# Schottky Rectifier, 60 V, 1 A, Single, DO-214AC (SMA), 2 Pins, 720 mV
**URL**: https://novapart.co/products/SBRA8160T3G/schottky-rectifier-60-v-1-a-single-do-214ac-sma-2
**SKU**: SBRA8160T3G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.3270
**Stock**: 10+
## Specifications
| Parameter | Value |
|---|---|
| No. Of Pins | 2Pins |
| Qualification | AEC-Q101 |
| Diode Mounting | Surface Mount |
| Diode Case Style | DO-214AC (SMA) |
| Diode Configuration | Single |
| Forward Voltage Max | 720mV |
| Forward Surge Current | 40A |
| Average Forward Current | 1A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 60V |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:2728075/)
## SS16T3G, SBRA8160T3G
## Surface Mount Schottky Power Rectifier **SMA Power Surface Mount Package**
## **http://onsemi.com**
These devices employ the Schottky Barrier principle in a large area metal−to−silicon power diode. State of the art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity diodes in surface mount applications where compact size and weight are critical to the system.
**SCHOTTKY BARRIER RECTIFIER 1.0 AMPERES 60 VOLTS**
## **Features**
- Small Compact Surface Mountable Package with J−Bent Leads
- Rectangular Package for Automated Handling
- Highly Stable Oxide Passivated Junction
- Very Low Forward Voltage Drop
- Guardring for Stress Protection
- AEC−Q101 Qualified and PPAP Capable
**==> picture [44 x 27] intentionally omitted <==**
**----- Start of picture text -----**
SMA
CASE 403D
PLASTIC
**----- End of picture text -----**
## **MARKING DIAGRAM**
- SBRA8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements
- All Packages are Pb-Free*
## **Mechanical Characteristics**
- Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
- Weight: 70 mg (approximately)
- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
- Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max. for 10 Seconds
- Shipped in 12 mm tape, 5000 units per 13 inch reel
- Polarity: Cathode Lead Indicated by Polarity Band
- ESD Ratings:
- Machine Model = C
- Human Body Model = 3B
- Device Meets MSL 1 Requirements
SS16 AYWW SS16 = Specific Device Code A = Assembly Location Y = Year WW = Work Week = Pb−Free Package **ORDERING INFORMATION Device Package Shipping**[†] SS16T3G SMA 5,000 / (Pb−Free) Tape & Reel SBRA8160T3G SMA 5,000 / (Pb−Free) Tape & Reel ~~—-~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
> *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Publication Order Number: **SS16/D**
**1**
Semiconductor Components Industries, LLC, 2012 **January, 2012 − Rev. 7**
**SS16T3G, SBRA8160T3G**
## **MAXIMUM RATINGS**
|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage|VRRM
VRWM
VR|60|V|
|Average Rectified Forward Current
(At Rated VR, TC= 105C)|IO|1.0|A|
|Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)|IFSM|40|A|
|Storage/Operating Case Temperature|Tstg, TC|−55 to +150|C|
|Operating Junction Temperature|TJ|−55 to +150|C|
|Voltage Rate of Change
(Rated VR, TJ= 25C)|dv/dt|10,000|V/�s|
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
## **THERMAL CHARACTERISTICS**
|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 1)|R�JL
R�JA|35
86|C/W|
1. Mounted on 2 in Square PC Board with 1 in Square Total Pad Size, PC Board FR4.
## **ELECTRICAL CHARACTERISTICS**
|**ELECTRICAL CHARACTERISTICS**|||||
|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**||**Unit**|
|Maximum Instantaneous Forward Voltage (Note 2)
(IF= 0.1 A)
(IF= 1.0 A)|VF|**TJ = 25****C**||V|
|||0.51
0.72|||
|Maximum Instantaneous Reverse Current
(VR= 60 V)|IR|**TJ = 25****C**|**TJ = 100****C**|mA|
|||0.2|5.0||
2. Pulse Test: Pulse Width 250 � s, Duty Cycle 2.0%.
**http://onsemi.com**
**2**
**SS16T3G, SBRA8160T3G**
**==> picture [490 x 625] intentionally omitted <==**
**----- Start of picture text -----**
10 10
5.0 TJ = 150 C
7.0 TJ = 150 C 100 C 25 C 2.0 125 C
5.0 1.0 100 C
0.5
0.2 75 C
3.0
0.1
2.0 0.05
0.02
0.01
0.005 25 C
1.0
0.002
0.7 0.001
0 10 20 30 40 50 60 70
0.5 VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Typical Reverse Current*
0.3 *The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections
0.2 can be estimated from these same curves if VR is sufficiently below rated
VR.
5.0
0.1 SQUARE
4.0
WAVE
0.07
0.05 3.0
dc
�
0.03 2.0 5
10
0.02 IPK/IAV = 20
1.0
0 0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 1.0 2.0 3.0 4.0 5.0
vF, INSTANTANEOUS VOLTAGE (VOLTS) IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 1. Typical Forward Voltage Figure 3. Forward Power Dissipation
200
TJ = 25 C
f = 1 MHz
100
80
70
60
50
40
30
20
0 10 20 30 40 50 60 70 80 90 100
VR, REVERSE VOLTAGE (VOLTS)
, REVERSE CURRENT (mA)
IR
iF, INSTANTANEOUS FORWARD CURRENT (AMPS)
PF(AV), AVERAGE FORWARD POWER DISSIPATION (WATTS)
C, CAPACITANCE (pF)
**----- End of picture text -----**
**Figure 4. Typical Capacitance**
**http://onsemi.com**
**3**
**SS16T3G, SBRA8160T3G**
## **PACKAGE DIMENSIONS**
**SMA** CASE 403D−02 ISSUE F
**==> picture [266 x 198] intentionally omitted <==**
**----- Start of picture text -----**
HE
E
=
F b D
= POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
A
A1
-, L c [=] fp)
**----- End of picture text -----**
NOTES:
**==> picture [195 x 104] intentionally omitted <==**
**----- Start of picture text -----**
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02.
MILLIMETERS INCHES
DIM MIN NOM MAX MIN NOM MAX
S———— A 1.97 2.10 2.20 0.078 0.083 0.087
A1 0.05 0.10 0.15 0.002 0.004 0.006
b 1.27 1.45 1.63 0.050 0.057 0.064
c 0.15 0.28 0.41 0.006 0.011 0.016
D 2.29 2.60 2.92 0.090 0.103 0.115
E 4.06 4.32 4.57 0.160 0.170 0.180
H E 4.83 5.21 5.59 0.190 0.205 0.220
L 0.76 1.14 1.52 0.030 0.045 0.060
**----- End of picture text -----**
STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE
## **SOLDERING FOOTPRINT***
4.0 0.157 2.0 0.0787 ~~EE[7]~~ 2.0 ~~a~~ 0.0787 SCALE 8:1 mm ~~(—})~~ inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
**ON Semiconductor** and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
## **PUBLICATION ORDERING INFORMATION**
## **LITERATURE FULFILLMENT** :
Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Email** : orderlit@onsemi.com
**N. American Technical Support** : 800−282−9855 Toll Free USA/Canada
**ON Semiconductor Website** : **www.onsemi.com**
**Europe, Middle East and Africa Technical Support: Order Literature** : http://www.onsemi.com/orderlit Phone: 421 33 790 2910 **Japan Customer Focus Center** For additional information, please contact your local Phone: 81−3−5817−1050 Sales Representative
**http://onsemi.com**
**SS16/D**
**4**
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- [Supplier page](https://es.farnell.com/en-ES/onsemi/sbra8160t3g/schottky-rect-auto-60v-1a-do214ac/dp/2728075)
---
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