# Small Signal Schottky Diode, Single, 30 V, 200 mA, 600 mV, 200 mA, 150 °C

![Product image](https://novapart.co/image/farnell:2317425RL/)

**URL**: https://novapart.co/products/RB520S30T1G/small-signal-schottky-diode-single-30-v-200-ma-600
**SKU**: RB520S30T1G
**Manufacturer**: ONSEMI
**Price**: €0.0250
**Stock**: 10+
**Lead Time**: 132 days (indicative)

## Description

Diode Configuration:Single; Repetitive Reverse Voltage Vrrm Max:30V; Forward Current If(AV):200mA; Forward Voltage VF Max:600mV; Forward Surge Current Ifsm Max:200mA; Operating Tem

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | RB520 |
| Qualification | AEC-Q101 |
| Diode Mounting | Surface Mount |
| Diode Case Style | SOD-523 |
| Diode Configuration | Single |
| Forward Voltage Max | 600mV |
| Forward Surge Current | 200mA |
| Reverse Recovery Time | - |
| Average Forward Current | 200mA |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 30V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2317425RL/)

## RB520S30T1G, RB520S30T5G 

## Schottky Barrier Diode 

These Schottky barrier diodes are designed for high−speed switching applications, circuit protection, and voltage clamping. Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for hand−held and portable applications where space is limited. 

## **Features** 

- Extremely Fast Switching Speed 

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## **30 VOLT SCHOTTKY BARRIER DIODE** 

- Extremely Low Forward Voltage 0.6 V (max) @ IF = 200 mA 

- Low Reverse Current 

- ESD Rating: Class 3B per Human Body Model Class C per Machine Model 

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1 2<br>CATHODE ANODE<br>2<br>1<br>SOD−523<br>CASE 502<br>w<br>**----- End of picture text -----**<br>


- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

**MAXIMUM RATINGS** 1 **Rating Symbol Value Unit SOD−523** Reverse Voltage VR 30 Vdc **CASE 502** Forward Current DC IF 200 mA ~~p+ w~~ Stresses exceeding those listed in the Maximum Ratings table may damage the ~~+ +4~~ device. If any of these limits are exceeded, device functionality should not be **MARKING DIAGRAM** assumed, damage may occur and reliability may be affected. **THERMAL CHARACTERISTICS** 5J M **Characteristic Symbol Max Unit** 1 2 Total Device Dissipation FR−5 Board, PD 200 mW (Note 1) TA = 25 ° C Derate above 25 ° C 1.57 mW/ ° C 5J = Device Code M = Date Code* ~~——~~ Thermal Resistance, Junction−to−Ambient R JA 635 ° C/W = Pb−Free Package Junction and Storage Temperature Range TJ, Tstg −55 to +150 ° C (Note: Microdot may be in either location) Non−Repetitive Peak Forward Current, tp < 10 msec IFSM 600 mA *Date Code orientation position may vary dependingupon manufacturing location. ~~ee~~ Repetitive Peak Forward Current IFRM 300 mA Pulse Wave = 1 sec, Duty Cycle =  66% **ORDERING INFORMATION** Thermal Resistance, R JA 635 ° C/W Junction−to−Ambient **Device Package Shipping**[†] 1. FR−5 Minimum Pad. RB520S30T1G SOD−523 4 mm Pitch **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) (Pb−Free) 3000/Tape & Reel RB520S30T5G SOD−523 2 mm Pitch **Characteristic Symbol Min Typ Max Unit** (Pb−Free) 8000/Tape & Reel ~~ee~~ Reverse Leakage ~~ce~~ IR − − 1.0 A ~~aa~~ (VR = 10 V) †For information on tape and reel specifications, Forward Voltage VF − − 0.60 Vdc including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications ~~ee~~ (IF = 200 mA) ~~ee ee~~ Brochure, BRD8011/D. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2011 **August, 2017 − Rev. 11** 

**RB520S30T1/D** 

**RB520S30T1G, RB520S30T5G** 

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820  �<br>+10 V 2 k<br>100 �H IF 0.1 �F t t p t IF<br>r<br>0.1  � F 10% t rr t<br>DUT<br>50  �  Output 50  �  Input 90%<br>Pulse Sampling iR(REC) = 1 mA<br>Generator Oscilloscope VR IR OUTPUT PULSE<br>INPUT SIGNAL<br>(IF = IR = 10 mA; measured<br>at iR(REC) = 1 mA)<br>**----- End of picture text -----**<br>


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Notes: 1. A 2.0 k �  variable resistor adjusted for a Forward Current (IF) of 10 mA.<br>Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.<br>Notes: 3. tp » trr<br>**----- End of picture text -----**<br>


**Figure 1. Recovery Time Equivalent Test Circuit** 

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200 1000<br>100 TA =  150° C<br>100<br>T A  =  125° C<br>1�50° C 10<br>10<br>1.0<br>1�25° C T A  =  85° C<br>0.1<br>1.0<br>85° C<br>25° C − �40° C − 55° C 0.01<br>TA =  25 ° C<br>0.1 0.001<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0 5 10 15 20 25 30<br>VF, FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>Figure 2. Forward Voltage Figure 3. Leakage Current<br>14 25<br>Based on square wave currents<br>12 TJ = 25 ° C prior to surge<br>20<br>10<br>15<br>8<br>6 10<br>4<br>5<br>2<br>0 0<br>0 5 10 15 20 25 30 0.001 0.01 0.1 1 10 100 1000<br>VR, REVERSE VOLTAGE (VOLTS) tP, PULSE ON TIME (ms)<br>A)<br>�<br>, FORWARD CURRENT (mA)IF , REVERSE CURRENT (IR<br>, TOTAL CAPACITANCE (pF)T<br>C<br>, FORWARD SURGE MAX CURRENT (A)<br>IFSM<br>**----- End of picture text -----**<br>


**Figure 4. Total Capacitance** 

**Figure 5. Forward Surge Current** 

**www.onsemi.com** 

**2** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

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o 2 © 2<br>1 1<br>STYLE 1 STYLE 2<br>SCALE 4:1<br>−X−<br>D<br>−Y−<br>— —<br>E<br>1 2<br>2X b qe<br>0.08 M X Y<br>TOP VIEW<br>A<br>id 4,<br>c IL HE<br>SIDE VIEW<br>2X L<br>ste<br>2X L2 JE<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


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RECOMMENDED<br>SOLDERING FOOTPRINT*<br>2X 1.80<br>0.48 2X<br>0.40<br>TH ) ,<br>PACKAGE ao<br>OUTLINE DIMENSION: MILLIMETERS<br>**----- End of picture text -----**<br>


**SOD−523** CASE 502−01 ISSUE E 

## DATE 28 SEP 2010 

## NOTES: 

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 

2. CONTROLLING DIMENSION: MILLIMETERS. 

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 

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4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-<br>TRUSIONS, OR GATE BURRS.<br>MILLIMETERS<br>DIM MIN NOM MAX<br>A 0.50 0.60 0.70<br>b 0.25 0.30 0.35<br>c 0.07 0.14 0.20<br>D 1.10 1.20 1.30<br>E 0.70 0.80 0.90<br>H E 1.50 1.60 1.70<br>L 0.30 REF<br>L2 0.15 0.20 0.25<br>====<br>GENERIC<br>MARKING DIAGRAM*<br>XX XX<br>1 2 1 2<br>dj Ff q_<br>STYLE 1 STYLE 2<br>XX = Specific Device Code<br>M  Date Code Ff<br>*This information is generic. Please refer to<br>device data sheet for actual part marking.<br>Pb−Free indicator, “G” or microdot “ ”,<br>may or may not be present.<br>STYLE 1: STYLE 2:<br>PIN 1. CATHODE (POLARITY BAND) NO POLARITY<br>2. ANODE<br>M M<br>**----- End of picture text -----**<br>


- *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98AON11524D** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: SOD−523 PAGE 1 OF 1** ~~_ 1~~ ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : **TECHNICAL SUPPORT Email Requests to:** orderlit@onsemi.com **North American Technical Support: Europe, Middle East and Africa Technical Support:** Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 00421 33 790 2910 **onsemi Website:** www.onsemi.com Phone: 011 421 33 790 2910 For additional information, please contact your local Sales Representative 

◊ 

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