# Small Signal Schottky Diode, Single, 30 V, 200 mA, 500 mV, 1 A, 125 °C

![Product image](https://novapart.co/image/farnell:2317433RL/)

**URL**: https://novapart.co/products/RB521S30T1G/small-signal-schottky-diode-single-30-v-200-ma-500
**SKU**: RB521S30T1G
**Manufacturer**: ONSEMI
**Price**: €0.0300
**Stock**: 1000+
**Lead Time**: 132 days (indicative)

## Description

Diode Configuration:Single; Repetitive Reverse Voltage Vrrm Max:30V; Forward Current If(AV):200mA; Forward Voltage VF Max:500mV; Forward Surge Current Ifsm Max:1A; Operating Temper

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | RB521 |
| Qualification | AEC-Q101 |
| Diode Mounting | Surface Mount |
| Diode Case Style | SOD-523 |
| Diode Configuration | Single |
| Forward Voltage Max | 500mV |
| Forward Surge Current | 1A |
| Reverse Recovery Time | - |
| Average Forward Current | 200mA |
| Operating Temperature Max | 125°C |
| Repetitive Peak Reverse Voltage | 30V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2317433RL/)

## RB521S30T1G, NSVRB521S30T1G, RB521S30T5G 

## Schottky Barrier Diode 

These Schottky barrier diodes are designed for high−speed switching applications, circuit protection, and voltage clamping. Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for hand−held and portable applications where space is limited. 

**www.onsemi.com** 

## **30 V SCHOTTKY BARRIER DIODE** 

## **Features** 

- Extremely Fast Switching Speed 

- Extremely Low Forward Voltage 0.5 V (max) @ IF = 200 mA 

**SOD−523 CASE 502** 

- Low Reverse Current 

- NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

1 2 CATHODE ANODE 

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant* **MARKING DIAGRAM MAXIMUM RATINGS** 5M M **Rating Symbol Value Unit** 1 2 Reverse Voltage VR 30 Vdc Forward Current DC IF 200 mA 5M = Device Code M = Date Code* Peak Forward Surge Current (Note 1) IFSM 1.0 A = Pb−Free Package ESD Rating: Class 1C per Human Body Model (Note: Microdot may be in either location) ESD Rating: Class C per Machine Model ~~oS~~ *Date Code orientation may vary depending upStresses exceeding those listed in the Maximum Ratings table may damage the on manufacturing location. device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. **ORDERING INFORMATION** 1. 60 Hz for 1 cycle. 

(Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. 

**ORDERING INFORMATION Device Package Shipping**[†] RB521S30T1G SOD−523 4 mm Pitch (Pb−Free) 3,000/Tape & Reel NSVRB521S30T1G SOD−523 **4 mm Pitch** (Pb−Free) **3,000/Tape & Reel** RB521S30T5G SOD−523 2 mm Pitch (Pb−Free) 8,000/Tape & Reel ~~==~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Max**|**Unit**|
|Total Device Dissipation FR−5 Board,<br>(Note 2)<br>TA= 25°C<br>Derate above 25°C|PD|200<br>1.57|mW<br>mW/°C|
|Thermal Resistance,<br>Junction−to−Ambient|R JA|635|°C/W|
|Junction and Storage Temperature<br>Range|TJ, Tstg|−55 to +125|°C|



2. FR−5 Minimum Pad. 

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: **RB521S30T1/D** 

**1** 

© Semiconductor Components Industries, LLC, 2015 **November, 2015 − Rev. 9** 

**RB521S30T1G, NSVRB521S30T1G,  RB521S30T5G** 

**ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

**==> picture [494 x 644] intentionally omitted <==**

**----- Start of picture text -----**<br>
Characteristic Symbol Min Typ Max Unit<br>Reverse Leakage (VR = 10 V) IR − − 30.0 � A<br>Forward Voltage (IF = 200 mA) VF − − 0.50 Vdc<br>1<br>T A  = 125 ° C<br>100m<br>10m TA = 75 ° C<br>1m<br>100 �<br>T A  = 25 ° C<br>10 �<br>TA = −25 ° C<br>1 �<br>0 0.1 0.2 0.3 0.4 0.5 0.6<br>VF, FORWARD VOLTAGE (V)<br>Figure 1. Forward Characteristics<br>10m<br>1m<br>TA = 125 ° C<br>100 �<br>TA = 75 ° C<br>10 �<br>1 � TA = 25 ° C<br>100n<br>TA = −25 ° C<br>10n<br>1n<br>0 5 10 15 20 25 30<br>VR, REVERSE VOLTAGE (VOLTS)<br>Figure 2. Reverse Characteristics<br>20<br>18<br>16<br>14<br>12<br>10<br>8<br>6<br>4<br>2<br>0<br>0 5 10 15 20 25 30<br>VR, REVERSE VOLTAGE (VOLTS)<br>, FORWARD CURRENT (A)<br>IF<br>, REVERSE CURRENT (A)<br>IR<br>, TOATAL CAPACITANCE (pF)<br>T<br>C<br>**----- End of picture text -----**<br>


**Figure 3. Total Capacitance** 

**www.onsemi.com** 

**2** 

**RB521S30T1G, NSVRB521S30T1G,  RB521S30T5G** 

## **PACKAGE DIMENSIONS** 

**SOD−523** CASE 502 ISSUE E 

**==> picture [162 x 280] intentionally omitted <==**

**----- Start of picture text -----**<br>
−X−<br>D<br>−Y−<br>— —<br>E<br>1 2<br>2X b rq<br>0.08 M X Y<br>TOP VIEW<br>A<br>id<br>c J, HE<br>SIDE VIEW<br>aoe 2X L<br>2X L2<br>fees<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


NOTES: 

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 

2. CONTROLLING DIMENSION: MILLIMETERS. 

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 

**==> picture [189 x 121] intentionally omitted <==**

**----- Start of picture text -----**<br>
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-<br>TRUSIONS, OR GATE BURRS.<br>MILLIMETERS<br>DIM MIN NOM MAX<br>A 0.50 0.60 0.70<br>b 0.25 0.30 0.35<br>c 0.07 0.14 0.20<br>D 1.10 1.20 1.30<br>E 0.70 0.80 0.90<br>H E 1.50 1.60 1.70<br>L 0.30 REF<br>L2 0.15 0.20 0.25<br>====<br>STYLE 1:<br>PIN 1. CATHODE (POLARITY BAND)<br>2. ANODE<br>**----- End of picture text -----**<br>


**==> picture [143 x 104] intentionally omitted <==**

**----- Start of picture text -----**<br>
RECOMMENDED<br>SOLDERING FOOTPRINT*<br>2X 1.80<br>0.48 2X<br>0.40<br>Teal,<br>PACKAGE ao<br>OUTLINE DIMENSION: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

ON Semiconductor and the         are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf.  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**N. American Technical Support** : 800−282−9855 Toll Free **ON Semiconductor Website** : **www.onsemi.com** USA/Canada **Europe, Middle East and Africa Technical Support: Order Literature** : http://www.onsemi.com/orderlit Phone: 421 33 790 2910 **Japan Customer Focus Center** For additional information, please contact your local Phone: 81−3−5817−1050 Sales Representative 

## **LITERATURE FULFILLMENT** : 

Literature Distribution Center for ON Semiconductor USA/Canada 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA **Europe, Middle East and Africa Technical Support: Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Japan Customer Focus Center Email** : orderlit@onsemi.com Phone: 81−3−5817−1050 

**www.onsemi.com** 

**RB521S30T1/D** 

**3** 



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