# Schottky Rectifier, 20 V, 2 A, Single, X3-WLB1406, 2 Pins, 530 mV

![Product image](https://novapart.co/image/farnell:3944953RL/)

**URL**: https://novapart.co/products/SDM2A20CSP-7/schottky-rectifier-20-v-2-a-single-x3-wlb1406-pins
**SKU**: SDM2A20CSP-7
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.1000
**Stock**: 1000+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | - |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | X3-WLB1406 |
| Diode Configuration | Single |
| Forward Voltage Max | 530mV |
| Forward Surge Current | 20A |
| Average Forward Current | 2A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 20V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3944953RL/)

**Product Summaryy VRRM (V)RRM (V)(V)V)) IOO (A)A)) VF maxF maxaxx (V)** 20 2.0 0.53 **Description and Applications ption and Applications tion and Applications pplications lications** occupies only 0.84 mm[[2]] suited for use in portable applications as a: | DIODES.  Blocking Diode  Boost Diode 

**SDM2A20CSP 2.0A SCHOTTKY BARRIER RECTIFIER CHIP SCALE PACKAGE Product Summaryy Features and Benefits VRRM (V)RRM (V)(V)V)) IOO (A)A)) VF maxF maxaxx (V) IR max (µA)**  Low forward voltage (VF) minimizes conduction losses and 20 2.0 0.53 80 improves efficiency.  Reduced high temperature reverse leakage; Increased reliability against thermal runaway failure in high temperature operation.  **Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)**  **Halogen and Antimony Free. “Green” Device (Note 3) Description and Applications ption and Applications tion and Applications pplications lications Mechanical Data** The SDM2A20CSP is a 20-volt 2A Schottky barrier rectifier that is  Case: X3-WLB1406-2 optimized for low forward voltage drop and low leakage current.  Moisture Sensitivity: Level 1 per J-STD-020 Housed in a compact chip scale package (CSP), the SDM2A20CSP  Terminals: Solderable per MIL-STD-202, Method 208 occupies only 0.84 mm[[2]] board-space with low profile. The low thermal  Polarity: Cathode Dot resistance enables designers to meet design challenges of increasing  Weight: 0.001 grams (Approximate) efficiency whilst at the same time reducing board space. It is ideally suited for use in portable applications as a: DIODES. &. ~~TT~~  Blocking Diode 

## **SDM2A20CSP 2.0A SCHOTTKY BARRIER RECTIFIER CHIP SCALE PACKAGE** VF) minimizes conduction losses and F) minimizes conduction losses and ) minimizes conduction losses and ~~TT~~ 

- Switching Diode 

- Reverse Protection Diode 

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Device Schematic<br>**----- End of picture text -----**<br>


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Pin #1<br>Cathode<br>Notch<br>Anode Cathode<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 4) 

|**Ordering Informationg Information Information** (Note 4)|||
|---|---|---|
|**Part Number**|**Case**|**Packaging**|
|SDM2A20CSP-7|X3-WLB1406-2|5,000/Tape &Reel|



- Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 

   2. See http://www.diodes.com/quality/lead_free.htmlfor more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

   3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

   4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. 

## **Marking Information** 

X7=Product Type Marking Code YM=Date Code Marking Y=Year (ex: C=2015) M=Month (ex: 9=September) Dot Denotes Cathode Pin 

|Date CodeKey|||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**Year**|**2014**||||**2015**|||**2016**|||**2017**||||**2018**|||**2019**|||**2020**||
|**Code**|B||||C|||D|||E||||F|||G||||H|
||||||||||||||||||||||||
|**Month**|**Jan**||**Feb**||**Mar**|**Apr**||**May**||**Jun**|||**Jul**||**Aug**|**Sep**||**Oct**||**Nov**||**Dec**|
|**Code**|1||2||3||4|5||6|||7||8|9|9|O||N||D|



1 of 5 **www.diodes.com** 

SDM2A20CSP Document number: DS37986  Rev. 3 - 2 

January 2016 © Diodes Incorporated 

**SDM2A20CSP** 

## **Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%. 

|Single phase, half wave, 60Hz, resistive or inductive load.<br>For capacitance load,or capacitance load,r capacitance load,capacitance load,itance load,tance load,nce load,ce load,load,oad, deraterateate currentrrententntt by 20%.20%.0%..||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage|VRRM|20|V|
|Average Rectified Output Current|IO|2.0|A|
|Repetitive Peak Forward Current<br>(Pulse Wave = 1 Sec, Duty Cycle = 66%)|IFRM|5.0|A|
|Non-Repetitive Peak Forward Surge Current 8.3ms<br>Single Half Sine-Wave Superimposed on Rated Load|IFSM|20|A|



## **Thermal Characteristics** 

|**Thermal Characteristics**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Typical Thermal Resistance Junction to Ambient (Note 5)|RθJA|140|°C/W|
|Typical Thermal Resistance Junction to Ambient(Note 6)|RθJA|73|°C/W|
|Operating and Storage Temperature Range|TJ, TSTG|-55 to +150|°C|



## **Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Electrical Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics **(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|---|---|
||||||||
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|**Test Condition**|
|Forward Voltage Drop|VF|—|—|0.44|V|IF= 1.0A|
|||—|—|0.53||IF= 2.0A|
|Reverse Current (Note 7)|IR|—<br>—|—<br>—|25<br>80|µA|VR= 10V<br>VR= 20V|
|Junction Capacitance|CT|—|70|—|pF|VR= 5V, f = 1.0MHz|



Notes: 5. Device mounted on FR-4 PCB, 2oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf. 6. Device mounted on FR-4 PCB, 2oz. 1 square inch Copper. 

7. Short duration pulse test used to minimize self-heating effect. 

2 of 5 **www.diodes.com** 

SDM2A20CSP Document number: DS37986  Rev. 3 - 2 

January 2016 © Diodes Incorporated 

**SDM2A20CSP** | 

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**----- Start of picture text -----**<br>
10  100000<br>150 ℃<br>——— 10000  e e ee<br>1<br>150 ℃ 85 ℃<br>eee| ff ffAeff |f | 1000  ee———————Yr e<br>0.1  | fff f fo 100  a 125 ℃<br>25 ℃<br>125 ℃ 10<br>0.01  [fff f- _ ——— aaa<br>aS eEEE—— ——<br>2 ye ee ee ee ee<br>85 ℃ 1<br>a —_ ———— —————————<br>0.001  PAEJ) f<br>25 ℃ 0.1<br>fff | ——————<br>—, | a -55 ℃ ee—=———— -55 ℃<br>0.0001  or [a] [a] 0.01  eea | —_|<br>0  200  400  600  800  0  5  10  15  20<br>VF, INSTANTANEOUS FORWARD VOLTAGE (mV)  VR, REVERSE VOLTAGE (V)<br>Figure 1. Typical Forward Characteristics  Figure 2. Typical Reverse Characteristics<br>1000  175<br>rs es<br>f=1MHz<br>—————— ee 150  PEt EELa|EE<br>ee ee ee ee 125<br>100<br>100  Sn EEE EEL EL<br>a a|<br>ota a ee 75  LEE LEE LL<br>a a ee<br>ee<br>a 50  EEE ELEL LE<br>ee ee 25  EEE EELEL EL<br>10  0<br>0  5  10  15  20  0  2  4  6  8  10 12 14 16 18 20<br>VR, REVERSE VOLTAGE (V)  VR, REVERSE VOLTAGE (V)<br>Figure 3. Typical Junction Capacitance  Figure 4. Operating Temperature Derating<br>(A)<br>, LEAKAGE CURRENT (µA)<br>IR<br>, INSTANTANEOUS FORWARD CURRENT<br>IF<br>)<br>℃<br>, JUNCTION CAPACITANCE (pF)  , AMBIENT TEMPERATURE (<br>T A<br>C T<br>**----- End of picture text -----**<br>


3 of 5 **www.diodes.com** 

SDM2A20CSP Document number: DS37986  Rev. 3 - 2 

January 2016 © Diodes Incorporated 

**SDM2A20CSP** 

## **Package Outline Dimensions** 

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. 

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A A1 X3-WLB1406-2<br>Dim  Min  Max  Typ<br>Seating Plane A  0.250 0.300 0.275<br>[; A1  0.000  0.015  -<br>D b 0.45  0.55  -<br>R = 100<br>rT b1  0.45  0.55  -<br>D  1.37  1.43  1.40<br>E  0.57  0.63  0.60<br>b1 b E k  -  -  0.30<br>L1  0.20  0.26  -<br>L2  0.70  0.80  -<br>All Dimensions in mm<br>L1 k L2<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. 

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X2<br>Value<br>Dimensions<br>(in mm)<br>X  0.304<br>— X1  0.840<br>Y<br>X2  1.352<br>Y  0.580<br>qt X X1 ==<br>Lj Lt<br>**----- End of picture text -----**<br>


4 of 5 **www.diodes.com** 

SDM2A20CSP Document number: DS37986  Rev. 3 - 2 

January 2016 © Diodes Incorporated 

**SDM2A20CSP IMPORTANT NOTICE** DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others.  Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending.  Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference.  Only the English version of this document is the final and determinative format released by Diodes Incorporated. **LIFE SUPPORT** Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A.   Life support devices or systems are devices or systems which: [ 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated.  Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2015, Diodes Incorporated **www.diodes.com**[;] SDM2A20CSP 5 of 5 January 2016 Document number: DS37986  Rev. 3 - 2 **www.diodes.com** © Diodes Incorporated 

January 2016 © Diodes Incorporated 



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