# Power MOSFET, N Channel, 60 V, 227 A, 1740 µohm, PowerPAK SO-DC, Surface Mount

![Product image](https://novapart.co/image/farnell:4014707RL/)

**URL**: https://novapart.co/products/SIDR626EP-T1-RE3/power-mosfet-n-channel-60-v-227-a-1740-ohm
**SKU**: SIDR626EP-T1-RE3
**Manufacturer**: VISHAY
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.3400
**Stock**: 50+
**Lead Time**: 2 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (21-Jan-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | TrenchFET Gen IV Series |
| Qualification | - |
| Power Dissipation | 150W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | PowerPAK SO-DC |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 227A |
| Drain Source On State Resistance | 1740µohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4014707RL/)

**SiDR626EP** 

Vishay Siliconix 

www.vishay.com 

## **N-Channel 60 V (D-S) 175 °C MOSFET** 

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PowerPAK [®]  SO-8DC<br>D<br>D D6 D7 8<br>5<br>S<br>1<br>1 4 S3 S2 S<br>G<br>Top View Bottom View<br>5.15 mm<br>6.15 mm<br>**----- End of picture text -----**<br>


## **PRODUCT SUMMARY** 

|**PRODUCT SUMMARY**|**PRODUCT SUMMARY**|
|---|---|
|VDS (V)|60|
|RDS(on)max.(Ω)at VGS= 10 V|0.00174|
|RDS(on)max.(Ω)at VGS= 7.5 V|0.0021|
|Qgtyp.(nC)|51|
|ID (A) a|227|
|Configuration|Single|



## **FEATURES** 

- TrenchFET[®] Gen IV power MOSFET 

- Very low RDS - Qg figure of merit (FOM) 

- Tuned for the lowest RDS - Qoss FOM 

- 100 % Rg and UIS tested 

- Top side cooling feature provides additional venue for thermal transfer 

- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 

## **APPLICATIONS** 

- D 

- • Synchronous rectification • Primary side switch • DC/DC converter • Solar micro inverter G • Motor drive switch N-Channel MOSFET 

- • Battery and load switch S 

- Industrial 

## **ORDERING INFORMATION** 

Package PowerPAK[®] SO-8DC Lead (Pb)-free and halogen-free SIDR626EP-T1-RE3 

~~Ce~~ **ABSOLUTE MAXIMUM RATINGS** (TA = 25 °C, unless otherwise noted) ~~|~~ **PARAMETER SYMBOL LIMIT UNIT** Drain-source voltage VDS 60 V Gate-source voltage VGS ± 20 ~~sp yt~~ TC = 25 °C 227 TC = 70 °C 190 Continuous drain current (TJ = 150 °C) ~~|~~ ID ~~PO~~ TA = 25 °C 50.8[b, c] ~~| Po i|~~ TA = 70 °C ~~PO~~ 42.5[b, c] A ~~|~~ Pulsed drain current (t = 100 μs) IDM 400 TC = 25 °C 136 Continuous source-drain diode current IS TA = 25 °C 6.8[b, c] Single pulse avalanche current IAS 50 ~~SS~~ L = 0.1 mH Single pulse avalanche energy EAS 125 mJ ~~ee A eee ee~~ TC = 25 °C 150 TC = 70 °C 105 Maximum power dissipation PD W TA = 25 °C 7.5[b, c] ~~| PO Ze~~ TA = 70 °C 5.25[b, c] ~~ee~~ Operating junction and storage temperature range TJ, Tstg -55 to +175 °C Soldering recommendations (peak temperature)[d, e] 260 ~~tp yt~~ **Notes** 

a. TC = 25 °C 

b. Surface mounted on 1" x 1" FR4 board 

c. t = 10 s 

- d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8DC is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection 

- e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components 

S22-0215-Rev. A, 28-Feb-2022 

Document Number: 62063 

**1** 

For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiDR626EP** 

www.vishay.com 

Vishay Siliconix 

|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**||||
|---|---|---|---|---|---|
|**PARAMETER**||**SYMBOL**|**TYPICAL**|**MAXIMUM**|**UNIT**|
|Maximumjunction to ambienta|t≤10 s|RthJA|15|20|°C/W|
|Maximumjunction to case(drain)|Steadystate|RthJC|0.8|1||
|Maximumjunction to case(source)|Steadystate|RthJC|1.1|1.4||



## **Notes** 

a. Surface mounted on 1" x 1" FR4 board 

|**SPECIFICATIONS**(TJ= 25 °C,unless otherwise noted)|**SPECIFICATIONS**(TJ= 25 °C,unless otherwise noted)|**SPECIFICATIONS**(TJ= 25 °C,unless otherwise noted)|||||
|---|---|---|---|---|---|---|
|**PARAMETER**|**SYMBOL**|**TEST CONDITIONS**|**MIN.**|**TYP.**|**MAX.**|**UNIT**|
|**Static**|||||||
|Drain-source breakdown voltage|VDS|VGS= 0 V, ID= 250μA|60|-|-|V|
|VDStemperature coefficient|ΔVDS/TJ|ID= 10 mA|-|33|-|mV/°C|
|VGS(th) temperature coefficient|ΔVGS(th)/TJ|ID= 250μA|-|-8.8|-||
|Gate-source threshold voltage|VGS(th)|VDS= VGS, ID= 250μA|2|-|4|V|
|Gate-source leakage|IGSS|VDS= 0 V, VGS= ± 20 V|-|-|100|nA|
|Zero gate voltage drain current|IDSS|VDS= 60 V, VGS= 0 V|-|-|1|μA|
|||VDS= 60 V, VGS= 0 V, TJ= 70 °C|-|-|15||
|Drain-source on-state resistancea|RDS(on)|VGS= 10 V, ID= 20 A|-|0.00145|0.00174|Ω|
|||VGS= 7.5 V, ID= 20 A|-|0.00175|0.0021||
|Forward transconductancea|gfs|VDS= 15 V, ID= 20 A|-|78|-|S|
|**Dynamicb**|||||||
|Input capacitance|Ciss|VDS= 30 V, VGS= 0 V, f = 1 MHz|-|5130|-|pF|
|Output capacitance|Coss||-|1190|-||
|Reverse transfer capacitance|Crss||-|39|-||
|Total gate charge|Qg|VDS= 30 V, VGS= 10 V, ID= 20 A|-|68|102|nC|
|||VDS= 30 V, VGS= 7.5 V, ID= 20 A|-|51|77||
|Gate-source charge|Qgs||-|25|-||
|Gate-drain charge|Qgd||-|7.4|-||
|Output charge|Qoss|VDS= 30 V, VGS= 0 V|-|71|-||
|Gate resistance|Rg|f = 1 MHz|0.2|0.62|1.1|Ω|
|Turn-on delaytime|td(on)|VDD= 30 V, RL= 1.5Ω, ID ≅20 A,<br>VGEN= 10 V, Rg= 1Ω|-|20|40|ns|
|Rise time|tr||-|10|20||
|Turn-off delaytime|td(off)||-|35|70||
|Fall time|tf||-|7|14||
|Turn-on delaytime|td(on)|VDD= 30 V, RL= 1.5Ω, ID ≅20 A,<br>VGEN= 7.5 V, Rg= 1Ω|-|24|48||
|Rise time|tr||-|25|50||
|Turn-off delaytime|td(off)||-|30|60||
|Fall time|tf||-|10|20||
|**Drain-Source Body Diode Characteristics**|||||||
|Continuous source-drain diode current|IS|TC= 25 °C|-|-|136|A|
|Pulse diode forward current|ISM||-|-|400||
|Bodydiode voltage|VSD|IS= 5 A, VGS= 0 V|-|0.74|1.1|V|
|Bodydiode reverse recoverytime|trr|IF= 20 A, di/dt = 100 A/μs,<br>TJ= 25 °C|-|45|90|ns|
|Bodydiode reverse recoverycharge|Qrr||-|45|90|nC|
|Reverse recoveryfall time|ta||-|21|-|ns|
|Reverse recoveryrise time|tb||-|24|-||



## **Notes** 

a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 % 

b. Guaranteed by design, not subject to production testing 

_Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability._ 

S22-0215-Rev. A, 28-Feb-2022 

**2** 

Document Number: 62063 

For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiDR626EP** 

Vishay Siliconix 

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## **TYPICAL CHARACTERISTICS** (25 °C, unless otherwise noted) 

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200 10000<br>VGS = 10 V thru 6 V<br>160<br>VGS = 5 V<br>1000<br>120<br>80<br>100<br>40<br>VGS = 4 V thru 0 V<br>0 10<br>0 1 2 3 4 5<br>VDS - Drain-to-Source Voltage (V)<br>Output Characteristics<br>Axis Title<br>0.0022 10000<br>0.0020<br>VGS = 7.5 V 1000<br>0.0018<br>0.0016<br>VGS = 10 V 100<br>0.0014<br>0.0012 10<br>0 20 40 60 80 100<br>ID - Drain Current (A)<br>2nd line<br> - Drain Current (A)<br>ID<br>)<br>2nd line<br> - On-Resistance (<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


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On-Resistance vs. Drain Current and Gate Voltage<br>**----- End of picture text -----**<br>


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10<br>ID = 20 A<br>8<br>6<br>VDS = 20 V, 30 V, 40 V<br>4<br>2<br>0<br>0 14 28 42 56 70<br>Qg - Total Gate Charge (nC)<br>Gate Charge<br> - Gate-to-Source Voltage (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


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200 10000<br>160<br>1000<br>120<br>80<br>TC = 25 °C 100<br>40<br>TC = 125 °C TC = -55 °C<br>0 10<br>0 1.6 3.2 4.8 6.4 8<br>VGS - Gate-to-Source Voltage (V)<br>Transfer Characteristics<br>Axis Title<br> 10 000 10000<br>C iss<br>1000<br>C oss 1000<br>100<br>100<br>10 Crss<br>1 10<br>0 12 24 36 48 60<br>VDS - Drain-to-Source Voltage (V)<br>Capacitance<br>Axis Title<br>2.4 10000<br>2.0 V GS = 10 V, 20 A<br>1000<br>1.6<br>1.2 V GS = 7.5 V, 20 A<br>100<br>0.8<br>0.4 10<br>-50 -25 0 25 50 75 100 125 150 175<br>TJ - Junction Temperature (°C)<br>On-Resistance vs. Junction Temperature<br> - Drain Current (A)<br>ID<br>C - Capacitance (pF)<br> - On-Resistance (Normalized)<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


S22-0215-Rev. A, 28-Feb-2022 

Document Number: 62063 

**3** 

For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiDR626EP** 

Vishay Siliconix 

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## **TYPICAL CHARACTERISTICS** (25 °C, unless otherwise noted) 

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100<br>10<br>1 TJ = 150 °C T J = 25 °C<br>0.1<br>0.01<br>0 0.2 0.4 0.6 0.8 1.0 1.2<br>VSD - Source-to-Drain Voltage (V)<br>Source-Drain Diode Forward Voltage<br>Axis Title<br>0.010<br>ID = 20 A<br>0.008<br>0.006<br>TJ = 125 °C<br>0.004<br>0.002<br>TJ = 25 °C<br>0<br>0 2 4 6 8 10<br>VGS - Gate-to-Source Voltage (V)<br> - Source Current (A)<br>IS<br>)<br> - On-Resistance (<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


**On-Resistance vs. Gate-to-Source Voltage** 

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0.60 10000<br>0.20<br>-0.20 1000<br>-0.60 ID = 5 mA<br>-1.00 100<br>ID = 250 µA<br>-1.40<br>-1.80 10<br>-50 -25 0 25 50 75 100 125 150 175<br>TJ - Junction Temperature (°C)<br>Threshold Voltage<br>Axis Title<br>500 10000<br>400<br>1000<br>300<br>200<br>100<br>100<br>0 10<br>0.001 0.01 0.1 1 10<br>t - Time (s)<br> - Variance (V)<br>GS(th)<br>V<br>P - Power (W)<br>**----- End of picture text -----**<br>


**Single Pulse Power, Junction-to-Ambient** 

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1000 10000<br>IDM limited<br>100<br>ID limited<br>1 00 µs<br>1000<br>1 ms<br>10<br>Limited by RDS(on) a 1 0 ms<br>1<br>1 00 ms<br>100<br>1 s<br>0.1 10 s<br>T A  = 25 °C, DC<br>single pulse BVDSS limited<br>0.01 10<br>0.01 0.1 1 10 100<br>VDS - Drain-to-Source Voltage (V)<br>Safe Operating Area, Junction-to-Ambient<br> - Drain Current (A)<br>ID<br>**----- End of picture text -----**<br>


## **Note** 

a.   VGS > minimum VGS at which RDS(on) is specified 

S22-0215-Rev. A, 28-Feb-2022 

Document Number: 62063 

**4** 

For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiDR626EP** 

Vishay Siliconix 

www.vishay.com 

## **TYPICAL CHARACTERISTICS** (25 °C, unless otherwise noted) 

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250<br>200<br>150<br>100<br>50<br>0<br>0 25 50 75 100 125 150 175<br>TC - Case Temperature (°C)<br>Current Derating  [a]<br> - Drain Current (A)<br>ID<br>**----- End of picture text -----**<br>


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175 10000 3.5 10000<br>140 2.8<br>1000 1000<br>105 2.1<br>70 1.4<br>100 100<br>35 0.7<br>0 10 0 10<br>0 25 50 75 100 125 150 175 0 25 50 75 100 125 150 175<br>TC - Case Temperature (°C) TA - Ambient Temperature (°C)<br>Power, Junction-to-Case Power, Junction-to-Ambient<br>1st line 2nd line 2nd line<br>P - Power (W) P - Power (W)<br>**----- End of picture text -----**<br>


## **Note** 

a. The power dissipation PD is based on TJ max. = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit 

S22-0215-Rev. A, 28-Feb-2022 

Document Number: 62063 

**5** For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**SiDR626EP** 

Vishay Siliconix 

**==> picture [77 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
www.vishay.com<br>**----- End of picture text -----**<br>


## **TYPICAL CHARACTERISTICS** (25 °C, unless otherwise noted) 

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1 10000<br>Duty cycle = 0.5<br>0.2 Notes 1000<br>0.1 0.1 PDM<br>0.050.02 1. Duty 2. Per unit base = R cycle, D = t 1 t2 tt12thJA = 54 °C/W 100<br>Single pulse 3. T JM - T A = P DM Z thJA (t)<br>4. Surface mounted<br>0.01 10<br>0.0001 0.001 0.01 0.1 1 10 100 1000<br>Square Wave Pulse Duration (s)<br>Normalized Thermal Transient Impedance, Junction-to-Ambient<br>Axis Title<br>1 10000<br>Duty cycle = 0.5<br>0.2<br>0.1 1000<br>0.05<br>0.02<br>0.1<br>Single pulse<br>100<br>0.01 10<br>0.0001 0.001 0.01 0.1 1<br>Square Wave Pulse Duration (s)<br>Thermal Impedance<br>Normalized Effective Transient<br>Thermal Impedance<br>Normalized Effective Transient<br>**----- End of picture text -----**<br>


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Normalized Thermal Transient Impedance, Junction-to-Case<br>**----- End of picture text -----**<br>


_Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package / tape drawings, part marking, and reliability data, see www.vishay.com/ppg?62063._ 

S22-0215-Rev. A, 28-Feb-2022 

Document Number: 62063 

**6** 

For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Package Information** 

www.vishay.com 

## Vishay Siliconix 

## **PowerPAK[®] SO-8 Double Cooling Case Outline** 

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D<br>M4 M1 M4 K1 D1 K1<br>8 7 6 5 5 6 7 8<br>e<br>M2 M3<br>1 2 3 4 4 3 2 1<br>b<br>Back side view<br>T5<br>H<br>T2<br>E1<br>T1<br>E<br>E2<br>T3<br>K<br>L<br>T4<br>A<br>A1 c<br>**----- End of picture text -----**<br>


|**DIM.**|**MILLIMETERS**|**MILLIMETERS**|**MILLIMETERS**|**INCHES**|**INCHES**|**INCHES**|
|---|---|---|---|---|---|---|
||**MIN.**|**NOM.**|**MAX.**|**MIN.**|**NOM.**|**MAX.**|
|A|0.51|0.56|0.61|0.020|0.022|0.024|
|A1|0.00|0.02|0.05|0.000|0.001|0.002|
|b|0.36|0.41|0.46|0.014|0.016|0.018|
|c|0.15|0.20|0.25|0.006|0.008|0.010|
|D|4.90|5.00|5.10|0.193|0.197|0.201|
|D1|3.71|3.76|3.81|0.146|0.148|0.150|
|e|1.27 BSC|||0.050 BSC|||
|E|5.90|6.00|6.10|0.232|0.236|0.240|
|E1|3.60|3.65|3.70|0.142|0.144|0.146|
|E2|0.46 typ.|||0.018 typ.|||
|H|0.49|0.54|0.59|0.019|0.021|0.023|
|K|1.22|1.27|1.32|0.048|0.050|0.052|
|K1|0.64 typ.|||0.025 typ.|||
|L|0.49|0.54|0.59|0.019|0.021|0.023|
|M1|3.8|3.90|4.00|0.150|0.154|0.158|
|M2|2.69|2.79|2.89|0.106|0.110|0.114|
|M3|1.01|1.11|1.21|0.040|0.044|0.048|
|M4|0.56 typ.|||0.022 typ.|||
|N|8|||8|||
|T1|4.46|4.56|4.66|0.176|0.180|0.184|
|T2|2.53|2.63|2.73|0.100|0.104|0.108|
|T3|1.83|1.93|2.03|0.072|0.076|0.080|
|T4|0.97 typ.|||0.038 typ.|||
|T5|0.48 typ.|||0.019 typ.|||
|ECN: T24-0304-Rev. C, 29-Jul-2024<br>DWG: 6048|||||||



ECN: T24-0304-Rev. C, 29-Jul-2024 DWG: 6048 

Revison: 29-Jul-2024 **1** For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

Document Number: 75846 

**Application Note 826** 

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## Vishay Siliconix 

## **RECOMMENDED MINIMUM PADS FOR PowerPAK[®] SO-8 Single** 

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**----- Start of picture text -----**<br>
0.260<br>(6.61)<br>0.150<br>(3.81)<br>0.024<br>(0.61)<br>0.026<br>(0.66)<br>0.050 0.032 0.040<br>(1.27) (0.82) (1.02)<br>0.154 (3.91) 0.174 (4.42)<br>0.050 (1.27)<br>**----- End of picture text -----**<br>


Recommended Minimum Pads Dimensions in Inches/(mm) Return to Index 

Return to Index 

Document Number: 72599 Revision: 21-Jan-08 

www.vishay.com 15 

**Legal Disclaimer Notice** Vishay 

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## **Disclaimer** 

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 

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Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. 

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Document Number: 91000 

_**© 2025 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED**_ 

Revision: 01-Jan-2025 

**1** 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 



## Links

- [View this product on Novapart](https://novapart.co/products/SIDR626EP-T1-RE3/power-mosfet-n-channel-60-v-227-a-1740-ohm)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/vishay/sidr626ep-t1-re3/mosfet-n-ch-60v-227a-powerpak/dp/4014707RL)
---

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