# Power MOSFET, N Channel, 500 V, 3 A, 3.2 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2283607/)

**URL**: https://novapart.co/products/SIHD3N50D-GE3/power-mosfet-n-channel-500-v-3-a-32-ohm-to-252
**SKU**: SIHD3N50D-GE3
**Manufacturer**: VISHAY
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3930
**Stock**: 10+
**Lead Time**: 456 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:3A; Drain Source Voltage Vds:500V; On Resistance Rds(on):2.6ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3V; Power Diss

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (17-Dec-2014) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | D |
| Qualification | - |
| Power Dissipation | 104W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 500V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 3A |
| Drain Source On State Resistance | 3.2ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2283607/)

**SiHD3N50D** 

Vishay Siliconix 

www.vishay.com 

## **D Series Power MOSFET** 

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**----- Start of picture text -----**<br>
D<br>DPAK (TO-252)<br>D<br>G<br>S<br>G<br>S<br>**----- End of picture text -----**<br>


## **FEATURES** 

- Optimal design 

   - Low area specific on-resistance 

   - Low input capacitance (Ciss) 

   - Reduced capacitive switching losses 

   - High body diode ruggedness 

   - Avalanche energy rated (UIS) Available 

- Optimal efficiency and operation 

   - Low cost 

   - Simple gate drive circuitry 

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**----- Start of picture text -----**<br>
N-Channel MOSFET<br>**----- End of picture text -----**<br>


- Low figure-of-merit (FOM): Ron x Qg 

- Fast switching 

## **PRODUCT SUMMARY** 

|**PRODUCT SUMMARY**|**PRODUCT SUMMARY**|**PRODUCT SUMMARY**|
|---|---|---|
|VDS(V) at TJmax.|550||
|RDS(on)max. (Ω) at 25 °C|VGS= 10 V|3.2|
|Qgmax. (nC)|12||
|Qgs(nC)|2||
|Qgd(nC)|3||
|Configuration|Single||



- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 

## **APPLICATIONS** 

- Consumer electronics 

   - Displays (LCD or plasma TV) 

- Server and telecom power supplies 

   - SMPS 

- Industrial 

   - Welding 

   - Induction heating 

   - Motor drives 

- Battery chargers 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**|**ORDERING INFORMATION**|**ORDERING INFORMATION**|**ORDERING INFORMATION**|
|---|---|---|---|
|Package|DPAK (TO-252)|DPAK (TO-252)|DPAK (TO-252)|
|Lead (Pb)-free and halogen-free|SiHD3N50D-GE3|SiHD3N50DT1-GE3|SiHD3N50DT4-GE3|
||SiHD3N50DT5-GE3|SiHD3N50D-BE3|-|
|Lead (Pb)-free|SiHD3N50D-E3|-|-|



~~Ct~~ **ABSOLUTE MAXIMUM RATINGS** (TC = 25 °C, unless otherwise noted) ~~a~~ **PARAMETER SYMBOL LIMIT UNIT** Drain-source voltage VDS 500 Gate-source voltage ± 30 V VGS ~~———ee~~ Gate-source voltage AC (f > 1 Hz) ~~ee ee /~~ 30 TC = 25 °C 3.0 Continuous drain current (TJ = 150 °C) VGS at 10 V ID TC = 100 °C 1.9 A ~~rra~~ Pulsed drain current[ a] IDM 5.5 Linear derating factor 0.56 W/°C ~~**a**~~ Single pulse avalanche energy[b] EAS 10.4 mJ ~~a~~ Maximum power dissipation PD 69 W ~~a~~ Operating junction and storage temperature range TJ, Tstg -55 to +150 °C Drain-source voltage slope TJ = 125 °C 24 dV/dt V/ns Reverse diode dV/dt[d] 0.22 ~~a~~ Soldering recommendations (peak temperature)[c] For 10 s 300 °C **Notes** 

a. Repetitive rating; pulse width limited by maximum junction temperature 

b. VDD = 50 V, starting TJ = 25 °C, L = 2.3 mH, Rg = 25 Ω, IAS = 3 A 

- c. 1.6 mm from case 

d. ISD ≤ ID, starting TJ = 25 °C 

S21-0373-Rev. F, 19-Apr-2021 

Document Number: 91495 

**1** 

For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHD3N50D** 

www.vishay.com 

Vishay Siliconix 

|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|
|---|---|---|---|---|
|**PARAMETER**|**SYMBOL**|**TYP.**|**MAX.**|**UNIT**|
|Maximum junction-to-ambient|RthJA|-|62|°C/W|
|Maximum junction-to-case (drain)|RthJC|-|1.8||



|**SPECIFICATIONS**(TJ= 25 °C, unless otherwise noted)|**SPECIFICATIONS**(TJ= 25 °C, unless otherwise noted)|**SPECIFICATIONS**(TJ= 25 °C, unless otherwise noted)|**SPECIFICATIONS**(TJ= 25 °C, unless otherwise noted)|||||
|---|---|---|---|---|---|---|---|
|**PARAMETER**|**SYMBOL**|**TEST CONDITIONS**||**MIN.**|**TYP.**|**MAX.**|**UNIT**|
|**Static**||||||||
|Drain-source breakdown voltage|VDS|VGS= 0 V, ID= 250 μA||500|-|-|V|
|VDStemperature coefficient|ΔVDS/TJ|Reference to 25 °C, ID= 250 μA||-|0.56|-|V/°C|
|Gate-source threshold voltage (N)|VGS(th)|VDS= VGS, ID= 250 μA||3|-|5|V|
|Gate-source leakage|IGSS|VGS= ± 30 V||-|-|± 100|nA|
|Zero gate voltage drain current|IDSS|VDS= 500 V, VGS= 0 V||-|-|1|μA|
|||VDS= 400 V, VGS= 0 V, TJ= 125 °C||-|-|10||
|Drain-source on-state resistance|RDS(on)|VGS= 10 V|ID= 1.5 A|-|2.6|3.2|Ω|
|Forward transconductancea|gfs|VDS= 8 V, ID= 1.5 A||-|1|-|S|
|**Dynamic**||||||||
|Input capacitance|Ciss|VGS= 0 V,<br>VDS= 100 V,<br>f = 1 MHz||-|175|-|pF|
|Output capacitance|Coss|||-|21|-||
|Reverse transfer capacitance|Crss|||-|5|-||
|Effective output capacitance,<br>energy relatedb|Co(er)|VDS= 0 V to 400 V, VGS= 0 V||-|21|-||
|Effective output capacitance,<br>time relatedc|Co(tr)|||-|26|-||
|Totalgate charge|Qg|VGS= 10 V|ID= 1.5 A, VDS= 400 V|-|6|12|nC|
|Gate-source charge|Qgs|||-|2|-||
|Gate-drain charge|Qgd|||-|3|-||
|Turn-on delay time|td(on)|VDD= 400 V, ID= 1.5 A<br>Rg= 9.1Ω, VGS= 10 V||-|12|24|ns|
|Rise time|tr|||-|9|18||
|Turn-off delay time|td(off)|||-|11|22||
|Fall time|tf|||-|13|26||
|Gate input resistance|Rg|f = 1 MHz, open drain||-|3.3|-|Ω|
|**Drain-Source Body Diode Characteristics**||||||||
|Continuous source-drain diode current|IS|MOSFET symbol<br>showing the<br>integral reverse<br>P - N junction diode<br>S<br>D<br>G||-|-|3|A|
|Pulsed diode forward current|ISM|||-|-|12||
|Diode forward voltage|VSD|TJ= 25 °C, IS= 1.5 A, VGS= 0 V||-|-|1.2|V|
|Reverse recovery time|trr|TJ= 25 °C, IF= IS= 1.5 A,<br>dI/dt = 100 A/μs, VR= 20 V||-|293|-|ns|
|Reverse recovery charge|Qrr|||-|0.74|-|μC|
|Reverse recovery current|IRRM|||-|5|-|A|



## **Notes** 

a. Repetitive rating; pulse width limited by maximum junction temperature 

b. Coss(er) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 % to 80 % VDSS 

c. Coss(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 % to 80 % VDSS 

S21-0373-Rev. F, 19-Apr-2021 

Document Number: 91495 

**2** 

For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHD3N50D** 

Vishay Siliconix 

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www.vishay.com<br>**----- End of picture text -----**<br>


## **TYPICAL CHARACTERISTICS** (25 °C, unless otherwise noted) 

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6<br>TOP 15 V14 V TJ = 25 °C<br>5  13 V<br>12 V<br>11 V<br>10 V<br>4    9 V<br>3<br>8 V<br>2<br>7 V<br>1<br>6 V<br>0<br>0  5  10  15  20  25  30<br>VDS, Drain-to-Source Voltage (V)<br> Fig. 1 -  Typical Output Characteristics<br>4<br>TOP  15 V<br>14 V TJ = 150 °C<br>13 V<br>12 V<br>3 11 V<br>10 V<br>9.0 V<br>8.0 V<br>7.0 V<br>2 6.0 V<br>5.0 V<br>1<br>  0<br>0 5 10 15 20 25 30<br>VDS, Drain-to-Source Voltage (V)<br> Fig. 2 - Typical Output Characteristics<br>6<br>5<br>4<br>3<br>2<br>TJ = 150 °C<br>1<br>TJ = 25 °C<br>0<br>0 5 10 15 20 25<br>VGS, Gate-to-Source Voltage (V)<br>, Drain-to-Source Current (A)<br>ID<br>, Drain-to-Source Current (A)<br>ID<br>, Drain-to-Source Current (A)<br>ID<br>**----- End of picture text -----**<br>


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3<br>ID = 1.5 A<br>2.5<br>2<br>1.5<br>1 V GS  = 10 V<br>0.5<br>0<br>- 60 - 40 - 20 0 20 40 60 80 100 120 140 160<br>TJ, Junction Temperature (°C)<br> Fig. 4 -  Normalized On-Resistance vs. Temperature<br>1000<br>VGS = 0 V, f = 1 MHz<br>Ciss = Cgs + Cgd, Cds Shorted<br>Crss = Cgd<br>C iss C oss  = C ds  + C gd<br>100<br>C oss<br>10<br>Crss<br>1<br>0  100  200  300  400  500<br>VDS, Drain-to-Source Voltage (V)<br> Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage<br>24<br>VDS = 400 V<br>20 VDS = 250 V<br>VDS = 100 V<br>16<br>12<br>8<br>4<br>  0<br>  0 3  6  9  12<br>Qg, Total Gate Charge (nC)<br>, Drain-to-Source<br>DS(on)<br>R<br>On Resistance (Normalized)<br>Capacitance (pF)<br>, Gate-to-Source Voltage (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**Fig. 4 -  Normalized On-Resistance vs. Temperature** 

**Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage** 

**Fig. 3 - Typical Transfer Characteristics** 

**Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage** 

S21-0373-Rev. F, 19-Apr-2021 

Document Number: 91495 

**3** For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHD3N50D** 

www.vishay.com 

Vishay Siliconix 

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100<br>10 TJ = 150 °C<br>1<br>TJ = 25 °C<br>0.1<br>V GS  = 0 V<br>0.01<br>0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6<br>VSD, Source-Drain Voltage (V)<br>, Reverse Drain Current (A)<br>ISD<br>**----- End of picture text -----**<br>


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3.0<br>2.5<br>2.0<br>1.5<br>1.0<br>0.5<br>0<br>25 50 75 100 125 150<br>TJ, Case Temperature (°C)<br>, Drain Current (A)<br>ID<br>**----- End of picture text -----**<br>


**Fig. 7 - Typical Source-Drain Diode Forward Voltage** 

**Fig. 9 - Maximum Drain Current vs. Case Temperature** 

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100<br>Operation in this area<br>limited by RDS(on)<br>10<br>100  μs<br>1<br>1 ms<br>Limited by R DS(on) *<br>0.1 10 ms<br>TC = 25 °C<br>T J  = 150 °C<br>Single Pulse BVDSS Limited<br>0.01<br>1 10 100 1000<br>VDS, Drain-to-Source Voltage (V)<br>* VGS > minimum VGS at which RDS(on) is specified<br>, Drain Current (A)<br>ID<br>**----- End of picture text -----**<br>


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625<br>600<br>575<br>550<br>525<br>500<br>475<br>- 60 - 40 - 20 0 20 40 60 80 100 120 140 160<br>TJ, Junction Temperature (°C)<br>, Drain-to-Source<br>DS<br>V Breakdown Voltage (V)<br>**----- End of picture text -----**<br>


**Fig. 8 - Maximum Safe Operating Area** 

**Fig. 10 - Typical Drain-to-Source Voltage vs. Temperature** 

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1<br>Duty Cycle = 0.5<br>0.2<br>0.1<br>0.1 0.05<br>0.02<br>Single Pulse<br>0.01<br>0.0001 0.001 0.01 0.1 1<br>Pulse Time (s)<br>Thermal Impedance<br>Normalized Effective Transient<br>**----- End of picture text -----**<br>


**Fig. 11 - Normalized Thermal Transient Impedance, Junction-to-Case** 

S21-0373-Rev. F, 19-Apr-2021 

Document Number: 91495 

**4** For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHD3N50D** 

Vishay Siliconix 

www.vishay.com 

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**----- Start of picture text -----**<br>
RD<br>VDS<br>VGS<br>D.U.T.<br>RG +- VDD<br>10 V<br>Pulse width ≤ 1 µs<br>Duty factor ≤ 0.1 %<br> Fig. 12 - Switching Time Test Circuit<br>VDS<br>90 %<br>10 %<br>VGS<br>td(on) tr td(off) tf<br>**----- End of picture text -----**<br>


**Fig. 13 - Switching Time Waveforms** 

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QG<br>10 V<br>QGS QGD<br>VG<br>Charge<br>**----- End of picture text -----**<br>


**Fig. 16 -  Basic Gate Charge Waveform** 

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Current regulator<br>Same type as D.U.T.<br>50 kΩ<br>12 V 0.2 µF<br>0.3 µF<br>+<br>D.U.T. - VDS<br>VGS<br>3 mA<br>IG ID<br>Current sampling resistors<br>**----- End of picture text -----**<br>


**Fig. 17 - Gate Charge Test Circuit** 

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**----- Start of picture text -----**<br>
L<br>VDS<br>Vary tp to obtain<br>required IAS<br>RG D.U.T +<br>- [V][DD]<br>IAS<br>10 V<br>tp 0.01 Ω<br>**----- End of picture text -----**<br>


**Fig. 14 - Unclamped Inductive Test Circuit** 

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VDS<br>t<br>p<br>VDD<br>VDS<br>IAS<br>**----- End of picture text -----**<br>


**Fig. 15 - Unclamped Inductive Waveforms** 

S21-0373-Rev. F, 19-Apr-2021 

Document Number: 91495 

**5** For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiHD3N50D** 

Vishay Siliconix 

**==> picture [77 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
www.vishay.com<br>**----- End of picture text -----**<br>


## **Peak Diode Recovery dV/dt Test Circuit** 

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+ Circuit layout considerations<br>D.U.T.<br>•  Low stray inductance<br>•  Ground plane<br>•  Low leakage inductance<br>current transformer<br>-<br>+<br>- - +<br>Rg •  dV/dt controlled by Rg +<br>••   Driver same type as D.U.T.ISD controlled by duty factor “D” - VDD<br>•  D.U.T. - device under test<br>Driver gate drive<br>Period D = P.W.<br>P.W. Period<br>VGS = 10 V [a]<br>D.U.T. lSD waveform<br>Reverse<br>recovery Body diode forward<br>current current dI/dt<br>D.U.T. VDS waveform Diode recovery<br>dV/dt<br>VDD<br>Re-applied<br>voltage<br>Body diode forward drop<br>Inductor current<br>Ripple ≤ 5 % ISD<br>Note<br>a. VGS = 5 V for logic level devices<br>**----- End of picture text -----**<br>


**Fig. 18 - For N-Channel** 

_Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91495._ 

Document Number: 91495 

S21-0373-Rev. F, 19-Apr-2021 

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For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Package Information** 

Vishay Siliconix 

**==> picture [59 x 48] intentionally omitted <==**

www.vishay.com 

## **TO-252AA Case Outline** 

## **VERSION 1: FACILITY CODE = Y** 

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E A<br>C2<br>b3<br>E1<br>b b2 C<br>e<br>A1<br>e1<br>L3<br>D1<br>D<br>H<br>L4<br>L5 L<br>gage plane height (0.5 mm)<br>**----- End of picture text -----**<br>


|b|b2<br>e1<br>gage plane height (0.5 mm)<br>e|b2<br>e1<br>gage plane height (0.5 mm)<br>e|
|---|---|---|
||**MILLIMETERS**||
|**DIM.**|**MIN.**|**MAX.**|
|A|2.18|2.38|
|A1|-|0.127|
|b|0.64|0.88|
|b2|0.76|1.14|
|b3|4.95|5.46|
|C|0.46|0.61|
|C2|0.46|0.89|
|D|5.97|6.22|
|D1|4.10|-|
|E|6.35|6.73|
|E1|4.32|-|
|H|9.40|10.41|
|e|2.28 BSC||
|e1|4.56 BSC||
|L|1.40|1.78|
|L3|0.89|1.27|
|L4|-|1.02|
|L5|1.01|1.52|



## **Note** 

- Dimension L3 is for reference only 

Revision: 16-Dec-2019 

Document Number: 71197 

**1** For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Package Information** 

Vishay Siliconix 

**==> picture [59 x 48] intentionally omitted <==**

www.vishay.com 

## **VERSION 2: FACILITY CODE = N** 

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**----- Start of picture text -----**<br>
e<br>E A<br>b3<br>E1<br>e c2 E1/2<br>2x b2<br>2x e 3x b 0.25 C A B DETAIL "B" (b)<br>H<br>C<br>b1<br>GAUGE<br>PLANE SEATING DETAIL "B"<br>C C<br>L PLANE<br>(L1)<br>(3°) (3°)<br>θ<br>θ<br>L3 D1<br>D<br>H<br>L6<br>L5<br>L4<br>c<br>c1<br>L2 A1<br>θ<br>**----- End of picture text -----**<br>


||**MILLIMETERS**|**MILLIMETERS**|
|---|---|---|
|**DIM.**|**MIN.**|**MAX.**|
|A|2.18|2.39|
|A1|-|0.13|
|b|0.65|0.89|
|b1|0.64|0.79|
|b2|0.76|1.13|
|b3|4.95|5.46|
|c|0.46|0.61|
|c1|0.41|0.56|
|c2|0.46|0.60|
|D|5.97|6.22|
|D1|5.21|-|
|E|6.35|6.73|
|E1|4.32|-|
|e|2.29 BSC||
|H|9.94|10.34|



||**MILLIMETERS**|**MILLIMETERS**|
|---|---|---|
|**DIM.**|**MIN.**|**MAX.**|
|L|1.50|1.78|
|L1|2.74 ref.||
|L2|0.51 BSC||
|L3|0.89|1.27|
|L4|-|1.02|
|L5|1.14|1.49|
|L6|0.65|0.85|
||0°|10°|
|1|0°|15°|
|2|25°|35°|



## **Notes** 

- Dimensioning and tolerance confirm to ASME Y14.5M-1994 

- All dimensions are in millimeters. Angles are in degrees 

- Heat sink side flash is max. 0.8 mm 

- Radius on terminal is optional 

ECN: E19-0649-Rev. Q, 16-Dec-2019 DWG: 5347 

Revision: 16-Dec-2019 

Document Number: 71197 

**2** 

For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Application Note 826** 

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## Vishay Siliconix 

## **RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)** 

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**----- Start of picture text -----**<br>
0.224<br>(5.690)<br>0.180 0.055<br>(4.572) (1.397)<br>0.243 (6.180)<br>0.420<br>(10.668)<br>0.087 (2.202)<br>0.090 (2.286)<br>**----- End of picture text -----**<br>


Recommended Minimum Pads Dimensions in Inches/(mm) 

> Return to Index Return to Index 

Document Number: 72594 Revision: 21-Jan-08 

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## **Disclaimer** 

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product.  To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. 

Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications.  Such statements are not binding statements about the suitability of products for a particular application.  It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time.  All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts.  Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. 

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. 

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.  Product names and markings noted herein may be trademarks of their respective owners. 

_**© 2021 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED**_ 

Revision: 01-Jan-2021 

Document Number: 91000 

**1** 



## Links

- [View this product on Novapart](https://novapart.co/products/SIHD3N50D-GE3/power-mosfet-n-channel-500-v-3-a-32-ohm-to-252)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/vishay/sihd3n50d-ge3/mosfet-n-ch-500v-3a-dpak/dp/2283607)
---

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