO-247AC<br>G<br>S<br>D S<br>G<br>N-Channel MOSFET<br>**----- End of picture text -----**<br>


## **FEATURES** 

- Low figure-of-merit (FOM): Ron x Qg 

- Low input capacitance (Ciss) 

- Reduced switching and conduction losses 

- Ultra low gate charge (Qg) 

Available 

- Avalanche energy rated (UIS) 

- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 

## **APPLICATIONS** 

- Server and telecom power supplies 

- Switch mode power supplies (SMPS) 

- Power factor correction power supplies (PFC) 

- Lighting 

   - High-intensity discharge (HID) 

   - Fluorescent ballast lighting 

- Industrial 

   - Welding 

   - Induction heating 

   - Motor drives 

   - Battery chargers 

   - Renewable energy 

   - Solar (PV inverters) 

## **ORDERING INFORMATION** 

|Package|TO-247AC|
|---|---|
|Lead (Pb)-free|SiHG33N60E-E3|
|Lead (Pb)-free and Halogen-free|SiHG33N60E-GE3|



~~pT~~ **ABSOLUTE MAXIMUM RATINGS** (TC = 25 °C, unless otherwise noted) **PARAMETER SYMBOL LIMIT UNIT** Drain-Source Voltage VDS 600 V ~~ee~~ Gate-Source Voltage VGS ± 30 TC = 25 °C 33 Continuous Drain Current (TJ = 150 °C) VGS at 10 V ~~Tt~~ TC = 100 °C ~~ee~~ ID ~~—~~ 21 A ~~jEa~~ Pulsed Drain Current[a] IDM 88 ~~a~~ Linear Derating Factor 2.2 W/°C ~~a~~ Single Pulse Avalanche Energy[b] EAS 793 mJ ~~a~~ Maximum Power Dissipation PD 278 W Operating Junction and Storage Temperature Range TJ, Tstg -55 to +150 °C ~~PT~~ Drain-Source Voltage Slope VDS = 0 V to 80 % VDS dV/dt ~~—~~ 70 V/ns Reverse Diode dV/dt[d] 12 ~~a~~ Soldering Recommendations (Peak Temperature)[c] ~~OO~~ for 10 s 300 °C 

## **Notes** 

a. Repetitive rating; pulse width limited by maximum junction temperature. 

- b. VDD = 50 V, starting TJ = 25 °C, L = 28.2 mH, Rg = 25 Ω, IAS = 7.5 A. 

- c. 1.6 mm from case. 

d. ISD ≤ ID, dI/dt = 100 A/μs, starting TJ = 25 °C. 

S15-0278-Rev. E, 23-Feb-15 

Document Number: 91522 

**1** 

For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHG33N60E** 

www.vishay.com 

Vishay Siliconix 

**==> picture [59 x 48] intentionally omitted <==**

|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|
|---|---|---|---|---|
|**PARAMETER**|**SYMBOL**|**TYP.**|**MAX.**|**UNIT**|
|Maximum Junction-to-Ambient|RthJA|-|40|°C/W|
|Maximum Junction-to-Case (Drain)|RthJC|-|0.45||



|**SPECIFICATIONS**(TJ= 25 °C,unless otherwise noted)|**SPECIFICATIONS**(TJ= 25 °C,unless otherwise noted)|**SPECIFICATIONS**(TJ= 25 °C,unless otherwise noted)|**SPECIFICATIONS**(TJ= 25 °C,unless otherwise noted)|||||
|---|---|---|---|---|---|---|---|
|**PARAMETER**|**SYMBOL**|**TEST CONDITIONS**||**MIN.**|**TYP.**|**MAX.**|**UNIT**|
|**Static**||||||||
|Drain-Source Breakdown Voltage|VDS|VGS= 0 V, ID= 250μA||600|-|-|V|
|VDSTemperature Coefficient|ΔVDS/TJ|Reference to 25 °C, ID= 1 mA||-|0.71|-|V/°C|
|Gate-Source Threshold Voltage(N)|VGS(th)|VDS= VGS, ID= 250μA||2.0|-|4.0|V|
|Gate-Source Leakage|IGSS|VGS= ± 20 V||-|-|± 100|nA|
|||VGS= ± 30 V||-|-|± 1|μA|
|Zero Gate Voltage Drain Current|IDSS|VDS= 600 V, VGS= 0 V||-|-|1|μA|
|||VDS= 480 V, VGS= 0 V, TJ= 125 °C||-|-|10||
|Drain-Source On-State Resistance|RDS(on)|VGS= 10 V|ID= 16.5 A|-|0.083|0.099|Ω|
|Forward Transconductancea|gfs|VDS= 30 V, ID= 16.5 A||-|11|-|S|
|**Dynamic**||||||||
|Input Capacitance|Ciss|VGS= 0 V,<br>VDS= 100 V,<br>f = 1 MHz||-|3508|-|pF|
|Output Capacitance|Coss|||-|156|-||
|Reverse Transfer Capacitance|Crss|||-|6|-||
|Effective output capacitance, energy<br>relatedb|Co(er)|VGS= 0 V, VDS= 0 V to 480 V||-|136|-||
|Effective output capacitance, time<br>relatedc|Co(tr)|||-|468|-||
|Total Gate Charge|Qg|VGS= 10 V|ID= 16.5 A, VDS= 480 V|-|100|150|nC|
|Gate-Source Charge|Qgs|||-|24|-||
|Gate-Drain Charge|Qgd|||-|42|-||
|Turn-On DelayTime|td(on)|VDD= 480 V, ID= 16.5 A<br>Rg= 9.1Ω, VGS= 10 V||-|28|56|ns|
|Rise Time|tr|||-|60|90||
|Turn-Off DelayTime|td(off)|||-|99|150||
|Fall Time|tf|||-|54|80||
|Gate Input Resistance|Rg|f = 1 MHz, open drain||-|0.7|-|Ω|
|**Drain-Source Body Diode Characteristics**||||||||
|Continuous Source-Drain Diode Current|IS|MOSFET symbol<br>showing the<br>integral reverse<br>p - n junction diode<br>S<br>D<br>G||-|-|33|A|
|Pulsed Diode Forward Current|ISM|||-|-|88||
|Diode Forward Voltage|VSD|TJ= 25 °C, IS= 16.5 A, VGS= 0 V||-|0.9|1.2|V|
|Reverse RecoveryTime|trr|TJ= 25 °C, IF= IS,<br>dI/dt = 100 A/μs, VR= 20 V||-|503|1006|ns|
|Reverse RecoveryCharge|Qrr|||-|8.5|17|μC|
|Reverse RecoveryCurrent|IRRM|||-|26|-|A|



## **Notes** 

a. Repetitive rating; pulse width limited by maximum junction temperature. 

b. Coss(er) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 % to 80 % VDSS. 

c. Coss(tr) is a fixed capacitance that gives the charging time as Coss while VDS is rising from 0 % to 80 % VDSS. 

S15-0278-Rev. E, 23-Feb-15 

Document Number: 91522 

**2** 

For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHG33N60E** 

www.vishay.com 

Vishay Siliconix 

**==> picture [59 x 48] intentionally omitted <==**

## **TYPICAL CHARACTERISTICS** (25 °C, unless otherwise noted) 

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**----- Start of picture text -----**<br>
120  TOP            15 V<br>14 V13 V TJ = 25 °C<br>100  12 V<br>11 V<br>10 V<br>80  9.0 V<br>8.0 V<br>7.0 V<br>BOTTOM  6.0 V<br>60<br>40<br>20<br> 5.0 V<br>0<br>0  5  10  15  20  25  30<br>VDS - Drain-to-Source Voltage (V)<br> - Drain Current (A)<br>ID<br>**----- End of picture text -----**<br>


**Fig. 1 - Typical Output Characteristics, TC = 150 °C** 

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**----- Start of picture text -----**<br>
3.0<br>ID = 16.5 A<br>2.5<br>2.0<br>1.5<br>1.0<br>0.5<br>VGS = 10 V<br>0.0<br>- 60 - 40 - 20 0 20 40 60 80 100 120 140 160<br>TJ - Junction Temperature (°C)<br> - On-Resistance (Normalized)<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**Fig. 4 -  Normalized On-Resistance vs. Temperature** 

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**----- Start of picture text -----**<br>
70   TOP            15 V<br>60   14 V13 V TJ = 150 °C<br>12 V<br>11 V<br>50   10 V<br>9.0 V<br>8.0 V<br>40   7.0 V<br>BOTTOM  6.0 V<br>30<br>20<br>10<br> 5.0 V<br>0<br>0  5  10  15  20  25  30<br>VDS - Drain-to-Source Voltage (V)<br> - Drain Current (A)<br>ID<br>**----- End of picture text -----**<br>


**Fig. 2 - Typical Output Characteristics, TC = 150 °C** 

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**----- Start of picture text -----**<br>
120<br>100<br>80<br>60<br>40<br>TJ = 150 °C<br>20<br>TJ = 25 °C<br>0<br>0  5  10  15  20  25<br>VGS, Gate-to-Source Voltage (V)<br>, Drain-to-Source Current (A)ID<br>**----- End of picture text -----**<br>


**Fig. 3 - Typical Transfer Characteristics** 

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**----- Start of picture text -----**<br>
100 000<br>VGS = 0 V, f = 1 MHz<br>Ciss = Cgs + Cgd x Cds shorted<br>Crss = Cgd<br>10 000  Ciss Coss = Cds + Cgd<br>1000<br>100  C oss<br>10<br>Crss<br>1<br>0  100  200  300  400  500  600<br>VDS - Drain-to-Source Voltage (V)<br> Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage<br>25<br> 5000<br>20<br>15<br>Coss Eoss<br> 500<br>10<br>5<br> 50  0<br>0   100   200   300   400   500   600<br>VDS<br>C - Capacitance (pF)<br> (pF)   (μJ)<br>oss oss<br>C E<br>**----- End of picture text -----**<br>


**Fig. 6 - COSS and EOSS vs. VDS** 

S15-0278-Rev. E, 23-Feb-15 

Document Number: 91522 

**3** 

For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHG33N60E** 

www.vishay.com 

Vishay Siliconix 

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**----- Start of picture text -----**<br>
24<br>VDS = 300 V<br>20<br>VDS = 120 V<br>16<br>VDS = 480 V<br>12<br>8<br>4<br>0<br>0  40   80   120   160   200<br>Qg - Total Gate Charge (nC)<br> - Gate-to-Source Voltage (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**Fig. 7 - Typical Gate Charge vs. Gate-to-Source Voltage** 

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**----- Start of picture text -----**<br>
1000<br>100 TJ = 150 °C<br>10<br>TJ = 25 °C<br>1<br>0.1<br>V GS = 0 V<br>0.01<br>0.0  0.2  0.4  0.6  0.8  1.0  1.2  1.4  1.6<br>VSD - Source-to-Drain Voltage (V)<br> Fig. 8 - Typical Source-Drain Diode Forward Voltage<br>1000<br>Operation in this area limited<br>by R DS(on) * I DM  Limited<br>100<br>10 Limited by RD(on) * 100  µs<br>1 m s<br>1<br>T C  = 25  ° C 10  ms<br>T J  = 150  ° C<br>Single Pulse BVDSS Limited<br>0.1<br>1 10 100 1000<br>VDS - Drain-to-Source Voltage (V)<br>* VGS > minimum VGS at which RDS(on) is specified<br> - Source Current (A)<br>IS<br>, Drain Current (A)<br>ID<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
35<br>30<br>25<br>20<br>15<br>10<br>5<br>0<br>25 50 75 100 125 150<br>TC - Temperature (°C)<br>, Drain Current (A)<br>ID<br>**----- End of picture text -----**<br>


**Fig. 10 - Maximum Drain Current vs. Case Temperature** 

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750<br>725<br>700<br>675<br>650<br>625<br>600<br>575<br>-60 -40 -20  0  20  40  60  80 100 120 140  160<br>TJ,Temperature (°C)<br>Voltage (V)<br>, Drain-to -Source Breakdown<br>DS<br>V<br>**----- End of picture text -----**<br>


**Fig. 11 - Typical Drain-to-Source Voltage vs. Temperature** 

**Fig. 9 - Maximum Safe Operating Area** 

S15-0278-Rev. E, 23-Feb-15 

Document Number: 91522 

**4** For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHG33N60E** 

www.vishay.com 

Vishay Siliconix 

**==> picture [59 x 48] intentionally omitted <==**

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**----- Start of picture text -----**<br>
1<br>Duty Cycle = 0.5<br>0.2<br>0.1  0.1<br>0.05<br>0.02<br>Single Pulse<br>0.01<br>0.0001  0.001  0.01  0.1  1<br>Square Wave Pulse Duration (s)<br>Thermal Impedance<br>Normalized Effective Transient<br>**----- End of picture text -----**<br>


**Fig. 12 - Normalized Thermal Transient Impedance, Junction-to-Case** 

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**----- Start of picture text -----**<br>
RD<br>VDS<br>VGS<br>D.U.T.<br>RG +- VDD<br>10 V<br>Pulse width ≤ 1 µs<br>Duty factor ≤ 0.1 %<br> Fig. 13 - Switching Time Test Circuit<br>VDS<br>90 %<br>10 %<br>VGS<br>td(on) tr td(off) tf<br>**----- End of picture text -----**<br>


**Fig. 14 - Switching Time Waveforms** 

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**----- Start of picture text -----**<br>
L<br>VDS<br>Vary tp to obtain<br>required IAS<br>RG D.U.T +<br>- [V][DD]<br>IAS<br>10 V<br>tp 0.01 Ω<br>**----- End of picture text -----**<br>


**Fig. 15 - Unclamped Inductive Test Circuit** 

S15-0278-Rev. E, 23-Feb-15 

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**----- Start of picture text -----**<br>
VDS<br>t<br>p<br>VDD<br>VDS<br>IAS<br> Fig. 16 - Unclamped Inductive Waveforms<br>QG<br>10 V<br>QGS QGD<br>VG<br>Charge<br> Fig. 17 -  Basic Gate Charge Waveform<br>Current regulator<br>Same type as D.U.T.<br>50 kΩ<br>12 V 0.2 µF<br>0.3 µF<br>+<br>D.U.T. - VDS<br>VGS<br>3 mA<br>IG ID<br>Current sampling resistors<br>**----- End of picture text -----**<br>


**Fig. 16 - Unclamped Inductive Waveforms** 

**Fig. 18 - Gate Charge Test Circuit** 

Document Number: 91522 

**5** 

For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHG33N60E** 

Vishay Siliconix 

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www.vishay.com<br>**----- End of picture text -----**<br>


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Peak Diode Recovery dV/dt Test Circuit<br>+ Circuit layout considerations<br>D.U.T.<br>•  Low stray inductance<br>•  Ground plane<br>•  Low leakage inductance<br>current transformer<br>-<br>+<br>- - +<br>Rg •  dV/dt controlled by Rg +<br>••   Driver same type as D.U.T.ISD controlled by duty factor “D” - VDD<br>•  D.U.T. - device under test<br>Driver gate drive<br>Period D = P.W.<br>P.W. Period<br>VGS = 10 V [a]<br>D.U.T. lSD waveform<br>Reverse<br>recovery Body diode forward<br>current current dI/dt<br>D.U.T. VDS waveform Diode recovery<br>dV/dt<br>VDD<br>Re-applied<br>voltage<br>Body diode forward drop<br>Inductor current<br>Ripple ≤ 5 % ISD<br>Note<br>a. VGS = 5 V for logic level devices<br>**----- End of picture text -----**<br>


**Fig. 19 - For N-Channel** 

_Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91522._ 

S15-0278-Rev. E, 23-Feb-15 

Document Number: 91522 

**6** 

For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Package Information** 

Vishay Siliconix 

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**----- Start of picture text -----**<br>
, §#£f<br>“wv BS<br>**----- End of picture text -----**<br>


www.vishay.com 

## **TO-247AC (High Voltage)** 

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**----- Start of picture text -----**<br>
4 4 A L A |<br>B E         ØP7 (Datum B)<br>E/2 S A2 Ø k M D B M<br>3  R/2 ØP1<br>A<br>D2<br>Q<br>r i A E 7 =e<br>2 x R 4 4<br>(2) D D1<br>ak | ain<br>1 2 3 D 4<br>Thermal pad<br>5  L1<br>C L 4<br>E1<br>MA See view B i A o| TUt 0.01 A M D B M<br>2 x b2 C View A - A<br>2 x  e<br>3 x b<br>b4 A1<br>0.10 M C A M<br>s —o 57 7 _<br>Planting (b1, b3, b5) Base metal<br>Lead Assignments<br>1. Gate D D E E<br>2. Drain<br>3. Source C C (c) c1<br>4. Drain<br>| (b, b2, b4) ss<br>(4)<br>Section C - C, D - D, E - E<br>View B<br>MILLIMETERS INCHES MILLIMETERS INCHES<br>ee ee<br>DIM. MIN. MAX. MIN. MAX. DIM. — MIN. MAX. MIN. MAX.<br>A 4.58 5.31 0.180 0.209 D2 0.51 1.30 0.020 0.051<br>a | +} ——<br>A1 2.21 2.59 0.087 0.102 E 15.29 15.87 0.602 a 0.625<br>sses A2 1.17 ee 2.49 es 0.046 0.098 nn E1 13.72 - 0.540 -<br>— b 0.99 1.40 0.039 0.055 — e 5.46 BSC 0.215 BSC<br>b1 0.99 1.35 0.039 0.053 Ø k 0.254 0.010<br>ee b2  a 1.53 2.39 0.060 0.094 L a 14.20 16.25 0.559 0.640<br>b3 1.65 2.37 0.065 0.093 L1 3.71 4.29 0.146 0.169<br>——— b4 2.42 3.43 0.095 0.135 N es 7.62 BSC 0.300 BSC<br>—_}| b5 2.59 3.38 ae 0.102 0.133 a Ø P a 3.51 3.66 0.138 0.144<br>c 0.38 0.86 —— 0.015 0.034 ee Ø P1 - 7.39 - 0.291<br>I c1 0.38 0.76 0.015 0.030 > Q 5.31 5.69 0.209 0.224<br>— D ft 19.71 20.82 0.776 0.820 R 4.52 5.49 0.178 0.216<br>D1 13.08 - 0.515 - S 5.51 BSC 0.217 BSC<br>ee es —<br>ECN: X13-0103-Rev. D, 01-Jul-13<br>DWG: 5971<br>PC —<br>**----- End of picture text -----**<br>


## **Notes** 

1. Dimensioning and tolerancing per ASME Y14.5M-1994. 

2. Contour of slot optional. 

3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body. 

4. Thermal pad contour optional with dimensions D1 and E1. 

5. Lead finish uncontrolled in L1. 

6. Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154"). 

7. Outline conforms to JEDEC outline TO-247 with exception of dimension c. 

8. Xian and Mingxin actually photo. 

Revision: 01-Jul-13 

Document Number: 91360 

For technical questions, contact: hvm@vishay.com 

**1** 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Legal Disclaimer Notice** Vishay 

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**==> picture [59 x 48] intentionally omitted <==**

## **Disclaimer** 

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 

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## **Material Category Policy** 

**Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant.** 

**Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.** 

**Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards.  Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition.  We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards.** 

Revision: 02-Oct-12 

Document Number: 91000 

**1** 



## Links

- [View this product on Novapart](https://novapart.co/products/SIHG33N60E-GE3/power-mosfet-n-channel-600-v-33-a-0099-ohm-to)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/vishay/sihg33n60e-ge3/mosfet-n-ch-600v-33a-to-247ac/dp/2291550)
---

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