# Fast / Ultrafast Diode, Qspeed, 600 V, 8 A, Single, 3.15 V, 11.1 ns, 80 A

![Product image](https://novapart.co/image/farnell:2771813/)

**URL**: https://novapart.co/products/QH08BZ600/fast-ultrafast-diode-qspeed-600-v-8-a-single-315
**SKU**: QH08BZ600
**Manufacturer**: POWER INTEGRATIONS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €0.9130
**Stock**: 10+
**Lead Time**: 134 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:600V; Forward Current If(AV):8A; Diode Configuration:Single; Forward Voltage VF Max:3.15V; Reverse Recovery Time trr Max:11.1ns; Forward Surge Cu

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (21-Jan-2025) |
| No. Of Pins | 3 Pin |
| Product Range | Qspeed H Series |
| Qualification | - |
| Diode Case Style | TO-263AB |
| Diode Configuration | Single |
| Forward Voltage Max | 3.15V |
| Forward Surge Current | 80A |
| Reverse Recovery Time | 11.1ns |
| Average Forward Current | 8A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 600V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2771813/)

## **QH08TZ600, QH08BZ600 Qspeed[™]** Family 

## **600 V, 8 A H-Series PFC Diode** 

## **Product Summary** 

|IF(AVG)|8|A|
|---|---|---|
|VRRM|600|V|
|QRR(Typat 125 °C)|25.5|nC|
|IRRM (Typat 125 °C)|1.9|A|
|Softness tB/tA(Typat 125 °C)|0.75||



## **General Description** 

This device has the lowest QRR of any 600 V silicon diode.  Its recovery characteristics increase efficiency, reduce EMI and eliminate snubbers. 

## **Applications** 

- Power Factor Correction (PFC) boost diode 

## **Pin Assignment** 

- Motor drive circuits 

- DC-AC inverters 

**==> picture [196 x 51] intentionally omitted <==**

**----- Start of picture text -----**<br>
K NC  NC<br>C  C<br>NC<br>K<br>A<br>**----- End of picture text -----**<br>


## **TO-220AC             TO-263AB** 

**QH08TZ600                       QH08BZ600** 

## **A K** 

## RoHS Compliant 

## **Features** 

- Low QRR, low IRRM, low tRR 

- High dIF/dt capable (1000 A / µs) 

- Soft recovery 

## **Benefits** 

- Increases efficiency 

- Eliminates need for snubber circuits 

- Reduces EMI filter component size & count 

- Enables extremely fast switching 

Package uses Lead-free plating and Green mold compound. Halogen free per IEC 61249-2-21. 

## **Absolute Maximum Ratings** 

Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. 

|**Symbol**<br>~~fT~~|**Parameter**<br>~~fT~~|**Conditions**<br>~~fT~~|**Rating**<br>~~fT~~|**Units**<br>~~fT~~|
|---|---|---|---|---|
|VRRM<br>~~fT~~<br>~~a~~|Peak repetitive reverse voltage<br>~~fT~~<br>~~es~~|TJ= 25 °C<br>~~fT~~|600<br>~~fT~~|V<br>~~fT~~|
|IF(AVG)<br>~~a~~<br>~~a~~|Average forward current<br>~~es~~|TJ= 150 °C, TC= 95 °C|8|A|
|IFSM<br>~~a~~|Non-repetitivepeak surge current<br>|60 Hz, ½ cycle, TC= 25 °C<br>|80<br>|A<br>|
|IFSM<br>~~es~~|Non-repetitivepeak surge current<br>~~es~~|½ cycle of t=28µs Sinusoid, TC=25 °C<br>~~es~~|350<br>~~es~~|A<br>~~es~~|
|TJ<br>~~QO~~|Operating junction temperature range<br>~~QO~~|~~QO~~|-55 to 150<br>~~QO~~|°C<br>~~QO~~|
|TSTG|Storage temperature||-55 to 150|°C|
||Lead solderingtemperature|Leads at 1.6 mm from case, 10 sec|300|°C|
|VISOL<br>~~a~~|Isolation voltage(leads-to-tab)|AC,TO-220|2500|V|
|VISOL<br>~~a~~|Isolation voltage(leads-to-tab)<br>|AC,TO-263<br>|1500<br><br>~~I~~|V<br>|
|PD<br>~~QO~~|Power dissipation<br>~~QO~~|TC= 25 °C<br>~~QO~~|44.6<br>~~QO~~<br>~~I~~|W<br>~~QO~~|



November 2015 

www.power.com 

Po **QH08TZ600, QH08BZ600** 

## **Thermal Resistance** 

|**Symbol**|**Resistance from:**|**Conditions**|**Rating**|**Units**|
|---|---|---|---|---|
|RθJA|Junction to ambient|TO-220(only)|62|°C/W|
|RθJC|Junction to case||2.8|°C/W|



|**Symbol**<br>~~Cc.~~|**Parameter**<br>~~Cc.~~<br>~~|~~|**Conditions**<br>~~©~~<br>~~|~~|**Conditions**<br>~~©~~<br>~~|~~|**Min**<br>~~|~~<br>~~I~~|**Typ**<br>~~I)~~|**Max**<br>~~I)~~|**Units**<br>~~I)~~|
|---|---|---|---|---|---|---|---|
|**DC Characteristics**<br>~~Cc.~~<br>~~|~~<br>~~©~~<br>~~|~~<br>~~I I)~~<br>~~Ld~~<br>~~eeeeeeee~~||||||||
|IR<br>~~a~~|Reverse current<br>~~ee~~|VR= 600 V, TJ= 25 °C<br>~~ee~~||-<br>~~ee~~<br>~~ee~~<br>~~Gs~~|-<br>~~ee~~<br>~~ee~~|250<br>~~ee~~<br>~~ee~~|µA<br>~~ee~~<br>~~ee~~|
|||VR= 600 V,TJ= 125 °C<br>~~ee~~<br>~~a~~||-<br>~~ee~~<br>~~ee~~<br>~~a~~<br>~~Gs~~|0.5<br>~~ee~~<br>~~ee~~<br>~~a~~|-<br>~~ee~~<br>~~ee~~<br>~~a~~|mA<br>~~ee~~<br>~~ee~~<br>~~a~~|
|VF<br>~~ef~~<br>~~a~~|Forward voltage<br>~~ef~~|IF= 8 A,TJ= 25 °C<br>~~ef~~||-<br>~~ee ~~<br>~~Gs~~<br>~~ef~~<br>~~Gs~~|2.6<br> ~~ee ~~<br>~~ef~~|3.15<br> ~~ee ~~<br>~~ef~~|V<br> ~~ee~~<br>~~ef~~|
|||IF= 8 A, TJ= 150 °C<br>~~ef~~<br>~~a~~||-<br>~~ef~~<br>~~a~~<br>~~Gs~~|2.23<br>~~ef~~<br>~~a~~|-<br>~~ef~~<br>~~a~~|V<br>~~ef~~<br>~~a~~|
|CJ<br>~~a~~|Junction capacitance|VR= 10 V,1 MHz<br>~~es~~||-<br>~~Gs~~<br>~~es~~<br>~~(~~|25<br>~~es~~<br>~~Gs (ee~~|-<br>~~es~~<br>~~(ee~~|pF<br>~~es~~|
|**Dynamic Characteristics**<br>~~(~~<br>~~Gs (ee~~<br>~~[|~~<br>~~ee~~||||||||
|tRR<br>~~ee~~<br>~~Pp~~|Reverse recovery time<br>~~ee~~<br>|dI/dt = 200 A/µs<br>VR= 400 V, IF= 8 A<br>~~ee~~<br>|TJ= 25 °C<br>~~ee~~<br>|-<br>~~ee~~<br>~~es~~<br>|11.1<br>~~ee~~<br>~~es~~<br>|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|ns<br>~~ee~~<br>~~ee~~<br>|
||||TJ= 125 °C<br>~~ee~~<br>~~ee~~<br>|-<br>~~ee~~<br>~~ee~~<br>~~es~~<br>|19.5<br>~~ee~~<br>~~ee~~<br>~~es~~<br>|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|ns<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|
|QRR<br>~~Pp~~<br>~~a~~|Reverse recovery charge<br>~~—~~<br>~~a~~|dI/dt = 200 A/µs<br>VR= 400 V, IF= 8 A<br>~~—~~<br>~~a~~|TJ= 25 °C<br>~~—~~<br>|-<br>~~es~~<br>~~—~~<br>~~es~~<br>|8.0<br>~~es~~<br>~~—~~<br>~~**e**s~~<br>|13.5<br>~~ee~~<br>~~ee~~<br>~~—~~<br>~~es~~|nC<br>~~ee~~<br>~~—~~|
||||TJ= 125 °C<br>~~—~~<br>~~ee~~<br>|-<br>~~es~~<br>~~—~~<br>~~ee~~<br>~~es~~<br>|25.5<br>~~es~~<br>~~—~~<br>~~ee~~<br>~~**e**s~~<br>|-<br>~~ee~~<br>~~ee~~<br>~~—~~<br>~~ee~~<br>~~es~~|nC<br>~~ee~~<br>~~—~~<br>~~ee~~|
|IRRM<br>~~Pp~~<br>~~a~~|Maximum reverse<br>recovery current<br><br>~~a~~|dI/dt = 200 A/µs<br>VR= 400 V, IF= 8 A<br><br>~~a~~|TJ= 25 °C<br><br>|-<br>~~es~~<br><br>~~es~~<br>|1.14<br>~~es~~<br><br>~~**e**s~~<br>|1.7<br>~~ee~~<br><br>~~es~~|A<br>|
||||TJ= 125 °C<br><br>~~e~~|-<br>~~es ~~<br><br>~~es ~~<br>~~e~~<br>~~es~~|1.9<br> ~~es ~~<br><br> ~~**e**s ~~<br>~~e~~<br>~~ee~~|-<br> ~~ee~~<br><br> ~~es~~<br>~~es~~|A<br>|
|S<br>~~ee~~|Softness factor =<br>A<br>B<br>t<br>t<br>~~ee~~|dI/dt = 200 A/µs<br>VR= 400 V, IF= 8 A<br>~~ee~~|TJ= 25 °C<br>~~ee~~<br>~~ee~~|-<br>~~es~~<br>~~ee~~|0.7<br>~~ee~~<br>~~ee~~|-<br>~~es~~<br>~~ee~~|~~ee~~|
||||TJ= 125 °C<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|0.75<br>~~ee~~|-<br>~~ee~~|~~ee~~|



**==> picture [450 x 137] intentionally omitted <==**

**----- Start of picture text -----**<br>
VR<br>D1<br>L1 DUT<br>IF  <q — tRR  15V<br>dIF/dt Pulse generator + Rg<br>ta  tb  > Q1<br>0  JLIFL<br>0.1xIRRM<br>IRRM<br>**----- End of picture text -----**<br>


**Figure 1.  Reverse Recovery Definitions.** 

**Figure 2.  Reverse Recovery Test Circuit.** 

Rev 1.3 11/15 

2 

~~ee~~ **QH08TZ600, QH08BZ600** 

## **Electrical Specifications at TJ= 25** ° **C (unless otherwise specified)** 

**==> picture [449 x 506] intentionally omitted <==**

**----- Start of picture text -----**<br>
20 80<br>18 70<br>16<br>60<br>14 Tj=125C<br>50<br>12<br>10 40<br>8 Tj=25C 30<br>6<br>20<br>4<br>2 10<br>0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 20 40 60 80 100 120 140 160 180<br>VF (V) VR (V)<br>Figure 3.  Typical IF vs. VF. Figure 4.  Typical CJ vs VR.<br>80 30<br>70 dI F /dt=1000A/us 25 dIF/dt=200A/us<br>60<br>dIF/dt=500A/us 20<br>50 dIF/dt=500A/us<br>40 15<br>30 10 dIF/dt=1000A/us<br>20 ge dIF/dt=200A/us | | |ge\<br>5<br>10<br>0 0<br>0 2 4 6 8 10 12 14 16 18 0 2 4 6 8 10 12 14 16 18<br>IF (A) IF (A)<br>Figure 5.  Typical QRR vs. IF at TJ = 125 °C.  Figure 6.  Typical tRR vs. IF at TJ = 125 °C.<br>16 45<br>14 40<br>12 35<br>30<br>10<br>25<br>8<br>20<br>6<br>15<br>4 10<br>2 5<br>0 0<br>25 50 75 100 125 150 25 50 75 100 125 150<br>o<br>Case Temperature, TC ( [o] C) Case Temperature, TC ( C)<br>(A)IF  C(pF)j<br> (nC)  (ns)<br>QRR tRR<br> (A)IF(AV) P (W)<br>**----- End of picture text -----**<br>


**Figure 7.  DC Current Derating Curve.** 

**Figure 8.  Power Derating Curve.** 

Rev 1.3 11/15 

3 

Po **QH08TZ600, QH08BZ600** 

**==> picture [257 x 156] intentionally omitted <==**

**----- Start of picture text -----**<br>
duty cycle=10%<br>80<br>duty cycle=30%<br>70<br>duty cycle=50%<br>60 DC<br>50<br>40<br>30<br>20<br>10<br>0<br>25 50 75 100 125 150<br>T C(°C)<br>(PEAK) (A)<br>IF<br>**----- End of picture text -----**<br>


**Figure 9.  IF(PEAK) vs. TC, f=70 kHz.** 

**==> picture [404 x 289] intentionally omitted <==**

**----- Start of picture text -----**<br>
QH08TZ600x<br>1 SS<br>D= 0.5<br>D = 0.3<br>0.1<br>D= 0.1<br>D= 0.05<br>D= 0.02<br>0.01 D= 0.01<br>D=0.005<br>D=0.002<br>0.001<br>Fo<br>Single Pulse<br>0.0001<br>1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00<br>t1(sec)<br>Zth(j-c)/Rth(j-c)<br>**----- End of picture text -----**<br>


**Figure 10.  Normalized Maximum Transient Thermal Impedance.** 

4 

Rev 1.3 11/15 

~~Pe~~ **QH08TZ600, QH08BZ600** 

## **Dimensional Outline Drawings** 

TO-220AC 

**==> picture [144 x 257] intentionally omitted <==**

**----- Start of picture text -----**<br>
ee Millimeters<br>Dim  MIN  MAX<br>esSo A  4.32  ee 4.70<br>A1  1.14  1.40<br>eeee<br>A2  2.03  2.79<br>ee<br>C  0.34  0.610<br>D  9.65  10.67<br>eeee<br>E  2.49  2.59<br>ee<br>ee<br>E1  4.98  5.18<br>eeee<br>F  0.508  1.016<br>ee F1  1.14  1.78<br>ee H  14.71  eeee 16.51<br>ee H1  5.84  ee 6.795<br>H2  8.40  9.00<br>ee H3  3.53  3.96<br>H4  2.54  3.05<br>ee ee<br>ee L  12.70  eeee 14.22<br>L1  -  6.35<br>**----- End of picture text -----**<br>


|**Mechanical Mounting Method**|**Maximum Torque / Pressure specification**|
|---|---|
|Screw through hole inpackage tab|1 Newton Meter(nm)or 8.8 inch-pounds(lb-in)|
|Clampagainstpackage body|12.3 kilogram-forceper square centimeter(kgf/cm2)or 175 lbf/in2|



**Soldering time and temperature:** This product has been designed for use with hightemperature, lead-free solder.  The component leads can be subjected to a maximum temperature of 300 °C, for up to 10 seconds.  See Application Note AN-303, for more details. 

## **Ordering Information** 

|**Part Number**|**Package**|**Packing**|
|---|---|---|
|QH08TZ600|TO-220AC|50 units/tube|



**The information contained in this document is subject to change without notice.** 

5 

> Rev 1.3 11/15 www.power.com 

Po **QH08TZ600, QH08BZ600** 

## **Dimensional Outline Drawings** 

## TO-263AB 

|TO-263AB||||||
|---|---|---|---|---|---|
|,||on||**Millimeters**<br>**Dim**<br>**MIN**<br>**MAX**<br>**A**<br>4.40<br>4.70<br>~~T_T~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~||
|es <br>Ted<br>Cp<br>2||ee|**A1**<br>0.00<br>0.25<br>**A2**<br>2.59<br>2.79<br>**b**<br>0.77<br>0.90<br>**b2**<br>1.23<br>1.36<br>**c2**<br>1.22<br>1.32<br>**D**<br>9.05<br>9.25<br>~~ee~~<br>~~ee~~<br>~~rT~~<br>~~|~~<br>~~||~~<br>~~ee~~<br>~~ee~~<br>~~———~~|||
|é||||**E**<br>10.06<br>10.26<br>**e**<br>2.54 BSC<br>2.54 BSC<br>~~ee~~<br>~~ee~~||
|||||**H**<br>14.70<br>15.50||
|||||**L**<br>2.00<br>2.60||
|oe<br>||| ce<br>Hl|i||**L1**<br>1.17<br>1.40<br>**L2**<br>–<br>1.75<br>**L3**<br>0.25 BSC<br>0.25 BSC<br>~~a~~<br>~~ee ee~~<br>~~ee~~<br>~~ee~~||
|||||**L4**<br>2.00 BSC<br>2.00 BSC<br>**Θ**<br>0°<br>8°<br>**Θ1**<br>5°<br>9°<br>**Θ2**<br>1°<br>5°<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~||



6 

Rev 1.3 11/15 

~~Pe~~ **QH08TZ600, QH08BZ600** 

## **Footprint and Solder Pad Dimensions** 

**Pad Dimensions in mm: TO-263AB** 

**Soldering time and temperature:** This product has been designed for use with hightemperature, lead-free solder.  The component leads can be subjected to a maximum temperature of 300 °C, for up to 10 seconds.  See Application Note AN-303, for more details. 

## **Ordering Information** 

|**Part Number**|**Package**|**Packing**|
|---|---|---|
|QH08BZ600|TO-263AB|800 units/reel|



**The information contained in this document is subject to change without notice.** 

7 | 

www.power.com 

Rev 1.3 11/15 

## Po **QH08TZ600, QH08BZ600** 

|**Revision**|**Notes**|**Date**|
|---|---|---|
|1.0|Released by Qspeed|01/10|
|1.1|Converted to Power Integrations Document|01/11|
|1.2|AddedQH08BZ600|02/13|
|1.3|Updated with new Brand Style. Added footprint and solder pad dimension<br>for TO-263ABpackage.|11/15|



8 

Rev 1.3 11/15 

~~ee~~ **QH08TZ600, QH08BZ600** 

## **For the latest updates, visit our website: www.power.com** 

Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability.  Power Integrations does not assume any liability arising from the use of any device or circuit described herein.  POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. 

## **Patent Information** 

The products and applications illustrated herein (including transformer construction and circuits’ external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations.  A complete list of Power Integrations’ patents may be found at www.power.com . Power Integrations grants its customers a license under certain patent rights as set forth at http://www.power.com/ip.htm. 

## **Life Support Policy** 

POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS.  As used herein: 

1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user. 

2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 

The PI Logo, TOPSwitch, TinySwitch, LinkSwitch, LYTSwitch, InnoSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS, HiperLCS, Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, FluxLink, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies.  ©Copyright 2015 Power Integrations, Inc. 

## **Power Integrations Worldwide Sales Support Locations** 

## **WORLD HEADQUARTERS** 

## **GERMANY** 

**WORLD HEADQUARTERS GERMANY JAPAN TAIWAN** 5245 Hellyer Avenue Lindwurmstrasse 114 Kosei Dai-3 Building 5F, No. 318, Nei Hu Rd., San Jose, CA 95138, USA. 80337, Munich 2-12-11, Shin-Yokohama, Sec.  1 Main: +1-408-414-9200 Germany Kohoku-ku, Yokohama-shi, Nei Hu District Customer Service: Phone: +49-895-527Kanagawa 222-0033 Taipei 11493, Taiwan R.O.C. Phone: +1-408-414-9665 39110 Japan Phone: +886-2-2659-4570 Fax: +1-408-414-9765 Fax: +49-895-527-39200 Phone: +81-45-471-1021 Fax: +886-2-2659-4550 e-mail: usasales@power.com e-mail: Fax: +81-45-471-3717 e-mail: eurosales@power.com e-mail: japansales@power.com taiwansales@power.com 

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## ~~|~~ 9 

Rev 1.3 11/15 

www.power.com 



## Links

- [View this product on Novapart](https://novapart.co/products/QH08BZ600/fast-ultrafast-diode-qspeed-600-v-8-a-single-315)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/power-integrations/qh08bz600/rectifier-single-600v-8a-to-263ab/dp/2771813)
---

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