# Power MOSFET, P Channel, 30 V, 2 A, 0.135 ohm, TSMT, Surface Mount

![Product image](https://novapart.co/image/farnell:1525469/)

**URL**: https://novapart.co/products/QS5U33TR/power-mosfet-p-channel-30-v-2-a-0135-ohm-tsmt
**SKU**: QS5U33TR
**Manufacturer**: ROHM
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2280
**Stock**: 10+
**Lead Time**: 134 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:2A; Drain Source Voltage Vds:-30V; On Resistance Rds(on):0.225ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:-2.5V; Power Dissipat

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 5Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 1.25W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TSMT |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | - |
| Continuous Drain Current Id | 2A |
| Drain Source On State Resistance | 0.135ohm |
| Gate Source Threshold Voltage Max | 2.5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1525469/)

Datasheet 

## QS5U33 

## 4V Drive Pch+SBD MOSFET 

## **l Outline** 

**==> picture [166 x 84] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||
|---|---|
|VDSS|-30V|
|RDS(on)(Max.)|225mΩ|
|ID|±2.0A|
|PD|1.25W|

**----- End of picture text -----**<br>


TSMT5 

## **l Inner circuit** 

## **l Features** 

- 1) The QS5U33 combines Pch MOSFET with a Schottky barrier diode in a single TSMT5 package. 

- 2) Low on-state resistance with fast swicthing 

- 3) Low voltage drive (4V drive). 

- 4) Built-in Low VF schottky barrier diode. 

- 5) Pb-free lead plating ; RoHS compliant. 

## **l Application** 

Load switch, DC/ DC conversion 

## **l Packaging specifications** 

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||||
|---|---|---|
|Embossed|
|Packing|
|Tape|
|Reel size (mm)|180|
|Type|Tape width (mm)|8|
|Basic ordering unit (pcs)|3000|
|Taping code|TR|
|Marking|U33|

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## **l Absolute maximum ratings** (Ta = 25°C) 

## **<MOSFET>** 

**==> picture [510 x 187] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||
|---|---|---|---|---|
|Parameter|Symbol|Value|Unit|
|Drain - Source voltage|VDSS|-30|V|
|Gate - Source voltage|VGSS|±20|V|
|Continuous drain current|ID|±2.0|A|
|Pulsed drain current|I|±8.0|A|
|D, pulse|[*1]|
|Continuous source current (body diode)|IS|-0.75|A|
|Pulsed source current (body diode)|IS, pulse|[*1]|-8.0|A|
|Power dissipation|PD|[*3]|0.9|W/element|
|Junction temperature|Tj|150|℃|

**----- End of picture text -----**<br>


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**QS5U33** 

Datasheet 

## **l Absolute maximum ratings** (Ta = 25°C) 

## **<SBD>** 

|**<SBD>**||||
|---|---|---|---|
|Parameter|Symbol|Value|Unit|
|Repetitive peak reverse voltage|VRM|25|V|
|Reverse voltage|VR|20|V|
|Forward current|IF|1.0|A|
|Forward current surge peak|IFSM*2|3.0|A|
|Power dissipation|PD*3|0.7|W/element|
|Junction temperature|Tj|150|℃|



## **<MOSFET + SBD>** 

|**<MOSFET + SBD>**||||
|---|---|---|---|
|Parameter|Symbol|Value|Unit|
|Power dissipation|PD*3|1.25|W/total|
|Range of storage temperature|Tstg|-55 to +150|℃|



## **l Electrical characteristics (Ta = 25°C)** 

## **<MOSFET>** 

|Parameter|Symbol|Conditions|Values|Values|Values|Unit|
|---|---|---|---|---|---|---|
||||Min.|Typ.|Max.||
|Gate - Source leakage current|IGSS|VGS= ±20V, VDS= 0V|-|-|±10|μA|
|Drain - Source breakdown<br>voltage|V(BR)DSS|VGS= 0V, ID= -1mA|-30|-|-|V|
|Zero gate voltage<br>drain current|IDSS|VDS= -30V, VGS= 0V|-|-|-1|μA|
|Gate threshold voltage|VGS(th)|VDS= -10V, ID= -1mA|-1.0|-|-2.5|V|
|Static drain - source<br>on - state resistance|RDS(on)*4|VGS= -10V, ID= -2A|-|95|135|mΩ|
|||VGS= -4.5V, ID= -1A|-|145|205||
|||VGS= -4.0V, ID= -1A|-|160|225||
|Transconductance|gfs*4|VDS= -10V, ID= -1A|1.4|-|-|S|



www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. 

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Datasheet 

## **l Electrical characteristics** (Ta = 25°C) 

## **<MOSFET>** 

|**<MOSFET>**|||||||
|---|---|---|---|---|---|---|
|Parameter|Symbol|Conditions|Values|||Unit|
||||Min.|Typ.|Max.||
|Input capacitance|Ciss|VGS= 0V<br>VDS= -10V<br>f = 1MHz|-|310|-|pF|
|Output capacitance|Coss||-|55|-||
|Reverse transfer capacitance|Crss||-|45|-||
|Turn - on delay time|td(on)*4|VDD ⋍-15V, VGS= -10V<br>ID= -1A<br>RL= 15Ω<br>RG= 10Ω|-|7|-|ns|
|Rise time|tr*4||-|6|-||
|Turn - off delay time|td(off)*4||-|25|-||
|Fall time|tf*4||-|6|-||



## **l Gate charge characteristics** (Ta = 25°C) 

## **<MOSFET>** 

|Parameter|Symbol|Conditions|Values|Values|Values|Unit|
|---|---|---|---|---|---|---|
||||Min.|Typ.|Max.||
|Total gate charge|Qg*4|VDD ⋍-15V, ID= -2A<br>VGS= -5V|-|3.4|-|nC|
|Gate - Source charge|Qgs*4||-|1.0|-||
|Gate - Drain charge|Qgd*4||-|1.3|-||



## **l Body diode electirical characteristics** (Source-Drain) (Ta = 25°C) 

## **<MOSFET>** 

|**<MOSFET>**|||||||
|---|---|---|---|---|---|---|
|Parameter|Symbol|Conditions|Values|||Unit|
||||Min.|Typ.|Max.||
|Forward voltage|VSD*4|VGS= 0V, IS= -0.75A|-|-|-1.2|V|



www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. 

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Datasheet 

## **l Electrical characteristics** (Ta = 25°C) 

## **<SBD>** 

|**<SBD>**|||||||
|---|---|---|---|---|---|---|
|Parameter|Symbol|Conditions|Values|||Unit|
||||Min.|Typ.|Max.||
|Forward voltage|VF|IF= 1.0A|-|-|0.45|V|
|Reverse current|IR|VR= 20V|-|-|200|μA|



*1 Pw ≤ 10μs, Duty cycle ≤ 1% 

- ・ 

- *2 60Hz 1 cycle 

- *3 Mounted on a ceramic board 

*4 Pulsed 

www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. 

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Datasheet 

## **l Electrical characteristic curves <MOSFET>** 

Fig.1 Typical Capacitance vs. Drain - Source Voltage 

Fig.3 Dynamic input Characteristics 

Fig.2 Switching Characteristics 

Fig.4 Typical Transfer Characteristics 

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Datasheet 

## **l Electrical characteristic curves <MOSFET>** 

Fig.5 Static Drain - Source On - State Resistance vs. Gate Source Voltage 

Fig.7 Static Drain - Source On - State Resistance vs. Drain Current (I) 

Fig.6 Source Current vs. Source Drain Voltage 

Fig.8 Static Drain - Source On - State Resistance vs. Drain Current (II) 

**20130716 - Rev.001** 

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**QS5U33** 

Datasheet 

## **l Electrical characteristic curves <MOSFET>** 

Fig.9 Static Drain - Source On - State Resistance vs. Drain Current (III) 

www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. 

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Datasheet 

## **l Electrical characteristic curves <SBD>** 

Fig.11 Forward Current vs. Forward Voltage 

Fig.12 Reverse Current vs. Reverse Voltage 

## **l Notice** 

1. SBD has a large reverse leak current compared to other type of diode. Therefore, it would raise a junction temperature, and increase a reverse power loss. Further rise of inside temperature would cause a thermal runaway. This built-in SBD has low VF characteristics and therefore, higher leak current. Please consider enough the surrounding temperature, generating heat of MOSFET and the reverse current. 

2. This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit. 

www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. 

**20130716 - Rev.001** 

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**QS5U33** 

Datasheet 

## **l Measurement circuits** 

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**----- Start of picture text -----**<br>
Fig.1-1 Switching Time Measurement Circuit<br>**----- End of picture text -----**<br>


Fig.2-1 Gate Charge Measurement Circuit 

Fig.1-2 Switching Waveforms Pulse width Ves \sl 10%50% 90% 10% Vos /| 90% tavon ry] | t, tavon Lt ton Fig.2-2 Gate Charge Waveform 

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Datasheet 

## **l Dimensions** 

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Notice 

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Notes<br>1) The information contained herein is subject to change without notice.<br>2) Before you use our Products, please contact our sales representative and verify the latest specifica-<br>tions:<br>3) Although ROHM is continuously working to improve product reliability and quality, semicon-<br>ductors can break down and malfunction due to various factors.<br>Therefore, in order to prevent personal injury or fire arising from failure, please take safety<br>measures such as complying with the derating characteristics, implementing redundant and<br>fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no<br>responsibility for any damages arising out of the use of our Poducts beyond the rating specified<br>by ROHM.<br>4) Examples of application circuits, circuit constants and any other information contained herein are<br>provided only to illustrate the standard usage and operations of the Products. The peripheral<br>conditions must be taken into account when designing circuits for mass production.<br>5) The technical information specified herein is intended only to show the typical functions of and<br>examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,<br>any license to use or exercise intellectual property or other rights held by ROHM or any other<br>parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of<br>such technical information.<br>6) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-<br>cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in<br>this document.<br>7) The Products specified in this document are not designed to be radiation tolerant.<br>8) For use of our Products in applications requiring a high degree of reliability (as exemplified<br>below), please contact and consult with a ROHM representative : transportation equipment (i.e.<br>cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety<br>equipment, medical systems, servers, solar cells, and power transmission systems.<br>9) Do not use our Products in applications requiring extremely high reliability, such as aerospace<br>equipment, nuclear power control systems, and submarine repeaters.<br>10) ROHM shall have no responsibility for any damages or injury arising from non-compliance with<br>the recommended usage conditions and specifications contained herein.<br>11) ROHM has used reasonable care to ensur the accuracy of the information contained in this<br>document. However, ROHM does not warrants that such information is error-free, and ROHM<br>shall have no responsibility for any damages arising from any inaccuracy or misprint of such<br>information.<br>12) Please use the Products in accordance with any applicable environmental laws and regulations,<br>such as the RoHS Directive. For more details, including RoHS compatibility, please contact a<br>ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting<br>non-compliance with any applicable laws or regulations.<br>13) When providing our Products and technologies contained in this document to other countries,<br>you must abide by the procedures and provisions stipulated in all applicable export laws and<br>regulations, including without limitation the US Export Administration Regulations and the Foreign<br>Exchange and Foreign Trade Act.<br>14) This document, in part or in whole, may not be reprinted or reproduced without prior consent of<br>ROHM.<br>**----- End of picture text -----**<br>


Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. 

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R1102A 



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