# Dual MOSFET, Complementary N and P Channel, 30 V, 3.5 A, 0.07 ohm, SOP, Surface Mount

![Product image](https://novapart.co/image/farnell:2706782RL/)

**URL**: https://novapart.co/products/SH8M11GZETB/dual-mosfet-complementary-n-and-p-channel-30-v-35
**SKU**: SH8M11GZETB
**Manufacturer**: ROHM
**Category**: Semiconductors - Discretes || FETs || Dual MOSFETs
**Price**: €0.2090
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Channel Type | Complementary N and P Channel |
| Power Dissipation N Channel | 2W |
| Power Dissipation P Channel | 2W |
| Drain Source Voltage Vds N Channel | 30V |
| Drain Source Voltage Vds P Channel | 30V |
| Continuous Drain Current Id N Channel | 3.5A |
| Continuous Drain Current Id P Channel | 3.5A |
| Drain Source On State Resistance N Channel | 0.07ohm |
| Drain Source On State Resistance P Channel | 0.07ohm |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2706782RL/)

## 4V Drive Nch + Pch MOSFET 

## **SH8M11** 

##  **Structure** 

Silicon N-channel MOSFET/ Silicon P-channel MOSFET 

##  **Features** 

- 1) Low on-resistance. 

- 2) High power package(SOP8). 

- 3) Low voltage drive(4V drive). 

 **Dimensions** (Unit : mm) 

**==> picture [101 x 77] intentionally omitted <==**

**----- Start of picture text -----**<br>
SOP8<br>5.0<br>+404 1.75<br>(8) (5)<br>(1) (4)<br>ee, [<br>**----- End of picture text -----**<br>


##  **Application** 

Switching 

##  **Packaging specifications** 

|Type|Package|Taping|
|---|---|---|
||Code|TB|
||Basic orderingunit(pieces)|2500|
|SH8M11|||



 **Absolute maximum ratings** (Ta = 25C) 

|**Absolute maximum ratingsgss **(Ta = 25C)Ta = 25C)C)C)|**Absolute maximum ratingsgss **(Ta = 25C)Ta = 25C)C)C)|(Ta = 25C)Ta = 25C)C)C))||||
|---|---|---|---|---|---|
|Parameter||Symbol<br>~~eee~~|Limits<br>~~pO~~<br>~~eee~~||Unit|
||||Tr1 : N-ch <br>~~eee~~|Tr2 : P-ch<br>~~eee~~||
|Drain-source voltage||VDSS<br>~~eee~~<br>~~a~~<br>~~a~~|30<br>~~eee~~<br>~~ee~~<br>~~ee~~|30<br>~~eee~~|V|
|Gate-source voltage||VGSS<br>~~a~~<br>~~a~~<br>~~ee~~|20<br>~~ee~~<br>~~ee~~<br>~~ee~~|20<br>~~ee~~|V<br>~~ee~~|
|Drain current|Continuous<br>~~ee~~|ID<br>~~a~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|3.5<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|3.5<br>~~ee~~<br>~~ee~~<br>~~ee~~|A<br>~~ee~~<br>~~ee~~|
||Pulsed<br>~~ee~~|IDP<br>*1<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|14<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|12<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|A<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|Source current<br>(Body Diode)|Continuous<br>~~ee~~|Is<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|1.6<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|1.6<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|A<br>~~ee~~<br>~~ee~~<br>~~ee~~|
||Pulsed<br>~~es~~|Isp<br>*1<br>~~ee~~<br>~~es~~<br>~~ee~~|14<br>~~ee~~<br>~~es~~<br>~~ee~~|12<br>~~ee~~<br>~~es~~<br>~~ee~~|A<br>~~ee~~<br>~~ee~~|
|Power dissipation||PD<br>*2<br>~~ee~~|2.0<br>~~ee~~<br>~~ee~~<br>~~po~~||W / TOTAL<br>~~ee~~|
||||1.4<br>~~po~~||W / ELEMENT|
|Channel temperature||Tch<br>~~a~~|150||C|
|Range of storage temperature||Tstg<br>~~a~~|55 to +150||C|



##  **Inner circuit** 

**==> picture [134 x 102] intentionally omitted <==**

**----- Start of picture text -----**<br>
(8) (7) (6) (5)<br>∗ 2 ∗ 2<br>(1) Tr1 Source<br>(2) Tr1 Gate<br>(3) Tr2 Source ∗ 1 ∗ 1<br>(4) Tr2 Gate<br>(5) Tr2 Drain (1) (2) (3) (4)<br>(6) Tr2 Drain<br>(7) Tr1 Drain ∗1 ESD PROTECTION DIODE<br>(8) Tr1 Drain ∗2 BODY DIODE<br>**----- End of picture text -----**<br>


*1 Pw10s, Duty cycle1% 

- *2 Mounted on a ceramic board. 

www.rohm.com © 2011  ROHM Co., Ltd. All rights reserved. 

**2011.10 -  Rev.A** 

1/10 

Data Sheet 

**SH8M11** 

##  **Electrical characteristics** (Ta = 25C) 

<Tr1(Nch)> 

|**Electrical characteristics**(Ta<br><Tr1(Nch)>|= 25C)||||||
|---|---|---|---|---|---|---|
|Parameter|Symbol|Min.|Typ.|Max.|Unit|Conditions|
|Gate-source leakage|IGSS|-|-|10|A|VGS=±20V, VDS=0V|
|Drain-source breakdown voltage|V(BR)DSS|30|-|-|V|ID=1mA, VGS=0V|
|Zerogate voltage drain current|IDSS|-|-|1|A|VDS=30V, VGS=0V|
|Gate threshold voltage|VGS(th)|1.0|-|2.5|V|VDS=10V, ID=1mA|
|Static drain-source on-state<br>resistance|RDS (on)<br>*|-|70|98|m|ID=3.5A, VGS=10V|
|||-|90|126||ID=3.5A, VGS=4.5V|
||||100|140||ID=3.5A, VGS=4V|
|Forward transfer admittance|l Yfsl<br>*|1.5|-|-|S|VDS=10V, ID=3.5A|
|Input capacitance|Ciss|-|85|-|pF|VDS=10V<br>VGS=0V<br>f=1MHz|
|Output capacitance|Coss|-|40|-|pF||
|Reverse transfer capacitance|Crss|-|20|-|pF||
|Turn-on delaytime|td(on)<br>*|-|4|-|ns|ID=1.7A, VDD 15V<br>VGS=10V<br>RL=8.8<br>RG=10|
|Rise time|tr<br>*|-|8|-|ns||
|Turn-off delaytime|td(off)<br>*|-|18|-|ns||
|Fall time|tf<br>*|-|3|-|ns||
|Totalgate charge|Qg<br>*|-|1.9|-|nC|ID=3.5A, VD~~D  ~~15V<br>VGS=5V|
|Gate-source charge|Qgs<br>*|-|0.8|-|nC||
|Gate-drain charge|Qgd<br>*|-|0.4|-|nC||



*Pulsed 

##  **Body diode characteristics** (Source-Drain) (Ta = 25C) 

|Parameter|Symbol|Min.|Typ.|Max.|Unit|Conditions|
|---|---|---|---|---|---|---|
|Forward Voltage|VSD<br>*|-|-|1.2|V|Is=3.5A, VGS=0V|



*Pulsed 

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**2011.10 -  Rev.A** 

2/10 

Data Sheet 

**SH8M11** 

##  **Electrical characteristics** (Ta = 25C) 

<Tr2(Pch)> 

|**Electrical characteristics**(Ta<br><Tr2(Pch)>|= 25C)||||||
|---|---|---|---|---|---|---|
|Parameter|Symbol|Min.|Typ.|Max.|Unit|Conditions|
|Gate-source leakage|IGSS|-|-|10|A|VGS=20V, VDS=0V|
|Drain-source breakdown voltage|V(BR)DSS|30|-|-|V|ID=1mA, VGS=0V|
|Zerogate voltage drain current|IDSS||-|1|A|VDS=30V, VGS=0V|
|Gate threshold voltage|VGS(th)|1.0|-|2.5|V|VDS=10V, ID=1mA|
|Static drain-source on-state<br>resistance|RDS (on)<br>*|-|70|98|m|ID=3.5A, VGS=10V|
|||-|100|140||ID=1.7A, VGS=4.5V|
|||-|110|155||ID=1.7A, VGS=4.0V|
|Forward transfer admittance|l Yfsl<br>*|2.5|-|-|S|VDS=10V, ID=3.5A|
|Input capacitance|Ciss|-|410|-|pF|VDS=10V<br>VGS=0V<br>f=1MHz|
|Output capacitance|Coss|-|55|-|pF||
|Reverse transfer capacitance|Crss|-|55|-|pF||
|Turn-on delaytime|td(on)<br>*****|-|9|-|ns|ID=1.7A, VDD  15V<br>VGS=10V<br>RL=8.8<br>RG=10|
|Rise time|tr<br>*****|-|18|-|ns||
|Turn-off delaytime|td(off)<br>*****|-|35|-|ns||
|Fall time|tf<br>*****|-|12|-|ns||
|Totalgate charge|Qg<br>*****|-|4.2|-|nC|ID=3.5A, VDD  15V<br>VGS=5V|
|Gate-source charge|Qgs<br>*****|-|1.7|-|nC||
|Gate-drain charge|Qgd<br>*****|-|1.1|-|nC||



*Pulsed 

##  **Body diode characteristics** (Source-Drain) (Ta = 25C) 

|Parameter|Symbol|Min.|Typ.|Max.|Unit|Conditions|
|---|---|---|---|---|---|---|
|Forward Voltage|VSD<br>*|-|-|1.2|V|Is=3.5A, VGS=0V|



*Pulsed 

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**2011.10 -  Rev.A** 

3/10 

Data Sheet 

**SH8M11** 

 **Electrical characteristic curves** (Ta=25C) 〈Tr.1(Nch)〉 

**==> picture [417 x 587] intentionally omitted <==**

**----- Start of picture text -----**<br>
Fig.1 Typical Output Characteristics(Ⅰ)  Fig.2 Typical Output Characteristics(Ⅱ)<br>3.5 3.5<br>Ta=25°C<br>3 Pulsed  3 VGS= 2.8V  Ta=25°C<br>2.5 VVVGSGSGS= 10V = 4.5V = 4.0V  2.5 VVVGSGSGS= 10V = 4.5V = 4.0V  Pulsed<br>2 2<br>1.5 VGS= 2.8V  1.5 VGS= 2.5V<br>1 1<br>0.5 VGS= 2.5V  0.5<br>0 0<br>0 0.2 0.4 0.6 0.8 1 0 2 4 6 8 10<br>DRAIN-SOURCE VOLTAGE : VDS[V]  DRAIN-SOURCE VOLTAGE : VDS[V]<br>Fig.4  Static Drain-Source On-State<br>Fig.3  Typical Transfer Characteristics             Resistance vs. Drain Current(Ⅰ)<br>10 1000<br>VDS= 10V  Ta=25°C<br>Pulsed<br>Pulsed<br>VGS= 4.0V<br>1 Ta=125°C VGS= 4.5V<br>Ta=75°C VGS= 10V<br>Ta=25°C<br>Ta=-25°C<br>0.1 100<br>.<br>0.01<br>0.001 10<br>0 1 2 3 0.1 1 10<br>GATE-SOURCE VOLTAGE : VGS[V]  DRAIN-CURRENT : ID[A]<br>Fig.5  Static Drain-Source On-State  Fig.6  Static Drain-Source On-State<br>           Resistance vs. Drain Current(Ⅱ)             Resistance vs. Drain Current(Ⅲ)<br>1000 1000<br>VPulsed GS= 10V  VPulsed GS= 4.5V  Ta=125°C<br>Ta=125°C Ta=75°C<br>Ta=75°C Ta=25°C<br>Ta=25°C  Ta=-25°C<br>Ta=-25°C<br>100 100<br>10 10<br>0.1 1 10 0.1 1 10<br>DRAIN-CURRENT : ID[A]  DRAIN-CURRENT : ID[A]<br>DRAIN CURRENT : I[A] D DRAIN CURRENT : I[A] D<br>]<br>Ω<br>[A] D<br>(on)[m<br>DS<br>DRAIN CURRENT : I RESISTANCE : R<br>STATIC DRAIN-SOURCE ON-STATE<br>(on)[m] Ω (on)[m] Ω<br>DS DS<br>RESISTANCE : R RESISTANCE : R<br>STATIC DRAIN-SOURCE ON-STATE   STATIC DRAIN-SOURCE ON-STATE<br>**----- End of picture text -----**<br>


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**2011.10 -  Rev.A** 

4/10 

Data Sheet 

**SH8M11** 

**==> picture [416 x 592] intentionally omitted <==**

**----- Start of picture text -----**<br>
Fig.7  Static Drain-Source On-State  Fig.8 Forward Transfer Admittance<br>           Resistance vs. Drain Current(Ⅳ)            vs. Drain Current<br>1000 10<br>VPulsed GS= 4.0V  Ta=125Ta=75°C°C VPulsed DS= 10V Pulsed DS= 10V DS= 10V = 10V<br>Ta=25°C<br>Ta=-25°C<br>100 1<br>Ta=125°C°CC<br>Ta=75°C°CC<br>Ta=25°C °C C<br>Ta=-25°C-25°C25°C°CC<br>10 0.1<br>0.1 1 10 0.01 0.1 1 10<br>DRAIN-CURRENT : ID[A]  DRAIN-CURRENT : ID[A] D[A] [A]<br>Fig.9 Reverse Drain Current  Fig.10  Static Drain-Source On-State<br>          vs. Sourse-Drain Voltage                Resistance vs. Gate Source Voltage<br>10 200<br>VGS=0V  Ta=25°C °C C<br>Pulsed  Pulsed<br>150 ID= 1.75A D= 1.75A = 1.75A<br>1<br>ID= 3.5A D= 3.5A = 3.5A<br>100<br>Ta=125°C<br>Ta=75°C<br>0.1 Ta=25°C<br>Ta=-25°C 50<br>0.01 0<br>0 0.5 1 1.5 0 2 4 6 8<br>SOURCE-DRAIN VOLTAGE : VSD [V]  GATE-SOURCE VOLTAGE : VGS[V] GS[V] [V]<br>Fig.11 Switching Characteristics  Fig.12 Dynamic Input Characteristics<br>1000 10<br>Ta=25°C<br>td(off)  VDD= 15V<br>VGS=10V  8<br>tf  RPulsed G=10Ω<br>100<br>6<br>4<br>10 td(on)<br>Ta=25°C<br>2<br>VDD= 15V<br>ID= 3.5A<br>tr  Pulsed<br>1 0<br>0.01 0.1 1 10 0 1 2 3 4 5<br>DRAIN-CURRENT : ID[A]  TOTAL GATE CHARGE : Qg  [nC]<br>]<br>Ω<br>(on)[m<br>DS<br>RESISTANCE : R<br>STATIC DRAIN-SOURCE ON-STATE<br>FORWARD TRANSFER  ADMITTANCE : |Yfs| [S]<br>]<br>Ω<br>(ON)[m<br>DS<br>SOURCE CURRENT : Is [A]  RESISTANCE : R<br>STATIC DRAIN-SOURCE ON-STATE<br> [V]<br>SWITCHING TIME : t [ns]  GS<br>GATE-SOURCE VOLTAGE : V<br>**----- End of picture text -----**<br>


**==> picture [174 x 188] intentionally omitted <==**

**----- Start of picture text -----**<br>
Fig.8 Forward Transfer Admittance<br>          vs. Drain Current<br>10<br>VPulsed DS= 10V Pulsed DS= 10V DS= 10V = 10V<br>1<br>Ta=125°C°CC<br>Ta=75°C°CC<br>Ta=25°C °C C<br>Ta=-25°C-25°C25°C°CC<br>0.1<br>0.01 0.1 1 10<br>DRAIN-CURRENT : ID[A] D[A] [A]<br>FORWARD TRANSFER  ADMITTANCE : |Yfs| [S]<br>**----- End of picture text -----**<br>


**==> picture [181 x 187] intentionally omitted <==**

**----- Start of picture text -----**<br>
Fig.10  Static Drain-Source On-State<br>             Resistance vs. Gate Source Voltage<br>200<br>Ta=25°C °C C<br>Pulsed<br>150 ID= 1.75A D= 1.75A = 1.75A<br>ID= 3.5A D= 3.5A = 3.5A<br>100<br>50<br>0<br>0 2 4 6 8 10<br>GATE-SOURCE VOLTAGE : VGS[V] GS[V] [V]<br>]<br>Ω<br>(ON)[m<br>DS<br>RESISTANCE : R<br>STATIC DRAIN-SOURCE ON-STATE<br>**----- End of picture text -----**<br>


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**2011.10 -  Rev.A** 

5/10 

Data Sheet 

**SH8M11** 

Fig.13  Typical Capacitance vs. Drain-Source Voltage 

Fig.14 Maximum Safe Operating Aera 

**==> picture [433 x 373] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000 100<br>Operation in this area is limited by RDS(ON)<br>Coss  (VGS=10V)<br>Ciss<br>10<br>100<br>PW=100us<br>1<br>Crss  PW=1ms<br>10<br>PW = 10ms<br>0.1<br>Ta=25f=1MHz °C  Ta = 25°C  DC operation<br>Single Pulse : 1Unit<br>VGS=0V  MOUNTED ON CERAMIC BOARD<br>1 0.01<br>0.01 0.1 1 10 100 0.1 1 10 100<br>DRAIN-SOURCE VOLTAGE : VDS[V]  DRAIN-SOURCE VOLTAGE : VDS[V]<br>Fig.15 Normalized Transient Thermal Resistance vs. Pulse Width<br>10<br>1<br>0.1<br>   Ta = 25°C<br>0.01    Single Pulse : 1Unit<br>   Rth(ch-a)(t) = r(t)×Rth(ch-a)<br>   Rth(ch-a) = 89.3 °C/W<br>     <Mounted on a CERAMIC board><br>0.001<br>0.0001 0.01 1 100<br>PULSE WIDTH : Pw(s)<br>CAPACITANCE : C [pF]    (A) DRAIN CURRENT : ID<br>RESISTANCE : r (t)<br>NORMARIZED TRANSIENT THERMAL<br>**----- End of picture text -----**<br>


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**2011.10 -  Rev.A** 

6/10 

Data Sheet 

**SH8M11** 

## 〈Tr.2(Pch)〉 

**==> picture [415 x 585] intentionally omitted <==**

**----- Start of picture text -----**<br>
Fig.1 Typical Output Characteristics(Ⅰ)  Fig.2 Typical Output Characteristics(Ⅱ)<br>Ta=25°C<br>Pulsed  VGS= -3.0V<br>3 VGS= -10V  3 VGS= -2.8V<br>VGS= -4.5V<br>VGS= -4.0V<br>2 VGS= -3.0V  2 VGS= -10V<br>VGS= -4.5V<br>VGS= -4.0V<br>1 VGS= -2.8V  1 VGS= -2.5V<br>Ta=25°C<br>VGS= -2.5V  Pulsed<br>0 0<br>0 0.2 0.4 0.6 0.8 1 0 2 4 6 8 10<br>DRAIN-SOURCE VOLTAGE : -VDS[V]  DRAIN-SOURCE VOLTAGE : -VDS[V]<br>Fig.4  Static Drain-Source On-State<br>Fig.3  Typical Transfer Characteristics             Resistance vs. Drain Current(Ⅰ)<br>10 1000<br>VDS= -10V  Ta=25°C<br>Pulsed  Pulsed<br>VGS= -4.0V<br>1 TTa= 125a= 75°°CC VVGSGS= = --4.5V 10V<br>Ta= 25°C<br>Ta= - 25°C<br>0.1 100<br>0.01<br>0.001 10<br>0 1 2 3 0.1 1 10<br>GATE-SOURCE VOLTAGE : -VGS[V]  DRAIN-CURRENT : -ID[A]<br>Fig.5  Static Drain-Source On-State  Fig.6  Static Drain-Source On-State<br>           Resistance vs. Drain Current(Ⅱ)             Resistance vs. Drain Current(Ⅲ)<br>1000 1000<br>VGS= -10V  VGS= -4.5V<br>Pulsed  Ta= 125°C Pulsed  Ta= 125°C<br>Ta= 75°C Ta= 75°C<br>Ta= 25°C Ta= 25°C<br>Ta= - 25°C  Ta= - 25°C<br>100 100<br>10 10<br>0.1 1 10 0.1 1 10<br>DRAIN-CURRENT : -ID[A]  DRAIN-CURRENT : -ID[A]<br>DRAIN CURRENT : [A] I-D DRAIN CURRENT : [A] I-D<br>]<br>Ω<br>[A] I-D )[m(DSon<br>DRAIN CURRENT :  RESISTANCE : R<br>STATIC DRAIN-SOURCE ON-STATE<br>)[m(] ΩDSon )[m(] ΩDSon<br>RESISTANCE : R RESISTANCE : R<br>STATIC DRAIN-SOURCE ON-STATE   STATIC DRAIN-SOURCE ON-STATE<br>**----- End of picture text -----**<br>


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**2011.10 -  Rev.A** 

7/10 

Data Sheet 

**SH8M11** 

**==> picture [183 x 591] intentionally omitted <==**

**----- Start of picture text -----**<br>
Fig.7  Static Drain-Source On-State<br>           Resistance vs. Drain Current(Ⅳ)<br>1000<br>VPulsed GS= -4.0V  Ta= 125°C<br>Ta= 75°C<br>Ta= 25°C<br>Ta= - 25°C<br>100<br>10<br>0.1 1 10<br>DRAIN-CURRENT : -ID[A]<br>Fig.9 Reverse Drain Current<br>         vs. Sourse-Drain Voltage<br>10<br>VGS=0V<br>Pulsed<br>1<br>Ta= 125°C<br>0.1 TTaa= 75= 25°°CC<br>Ta= - 25°C<br>0.01<br>0 0.5 1 1.5<br>SOURCE-DRAIN VOLTAGE : -VSD [V]<br>Fig.11 Switching Characteristics<br>1000<br>tf  TVaDD=25= -°15V C<br>VGS= -10V<br>td(off)  RG=10Ω<br>Pulsed<br>100<br>td(on)<br>10<br>tr<br>1<br>0.01 0.1 1 10<br>DRAIN-CURRENT : -ID[A]<br>]<br>Ω<br>)[m<br>(DSon<br>RESISTANCE : R<br>STATIC DRAIN-SOURCE ON-STATE<br>[A]<br>I- s<br>SOURCE CURRENT :<br>SWITCHING TIME : t [ns]<br>**----- End of picture text -----**<br>


**==> picture [188 x 588] intentionally omitted <==**

**----- Start of picture text -----**<br>
Fig.8 Forward Transfer Admittance<br>          vs. Drain Current<br>100<br>VDS= -10V<br>Pulsed<br>10<br>1 Ta= 125°C<br>Ta= 75°C<br>Ta= 25°C<br>Ta= - 25°C<br>0.1<br>0.01 0.1 1 10 100<br>DRAIN-CURRENT : -ID[A]<br>Fig.10  Static Drain-Source On-State<br>             Resistance vs. Gate Source Voltage<br>250<br>Ta=25°C<br>ID= -1.7A  Pulsed<br>200<br>150 ID= -3.5A<br>100<br>50<br>0<br>0 5 10 15<br>GATE-SOURCE VOLTAGE : -VGS[V]<br>Fig.12 Dynamic Input Characteristics<br>10<br>8<br>6<br>4<br>Ta=25°C<br>VDD= -15V<br>2 ID= -3.5A<br>RG=10Ω<br>Pulsed<br>0<br>0 2 4 6 8 10<br>TOTAL GATE CHARGE : Qg  [nC]<br>FORWARD TRANSFER  ADMITTANCE : |Yfs| [S]<br>]<br>Ω<br>)[m<br>(ONDS<br>RESISTANCE : R<br>STATIC DRAIN-SOURCE ON-STATE<br> [V]<br>GS<br>V<br>-<br>GATE-SOURCE VOLTAGE :<br>**----- End of picture text -----**<br>


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**2011.10 -  Rev.A** 

8/10 

Data Sheet 

**SH8M11** 

Fig.13 Typical Capacitance vs. Drain-Source Voltage 

Fig.14 Maximum Safe Operating Aera 

**==> picture [430 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
10000 100<br>Operation in this area is limited by RDS(ON)<br>(VGS=-10V)<br>Ciss  10<br>1000 Coss  PW=100us<br>1<br>Crss  PW=1ms<br>100 PW = 10ms<br>0.1<br>Tf=1MHz a=25°C  TSingle Pulse : 1Unit a = 25°C  DC operation<br>VGS=0V  Mounted on a CERAMIC board<br>10 0.01<br>0.01 0.1 1 10 100 0.1 1 10 100<br>DRAIN-SOURCE VOLTAGE : -VDS [V]  DRAIN-SOURCE VOLTAGE : -VDS[V]<br>  (A) I-D<br>CAPACITANCE : C [pF]<br>DRAIN CURRENT :<br>**----- End of picture text -----**<br>


Fig.15 Normalized Transient Thermal Resistance vs. Pulse Width 

**==> picture [189 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>1<br>0.1<br>   Ta = 25°C<br>0.01    Single Pulse : 1Unit<br>   Rth(ch-a)(t) = r(t)×Rth(ch-a)<br>   Rth(ch-a) = 82.3 °C/W<br>     <Mounted on a CERAMIC<br>0.001<br>0.0001 0.001 0.01 0.1 1 10 100 1000<br>PULSE WIDTH : Pw(s)<br>RESISTANCE : r (t)<br>NORMARIZED TRANSIENT THERMAL<br>**----- End of picture text -----**<br>


www.rohm.com © 2011  ROHM Co., Ltd. All rights reserved. 

**2011.10 -  Rev.A** 

9/10 

Data Sheet 

**SH8M11** 

##  **Measurement circuits** 

<Tr1(Nch)> 

**==> picture [105 x 75] intentionally omitted <==**

**----- Start of picture text -----**<br>
VGS ID<br>VDS<br>RL<br>D.U.T.<br>RG VDD<br>**----- End of picture text -----**<br>


**==> picture [121 x 92] intentionally omitted <==**

**----- Start of picture text -----**<br>
Pulse width<br>50% 90% 50%<br>VGS 10%<br>VDS<br>10% 10%<br>90% 90%<br>td(on) tr td(off) tf<br>ton toff<br>**----- End of picture text -----**<br>


Fig.1-1  Switching Time Measurement Circuit 

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**----- Start of picture text -----**<br>
VGS ID<br>VDS<br>RL<br>IG(Const.) D.U.T.<br>VDD<br>**----- End of picture text -----**<br>


Fig.2-1  Gate Charge Measurement Circuit 

Fig.1-2 Switching Waveforms 

**==> picture [104 x 89] intentionally omitted <==**

**----- Start of picture text -----**<br>
VG<br>Qg<br>VGS<br>Qgs Qgd<br>Charge<br>**----- End of picture text -----**<br>


Fig.2-2  Gate Charge Waveform 

## <Tr2(Pch)> 

**==> picture [106 x 75] intentionally omitted <==**

**----- Start of picture text -----**<br>
VGS ID<br>VDS<br>RL<br>D.U.T.<br>RG<br>VDD<br>**----- End of picture text -----**<br>


**==> picture [122 x 85] intentionally omitted <==**

**----- Start of picture text -----**<br>
Pulse Width<br>VGS 10%<br>50% 90% 50%<br>10% 10%<br>90% 90%<br>VDS<br>td(on) tr td(off) tf<br>ton toff<br>**----- End of picture text -----**<br>


Fig.3-1  Switching Time Measurement Circuit 

Fig.3-2 Switching Waveforms 

**==> picture [153 x 97] intentionally omitted <==**

**----- Start of picture text -----**<br>
ID<br>VGS VDS<br>RL<br>IG(Const.) D.U.T.<br>VDD<br>Fig.4-1  Gate Charge Measurement Circuit<br>**----- End of picture text -----**<br>


**==> picture [104 x 88] intentionally omitted <==**

**----- Start of picture text -----**<br>
VG<br>Qg<br>VGS<br>Qgs Qgd<br>Charge<br>**----- End of picture text -----**<br>


Fig.4-2  Gate Charge Waveform 

##  **Notice** 

This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit. 

www.rohm.com © 2011  ROHM Co., Ltd. All rights reserved. 

**2011.10 -  Rev.A** 

10/10 

Notice 

## N o t e s 

Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. 

## ROHM  Customer Support System 

http://www.rohm.com/contact/ 

www.rohm.com © 2011  ROHM Co., Ltd. All rights reserved. 

R1120A 

**Datasheet** 

## SH8M11 - Web Page 

Buy Distribution Inventory 

|Part Number|SH8M11|
|---|---|
|Package|SOP8|
|Unit Quantity|2500|
|Minimum Package Quantity|2500|
|Packing Type|Taping|
|Constitution Materials List|inquiry|
|RoHS|Yes|





## Links

- [View this product on Novapart](https://novapart.co/products/SH8M11GZETB/dual-mosfet-complementary-n-and-p-channel-30-v-35)
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- [Supplier page](https://es.farnell.com/en-ES/rohm/sh8m11gzetb/mosfet-n-p-ch-30v-sop8/dp/2706782RL)
---

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