SGGP.25.4.A.02

## **SPECIFICATION** 

Model No. : **SGGP.25.4.A.02** 

Product Name :  GPS/GLONASS/GALILEO SMT Patch Antenna 

Features : 25mm*25mm*4.5mm Single Feed SMT Mount GPS/GALILEO: 1575MHz GLONASS: 1602MHz Patent pending RoHS Compliant 

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## **1. Introduction** 

This ceramic 25mm GPS/GLONASS/GALILEO patch antenna is mounted via SMT process and has been pre-tuned for a 50*50mm ground plane. Custom part no's tuned for different ground-plane or layout positions and taking into account the specific conditions in your device can be created and supplied by Taoglas. 

## **2. Specification** 

Original Patch Specification tested on 50*50mm ground plane 

|No<br>~~eee~~|Parameter<br>~~eee~~|Specification<br>~~eee~~|Notes<br>~~eee~~|
|---|---|---|---|
|1|Range of Receiving Frequency|GPS/GALILEO: 1575.42 MHz ± 1.023 MHz<br>GLONASS: 1602± 5 MHz||
|2|Center Frequency|1592± 3MHz|With 50*50mm ground plane|
|3|Bandwidth|8MHz min|Return Loss <-10 dB|
|4|VSWR|1.5 max|Center Frequency|
|5|Gain at Zenith|GPS/GALILEO: -0.14dBic<br>typ.<br>GLONASS: 1.75dBic typ.||
|8|Polarization|RHCP||
|9|Impedance|50 Ohms||
|10|Frequency Temperature<br>Coefficient（τf）|0 ± 20ppm / oC|-40ºC to +85ºC|
|11|Operating Temperature    -40C to +85C|||



**Changes in user groundplane and environment will offset centre frequency 

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## **3. Electrical Specifications** 

## **3.1. Return Loss, SWR, Impedance, measured on the test fixture** 

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## **4. Radiation Patterns** 

## **4.1. 1575MHz** 

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## **4.2. 1602MHz** 

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## **5. Mechanical Specifications** 

**5.1. Antenna Dimensions and Drawing** 

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## **5.2. Footprint Copper Keepout Area** 

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## **5.3. Paste Area** 

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## **5.4. Soder Mask (Negative)** 

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## **5.5. Footprint Composite** 

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## **5.6. Test Jig and Dimension SGGPD.25A** 

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## **5.7. SGGPD.25A** 

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## **6. Recommended Reflow Soldering Profile** 

SGGP.25A can be assembled following Pb-free assembly. According to the Standard IPC/JEDEC J-STD-020C, the temperature profile suggested is as follow: 

|Phase|Profile Features|Pb-Free Assembly (SnAgCu)|
|---|---|---|
|PREHEAT|Temperature Min(Tsmin)<br>Temperature Max(Tsmax)<br>Time(ts) from (Tsmin to Tsmax)|150°C<br>200°C<br>60-120 seconds|
|RAMP-UP|Avg. Ramp-up Rate (Tsmax to TP)|3°C/second(max)|
|REFLOW|Temperature(TL)<br>Total Time above TL (tL)|217°C<br>30-100 seconds|
|PEAK|Temperature(TP)<br>Time(tp)|260°C<br>2-5 seconds|
|RAMP-DOWN|Rate|3°C/second(max)|
|Time from 25°C to Peak Temperature||8 minutes max.|
|Composition of solder paste||96.5Sn/3Ag/0.5Cu|
|Solder Paste Model||SHENMAO PF606-P26|



Soldering Iron condition: Soldering iron temperature 270°C±10°C. 

Apply preheating at 120°C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering iron temperature over270°C±10°C or 3 seconds, it will make cause component surface peeling or damage. 

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## **7. Packaging** 

Taoglas makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Taoglas reserves all rights to this document and the information contained herein. 

Reproduction, use or disclosure to third parties without express permission is strictly prohibited. 

Copyright © Taoglas Ltd. 

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