# Small Signal Schottky Diode, Single, 30 V, 200 mA, 600 mV, 200 mA, 150 °C

![Product image](https://novapart.co/image/farnell:2441757/)

**URL**: https://novapart.co/products/RB520S30T1G/small-signal-schottky-diode-single-30-v-200-ma-600
**SKU**: RB520S30T1G
**Manufacturer**: ONSEMI
**Price**: €0.0160
**Stock**: 10+
**Lead Time**: 127 days (indicative)

## Description

Diode Configuration:Single; Repetitive Reverse Voltage Vrrm Max:30V; Forward Current If(AV):200mA; Forward Voltage VF Max:600mV; Forward Surge Current Ifsm Max:200mA; Operating Tem

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | RB520 |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | SOD-523 |
| Diode Configuration | Single |
| Forward Voltage Max | 600mV |
| Forward Surge Current | 200mA |
| Reverse Recovery Time | - |
| Average Forward Current | 200mA |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 30V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2441757/)

## RB520S30T1G, RB520S30T5G 

## Schottky Barrier Diode 

These Schottky barrier diodes are designed for high−speed switching applications, circuit protection, and voltage clamping. Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for hand−held and portable applications where space is limited. 

## **Features** 

- Extremely Fast Switching Speed 

**http://onsemi.com** 

## **30 VOLT SCHOTTKY BARRIER DIODE** 

- Extremely Low Forward Voltage 0.6 V (max) @ IF = 200 mA 

- Low Reverse Current 

- ESD Rating: Class 3B per Human Body Model Class C per Machine Model 

1 2 CATHODE ANODE 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

**MAXIMUM RATINGS** 

**Rating Symbol Value Unit** Reverse Voltage VR 30 Vdc Forward Current DC IF 200 mA ~~——~~ Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. **THERMAL CHARACTERISTICS Characteristic Symbol Max Unit** ~~ee~~ Total Device Dissipation FR−5 Board, ~~ee~~ PD 200 ~~ee~~ mW (Note 1) TA = 25 ° C Derate above 25 ° C 1.57 mW/ ° C Thermal Resistance, Junction−to−Ambient R JA 635 ° C/W ~~H———~~ Junction and Storage Temperature Range TJ, Tstg −55 to +150 ° C 

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2<br>1<br>SOD−523<br>CASE 502<br>**----- End of picture text -----**<br>


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MARKING DIAGRAM<br>**----- End of picture text -----**<br>


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5J M<br>1 2<br>5J iL} = Device Code<br>M = Date Code*<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>*Date Code orientation position may vary depending<br>upon manufacturing location.<br>**----- End of picture text -----**<br>


1. FR−5 Minimum Pad. 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**Characteristic**<br>|**Symbol**<br>|**Min**<br>|**Typ**<br>|**Max**<br>|**Unit**<br>|
|---|---|---|---|---|---|
|Reverse Leakage<br>(VR= 10 V)<br>|IR<br>|−<br>|−<br>|1.0<br>|A<br>|
|Forward Voltage<br>(IF= 200 mA)<br>|VF<br>|−<br>|−<br>|0.60<br>|Vdc<br>|



**ORDERING INFORMATION** 

**Device Package Shipping**[†] RB520S30T1G SOD−523 4 mm Pitch (Pb−Free) 3000/Tape & Reel RB520S30T5G SOD−523 2 mm Pitch (Pb−Free) 8000/Tape & Reel ~~=~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Publication Order Number: **RB520S30T1/D** 

**1** 

© Semiconductor Components Industries, LLC, 2011 **August, 2011 − Rev. 10** 

**RB520S30T1G, RB520S30T5G** 

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820  �<br>+10 V 2 k<br>100 �H IF 0.1 �F t tp t IF<br>r<br>0.1  � F 10% trr t<br>DUT<br>50  �  Output 50  �  Input 90%<br>Pulse Sampling iR(REC) = 1 mA<br>Generator Oscilloscope VR IR OUTPUT PULSE<br>INPUT SIGNAL<br>(IF = IR = 10 mA; measured<br>at iR(REC) = 1 mA)<br>Notes: 1. A 2.0 k �  variable resistor adjusted for a Forward Current (IF) of 10 mA.<br>Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.<br>Notes: 3. tp » trr<br>**----- End of picture text -----**<br>


**Figure 1. Recovery Time Equivalent Test Circuit** 

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200 1000<br>100 TA =  150° C<br>100<br>T A  =  125° C<br>1�50° C 10<br>10<br>1.0<br>1�25° C T A  =  85° C<br>0.1<br>1.0<br>85° C<br>25° C − �40° C − 55° C 0.01<br>T A = 25 ° C<br>0.1 0.001<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0 5 10 15 20 25 30<br>VF, FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>A)<br>�<br>, FORWARD CURRENT (mA)IF , REVERSE CURRENT (IR<br>**----- End of picture text -----**<br>


**Figure 2. Forward Voltage** 

**Figure 3. Leakage Current** 

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14<br>12<br>10<br>8<br>6<br>4<br>2<br>0<br>0 5 10 15 20 25 30<br>VR, REVERSE VOLTAGE (VOLTS)<br>, TOTAL CAPACITANCE (pF)T<br>C<br>**----- End of picture text -----**<br>


**Figure 4. Total Capacitance** 

**http://onsemi.com** 

**2** 

**RB520S30T1G, RB520S30T5G** 

## **PACKAGE DIMENSIONS** 

**SOD−523** CASE 502−01 ISSUE E 

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−X−<br>D NOTES:<br>—a −Y− 1.2. CONTROLLING DIMENSION: MILLIMETERS.<br>— 3.<br>E<br>BASE MATERIAL.<br>1 2 4.<br>2X b SE TRUSIONS, OR GATE BURRS.<br>0.08 M X Y MILLIMETERS<br>DIM MIN NOM MAX<br>TOP VIEW A 0.50 0.60 0.70<br>b 0.25 0.30 0.35<br>c 0.07 0.14 0.20<br>D 1.10 1.20 1.30<br>E 0.70 0.80 0.90<br>A H E 1.50 1.60 1.70<br>L 0.30 REF<br>L2 0.15 0.20 0.25<br>c ot) HE EE<br>RECOMMENDED<br>SIDE VIEW SOLDERING FOOTPRINT*<br>2X 1.80<br>2X L 0.48 2X<br>PACKAGE<br>2X L2 OUTLINE DIMENSION: MILLIMETERS<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


- DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 

2. CONTROLLING DIMENSION: MILLIMETERS. 

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO- 

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2X 1.80<br>0.48 2X<br>0.40<br>PACKAGE<br>OUTLINE DIMENSION: MILLIMETERS<br>**----- End of picture text -----**<br>


- *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

## **LITERATURE FULFILLMENT** : 

**N. American Technical Support** : 800−282−9855 Toll Free **ON Semiconductor Website** : **www.onsemi.com** 

Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA **Europe, Middle East and Africa Technical Support: Order Literature** : http://www.onsemi.com/orderlit **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Japan Customer Focus Center** For additional information, please contact your local **Email** : orderlit@onsemi.com Phone: 81−3−5773−3850 Sales Representative 

**RB520S30T1/D** 

**http://onsemi.com 3** 



## Links

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- [Supplier page](https://es.farnell.com/onsemi/rb520s30t1g/diode-schottky-200ma-30v-sod-523/dp/2441757)
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