SE60N3JHM3/I
Standard Recovery Diode, 600 V, 6 A, Quad Common Anode, 1.05 V, 80 A
- Manufacturer: VISHAY
- Product type: Standard Recovery Rectifier Diodes
- SVHC: Lead (04-Feb-2026)
- No. of Pins: 4Pins
- Product Range: -
- Qualification: AEC-Q101
- Diode Case Style: DFN33A
- Diode Configuration: Quad Common Anode
- Forward Voltage Max: 1.05V
- Forward Surge Current: 80A
- Reverse Recovery Time: -
- Average Forward Current: 6A
- Operating Temperature Max: 175°C
- Repetitive Peak Reverse Voltage: 600V
| Delivery and price | |
|---|---|
| Units per pack | 5000 |
| Price | 0.147 € |
| Current stock | 1000+ |
| Lead time | 30 days |
**SE60N3D, SE60N3G, SE60N3J** www.vishay.com Vishay General Semiconductor ## **Surface-Mount Standard Rectifier** **==> picture [216 x 142] intentionally omitted <==** **----- Start of picture text -----**<br> K<br>1 4<br>2 3<br>3 2<br>Ss 4 Ss 1<br>DFN33A<br>Anode (1)<br>Anode (2)<br>Cathode (K)<br>Anode (3)<br>Anode (4)<br>**----- End of picture text -----**<br> ## **LINKS TO ADDITIONAL RESOURCES** **==> picture [222 x 60] intentionally omitted <==** **----- Start of picture text -----**<br> Fu EDA / CAD la, Related = Packages oF \ Marking Application<br>Documents Notes<br>SPICE<br>Models<br>**----- End of picture text -----**<br> ## **FEATURES** - Low-profile package Available - typical height of 0.88 mm - • Leadless DFN package with side-wettable flanks suitable for customer AOI (Automatic Optical Inspection) COMPLIANTRoHS - Ideal for automated replacement - Oxide planar chip junction - Low forward voltage drop - Typical IR less than 0.1 μA - ESD capability - Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C - AEC-Q101 qualified available - Automotive ordering code: base P/NHM3 - Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 ## **TYPICAL APPLICATIONS** General purpose, power line polarity protection and rail-to-rail protection in consumer, industrial, and automotive applications. ## **PRIMARY CHARACTERISTICS** |**PRIMARY CHARACTERISTICS**|**PRIMARY CHARACTERISTICS**| |---|---| |IF(AV)|6 A| |VRRM|200 V, 400 V, 600 V| |IFSM|80 A| |VFat IF= 6 A (TJ= 125 °C)|0.88 V| |TJmax.|175 °C| |Package|DFN33A| |Circuit configuration|Single| ## **MECHANICAL DATA** ## **Case:** DFN33A Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant Base P/NHM3 - halogen-free, RoHS-compliant, and AEC-Q101 qualified **Terminals:** matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 and HM3 suffix meet JESD 201 class 2 whisker test |**MAXIMUM RATINGS**(TA= 25 °C unless otherwise noted)|**MAXIMUM RATINGS**(TA= 25 °C unless otherwise noted)|**MAXIMUM RATINGS**(TA= 25 °C unless otherwise noted)|**MAXIMUM RATINGS**(TA= 25 °C unless otherwise noted)|**MAXIMUM RATINGS**(TA= 25 °C unless otherwise noted)|**MAXIMUM RATINGS**(TA= 25 °C unless otherwise noted)| |---|---|---|---|---|---| |**PARAMETER**|**SYMBOL**|**SE60N3D**|**SE60N3G**|**SE60N3J**|**UNIT**| |Device markingcode||6D|6G|6J|| |Maximum repetitive peak reverse voltage|VRRM|200|400|600|V| |Maximum average forward rectified current (fig.1)|IF(AV) (1)|6|||A| ||IF(AV) (2)|1.88|||| |Peak forward surge current 10 ms single half sine-wave<br>superimposed on rated load|IFSM|80|||A| |Operatingjunction temperature range|TJ (3)|-55 to +175|||°C| |Storage temperature range|TSTG|-55 to +175|||| ## **Notes** - (1) With infinite heatsink - (2) Free air, mounted on recommended copper pad area > (3) The heat generated must be less than the thermal conductivity from junction-to-ambient: dPD/dTJ < 1/RθJA Revision: 08-Jan-2024 Document Number: 98542 **1** For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 **SE60N3D, SE60N3G, SE60N3J** ## www.vishay.com Vishay General Semiconductor |**ELECTRICAL CHARACTERISTICS**(TJ= 25 °C unless otherwise noted)|**ELECTRICAL CHARACTERISTICS**(TJ= 25 °C unless otherwise noted)|**ELECTRICAL CHARACTERISTICS**(TJ= 25 °C unless otherwise noted)|**ELECTRICAL CHARACTERISTICS**(TJ= 25 °C unless otherwise noted)|**ELECTRICAL CHARACTERISTICS**(TJ= 25 °C unless otherwise noted)|**ELECTRICAL CHARACTERISTICS**(TJ= 25 °C unless otherwise noted)|| |---|---|---|---|---|---|---| |**PARAMETER**|**TEST CONDITIONS**||**SYMBOL**|**TYP.**|**MAX.**|**UNIT**| |Instantaneous forward voltage|IF= 3 A|TJ= 25 °C|VF (1)|0.91|-|V| ||IF= 6 A|||0.98|1.05|| ||IF= 3 A|TJ= 125 °C||0.80|-|| ||IF= 6 A|||0.88|0.98|| |Reverse current|Rated VR|TJ= 25 °C|IR (2)|-|10|μA| |||TJ= 125 °C||18|100|| |Typical junction capacitance|4.0 V, 1 MHz||CJ|40|-|pF| ## **Notes** > (1) Pulse test: 300 μs pulse width, 1 % duty cycle - (2) Pulse test: pulse width ≤ 5 ms |**THERMAL CHARACTERISTICS**(TA= 25|°C unless otherwise specified)|°C unless otherwise specified)|°C unless otherwise specified)|°C unless otherwise specified)| |---|---|---|---|---| |**PARAMETER**|**SYMBOL**|**TYP.**|**MAX.**|**UNIT**| |Thermal resistance|RθJA (1)(2)|122|153|°C/W| ||RθJM (3)|2.9|3.6|| ## **Notes** > (1) The heat generated must be less than the thermal conductivity from junction-to-ambient: dPD/dTJ < 1/RθJA > (2) Thermal resistance junction-to-ambient to follow JEDEC® 51-2A, device mounted on FR4 PCB, 2 oz., standard footprint - (3) Thermal resistance junction-to-mount to follow JEDEC 51-14 transient dual interface test method (TDIM) ## **IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS** (TA = 25 °C unless otherwise noted) |**IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS**<br>(TA= 25 °C unless otherwise noted)|**IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS**<br>(TA= 25 °C unless otherwise noted)|**IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS**<br>(TA= 25 °C unless otherwise noted)|**IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS**<br>(TA= 25 °C unless otherwise noted)|**IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS**<br>(TA= 25 °C unless otherwise noted)|**IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS**<br>(TA= 25 °C unless otherwise noted)| |---|---|---|---|---|---| |**STANDARD**|**TEST TYPE**|**TEST CONDITIONS**|**SYMBOL**|**CLASS**|**VALUE**| |AEC-Q101-001|Human body model (contact mode)|C = 100 pF, R = 1.5 kΩ|VC|H3B|> 8 kV| |AEC-Q101-005|Charge device mode|Refer to AEC-Q101-005||C3|> 1000 V| |JESD22-A114|Human body model (contact mode)|C = 100 pF, R = 1.5 kΩ||3B|> 8 kV| |IEC 61000-4-2(2)|Human body model (contact mode)|C = 150 pF, R = 330Ω||4|> 8 kV| ||Human body model (air-discharge mode)(1)|C = 150 pF, R = 330Ω||4|> 15 kV| ## **Notes** > (1) Immunity to IEC 61000-4-2 air discharge mode has a typical performance > 30 kV - (2) System ESD standard ## **ORDERING INFORMATION TABLE** |**Device code**|**S**|**S**||**E**<br>**60**<br>**N3**<br>**J**<br>**H**|**E**<br>**60**<br>**N3**<br>**J**<br>**H**|**E**<br>**60**<br>**N3**<br>**J**<br>**H**|**M3**|| |---|---|---|---|---|---|---|---|---| ||1|||6<br>2<br>4<br>3<br>5|||7|| ||**1**||-||Vishay standard recovery product|||| |||||||||| ||**2**||-||Oxide planar chip technology|||| |||||||||| ||**3**||-||Current rating (60 = 6 A)|||| |||||||||| ||**4**||-||Package type (N3 = DFN33A package)|||| |||||||||| ||**5**||-||Voltage rating (D = 200 V, G =|400|V, J = 600 V)|| |||||||||| ||**6**||-||Quality grade (H = AEC-Q101 qualified, otherwise = industry grade)|||| |||||||||| ||**7**||-||Material / environmental category (M3 = halogen-free,|||| ||||||RoHS-compliant, and termination lead (Pb)-free)|||| Document Number: 98542 Revision: 08-Jan-2024 **2** For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 **SE60N3D, SE60N3G, SE60N3J** www.vishay.com Vishay General Semiconductor |**ORDERING INFORMATION**(Example)|**ORDERING INFORMATION**(Example)|**ORDERING INFORMATION**(Example)|**ORDERING INFORMATION**(Example)|**ORDERING INFORMATION**(Example)| |---|---|---|---|---| |**PREFERRED P/N**|**UNIT WEIGHT (g)**|**PREFERRED PACKAGE CODE**|**BASE QUANTITY**|**DELIVERY MODE**| |SE60N3J-M3/I|0.031|I|6000|13" diameter plastic tape and reel| |SE60N3JHM3/I(1)|0.031|I|6000|13" diameter plastic tape and reel| ## **Note** > (1) AEC-Q101 qualified ## **RATINGS AND CHARACTERISTICS CURVES** (TA = 25 °C unless otherwise noted) **==> picture [209 x 388] intentionally omitted <==** **----- Start of picture text -----**<br> 8 10000<br>7 T M measured on with infinite<br>heatsink<br>6<br>1000<br>5<br>4<br>3<br>TA measured on 100<br>2 recommended PCB, free air<br>1<br>0 10<br>0 25 50 75 100 125 150 175<br>Mount Temperature (°C)<br>Fig. 1 - Maximum Forward Current Derating Curve<br>Axis Title<br>7 10000<br>6<br>5<br>D = 0.8 D = 1.0 1000<br>4 D = 0.5<br>3<br>D = 0.3<br>100<br>2 T<br>D = 0.1<br>1<br>D = 0.2 D = tp/T tp<br>0 10<br>0 1 2 3 4 5 6 7<br>Average Forward Current (A)<br>Fig. 2 - Forward Power Loss Characteristics<br>Average Forward Rectified Current (A)<br>Average Power Loss (W)<br>**----- End of picture text -----**<br> **==> picture [209 x 386] intentionally omitted <==** **----- Start of picture text -----**<br> 100 10000<br>TJ = 175 ° C<br>10<br>TJ = 150 1000<br>°C<br>1 TJ = 125 °C<br>TJ = 100 ° C T J = 25 °C 100<br>0.1<br>TJ = -40 °C<br>0.01 10<br>0.2 0.4 0.6 0.8 1.0 1.2<br>Instantaneous Forward Voltage (V)<br>Fig. 3 - Typical Instantaneous Forward Characteristics<br>Axis Title<br>1000 10000<br>TJ = 175 °C<br>100<br>TJ = 150 ° C<br>10 TJ = 125 °C 1000<br>1 TJ = 100 °C<br>0.1 TJ = 25 °C<br>100<br>0.01<br>T J = -40 ° C<br>0.001<br>0.0001 10<br>10 20 30 40 50 60 70 80 90 100<br>Percent of Rated Peak Reverse Voltage (%)<br>Fig. 4 - Typical Reverse Leakage Characteristics<br>Instantaneous Forward Current (A)<br>Instantaneous Reverse Current (µA)<br>**----- End of picture text -----**<br> Revision: 08-Jan-2024 Document Number: 98542 **3** For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 **SE60N3D, SE60N3G, SE60N3J** www.vishay.com **==> picture [209 x 364] intentionally omitted <==** **----- Start of picture text -----**<br> 1000 10000<br>TJ = 25 °C<br>f = 1.0 MHz<br>Vsig = 50 mVp-p<br>100 1000<br>10 100<br>1 10<br>0.1 1 10 100 1000<br>Reverse Voltage (V)<br>Fig. 5 - Typical Junction Capacitance<br>Axis Title<br>1000 10000<br>Junction to ambient<br>100 1000<br>10 100<br>1 10<br>0.01 0.1 1 10 100 1000<br>tp - Pulse Duration (s)<br>Junction Capacitance (pF)<br>Transient Thermal Impedance (°C/W)<br>**----- End of picture text -----**<br> Vishay General Semiconductor **==> picture [209 x 186] intentionally omitted <==** **----- Start of picture text -----**<br> 120 10000<br>110 Epoxy printed circuit<br>board FR4 copper<br>100 thickness = 70 µm<br>90<br>80 1000<br>70<br>60<br>50<br>40 100<br>30 S (cm [2] )<br>20<br>10<br>0 10<br>0 1 2 3 4 5 6 7 8 9 10<br>Copper Pad Areas (cm [2] )<br>Fig. 7 - Thermal Resistance Junction -to-Ambient vs.<br>Copper Pad Areas<br>Thermal Resistance (°C/W)<br>**----- End of picture text -----**<br> Fig. 6 - Typical Transient Thermal Impedance Revision: 08-Jan-2024 Document Number: 98542 **4** For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 **SE60N3D, SE60N3G, SE60N3J** Vishay General Semiconductor **==> picture [77 x 10] intentionally omitted <==** **----- Start of picture text -----**<br> www.vishay.com<br>**----- End of picture text -----**<br> ## **PACKAGE OUTLINE DIMENSIONS** in inches (millimeters) ## **DFN33A** **==> picture [156 x 134] intentionally omitted <==** **----- Start of picture text -----**<br> 0.134 (3.40)<br>0.126 (3.20)<br>0.134 (3.40)<br>0.126 (3.20)<br>**----- End of picture text -----**<br> **==> picture [133 x 145] intentionally omitted <==** **----- Start of picture text -----**<br> Min. 0.005 (0.13)<br>0.039 (0.98)<br>0.031 (0.79)<br>**----- End of picture text -----**<br> **==> picture [227 x 155] intentionally omitted <==** **----- Start of picture text -----**<br> 0.022 (0.55) ref.<br>0.017 (0.44)<br>0.011 (0.29)<br>0.094 (2.39)<br>0.086 (2.19)<br>0.030 (0.75)<br>0.022 (0.55)<br>0.020 (0.50)<br>0.028 (0.70)<br>0.012 (0.30)<br>0.088 (2.23) 0.020 (0.50)<br>0.080 (2.03)<br>**----- End of picture text -----**<br> **==> picture [209 x 135] intentionally omitted <==** **----- Start of picture text -----**<br> Mounting pad layout<br>0.017 (0.44)<br>0.094 (2.39)<br>0.026 (0.65)<br>0.088 (2.23)<br>0.028 (0.70)<br>0.134 (3.40)<br>**----- End of picture text -----**<br> Revision: 08-Jan-2024 Document Number: 98542 **5** For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 **Legal Disclaimer Notice** Vishay www.vishay.com ## **Disclaimer** ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer's technical experts. Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein. Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of any of the products, services or opinions of the corporation, organization or individual associated with the third-party website. Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website or for that of subsequent links. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. _**© 2024 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED**_ Revision: 01-Jan-2024 Document Number: 91000 **1** For technical questions, contact: THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Updated at June 7, 2026
Vishay is a global leader in the manufacturing of discrete semiconductors and passive electronic components. Renowned for its exceptional quality and engineering expertise, the company produces highly reliable solutions that drive innovation across the industrial, automotive, telecommunications, and consumer electronics markets. From advanced factory automation to vehicle electrification, Vishay components provide the foundational building blocks for modern electronic design. The company's expansive portfolio is heavily focused on efficient power management, signal routing, and energy storage. Within its passive component lineup, Vishay is recognized for its extensive array of high-performance capacitors, including robust aluminium electrolytic, film, and polymer variants, alongside highly efficient power inductors. In the realm of discrete semiconductors, Vishay is a premier manufacturer of single and dual MOSFETs, as well as a vast selection of Schottky, Zener, and fast-recovery rectifier diodes designed for demanding power applications. Furthermore, Vishay delivers industry-leading circuit protection and thermal management solutions. With a broad offering of transient voltage suppressors (TVS diodes) and temperature-sensing NTC thermistors, these components are engineered to safeguard sensitive circuitry against both electrical and thermal overstress. By combining this vital mix of advanced discretes and passives, Vishay enables engineers to develop robust, space-saving, and highly resilient electronic systems.
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