# MEMS Accelerometer, ± 6g, X, Y, Z, SPI, SMD, 12 Pins, 2700LSB/g

![Product image](https://novapart.co/image/farnell:2786923/)

**URL**: https://novapart.co/products/SCA3300-D01-1/mems-accelerometer-6g-x-y-z-spi-smd-12-pins
**SKU**: SCA3300-D01-1
**Manufacturer**: MURATA
**Category**: Semiconductors - ICs || IC Sensors || MEMS Accelerometers
**Price**: €12.8800
**Stock**: 25+
**Lead Time**: 2 days (indicative)

## Description

MEMS Sensor Output:Digital; Measurement Axis:X, Y, Z; Acceleration Range:± 6g; Supply Voltage Min:3V; Supply Voltage Max:3.6V; Sensor Case Style:SMD; No. of Pins:12Pins; Sensitivity Typ

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 3 - 168 hours |
| Svhc | No SVHC (04-Feb-2026) |
| No. Of Pins | 12Pins |
| Sensing Axis | X, Y, Z |
| Product Range | SCA Series |
| Qualification | - |
| Sensitivity Max | 5400LSB/g |
| Sensitivity Min | 1350LSB/g |
| Sensitivity Typ | 2700LSB/g |
| Output Interface | SPI |
| Sensor Case Style | SMD |
| Mems Sensor Output | Digital |
| Supply Voltage Max | 3.6V |
| Supply Voltage Min | 3V |
| Sensor Case / Package | SMD |
| Operating Temperature Max | 125°C |
| Operating Temperature Min | -40°C |
| Sensing Range - Accelerometer | ± 6g |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2786923/)

## Data Sheet 

## SCA3300-D01 3-axis Industrial Accelerometer and Inclinometer with Digital SPI Interface 

## Features 

- 3-axis high performance accelerometer with ±1.5g to ±6g user selectable measurement range 

- Extensive self-diagnostics features 

- Excellent bias stability and low noise level 

- Mechanically damped sensing element design for superior vibration robustness 

- SPI digital interface 

- −40°C…+125°C operating temperature range 

- 3.0V…3.6V supply voltage with low 1mA current consumption 

- RoHS compliant robust DFL plastic package suitable for lead free soldering process and SMD mounting 

- Proven capacitive 3D-MEMS technology 

## Applications 

SCA3300-D01 is targeted at applications demanding high stability with tough environmental requirements. 

Typical applications include: 

- Professional Leveling 

- Platform Angle Measurement 

- Tilt Compensation 

- Inertial Measurement Units (IMUs) for highly demanding environments 

- Motion Analysis and Control 

- Navigation Systems 

## Overview 

The SCA3300-D01 is a high performance accelerometer sensor component. It is three axis accelerometer sensor based on Murata's proven capacitive 3D-MEMS technology. Signal processing is done in mixed signal ASIC with flexible SPI digital interface. Sensor element and ASIC are packaged to 12 pin premolded plastic housing that guarantees reliable operation over product's lifetime. 

The SCA3300-D01 is designed, manufactured and tested for high stability, reliability and quality requirements. The component has extremely stable output over wide range of temperature and vibration. The component has several advanced self diagnostics features, is suitable for SMD mounting and is compatible with RoHS and ELV directives. 

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## TABLE OF CONTENTS 

|1|Introduction .................................................................................................................. 3|Introduction .................................................................................................................. 3|
|---|---|---|
|2|Specifications ............................................................................................................... 3||
||2.1|General Specifications .................................................................................................................. 3|
||2.2|Performance Specifications ........................................................................................................ 3|
||2.3|Performance Specification for Temperature Sensor ............................................................ 4|
||2.4|Absolute Maximum Ratings ......................................................................................................... 4|
||2.5|Pin Description ................................................................................................................................ 5|
||2.6|Typical Performance Characteristics ........................................................................................ 6|
||2.7|Digital I/O Specification ............................................................................................................... 9|
||2.8|Measurement Axis and Directions ............................................................................................11|
||2.9|Package Characteristics .............................................................................................................. 12|
||2.10|PCB Footprint ................................................................................................................................ 13|
|3|General Product Description ................................................................................... 14||
||3.1|Factory Calibration....................................................................................................................... 15|
|4|Component Operation, Reset and Power Up ....................................................... 15||
||4.1|Recommended Start Up Sequence .......................................................................................... 15|
||4.2|Recommended Operation Sequence ...................................................................................... 15|
|5|Component Interfacing ............................................................................................ 16||
||5.1|General ............................................................................................................................................ 16|
||5.2|Protocol .......................................................................................................................................... 16|
||5.3|SPI Frame ........................................................................................................................................ 17|
||5.4|Example of Acceleration Data Conversion ............................................................................. 18|
||5.5|Example of Temperature Data Conversion ............................................................................ 18|
||5.6|Example of Self-Test Analysis ................................................................................................... 19|
|6|Application Information .......................................................................................... 20||
||6.1|Application Circuitry and External Component Characteristics ....................................... 20|
||6.2|Assembly Instructions ................................................................................................................. 21|



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## 1 Introduction 

This document contains essential technical information about the SCA3300-D01 sensor including specifications, SPI interface descriptions, electrical properties and application information. This document should be used as a reference when designing in SCA3300-D01 component. 

## 2 Specifications 

## 2.1 General Specifications 

General specifications for SCA3300-D01 component are presented in Table 1. All analog voltages are referenced to the potential at AVSS and all digital voltages are referenced to the potential at DVSS. 

Table 1. General specifications. 

|Parameter|Condition|Min|Typ|Max|Units|
|---|---|---|---|---|---|
|Supply voltage: VDD, DVIO||3.0|3.3|3.6|V|
|I_VDD|Normal mode||1.2||mA|



## 2.2 Performance Specifications 

Table 2. Accelerometer performance specifications (VDD=3.3V and room temperature unless otherwise specified). 

|Parameter|Condition|Min|Typ|Max|Unit|
|---|---|---|---|---|---|
|Measurement range|Measurement axes XYZ|-6||6|g|
|Offset (zero acceleration output)|||0||LSB|
|Offset error(A|||±20<br>±1.15||mg<br>°|
|Offset temperature drift(B|X-,Y-axis -40°C ... +125°C<br>Z-axis -40°C ... +125°C||±10<br>±0.57<br>±15<br>±0.86||mg<br>°<br>mg<br>°|
|Sensitivity|±1.5g Mode 4 and Mode 3<br>±3g Mode 1<br>±6g Mode 2||5400<br>2700<br>1350||LSB/g|
|Sensitivityerror(A|||±0.7||%|
|Sensitivitytemperature drift(B|-40°C ... +125°C||±0.3||%|
|Linearity error(C|-1g ... +1g range<br>-6g ...+6grange||±1<br>±15||mg<br>mg|
|Integrated noise (RMS)|In mode 3 1.5g|||1.2|mgRMS|
|Noise density|In mode 3 1.5g||37||µg/<br>Hz|
|Cross axis sensitivity (D|per axis|-1||+1|%|
|Amplitude response<br>-3dB frequency|Mode 1, Mode 2 and Mode 3<br>Mode4||88<br>10||Hz<br>Hz|
|Power on start-uptime|||1||ms|
|ODR|Normal mode||2000||Hz|



VALUES ARE ±3 SIGMA VARIATION LIMITS FROM TEST POPULATION. VALUES ARE NOT GUARANTEED. 

- A. INCLUDES CALIBRATION ERROR AND DRIFT OVER LIFETIME. 

- B. DEVIATION FROM VALUE AT ROOM TEMPERATURE. 

- C. STRAIGHT LINE THROUGH SPECIFIED MEASUREMENT RANGE END POINTS. 

- D. CROSS AXIS SENSITIVITY IS THE MAXIMUM SENSITIVITY IN THE PLANE PERPENDICULAR TO THE MEASURING DIRECTION. X-AXIS OUTPUT CROSS AXIS SENSITIVITY (CROSS AXIS FOR Y AND Z-AXIS OUTPUTS ARE DEFINED CORRESPONDINGLY): 

   - CROSS AXIS FOR Y AXIS = SENSITIVITY Y / SENSITIVITY X CROSS AXIS FOR Z AXIS = SENSITIVITY Z / SENSITIVITY X 

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## 2.3 Performance Specification for Temperature Sensor 

Table 3. Temperature sensor performance specifications. 

|Parameter|Condition|Min.|Typ|Max.|Unit|
|---|---|---|---|---|---|
|Temperature signal range||-50||+150|°C|
|Temperature signal sensitivity|Unsigned 16-bit word||18.9||LSB/°C|
|Temperature signal offset|°C output|-283|-273|-263|°C|



Temperature is converted to °C with following equation: 

Temperature [°C] = -273 + (TEMP / 18.9), 

where TEMP is temperature sensor output in decimal format. 

## 2.4 Absolute Maximum Ratings 

Within the maximum ratings (Table 4), no damage to the component shall occur. Parametric values may deviate from specification, yet no functional failure shall occur. 

Table 4. Absolute maximum ratings. 

|Parameter|Remark|Min.|Typ|Max.|Unit|
|---|---|---|---|---|---|
|VDD|Supplyvoltage analogcircuitry|-0.3||4.3|V|
|DIN/DOUT Maximum volta|DIN/DOUT Maximum voltage at digital input and outputpins|ins<br>-0.3||DVIO+0.3|V|
|Topr|Operatingtemperature range|-40||125|°C|
|Tstg|Storage temperature range|-40||150|°C|
|ESD_HBM|ESD according Human Body Model (HBM),<br>Q100-002|±2000|||V|
|ESD_CDM|ESD according Charged Device Model (CDM),<br>Q100-011|±500<br>±750 (corner<br>pins)|||V|
|US|Ultrasonic agitation (cleaning,welding,etc)|Prohibited||||



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## 2.5 Pin Description 

The pinout for SCA3300-D01 is presented in Figure 1, while the pin descriptions can be found in Table 5. 

**==> picture [362 x 118] intentionally omitted <==**

**----- Start of picture text -----**<br>
AVSS 1 Ea 12 EMC_ GND<br>||<br>A_EXTC 2 Z| 11 DVSS<br>||<br>RESERVED 3 Ea 10 D_EXTC<br>VDD 4 9 DVIO<br>||<br>CSB 5 L | 8 SCK<br>MISO 6 7 MOSI<br>**----- End of picture text -----**<br>


Figure 1. Pinout for SCA3300-D01. 

Table 5. SCA3300-D01 pin descriptions. 

|Pin#|Name|Type|Description|
|---|---|---|---|
|1|AVSS|GND|Analogreferenceground,connect externallyto AVSS|
|2|A_EXTC|AOUT|External capacitor connection forpositive reference voltage|
|3|RESERVED|-|Factoryuse only,leave floatingor connect to GND|
|4|VDD|SUPPLY|AnalogSupplyvoltage|
|5|CSB|DIN|ChipSelect of SPI Interface,3.3V logic compatible Schmitt-trigger input|
|6|MISO|DOUT|Data Out of SPI Interface|
|7|MOSI|DIN|Data In of SPI Interface,3.3V logic compatible Schmitt-trigger input|
|8|SCK|DIN|CLK signal of SPI Interface|
|9|DVIO|SUPPLY|SPI interface SupplyVoltage|
|10|D_EXTC|AOUT|External capacitor connection for digital core|
|11|DVSS|GND|Digital SupplyReturn,connect externallyto GND|
|12|EMC_GND|EMC GND EMC|EMC GND EMCgroundpin,connect externallyto AVSS|



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## 2.6 Typical Performance Characteristics 

Figure 2. SCA3300-D01 accelerometer typical offset temperature behavior. 

Figure 3. SCA3300-D01 accelerometer typical long term stability during 1000h HTOL. T=+125°C Vsupply=3.6V 

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Figure 4. SCA3300-D01 accelerometer typical sensitivity temperature error in %. 

Figure 5. Vibration rectification error. Sine sweep 500...5KHz with 4g amplitude and 5kHz...25kHz with 2g amplitude. 

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Figure 6. SCA3300-D01 accelerometer typical linearity behavior. 

Figure 7. SCA3300-D01 accelerometer typical noise density 

Figure 8. SCA3300-D01 typical allan deviation. 

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## 2.7 Digital I/O Specification 

## 2.7.1 DC Characteristics 

Table 6. Input terminal: CSB 

||Parameter|Conditions|Symbol|Min|Typ|Max|Unit|
|---|---|---|---|---|---|---|---|
|1|Pull-up current|VIN = 0V|IPU|10|16.5|50|uA|
|2|Input voltage '1'|Input voltage '1'<br>DVIO = 3.3 V|VIH|2.5||DVIO|V|
|3|Input voltage '0'|e '0'<br>DVIO = 3.3 V|VIL|0||1.1|V|



Table 7. Input terminal: MOSI, SCK 

||Parameter|Conditions|Symbol|Min|Typ|Max|Unit|
|---|---|---|---|---|---|---|---|
|1|Pull-down|VIN = 0V|IPU|10|16.5|50|uA|
||current|||||||
|2|Input voltage '1'|Input voltage '1'<br>DVIO = 3.3 V|VIH|2.5||DVIO|V|
|3|Input voltage '0'|e '0'<br>DVIO = 3.3 V|VIL|0||1.1|V|



Table 8. Output terminal: MISO 

||Parameter|Conditions|Symbol|Min|Typ|Max|Unit|
|---|---|---|---|---|---|---|---|
|9|Output high voltage|I > -1 mA|VOH|DVIO-|||uA|
|||DVIO = 3.3 V||0.5V||||
|10|Output low voltage|I < 1 mA|VOL|||0.5|V|
|11|Tri-state leakage|0 <  VMISO <|ILEAK||TBD||uA|
|||3.3 V||||||
|12|Maximum Capacitive|||||50|pF|
||load|||||||



## 2.7.2 SPI AC Characteristics 

The AC characteristics of SCA3300-D01 SPI interface are defined in Figure 9 and Table 9. 

Figure 9. Timing diagram of SPI communication. 

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Table 9. SPI AC electrical characteristics. 

|Terminals|Parameter|Description|Min|Typ|Max|Unit|
|---|---|---|---|---|---|---|
|SCK|TCL|SCK low time|Tper/2|200||ns|
||TCH|SCK high time|Tper/2|200||ns|
||fSCK = 1/Tper|SCK Frequency|0.1|2.5|8|MHz|
|CSB, SCK|TLS1|Time from CSB (10%)<br>to SCK(90%)|Tper/2|1740||ns|
||TLS2|Time from SCK (10%)<br>to CSB(90%)|Tper/2|920||ns|
|MOSI, SCK|TSET|Time from changing<br>MOSI (10%, 90%) to<br>SCK (90%). Data<br>setuptime|Tper/4|200||ns|
||THOL|Time from SCK (90%)<br>to changing MOSI<br>(10%, 90%). Data<br>hold time|Time from SCK (90%)<br>Tper/4|200||ns|
|MISO, CSB|TVAL1|Time from CSB (10%)<br>to stable MISO (10%,<br>90%)||120||ns|
||TLZ|Time from CSB (90%)<br>to high impedance<br>state of MISO|Time from CSB (90%)|110||ns|
|SCK, MISO|TVAL2|Time from SCK (10%)<br>to stable MISO (10%,<br>90%)||110||ns|
|MISO|LOAD|Capacitive load|||50|pF|
|CSB|TLH|Time between SPI<br>cycles, CSB at high<br>level(90%)|10|||us|



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## 2.8 Measurement Axis and Directions 

Figure 10. SCA3300-D01 measurement directions. 

Table 10. SCA3300-D01 accelerometer measurement directions. 

**==> picture [424 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
x: +1g<br>x: 0g<br>x: 0g  y: 0g<br>y: 0g<br>y: 0g  z: 0g<br>z: -1g<br>z: +1g<br>=jaj=<br>x: 0g  x: -1g  x: 0g<br>y: -1g  y: 0g  y: +1g<br>z: 0g  z: 0g<br>z: 0g<br>**----- End of picture text -----**<br>


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## 2.9 Package Characteristics 

## 2.9.1 Package Outline Drawing 

Figure 11. Package outline. The tolerances are according to ISO2768-f (see Table 11). 

- Table 11. Limits for linear measures (ISO2768 f). 

|Tolerance|Limits in mm for nominal size in mm|Limits in mm for nominal size in mm|Limits in mm for nominal size in mm|
|---|---|---|---|
|class|0.5 to 3|Above 3 to 6|Above 6 to 30|
|f (fine)|±0.05|±0.05|±0.1|



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## 2.10 PCB Footprint 

Figure 12. Recommended PWB pad layout for SCA3300-D01. The tolerances are according to ISO2768-f (see Table 11). 

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## 3 General Product Description 

The SCA3300-D01 sensor includes acceleration sensing element and Application-Specific Integrated Circuit (ASIC). Figure 13 contains an upper level block diagram of the component. 

**==> picture [445 x 284] intentionally omitted <==**

**----- Start of picture text -----**<br>
EEPROM<br>Po<br>Acceleration<br>Signal<br>sensing  AFE ADC conditioning  SPI<br>element and filtering<br>Self diagnostics Temperature sensor<br>ia<br>Figure 13. SCA3300-D01 component block diagram.<br>The sensing elements are manufactured using Murata proprietary High Aspect Ratio (HAR) 3D-<br>MEMS process, which enables making robust, extremely stable and low noise capacitive sensors.<br>**----- End of picture text -----**<br>


The acceleration sensing element consists of four acceleration sensitive masses. Acceleration causes capacitance change that is converted into a voltage change in the signal conditioning ASIC. 

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## 3.1 Factory Calibration 

SCA3300-D01 sensors are factory calibrated. No separate calibration is required in the application. Calibration parameters are stored to non-volatile memory during manufacturing. The parameters are read automatically from the internal non-volatile memory during the startup. 

It should be noted that assembly can cause minor offset/bias errors to the sensor output. If best possible offset/bias accuracy is required, system level offset/bias calibration (zeroing) after assembly is recommended. 

## 4 Component Operation, Reset and Power Up 

## 4.1 Recommended Start Up Sequence 

|Item|Item<br>Procedure|Function|Function|Note|
|---|---|---|---|---|
|1|Set VDD = 3.0 ..||Startup the|VDD and DVIO don't need to|
||3.6 V||device|rise at the same time|
||Set DVIO       =||||
||3.0 .. 3.6 V||||
|2|Wait 10 ms||Memory reading||
||||Settling of signal||
||||path||
|3|Set||Select operation|Mode1: 3g full-scale. 88 Hz 1st|
||Measurement||mode|order low pass filter (default)|
||mode|||Mode2: 6g full-scale. 88 Hz 1st|
|||||order low pass filter|
|||||Mode3: 1.5g full-scale. 88 Hz|
|||||1st order low pass filter.|
|||||Mode4: 1.5g full-scale. 10 Hz|
|||||1st order low pass filter.|
|4|Wait 5 ms||Settling of signal||
||||path||
|5|Read||Read error status|Read error status|
||ERR_STATUS,||and acceleration||
||ACCX, ACCY,||data and self-||
||ACCZ,STO||test output||



## 4.2 Recommended Operation Sequence 

Sensor ODR in normal operation mode is 2000Hz. Registers are updated in every 0.5ms and if all data is not read the full noise performance of sensor is not met. 

During normal operation during every cycle needed acceleration outputs ACCX, ACCY, ACCZ are read in wanted ODR. Error summary is read if return status (RS) indicates error. 

For fail safe option self-test output STO is read after reading all corresponding acceleration outputs. If STO is not within ±400d then corresponding acceleration readings are not reliable. If STO is not returned within limits in no vibration condition after HW reset, it is possible that component failure has occurred. 

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## 5 Component Interfacing 

## 5.1 General 

SPI communication transfers data between the SPI master and SCA3300-D01 ASIC. The SCA3300D01 always operates as a slave device in master-slave operation mode. 3-wire SPI connection cannot be used. 

SPI interface pins: 

|CSB|Chip Select (active low)|MCUASIC|
|---|---|---|
|SCK|Serial Clock|MCUASIC|
|MOSI|Master Out Slave In|MCUASIC|
|MISO|Master In Slave Out|ASICMCU|



## 5.2 Protocol 

The SPI is a 32-bit 4-wire slave configured bus. Off-frame protocol is used so each transfer consists of two phases. A response to the request is sent within next request frame. The response concurrent to the request contains the data requested by the previous command. 

The SPI transmission is always started with the falling edge of chip select (CSB) and terminated with the CSB rising edge. The data bits are sampled from MOSI line at the rising edge of the SCK signal and it is propagated on the falling edge (MISO line) of the SCK. This equals to SPI Mode 0 (CPOL = 0 and CPHA = 0). 

The first bit in a sequence is an MSB. 

**==> picture [360 x 207] intentionally omitted <==**

**----- Start of picture text -----**<br>
CSB i a<br>SCK<br>MOSI<br>C e a | ea eee a e ee e e<br>Request 1 Request 2 Request 3<br>MISO<br>e e e e e e  § e ee<br>* Undefined Response 1 Response 2<br>| |<br>* The first response after reset is<br>undefined and shall be discarded<br>Figure 14. SPI Protocol  —— |<br>**----- End of picture text -----**<br>


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## 5.3 SPI Frame 

SPI operating commands can be found in Table 13. Response frame has data bits and read status determined in Table 12. 

Figure 15 - SPI Frame 

Table 12. SPI Frame Specification 

|Name|Description|MISO|
|---|---|---|
|RS|Return status(1|'00' - Startup in progress<br>'01' - Normal operation, no flags<br>'11' -Error|
|D|Data|Returned data|



Return Status (RS) shows error (i.e. '11') when an error flag (or flags) is active in, or if previous MOSI-command was incorrect frame. 

## 5.3.1 Operations 

Table 13. Operations and their equivalent SPI frames. 

|Operation<br>Read ACCX|SPI Frame<br>0000 0100 0000 0000 0000 0000 1111 0111|SPI Frame Hex<br>040000F7h|
|---|---|---|
|Read ACCY|0000 1000 0000 0000 0000 0000 1111 1101|080000FDh|
|Read ACCZ|0000 1100 0000 0000 0000 0000 1111 1011|0C0000FBh|
|Read STO(self-test output)|0001 0000 0000 0000 0000 0000 1110 1001|0x100000E9|
|Read TEMP|0001 0100 0000 0000 0000 0000 1110 1111|140000EFh|
|Read Status Summary|0001 1000 0000 0000 0000 0000 1110 0101|180000E5h|
|SW reset|1011 0100 0000 0000 0010 0000 1001 1000|0xB4002098|
|Change to mode1|1011 0100 0000 0000 0000 0000 0001 1111|B400001Fh|
|Change to mode2|1011 0100 0000 0000 0000 0001 0000 0010|B4000102h|
|Change to mode3|1011 0100 0000 0000 0000 0010 0010 0101|B4000225h|
|Change to mode4|1011 0100 0000 0000 0000 0011 0011 1000|B4000338h|
|Read WHOAMI|0100 0000 0000 0000 0000 0000 1001 0001|40000091h|



> 1) PRIORITY OF RETURN STATUS STATES FROM HIGHEST TO LOWEST IS: '00' -> '11' -> '01' 

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## 5.3.2 Status Explanation 

Status summary contain more accurate information of possible error source. SW reset is done with SPI bus. HW reset means that to resolve error there is need to power cycling. If this does not reset the error then possible component error has occurred and system needs to be shutdown and part returned to supplier. Status summary explanations: 

|**Status summary bits**|**Status summary bits**||||
|---|---|---|---|---|
|**Bit**|**Name**||**Description **|**Note/Action **|
|15:10|reserved||Not used||
|9|digi1||Digitalblockerrortype1|SWor HW resetneeded|
|8|digi2||Digitalblockerrortype2|SWor HW resetneeded|
|7|clock||ASIC clockerror|SWor HW resetneeded|
|6|sat||Signal saturated in signal<br>path|Acceleration too high and<br>acceleration reading not<br>usable. Component<br>failure possible|
|5|temp||Signal saturated in<br>temperature compensation|External temperature too<br>high or low. Component<br>failure possible|
|4|power||Voltage level failure|External voltages too<br>high or low. Component<br>failure possible|
|3|mem||Memory error|Memory check failed. SW<br>or HW reset needed.<br>Possible component<br>failure.|
|2|digi3||Digitalblockerrortype 3|SWor HW resetneeded|
|1|mode_change||Operation mode has<br>changed|If mode change is not<br>requested. SW or HW<br>reset needed.|
|0|pin_continuity||Component internal<br>connection error|Possible component<br>failure.|



## 5.4 Example of Acceleration Data Conversion 

For example, if ACC_X read results: ACC_X = 0500DC02 h, the content is converted to acceleration rate as follows: 05h = 000001 01b 01b = return status (RS bits) = no error 00DCh = bin 0000 0000 1101 1100b = ACC_X 00DCh in 2's complement format = 220d Acceleration(Mode1) = 220LSB / sensitivity(mode1) =  220LSB/2700=0.081g=81mg Mode1 sensitivity = 2700 LSB/g Mode2 sensitivity = 1350 LSB/g Mode3 and 4 sensitivity = 5400 LSB/g 

## 5.5 Example of Temperature Data Conversion 

For example, if TEMP read results: TEMP = 15161E4E h, the content is converted to temperature as follows: 15h = bin 000111 01b 01 = return status (RS bits) = no error 161Eh = bin 0001 0110 0001 1110 = TEMP FE6Fh in 2's complement format = 5662d Temperature = -273 + ( TEMP / 18.9) = -273 + [298/18.9] = +26.6°C See section 2.3 for temperature conversion equation 

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Subject to changes 

## 5.6 Example of Self-Test Analysis 

If Self-test data read results: 0500DC02 h, the content analyzed as follows: 05h = 000001 01b 01b = return status (RS bits) = no error 00DCh = bin 0000 0000 1101 1100b = self-test reading 00DCh in 2's complement format = 220d 

If self-test readings are higher than 400d or lower than -400d, acceleration data read same time is not usable. If self-test output is not returned within requested limits there is possible component failure. 

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Murata Electronics Oy www.murata.com 

SCA3300-D01 Doc.Nr. 82 2290 00 

Subject to changes 

## 6 Application Information 

## 6.1 Application Circuitry and External Component Characteristics 

See Figure 16 and Table 14 for specification of the external components. The PCB layout example is shown in Figure 17. 

Figure 16. Application schematic. 

Table 14. External component description for SCA3300-D01. 

|Symbol|Description|Min.|Nom.|Max.|Unit|
|---|---|---|---|---|---|
|C1|Decoupling capacitor between VDD and GND<br>ESR<br>Recommended component:<br>Murata GCM188R71C104KA37, 0603, 100N, 16V, X7R|70|100|130<br>100|nF<br>m|
|C2|Decoupling capacitor between A_EXTC and AVSS<br>ESR<br>Recommended component:<br>Murata GCM188R71C104KA37, 0603, 100N, 16V, X7R|70|100|130<br>100|nF<br>m|
|C3|Decoupling capacitor between D_EXTC and GND<br>ESR<br>Recommended component:<br>Murata GCM188R71C104KA37, 0603, 100N, 16V, X7R|70|100|130<br>100|nF<br>m|
|C4|Decoupling capacitor between DVIO and GND<br>ESR<br>Recommended component:<br>Murata GCM188R71C104KA37, 0603, 100N, 16V, X7R|70|100|130<br>100|nF<br>m|



20/21 Rev. A1 

Murata Electronics Oy www.murata.com 

SCA3300-D01 Doc.Nr. 82 2290 00 

Subject to changes 

Figure 17. Application PCB layout. 

General circuit diagram and PCB layout recommendations for SCA3300-D01 (refer to Figure 16 and Figure 17): 

Connect decoupling SMD capacitors (C1 - C5) right next to respective component pins. Locate ground plate under component. 

Do not route signals or power supplies under the component on top layer. Ensure good ground connection of DVSS, AVSS and EMC_GND pins 

## 6.2 Assembly Instructions 

The Moisture Sensitivity Level of the component is Level 3 according to the IPC/JEDEC JSTD020C. The part is delivered in a dry pack. The manufacturing floor time (out of bag) at the customer’s end is 168 hours. 

Usage of PCB coating materials may penetrate component lid and affect component performance. PCB coating is not allowed. 

Sensor components shall not be exposed to chemicals which are known to react with silicones, such as solvents. Sensor components shall not be exposed to chemicals with high impurity levels, such as Cl-, Na+, NO3-, SO4-, NH4+ in excess of >10 ppm. Flame retardants such as Br or P containing materials shall be avoided in close vicinity of sensor component. Materials with high amount of volatile content should also be avoided. 

If heat stabilized polymers are used in application, user should check that no iodine, or other halogen, containing additives are used. 

For additional assembly related details please refer to Technical Note Assembly instructions of Dual Flat Lead Package (DFL). 82201500A_DFL Assembly instructions 

21/21 Rev. A1 

Murata Electronics Oy www.murata.com 

SCA3300-D01 Doc.Nr. 82 2290 00 Subject to changes 

## **Document Change Control** 

|Authors|Approved by|
|---|---|
|Antti Viitanen<br>Iivari Heikkilä||
|Department/Role||
|Product Division / Product Manager<br>Product Division / Product Engineer||



|Rev.|Date|ChangeDescription|Author|Reviewed by|ECN|
|---|---|---|---|---|---|
|A0|29.9.2016|Preliminary release|ASV|||
|A1|3.11.2016|Newoutlook.Updatedfigures. Low-power moderemoved.|ASV/IIHE|||
|||||||
|||||||



22/21 Rev. A1 

Murata Electronics Oy www.murata.com 

SCA3300-D01 Doc.Nr. 82 2290 00 Subject to changes 



## Links

- [View this product on Novapart](https://novapart.co/products/SCA3300-D01-1/mems-accelerometer-6g-x-y-z-spi-smd-12-pins)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/murata/sca3300-d01-1/mems-accelerometer-3axis-smd-12/dp/2786923)
---

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