# TVS DIODE, BIDIR, 8V, SLP0603P2X3F

![Product image](https://novapart.co/image/farnell:4257380/)

**URL**: https://novapart.co/products/RCLAMP2451ZATFT/tvs-diode-bidir-8v-slp0603p2x3f
**SKU**: RCLAMP2451ZATFT
**Manufacturer**: SEMTECH
**Category**: Circuit Protection || TVS - Transient Voltage Suppressors || TVS Diodes
**Price**: €0.2030
**Stock**: 10+
**Lead Time**: 100 days (indicative)

## Description

Prod; TVS DIODE, BIDIR, 8V, SLP0603P2X3F; Product Range:RailClamp Series; TVS Polarity:Bidirectional; Reverse Standoff Voltage:24V; Clamping Voltage Max:8V; Diode Case Style:SLP0603P2X

## Specifications

| Parameter | Value |
|---|---|
| Svhc | To Be Advised |
| No. Of Pins | 2Pins |
| Tvs Polarity | Bidirectional |
| Product Range | RailClamp Series |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | SLP0603P2X3F |
| Clamping Voltage Max | 8V |
| Reverse Standoff Voltage | 24V |
| Maximum Breakdown Voltage | 31V |
| Minimum Breakdown Voltage | 25.5V |
| Operating Temperature Max | 85°C |
| Peak Pulse Power Dissipation | 32W |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4257380/)

**RClamp2451ZA Ultra Small RClamp® 1-Line, 24V ESD Protection** 

## **PROTECTION PRODUCTS** 

## **Description** 

RailClamp® TVS diodes are ultra low capacitance devices designed to protect sensitive electronics from damage or latch-up due to ESD, EFT, and EOS. They are designed for use on high speed ports in applications such as cell phones, notebook computers, and other portable electronics. These devices offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. 

## **Features** 

- High ESD withstand voltage: +/-14kV (contact) and +/-18kV (air) per IEC 61000-4-2 

- Able to withstand over 1000 ESD strikes per IEC 61000-4-2 Level 4 

- Ultra-small 0201 package 

- Protects one high speed data line 

- Low ESD clamping voltage 

- Working voltage: +/- 24V 

- Low capacitance: 0.35pF Typical 

- Low leakage current 

- Low dynamic resistance: 0.16 Ohms Typical 

RClamp®2451ZA is specifically designed for protection of Near Field Communications (NFC) interfaces. It features extremely good ESD protection characteristics including a low typical dynamic resistance of 0.16 Ohms (typical), low peak ESD clamping voltage, and high ESD withstand voltage (+/-14kV contact per IEC 61000-4-2). Low typical capacitance (0.35pF at VR=0V) means that RClamp2451ZA will not create harmonic distortion in the RF signal. This device is bidirectional and has a working voltage of 24V for use on NFC resonator circuits without signal clipping. 

RClamp2451ZA is in a 2-pin SLP0603P2X3F package measuring 0.6 x 0.3 mm with a nominal height of 0.25mm. Leads are finished with lead-free NiAu. The combination of working voltage, low dynamic resistance, and low capacitance makes this device ideal for use on NFC antenna ciruits, RF signal lines, and FM antennas in portable devices. 

## **Package Dimension** 

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0.220 0.600 =e 0.300<br>i 0.160<br>0.355 BSC<br>0.250<br>Tr<br>**----- End of picture text -----**<br>


- Solid-state silicon-avalanche technology 

## **Mechanical Characteristics** 

- SLP0603P2X3F package 

- Pb-Free, Halogen Free, RoHS/WEEE compliant 

- Nominal Dimensions: 0.6 x 0.3 x 0.25 mm 

- Lead Finish: NiAu 

- Marking: Marking code 

- Packaging: Tape and Reel 

## **Applications** 

- Near Field Communication (NFC) lines 

- RF signal lines 

- FM Antenna 

## **Schematic & Pin Configuration** 

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1<br>2<br>SLP0603P2X3F (Bottom View)<br>**----- End of picture text -----**<br>


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## **Absolute Maximum Rating** 

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Rating Symbol Value Units<br>**----- End of picture text -----**<br>


|**Rating**|**Symbol**|**Value**|**Units**|
|---|---|---|---|
|||||
|Peak Pulse Power (tp = 8/20µs)|PPK|32|W|
|Peak Pulse Current (tp = 8/20µs)|IPP|4|A|
|ESD per IEC 61000-4-2 (Air)(1)<br>ESDper IEC 61000-4-2 (Contact)(1)|VESD|±18<br>±14|kV|
|Operating Temperature|TJ|-40 to +85|OC|
|Storage Temperature|TSTG|-55 to +150|OC|



## **Electrical Characteristics (T=25[O] C unless otherwise specified)** 

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Parameter  Symbol Conditions Min. Typ. Max. Units<br>**----- End of picture text -----**<br>


|**Parameter**|**Symbol**|**Conditions**|**Min.**|**Typ.**|**Max. **|**Units**|
|---|---|---|---|---|---|---|
||||||||
|Reverse Stand-Of Voltage|VRWM|Pin 1 to 2 or Pin 2 to 1|||24|V|
|Breakdown Voltage|VBR|IBR= 10 μ`A`|25.5|27.5|31|V|
|Reverse Leakage Current|IR|VRWM= 24V||<1|50|nA|
|Clamping Voltage2|VC|IPP= 1A, tp = 1.2/50µs (Voltage), 8/20µs<br>(Current) Combination Waveform, RS= 12 Ω||4.5|7|V|
|Clamping Voltage2|VC|IPP= 4A, tp = 1.2/50µs (Voltage), 8/20µs<br>(Current) Combination Waveform, RS= 12 Ω||5.5|8||
|ESD Clamping Voltage3|VC|I = 4A, tp = 0.2/100ns||5||V|
|||I = 16A, tp = 0.2/100ns||7|||
|Dynamic Resistance3,4|RDYN|tp = 0.2/100ns||0.16||Ω|
|Junction Capacitance|CJ|VR= 0V, f = 1MHz||0.35|0.45|pF|



## Notes: 

(1) ESD gun return path connected to Ground Reference Plane (GRP) 

(2) Measured using a 1.2/50μs voltage, 8/20μs current combination waveform, RS = 12 Ω.  Clamping is defined as the peak voltage across the device after the device snaps back to a conducting state. 

(3) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 

(4) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A. 

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## **Typical Characteristics** 

## **ESD Clamping (8kV Contact per IEC 61000-4-2)** 

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100<br>TA = 25 [O] C.<br>Waveform IEC61000-4-2 8kV contact discharge.<br>Measured with and corrected for 50Ω, 40dB Attenuator.<br>80 50Ω Scope Input Impedance, ≥2GHz BW.<br>ESD Gun Return connected to ESD Ground Plane.<br>60<br>40<br>20<br>0<br>-20<br>-10 0 10 20 30 40 50 60 70 80<br>Time (ns)<br>Clamping Voltage (V)<br>**----- End of picture text -----**<br>


## **TLP Characteristic (Positive Pulse)** 

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30<br>Transmission Line Pulse Test<br>(TLP) Settings:<br>25 tp = 100ns, tr = 0.2ns,<br>ITLP and VTLP averaging window:<br>20 t1 = 70ns to t2 = 90ns<br>15<br>10<br>5<br>0<br>-5<br>0 5 10 15 20 25 30<br>Clamping Voltage (V)<br>TLP Current (A)<br>**----- End of picture text -----**<br>


## **Junction Capacitance vs. Reverse Voltage** 

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0.5<br>0.45<br>0.4<br>0.35<br>0.3<br>0.25<br>0.2<br>0.15<br>0.1<br>0.05 f = 1 MHz<br>0<br>0 5 10 15 20 25 30<br>Reverse Voltage - VR (V)<br>(pF) Junction Capacitance - CJ<br>**----- End of picture text -----**<br>


## **ESD Clamping (-8kV Contact per IEC 61000-4-2)** 

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20<br>0<br>-20<br>-40<br>-60<br>TA = 25 [O] C.<br>Waveform IEC61000-4-2 8kV contact discharge.<br>-80 Measured with and corrected for 50Ω, 40dB Attenuator.<br>50Ω Scope Input Impedance, ≥2GHz BW.<br>ESD Gun Return connected to ESD Ground Plane.<br>-100<br>-10 0 10 20 30 40 50 60 70 80<br>Time (ns)<br>Clamping Voltage (V)<br>**----- End of picture text -----**<br>


## **TLP Characteristic (Negative Pulse)** 

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5<br>0<br>-5<br>-10<br>-15<br>-20 Transmission Line Pulse Test<br>(TLP) Settings:<br>-25 tITLPp = 100ns, t and VTLP averaging window: r = 0.2ns,<br>t1 = 70ns to t2 = 90ns<br>-30<br>-30 -25 -20 -15 -10 -5 0<br>Clamping Voltage (V)<br>TLP Current (A)<br>**----- End of picture text -----**<br>


## **Typical Insertion Loss -S21** 

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0<br>-3<br>-6<br>-9<br>-12<br>RClamp2451ZA_IL_SPCD<br>-15<br>0.01 0.1 1 10<br>Frequency (GHz)<br>Insertion Loss (dB)<br>**----- End of picture text -----**<br>


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## **Application Information** 

## **ESD Protection of NFC Interfaces** 

The Near Field Communication (NFC) antenna is usually connected to the NFC controller IC via contact points on the phone.  These contact points are user accessable and therefore may be subjected to ESD strikes.  External protection (TVS) devices should be placed between the antenna and the NFC chip interface. The working voltage of the TVS should be high enough as not to clip the NFC signal.  Additionally, the capacitance of the device should be minimized in 

order to avoid harmonic distortion of the RF signal. RClamp2451ZA meets these requirements and also features extremely low dynamic resistance (<0.2 Ohms) resulting in low ESD clamping voltage. The low dynamic resistance also helps insure protection for Schottky diodes that may be used in the NFC circuit. RClamp2451ZA is designed to work on NFC circuits with AC signals as high as 24V.  An example protection ciruit using RClamp2451ZA is shown below in Figure 1. 

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RX+ RX-<br>Antenna+<br>Antenna<br>TX+ EMI Filter Matching YJ<br>Ckt Ckt X\/7<br>RClamp2451ZA<br>/\<br>NFC [\ GND<br>Controller ()~<br>Wy [7]<br>\ /<br>RClamp2451ZA<br>/ \ / \<br>Antenna<br>TX- EMI Filter<br>Ckt Matching C YY)<br>Ckt Antenna-<br>REC<br>R C<br>**----- End of picture text -----**<br>


**Figure 1 - NFC  Protection Example** 

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## **Application Information** 

## **Assembly Guidelines** 

The small size of this device means that some care must be taken during the mounting process to insure reliable solder joints.  The figure at the right details Semtech’s recommended mounting pattern.  Recommended assembly guidelines are shown in Table 1.  Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process.  Exact manufacturing parameters will require some experimentation to get the desired solder application. 

## **Solder Stencil** 

Stencil design is one of the key factors which will determine the volume of solder paste which is deposited onto the land pad.  The area ratio of the stencil aperture will determine how well the stencil will print.  The area ratio takes into account the aperture shape, aperture size, and stencil thickness.  A minimum area ratio of 0.66 is preferred for the subject package.  The area ratio of a rectangular aperture is given as: 

Area Ratio = (L * W )/ (2 * (L + W) * T) 

Where: 

L = Aperture Length W = Aperture Width T = Stencil Thickness 

Semtech recommends a stencil with square aperture and rounded corners for consistent solder release.  The stencil should be laser cut with electropolished finish.  A stencil thickness of 0.075mm (0.003”) is recommended. A 0.100mm (0.004”) stencil may be used, however the stencil opening may need to be increased slightly to achieve the desired area ratio to ensure proper solder coverage on the pad. 

## **Recommended Mounting Pattern** 

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Component Land Pattern<br>0.270<br>0.620<br>0.675<br>0.175<br>0.250<br>0.320<br>Stencil Opening<br>All Dimensions are in mm.<br>Land Pad. Stencil opening Component<br>**----- End of picture text -----**<br>


**Table 1 - Assembly Guidelines** 

|**Assembly Parameter**|**Recommendation**|
|---|---|
|Solder Stencil Design|Laser Cut,Electro-Polished|
|Aperture Shape|Rectangular with<br>Rounded Corners|
|Solder Stencil Thickness|0.075mm (0.003”) or<br>0.100mm(0.004”)|
|Solder Paste Type|Type 4 Size Sphere or<br>Smaller|
|Solder Refow Profle|Per JEDEC J-STD-020|
|PCB Solder Pad Design|Solder Mask Defned|
|PCB Pad Finish|OSP or NiAu|



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## **Outline Drawing - SLP0603P2X3F** 

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A D B DIMENSIONS<br>MILLIMETERS<br>DIM<br>MIN NOM MAX<br>A 0.235 0.250 0.265<br>E A1 0.000 0.010 0.050<br>b 0.200 0.220 0.240<br>D 0.580 0.600 0.620<br>E 0.280 0.300 0.320<br>e 0.355 BSC<br>TOP VIEW L 0.140 0.160 0.180<br>N 2<br>aaa 0.08<br>bbb 0.10<br>A<br>SEATING<br>aaa C PLANE<br>C<br>A1<br>e/2<br>R0.025<br>TYP<br>bxN<br>bbb C A B<br>2X L<br>e<br>BOTTOM VIEW<br>NOTES:<br>1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).<br>**----- End of picture text -----**<br>


## **Land Pattern - SLP0603P2X3F** 

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DIMENSIONS<br>DIM MILLIMETERS<br>Z (C) (0.425)<br>(C) G G 0.175<br>X 0.270<br>Y 0.250<br>Z 0.675<br>Y<br>X<br>**----- End of picture text -----**<br>


## NOTES: 

1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 

2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 

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## **Marking Code** 

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e<br>**----- End of picture text -----**<br>


Notes: Device is electrically symmetrical. 

## **Tape and Reel Specification** 

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## **Orderin Information g** 

|**Part Number**|**Qty per Reel**|**Reel Size**|
|---|---|---|
|RClamp2451ZATFT|15,000|7”|
|RailClamp and RClamp are registered trademarks of Semtech Corporation.|||



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## **IMPORTANT NOTICE** 

**Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.** 

**SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE.  INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise.** 

**The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved.** 

## **© Semtech 2015** 

## **Contact Information** 

**Semtech Corporation 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com** 

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